Prosecution Insights
Last updated: July 05, 2026
Application No. 18/794,603

THERMAL PRINT HEAD AND METHOD FOR MANUFACTURING THEREOF

Non-Final OA §102§103§112
Filed
Aug 05, 2024
Priority
Aug 18, 2023 — JP 2023-133467
Examiner
MCMILLION, TRACEY M
Art Unit
2853
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Röhm GmbH
OA Round
1 (Non-Final)
88%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 88% — above average
88%
Career Allowance Rate
555 granted / 633 resolved
+19.7% vs TC avg
Minimal +2% lift
Without
With
+2.2%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 11m
Avg Prosecution
23 currently pending
Career history
668
Total Applications
across all art units

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
84.3%
+44.3% vs TC avg
§102
9.5%
-30.5% vs TC avg
§112
2.5%
-37.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 633 resolved cases

Office Action

§102 §103 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claim 6 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. With regard to claim 6, it is unclear to Examiner how the second layer “covers” the first layer and “uncovers” an area above the heat element. In addition, the limitation “uncovers an area above the heat element” is not disclosed in the specification and according to paragraph [0030] in Applicant’s specification. For the purpose of examination, Examiner will assume the second layer does not cover the area above the heat element. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 3, 5 and 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Watanabe (JP 2022059849). With regard to claim 1, Watanabe discloses a thermal print head (100A) [Para. 0034; Fig. 1], comprising: a substrate (15) [Fig. 2]; a glaze layer (33) [Para. 0038; Fig. 2]; a wiring layer (not shown) [Para. 0068]; a heat element (50) [heating resistor; Para. 0034; Fig. 2]; and a protective layer (52) [Para. 0034; Fig. 2], wherein the glaze layer is disposed on the substrate [Fig. 2], the wiring layer is disposed on the glaze layer [not shown; Para. 0068], the wiring layer has a common electrode (32) and a plurality of individual electrodes (31) [Para. 0034], the common electrode has protrusions (32A) arranged in intervals along a first direction (X direction) in a plan view [Para. 0034; Fig. 1] and extending along a second direction perpendicular to the first direction in the plan view (Y direction), the plurality of individual electrodes have tip portions (not labeled) extending along the second direction [Fig. 5], the protrusions and the tip portions are alternately arranged in intervals along the first direction in the plan view [Fig. 5], the heat element extends along the first direction in the plan view [Fig. 1], is disposed on the glaze layer [Fig. 2], and overlaps with the protrusions and the tip portions [Fig. 1], the protective layer is disposed on the glaze layer to cover the wiring layer and the heat element [Fig. 2], a recess (not labeled) is formed on a surface of the protective layer [Fig. 2, concave portion on layer 54 and formed on the surface of layer 52], and the recess extends along the first direction in a manner of overlapping with the heat element [50] in the plan view [Fig. 2]. With regard to claim 3, wherein a bottom surface of the recess has an upwardly convex curved shape in a cross-sectional view perpendicular to the first direction [Fig. 2]. With regard to claim 5, Watanabe discloses a method of manufacturing a thermal print head, comprising: providing a substrate (15) [Fig. 2]; forming a glaze layer (33) [Para. 0038; Fig. 2]; forming a wiring layer (not shown) [Para. 0068]; forming a heat element (50) [heating resistor; Para. 0034; Fig. 2]; and forming a protective layer (52) [Para. 0034; Fig. 2] on the glaze layer to cover the wiring layer and the heat element [Fig. 2], wherein the wiring layer has a common electrode (32) and a plurality of individual electrodes (31) [Para. 0034], the common electrode has protrusions (32A) arranged in intervals along a first direction (X direction) in a plan view [Para. 0034; Fig. 1] and extending along a second direction perpendicular to the first direction in the plan view (Y direction), the plurality of individual electrodes have tip portions (not labeled) extending along the second direction [Fig. 5], the protrusions and the tip portions are alternately arranged in intervals along the first direction in the plan view [Fig. 5], the heat element extends along the first direction in the plan view [Fig. 1] and is disposed on the glaze layer [Fig. 2] while overlapping with the protrusions and the tip portions [Fig. 1], the protective layer is disposed on the glaze layer to cover the wiring layer and the heat element [Fig. 2], a recess (not labeled) is formed on a surface of the protective layer [Fig. 2], and the recess extends along the first direction in a manner of overlapping with the heat element in the plan view [Fig. 2]. With regard to claim 7, wherein the protective layer includes a first layer (52) and a second layer (54), in the forming of the protective layer, the second layer is formed after the first layer is formed [Fig. 2], the first layer covers the wiring layer (not shown) [Para. 0068], and the second layer covers the heat element and the first layer [Fig. 2]. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 2 and 4 are rejected under 35 U.S.C. 103 as being unpatentable over Watanabe (JP 2022059849) as applied to claim 1 above, and further in view of Kyunai (EP 4223544). With regard to claim 2, Watanabe’s thermal print head discloses all the limitations of claim 1, but does not disclose wherein a width of the recess along the second direction is within a range of about ±50 µm with respect to a width of the heat element along the second direction. However, Kyunai teaches a width of a recess [Fig. 8] along a second direction (D2) is within a range of about ±50 µm (10 to 50 µm) with respect to a width of a heat element (17c) along the second direction. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to utilize a width of a recess along a second direction within a range of ±50 µm with respect to a width of a heat element along the second direction for the purpose of reducing the thermal conduction distance to the surface of the protective layer which improves the print image quality. With regard to claim 4, Watanabe’s modified thermal print head discloses all the limitations of claim 2, and Watanabe also discloses wherein a bottom surface of the recess has an upwardly convex curved shape in a cross-sectional view perpendicular to the first direction [Fig. 2]. Allowable Subject Matter Claim 6 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claim 6 would be allowable if rewritten to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action and to include all of the limitations of the base claim and any intervening claims. Claim 6 is objected to because the prior art does not teach or make obvious “the second layer covers the first layer and uncovers an area above the heat element.” Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TRACEY M MCMILLION whose telephone number is (571)270-5193. The examiner can normally be reached Monday-Friday 6AM-2:30PM EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Ricardo Magallanes can be reached at 571-272-5960. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RICARDO I MAGALLANES/Supervisor Patent Examiner, Art Unit 2853 /TRACEY M MCMILLION/ Examiner, Art Unit 2853
Read full office action

Prosecution Timeline

Aug 05, 2024
Application Filed
Apr 03, 2026
Non-Final Rejection mailed — §102, §103, §112
Jun 23, 2026
Applicant Interview (Telephonic)
Jun 23, 2026
Examiner Interview Summary

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
88%
Grant Probability
90%
With Interview (+2.2%)
1y 11m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 633 resolved cases by this examiner. Grant probability derived from career allowance rate.

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