Prosecution Insights
Last updated: July 17, 2026
Application No. 18/743,879

SERVER COOLING WITH IMMERSED HEAT SINK

Non-Final OA
Filed
Jun 14, 2024
Priority
Jun 20, 2023 — provisional 63/509,104
Examiner
FENG, ZHENGFU J
Art Unit
2835
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Carrier Corporation
OA Round
1 (Non-Final)
75%
Grant Probability
Favorable
1-2
OA Rounds
5m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 75% — above average
75%
Career Allowance Rate
382 granted / 507 resolved
+7.3% vs TC avg
Strong +39% interview lift
Without
With
+39.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 7m
Avg Prosecution
24 currently pending
Career history
526
Total Applications
across all art units

Statute-Specific Performance

§103
90.0%
+50.0% vs TC avg
§102
7.5%
-32.5% vs TC avg
§112
2.3%
-37.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 507 resolved cases

Prosecution Timeline

Jun 14, 2024
Application Filed
Apr 07, 2026
Non-Final Rejection mailed
Jul 07, 2026
Response Filed

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685218
METAL PCB FOR TOPSIDE POWER DELIVERY
4y 3m to grant Granted Jul 14, 2026
Patent 12684687
CIRCUIT APPARATUS FOR ELECTRONIC DEVICES
3y 10m to grant Granted Jul 14, 2026
Patent 12666524
HOME APPLIANCE AND HEAT SINK INSTALLED THEREIN
4y 0m to grant Granted Jun 23, 2026
Patent 12660624
SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME
3y 4m to grant Granted Jun 16, 2026
Patent 12660123
HEAT EXCHANGE ASSEMBLY AND THERMAL MANAGEMENT SYSTEM INCLUDING THE SAME
2y 5m to grant Granted Jun 16, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
75%
Grant Probability
99%
With Interview (+39.0%)
2y 7m (~5m remaining)
Median Time to Grant
Low
PTA Risk
Based on 507 resolved cases by this examiner. Grant probability derived from career allowance rate.

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