Prosecution Insights
Last updated: April 19, 2026
Application No. 18/795,388

ELECTRONIC ASSEMBLIES FOR MEDICAL DEVICES AND ASSOCIATED METHODS

Non-Final OA §102§103
Filed
Aug 06, 2024
Examiner
LONDON, STEPHEN FLOYD
Art Unit
3795
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
BOSTON SCIENTIFIC CORPORATION
OA Round
1 (Non-Final)
68%
Grant Probability
Favorable
1-2
OA Rounds
3y 2m
To Grant
99%
With Interview

Examiner Intelligence

Grants 68% — above average
68%
Career Allow Rate
140 granted / 205 resolved
-1.7% vs TC avg
Strong +40% interview lift
Without
With
+40.5%
Interview Lift
resolved cases with interview
Typical timeline
3y 2m
Avg Prosecution
37 currently pending
Career history
242
Total Applications
across all art units

Statute-Specific Performance

§101
2.0%
-38.0% vs TC avg
§103
36.8%
-3.2% vs TC avg
§102
24.2%
-15.8% vs TC avg
§112
30.2%
-9.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 205 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Disposition of Claims Claims 1-20 are pending and rejected. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-3, 6-17 & 19-20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Chung (US 2023/0165450). EXAMINER’S NOTE: the following rejection relies on a third embodiment (Figs. 9-10) of Chung. On Para. [0075], however, Chung discloses “other details of this [third] embodiment are similar to the ones of the first embodiment… detailed description is omitted herein for simplicity”. As such, element numbers from the first embodiment (Figs. 1-6) will be used for common structure not labeled in the third embodiment. Regarding Claim 1, Chung discloses an electronic assembly (Fig. 9, 11’’; [0073]) for a medical device (Fig. 1, 1; [0049]), the electronic assembly including: a body (Fig. 9, 111’’; [0073]) including a plurality of electrical connection points (Figs. 4-5 & 10, four image-sensing-device mounting contacts of 113’’ on 1111’’, 1131, 1132 and 1181’’; [0053], [0058] & [0075]) and a plurality of electrical traces (Figs. 9 & 10, 113’’; [0073]) in a material that is electrically insulative (Fig. 9, 111’’ is made of ceramic; [0095]), wherein the plurality of electrical connection points are on one or more external surfaces of the body (see Figs. 9 & 10), wherein the plurality of electrical connection points includes proximal connection points (Figs. 4 & 5, 1131 and 1132; [0058]) and distal connection points (Fig. 10, four image-sensing-device mounting contacts of 113’’ on 1111’’ and 1181’’; [0053] & [0075]), and wherein each electrical trace of the plurality of electrical traces connects a proximal connection point to a respective distal connection point ([0053]); at least one imaging device (Fig. 10, an image assembly comprising 112’’ and 115’’; [0073]) coupled to one or more of the distal connection points (Fig. 10, 112’’ of the image assembly is coupled to the four image-sensing-device mounting contacts of 113’’ on 1111’’ via 1121; [0053]); and at least one light source (Fig. 10, 118’’; [0074]) coupled to one or more of the distal connection points (Fig. 10, 1181’’; [0075]). Regarding Claim 2, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the at least one imaging device and the at least one light source face in a same direction (see Fig. 9). Regarding Claim 3, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the plurality of electrical connection points includes a plurality of cable connection points (Fig. 5, 1132; [0058]) and at least one sensor connection point (Fig. 4, 1131; [0058]). Regarding Claim 6, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the body includes an end face (Fig. 10, 1111’’; [0075]) and at least one arm (Fig. 10, 1118’’; [0075]) adjacent to, and extending distally of, the end face (see Fig. 10). Regarding Claim 7, Chung discloses the electronic assembly of Claim 6. Chung further discloses wherein the end face includes at least one of the distal connection points (Fig. 10, the four image-sensing-device mounting contacts of 113’’ are disposed on 1111’’; [0053] & [0075]), and the at least one imaging device is coupled to the distal connection point on the end face ([0053]). Regarding Claim 8, Chung discloses the electronic assembly of Claim 6. Chung further discloses wherein the at least one arm includes at least one of the distal connection points (Fig. 10, 1181’’; [0075]), and the at least one light source is coupled to the distal connection point on the at least one arm ([0075]). Regarding Claim 9, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the at least one light source includes two light-emitting diodes LEDs ([0075]) positioned on opposing sides of the at least one imaging device (see Figs. 9 & 10). Regarding Claim 10, Chung discloses the electronic assembly of Claim 9. Chung further discloses wherein the LEDs are proximal to the at least one imaging device (118’’ are proximal to the 115’’ of the image assembly; see Fig. 9). Regarding Claim 11, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the material of the body comprises a ceramic and/or other non-conductive materials ([0095]). Regarding Claim 12, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the plurality of electrical traces comprise copper and/or other conductive materials (Fig. 9, 113’’ is electrically conductive; [0073]). Regarding Claim 13, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the plurality of electrical traces passes through an interior of the body ([0075]). Regarding Claim 14, Chung discloses the electronic assembly of Claim 1. Chung further discloses a capacitor and a resistor (Fig. 4, 117; [0065]). Regarding Claim 15, Chung discloses the electronic assembly of Claim 1. Chung further discloses wherein the body includes an end face (Fig. 4, 1114A; [0062]) that has a curved surface (see Figs. 3 & 4). Regarding Claim 16, Chung discloses an electronic assembly (Fig. 9, 11’’; [0073]) for a medical device (Fig. 1, 1; [0049]), the electronic assembly including: a body (Fig. 9, 111’’; [0073]) that includes an end face (Fig. 10, 1111’’; [0075]) and at least one arm (Fig. 10, 1118’’; [0075]) adjacent to and extending distally of the end face (see Fig. 10), wherein the body comprises an electrically insulative material (Fig. 9, 111’’ is made of ceramic; [0095]), a plurality of electrical connection points (Figs. 4-5 & 10, four image-sensing-device mounting contacts of 113’’ on 1111’’, 1131, 1132 and 1181’’; [0053], [0058] & [0075]), and a plurality of electrically conductive traces (Figs. 9 & 10, 113’’; [0073]); at least one imaging device (Fig. 10, an image assembly comprising 112’’ and 115’’; [0073]) coupled to the end face of the body ([0053]); and at least one light source (Fig. 10, 118’’; [0074]) coupled to the at least one arm ([0075]). Regarding Claim 17, Chung discloses the electronic assembly of Claim 16. Chung further discloses wherein the plurality of electrical connection points includes proximal connection points (Figs. 4 & 5, 1131 and 1132; [0058]) and distal connection points (Fig. 10, four image-sensing-device mounting contacts of 113’’ on 1111’’ and 1181’’; [0053] & [0075]), and wherein each electrically conductive trace of the plurality of electrically conductive traces electrically connects a proximal connection point to a respective distal connection point ([0053]). Regarding Claim 19, Chung discloses an electronic assembly (Fig. 9, 11’’; [0073]) for a medical device (Fig. 1, 1; [0049]), the electronic assembly including: a body (Fig. 9, 111’’; [0073]) that includes an end face (Fig. 10, 1111’’; [0075]) and at least one arm (Fig. 10, 1118’’; [0075]) adjacent to the end face (see Fig. 10), wherein the body comprises an electrically insulative material (Fig. 9, 111’’ is made of ceramic; [0095]), a plurality of electrical connection points (Figs. 4-5 & 10, four image-sensing-device mounting contacts of 113’’ on 1111’’, 1131, 1132 and 1181’’; [0053], [0058] & [0075]) on an external surface of the body (see Figs. 9 & 10), and a plurality of electrically conductive traces (Figs. 9 & 10, 113’’; [0073]) that passes through an interior of the body between two electrical connection points of the plurality of electrical connection points ([0075]); at least one imaging device (Fig. 10, an image assembly comprising 112’’ and 115’’; [0073]) coupled to the end face ([0053]); and at least one light source (Fig. 10, 118’’; [0074]) coupled to the at least one arm ([0075]). Regarding Claim 20, Chung discloses the electronic assembly of Claim 19. Chung further discloses wherein the plurality of electrical connection points includes proximal connection points (Fig. 5, 1132; [0058]) and distal connection points (Fig. 10, four image-sensing-device mounting contacts of 113’’ on 1111’’, 1131 and 1181’’; [0053], [0058] & [0075]), a proximal portion of the body (Fig. 2, 1112; [0052]) including the proximal connection points (Fig. 5, 1132; [0058]) and an intermediate portion of the body (Fig. 9, 1113’’; [0075]) including the distal connection points (Fig. 4, 1131; [0058]), and wherein the body includes a stepped portion (Fig. 4, 1117; [0055]) between the proximal portion and the intermediate portion (see Figs. 4 & 9). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claims 4-5 & 18 are rejected under 35 U.S.C. 103 as being unpatentable over Chung (US 2023/0165450) in view of Kucklick (US 2012/0029280). Regarding Claims 4-5, Chung discloses the electronic assembly of Claim 1. Chung further discloses at least one electrical component (Fig. 4, 117; [0065]) coupled to the body on a side of the body opposite at least one electrical connection point of the plurality of electrical connection points (Figs. 4 & 5, 117 is disposed on 1115 which is a side opposite 1112 which has 1132; [0055], [0058] & [0065]). Chung fails to explicitly disclose wherein the at least one electrical component is at least one sensor; and wherein the at least one sensor includes a pressure sensor. However, Kucklick teaches an electronic assembly (Fig. 4, 7; [0038]) for a medical device (Fig. 1, 1; [0037]), the electronic assembly including: a body (Fig. 5a, 18; [0041]) including electrical connection points (Fig. 5b, 21; [0041]); an imaging device (Fig. 6, 24; [0042]) coupled to one or more of the connection points ([0041]); and a pressure sensor (Fig. 6, 22; [0041]). The advantage of the distal pressure sensor is to accurately measure pressure inside of a patient during a procedure (Kucklick; [0066]). Therefore, it would have been obvious before the effective filing date of the claimed invention to someone with ordinary skill in the art to modify the electric component as disclosed by Chung, to be the pressure sensor taught by Kucklick, to accurately measure pressure inside of a patient during a procedure (Kucklick; [0066]). Regarding Claim 18, Chung discloses the electronic assembly of Claim 16. Chung further discloses an electric component (Fig. 4, 117; [0065]) coupled to one or more of the electrical connection points of the plurality of electrical connection points (Fig. 4, 117 is coupled to 1132; [0058] & [0065]). Chung fails to explicitly disclose wherein the electrical component is pressure sensor. However, Kucklick teaches an electronic assembly (Fig. 4, 7; [0038]) for a medical device (Fig. 1, 1; [0037]), the electronic assembly including: a body (Fig. 5a, 18; [0041]) including electrical connection points (Fig. 5b, 21; [0041]); an imaging device (Fig. 6, 24; [0042]) coupled to one or more of the connection points ([0041]); and a pressure sensor (Fig. 6, 22; [0041]). The advantage of the distal pressure sensor is to accurately measure pressure inside of a patient during a procedure (Kucklick; [0066]). Therefore, it would have been obvious before the effective filing date of the claimed invention to someone with ordinary skill in the art to modify the electric component as disclosed by Chung, to be the pressure sensor taught by Kucklick, to accurately measure pressure inside of a patient during a procedure (Kucklick; [0066]). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure: Espinosa (US 2024/0268631) teaches an endoscopy device having an electrical control system. Hsu (US 2024/0180399) teaches an endoscope having a pair of LEDs with an image sensor therebetween. Yan et al. (US 2022/0061630) teaches a detection package structure for in-vivo imaging. Smith (U.S. 11,153,970) teaches an apparatus with electrical components end mounted to a PCB. Morita (US 2021/0290041) teaches a distal end portion of an endoscope. Oyama (US 2021/0127953) teaches an distal portion of an endoscope with a FPC with sandwiched between a distal surface and a distal cap. Sorensen (US 2021/0068642) teaches an arcuate tip part of an endoscope. Sorensen et al. (US 2020/0405137) teaches a distal FPC with tolerance compensating members. Loo et al. (US 2020/0221598) teaches a microelectronic device and circuit board thereof. Kuo et al. (US 2020/0196434) teaches a flexible printed circuit board assembly for an endoscope. Viebach et al. (US 2017/0127915) teaches an endoscope head with a plurality of conductive paths. Any inquiry concerning this communication or earlier communications from the examiner should be directed to STEPHEN FLOYD LONDON whose telephone number is (571)272-4478. The examiner can normally be reached Monday - Friday: 10:00 am ET - 6:00pm ET. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, MICHAEL CAREY can be reached at (571)270-7235. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /STEPHEN FLOYD LONDON/Examiner, Art Unit 3795 /MICHAEL J CAREY/Supervisory Patent Examiner, Art Unit 3795
Read full office action

Prosecution Timeline

Aug 06, 2024
Application Filed
Jan 29, 2026
Non-Final Rejection — §102, §103
Apr 16, 2026
Interview Requested

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
68%
Grant Probability
99%
With Interview (+40.5%)
3y 2m
Median Time to Grant
Low
PTA Risk
Based on 205 resolved cases by this examiner. Grant probability derived from career allow rate.

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