DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 8/12/2024 was is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by SHIN et al. (US Patent Appl. Pub. No. 2015/0129878 A1).
[Re claim 1] SHIN discloses the semiconductor memory device, comprising: a substrate (110); an integrated circuit (120, 130, 150) provided above the substrate, the integrated circuit including a first interconnect (158); a stacked body provided above the integrated circuit, the stacked body including electrode films (192, 194, 196, 198), semiconductor pillars (202), and memory films (204a, 204b, 204c) (see figure 8); a through-via (232) piercing the stacked body and connected to the first interconnect (158); and a second interconnect (236) provided above the stacked body and connected to the through-via (see figure 1B and paragraph [0044]-[0072]).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KYOUNG LEE whose telephone number is (571)272-1982. The examiner can normally be reached M to F, 10am to 6pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eliseo Ramos-Feliciano can be reached at (571)272-7925. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/KYOUNG LEE/Primary Examiner, Art Unit 2817
