Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
1. Claims 1-15 are presented for examination.
Claim Rejections - 35 USC § 112
2. The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-15 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claims 9, 11 and 14-15, The term “prescribed minimum H pressure value” in claims 9, 11 and 14-15 is a relative term which renders the claim indefinite. The term “prescribed minimum H pressure value” is not defined by the claim, the specification does not provide a standard for ascertaining the requisite degree, and one of ordinary skill in the art would not be reasonably apprised of the scope of the invention, appropriated correction requested.
Claims 1 and 12, “calculating a thermal load Q of the first liquid distribution circuit based on the measured TC, TH, and TDC values” unclear and vague how the calculation relationship among the Tc, TH and TDC as the specification par. [0013], [0022], are different from the Par. [0072]. Clarification requester.
As per claims 2-11 and 13-15, these claims are at least rejected for their dependencies, directly or indirectly, on the rejected claims 1 and 12. They are therefore rejected as set forth above.
3. The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Applicant specification Par. [0071] and 0072] does not provide any guidance to the person skilled in the art as to what constitute "appropriate H values" and as to how the values are "selected and applied".
Claims 1, 8-9, 11-12 and 14-15, from the paragraph [0071]-[0072] does not disclose how the measured flow rate, which appears to be the only input to the pump control process, is used for the selection and application of the appropriate H values, and how the "appropriate H pressure values" are applied to the "pump speed npump". It follows that the application does not provide for a person skilled in art with sufficient information to implement a control module that performs block 316, selection of H value. Consequently, it is not sufficient to understand for a person skilled in the art that the "control module 150" is configured to "control the speed of at least one pump" by means of control process 300.
The description of the application in paragraph [0071]-[0072], Process 300 then proceeds to task block 316 to select and apply the appropriate H values based on empirically determined pump head H curves 400 as depicted by FIG. 4, in accordance with the non-limiting embodiments of the present technology. Generally, pump head pressure values H are based on a pump’s output discharge pressure minus the pump’s input suction pressure. As such, the H curves represent empirical data regarding the minimum head pressure values H min required to provide the necessary pressure for given flow rates for one and two pumps. Accordingly, process 300 applies the appropriate H pressure values to the pump speed n pump based on the use of the one or two pumps 112A, 112B. Then, after the appropriate H values are selected and applied, at decision block 318, process 300 determines whether the applied H pressure values are less than the minimum value H min for the measured flow rate V and if so, process 300 incrementally increases the pump speed npump at task block 322. However, if the applied H pressure values are not less than the minimum value Hmin for the measured flow rate V, the pump speed npump is determined to be efficient and maintained at task block 320.
The independent claims 1 and 12, claimed "liquid cooling method that comprises, among others, the step of: estimating a power consumption of the rack-mounted data processing assemblies by calculating a thermal load Q of the first liquid distribution circuit based on the measured Tc, TH. and TDC values.
However, the description of the application in paragraph [0062] teaches that the parameter "estimated thermal load Q of the first liquid distribution circuit" is computed based on the relationship: thermal load Q = m × pc × ΔT, where m represents the mass flow rate of water and cp represents the specific heat calculated as a function of the fluid average temperature. ΔT stands for the temperature difference between the temperature of the supplied cooling liquid Tc and the temperature of the returned heated cooling liquid TH. Therefore, from the description of the application that the estimation of the parameter Q does not involve the value of the ambient temperature of the dry cooling unit Toc. And the other part of the specification, for example, Par. [0013], [0022], is unclear how the calculation has been done. Consequently, the subject-matter of the independent claims 1 and 12 is not fully supported by the description, but the specification must contain a description of the invention “sufficient to enable a person skilled in the art to make and use the invention”. can reasonably conclude that the inventor had possession of the claimed invention. See, e.g., Moba, B.V. v. Diamond Automation, Inc., 325 F.3d 1306, 1319, 66 USPQ2d 1429, 1438 (Fed. Cir. 2003); Vas-Cath, Inc. v. Mahurkar, 935 F.2d at 1563, 19 USPQ2d at 1116. However, a showing of possession alone does not cure the lack of a written description. Enzo Biochem, Inc. v. Gen-Probe, Inc., 323 F.3d 956, 969-70, 63 USPQ2d 1609, 1617 (Fed. Cir. 2002). For example, it is now well accepted that a satisfactory description may be found in originally-filed claims or any other portion of the originally-filed specification. See In re Koller, 613 F.2d 819, 204 USPQ 702 (CCPA 1980); In re Gardner, 475 F.2d 1389, 177 USPQ 396 (CCPA 1973); In re Wertheim, 541 F.2d 257, 191 USPQ 90 (CCPA 1976). However, that does not mean that all originally filed claims have adequate written support.
For new or amended claims, support must come from the original disclosure (such descriptive means as words, structures, figures, diagrams, and formulas that fully set forth the claimed invention; the applicant must show where each new or amended claim element is supported.
Allowable Subject Matter
4. Claims 1 and 12 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, and 112(a) set forth in this Office action.
The following is an examiner’s statement of reasons for allowance:
The allowability of the independent claims 1 and 12, resides, at least in part, in that closest prior art, Shaw (US 20220201902 A1) discloses a liquid cooling method ([0004], Fig.1, liquid cooling) for rack-mounted processing assemblies ([0001],[0027], Fig. 1, the cooling system 114 can also be centralized for multiple enclosures 104,a computing system 101 having a plurality of network devices that interconnect a plurality of servers to one another or to external networks), comprising:
providing a dry cooling unit (a radiator 116) supply a cooling liquid to the rack-mounted processing assemblies ([0004], [0030], [0031], a radiator to dissipate the absorbed heat from the cooing fluid to cooling air flowing through the enclosure before the cooling air is exhausted to the return air plenum), and receive a heated liquid from the rack-mounted processing assemblies ([0027], remove at least a portion of the heat generated by the computing units 101 during operation), the dry cooling unit comprising a fan assembly and a heat exchanger unit ([0030], the radiator 116 includes a heat exchanger 126 and fan speed drive 129);
providing a first liquid distribution circuit (the inlet manifold 108a) to convey the cooling liquid from the dry cooling unit to the rack-mounted processing assemblies ([0004], [0007], [0027], Fig. 1, a cooling system in an enclosure can provide a coolant (e.g., cooling water) to a jacket surrounding high-power electronic components via an inlet manifold 108a), and
a second liquid distribution circuit (the outlet manifold 108b) to convey the heated liquid from the rack-mounted processing assemblies to the dry cooling unit ([0004], [0007], [0027], Fig. 1 the coolant can then flow through the jacket to remove generated heat from the electronic components before being collected at an outlet manifold 108b),
the first liquid distribution circuit (the inlet manifold 108a) incorporating at least one pump (pump 124) along the first liquid distribution circuit (the inlet manifold 108a) to provide a pressure flow ( ([0031], provides the coolant 121 at a pressure and flow rate to the inlet manifold 108a) in supplying the cooling liquid from the dry cooling unit to the rack-mounted processing assemblies (Abstract, [0008], Fig. 1, a supply temperature of the coolant at the inlet manifold 108a; and automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint);
each of the rack-mounted data processing assemblies ([0024], Fig. 1, Fig. 2Acomputing unit 101) comprising:
at least one heat-generating electronic processing element ([0004], [0024], electronic components accommodate high rates of heat generation. A heat generating rate of the added electronic component and instruct the air mover to implement the change in a feed-forward manner) and at least one liquid cooling block arranged to be in respective thermal contact with the at least one heat-generating electronic processing element ([0004], [0027], The coolant can then flow through the jacket to remove generated heat from the electronic components before being collected at an outlet manifold. liquid-cooled cooling system that is configured to remove at least a portion of the heat generated by the computing units 101 during operation. To heat transfer rates, liquid cooling may be implemented in the enclosure to remove heat from the electronic components) and fluidly coupled to the first liquid distribution circuit ([0029], The inlet manifold 108a can be configured to receive the coolant 121 from the RPU 120 and distribute the received coolant 121 to the individual computing units 101), and
providing a first temperature sensor ([0007], temperature sensors 136a in the cooling system) along the first liquid distribution circuit (inlet 118a) to measure a temperature of the supplied cooling liquid ([0007], [0033], the various sensors can be configured to measure and provide readings of a supply pressure of the coolant at the inlet manifold and temperature of the coolant to the cooling system) and a volume sensor ([0007], [0031], flow sensor in the cooling system), to measure a flow rate of the supplied cooling liquid ([0007], [0009], sensors is configured to measure a flow rate of the coolant in the inlet manifold 108a),
providing a second temperature sensor (temperature sensor 136b) along the second liquid distribution circuit (outlet manifolds 108b) to measure a temperature of the returned heated cooling liquid ([0009], [0026], a return temperature of the coolant at the outlet manifold, a temperature difference between the return and supply temperatures of the coolant, a flow rate of the coolant, and/or other suitable process variable),
Control module (control system 118), communicatively coupled to the fan assembly ([0020], air mover 110/128 includes fan and blower) and the pump (pump 124) (Fig. 1, controller 103 communicate with pump 124 and air mover 110/128), and
controlling (controller 130) a speed of the pump (a pump speed 152) based on whether the flow rate has increased ([0008],[0010], [0035], [0039], controller adjust a pump speed of a pump in the coolant source and expected change in the pump capacity (i.e., a flow rate increase of the coolant).
receive the measured the supplied cooling liquid TC, returned heated cooling liquid TH, and flow rate VC ([0033], With readings from the various sensors, the controller 130 can be configured to automatically tune the cooling system 114 to accommodate the computing units 101, as described below with reference to FIGS. 2A-2C).
Gao (US 20220104402 A1) discloses a smart control valve ([0016], loop control using multiple valves/three-way valves) respectively arranged to be fluidly-coupled (Abstract, Fig. 2, fluidly coupled) to the at least one liquid cooling block (Abstract, The cooling unit) of the corresponding rack-mounted data processing assembly (server 103A to 103D) (Abstract, [0023]-[0024],[0034], claim 8, a facility cooling fluid source and an external outlet fluidly coupled by a control valve to a facility hot fluid return. The first three-way valve and a second three-way valve is fluidly coupled to the unit inlet and is fluidly coupled by the second three-way valve to the open-loop outlet and the closed-loop outlet); and determining whether the flow rate has increased based on the measured VC value ([0039],[0052], measured by flow rate sensor M1, is increasing, where it decreases the speed of pump 212, and then returns to block 726).
Lei (US 20200192444 A1) providing a third temperature sensor to measure an ambient temperature of the dry cooling unit (a target DTS temperature curve corresponding to the current ambient temperature of the server is determined), and controlling a speed of the fan assembly based on the estimated power consumption and/or ambient thermal conditions (Fig. 3, [0011], [0015], [0016], [0021], Fig. 8, determining a speed of a fan associated with a power consumption. control the fan in the server to operate according to the obtained fan speed. The fan speed-temperature curve is a predetermined and fixed curve satisfying an energy-saving requirement that when the temperature of the server is low, the fan speed is low, and the power consumption of the fan is low).
However, the cited prior arts, Leim Goa and Shaw fail to disclose the disclose or suggest, alone or in combination, estimating a power consumption of the rack-mounted data processing assemblies by calculating a thermal load Q of the first liquid distribution circuit based on the measured the supplied cooling liquid TC, returned heated cooling liquid TH, and ambient temperature of the dry cooling unit TDC values, in combination with the other elements and features of the claimed invention.
As claims 2-11 and 13-15 are directly or indirectly dependent on claims 1 and 12, those claims are also allowable at least by virtue of their dependency.
Citation Pertinent prior art
5. The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Chainer (US 2013/0317785 A1) discloses a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center.
Regimbal (US20160360649A1 A) discloses fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers.
Heydari (US 20220117121 A1) discloses an integrated power and coolant distribution unit (PCDU) comprises control logic to cause at least one power controller to provide a power response or to cause at least one flow controller to provide a coolant response from the PCDU upon a determined change in a power state or coolant state.
Conclusion
6. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Kidest Worku, whose telephone number is 571-272-3737. The examiner can normally be reached on Mon-Fri 9am to 5pm, ET.
If attempts to reach the examiner by telephone are unsuccessful, the examiner's supervisor, Ali Mohammad, can be reached on 571-272-4105. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/KIDEST WORKU/ Primary Examiner, Art Unit 2119
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