Prosecution Insights
Last updated: October 25, 2026
Application No. 18/738,070

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Non-Final OA §102§OTHER
Filed
Jun 10, 2024
Priority
Jun 12, 2023 — RE 10-2023-0075187
Examiner
LAU, JASON
Art Unit
3762
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Tes Co. Ltd.
OA Round
1 (Non-Final)
54%
Grant Probability
Moderate
1-2
OA Rounds
12m
Est. Remaining
70%
With Interview

Examiner Intelligence

Grants 54% of resolved cases
54%
Career Allowance Rate
501 granted / 926 resolved
-15.9% vs TC avg
Strong +16% interview lift
Without
With
+15.9%
Interview Lift
resolved cases with interview
Typical timeline
3y 4m
Avg Prosecution
55 currently pending
Career history
983
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
66.1%
+26.1% vs TC avg
§102
16.1%
-23.9% vs TC avg
§112
14.1%
-25.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 926 resolved cases

Office Action

§102 §OTHER
DETAILED ACTION Election/Restrictions Applicant’s election without traverse of claims 1-9 in the reply filed on 8/5/2026 is acknowledged. Claims 10-13 are withdrawn from consideration. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1- 9 is/are rejected under 35 U.S.C. 102a1 as being anticipated by McCullough (US 20020179155 A1). Regarding claim 1, McCullough discloses a substrate processing apparatus comprising: a chamber (12) that provides a processing space configured to perform a process on a substrate coated with a processing solution or organic solvent by using a fluid in a supercritical state; and a fluid supply unit configured to supply the fluid to the chamber, wherein the fluid supply unit includes: a fluid storage (14) configured to store the fluid; a main supply line connecting the fluid storage to the chamber (Fig); a pump (20) provided on the main supply line to pressurize the fluid in the fluid storage and supply the fluid toward the chamber; a buffer tank (16) provided at a rear end of the pump on the main supply line and configured to accommodate the fluid; and a bypass line (26) bypassing the buffer tank to connect the pump to the chamber. Regarding claim 2, McCullough discloses the substrate processing apparatus of claim 1, wherein the bypass line branches off from the main supply line between the pump and the buffer tank and is merged with the main supply line between the buffer tank and the chamber (Fig. 1). Regarding claim 3, McCullough discloses the substrate processing apparatus of claim 2, further comprising a first orifice (orifice of the valve 24) between the buffer tank and the chamber on the main supply line, wherein the bypass line is merged with the main supply line of a front end of the first orifice (it is inherent that the valve 24 has a front end of a first orifice; para. 21). Regarding claim 4, McCullough discloses the substrate processing apparatus of claim 2, further comprising a first orifice (orifice of the valve 24) between the buffer tank and the chamber on the main supply line, wherein the bypass line is merged with the main supply line of a rear end of the first orifice (it is inherent that the valve 24 has a rear end of a first orifice; para. 21). Regarding claim 5, McCullough discloses the substrate processing apparatus of claim 4, further comprising a second orifice (orifice connected to valve 22) on the bypass line. Regarding claim 6, McCullough discloses the substrate processing apparatus of claim 1, wherein, when the fluid is supplied toward the chamber and pressurized to a predetermined process pressure (abstract and para. 11), a first pressurization step of supplying the fluid from the buffer tank toward the chamber (para. 11), and a second pressurization step of supplying the fluid toward the chamber through the bypass line are provided (para. 24) (note: the valves 22, 24, 28, and pump 20 can be operated manually by the operator and therefore can be adjusted to perform the claimed functions; para. 23). Regarding claim 7, McCullough discloses the substrate processing apparatus of claim 6, wherein a converting point at which the first pressurization step is converted to the second pressurization step is determined by at least one of a predetermined time of the first pressurization step or the second pressurization step, a pressure value inside the chamber, a pressure change rate inside the chamber, a pressure value inside the buffer tank, a pressure change rate inside the buffer tank, and a pressure difference between the chamber and the buffer tank (note: the valves 22, 24, 28, and pump 20 can be operated manually by the operator and therefore can be adjusted to perform the claimed functions at a predetermined time; para. 23). Regarding claim 8, McCullough discloses the substrate processing apparatus of claim 1, wherein, when the pressure inside the chamber reaches a predetermined pressure and a process for the substrate is performed, the fluid is supplied toward the chamber through the bypass line and the fluid is discharged from the chamber (para. 28) (note: the valves 22, 24, 28, and pump 20 can be operated manually by the operator and therefore can be adjusted to perform the claimed functions; para. 23). Regarding claim 9, McCullough discloses the substrate processing apparatus of claim 1, wherein, when the fluid is discharged from an inside of the chamber, the fluid is discharged from the inside of the chamber and fluid is supplied to the buffer tank from the fluid storage (para. 30; step 6) (note: the valves 22, 24, 28, and pump 20 can be operated manually by the operator and therefore can be adjusted to perform the claimed functions; para. 23). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JASON LAU whose telephone number is (571)270-7644. The examiner can normally be reached Mon-Fri 8:00-5:00. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Michael Hoang can be reached at 571-272-6460. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /JASON LAU/Primary Examiner, Art Unit 3762
Read full office action

Prosecution Timeline

Jun 10, 2024
Application Filed
Oct 13, 2026
Non-Final Rejection mailed — §102, §OTHER (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
54%
Grant Probability
70%
With Interview (+15.9%)
3y 4m (~12m remaining)
Median Time to Grant
Low
PTA Risk
Based on 926 resolved cases by this examiner. Grant probability derived from career allowance rate.

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