DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 6/28/2024 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 6-7 and 11 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Maeda et al. (US Patent Appl. Pub. No. 2014/0208587 A1).
[Re claim 1] Maeda discloses the electronic component mounting device, comprising: an electronic component (210) supply part that supplies an electronic component having a bump electrode (214) (see figure 2A and paragraph [0045]); a transfer stage (320) that stores flux (206); a mounting stage on which a substrate is placed; a connecting member which connects a plurality of heads (325) that are capable of picking up the electronic component at a predetermined interval and which inter-connectedly operates the plurality of heads in a direction along a placement surface of the mounting stage on which the electronic component is placed; and a controller (control unit) that controls operations of the plurality of heads, wherein the controller is configured to allocate and enable the plurality of heads to function as a dipping head that immerses the bump electrode of the electronic component into the flux stored in the transfer stage, and as a bonding head that mounts the electronic component to the substrate on the mounting stage via the bump electrode, and the controller is configured to pick up the electronic component in a state of being immersed in the flux from the transfer stage by the bonding head by moving the connecting member by the predetermined interval after releasing the electronic component in the state of being immersed in the flux from the dipping head on the transfer stage (see figure 5-8 and paragraph [0057]-[0075]).
[Re claim 6] Maeda discloses the electronic component mounting device wherein the controller transports the electronic component from the transfer stage (320) to the mounting stage by the bonding head (325) (see figure 5-8 and paragraph [0065]).
[Re claim 7] Maeda discloses the electronic component mounting device wherein the controller enables the dipping head (325) to transport the electronic component from the transfer stage (320) to the mounting stage (see figure 5-8 and paragraph [0065]).
[Re claim 11] Maeda discloses the electronic component mounting method, using an electronic component mounting device which comprises: an electronic component (210) supply part that supplies an electronic component having a bump electrode (214) (see figure 2A and paragraph [0045]); a transfer stage (320) that stores flux (206); a mounting stage on which a substrate (101) is placed; a connecting member which connects a plurality of heads (325) that are capable of picking up the electronic component at a predetermined interval and which inter-connectedly operates the plurality of heads in a direction along a placement surface of the mounting stage on which the electronic component is placed; and a controller that controls operations of the plurality of heads, the electronic component mounting method comprising: picking up the electronic component from the electronic component supply part by a dipping head among the plurality of heads; immersing the bump electrode of the electronic component into the flux stored in the transfer stage by the dipping head; mounting the electronic component (210) to the substrate (101) by a bonding head among the plurality of heads; moving the connecting member by the predetermined interval after releasing the electronic component from the dipping head on the transfer stage; and picking up the electronic component from the transfer stage by the bonding head (see figure 5-8 and paragraph [0057]-[0075]).
Allowable Subject Matter
Claims 2-5, 9-10 and 13 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KYOUNG LEE whose telephone number is (571)272-1982. The examiner can normally be reached M to F, 10am to 6pm.
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/KYOUNG LEE/Primary Examiner, Art Unit 2817
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