Prosecution Insights
Last updated: October 15, 2026
Application No. 18/813,303

PLATE WITH ACOUSTIC BLACK HOLES

Non-Final OA §102§103
Filed
Aug 23, 2024
Examiner
OLSON, JENNIFER MAR B
Art Unit
2837
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
GM Global Technology Operations LLC
OA Round
1 (Non-Final)
55%
Grant Probability
Moderate
1-2
OA Rounds
1y 0m
Est. Remaining
77%
With Interview

Examiner Intelligence

Grants 55% of resolved cases
55%
Career Allowance Rate
51 granted / 92 resolved
-12.6% vs TC avg
Strong +21% interview lift
Without
With
+21.2%
Interview Lift
resolved cases with interview
Typical timeline
3y 2m
Avg Prosecution
16 currently pending
Career history
116
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
54.3%
+14.3% vs TC avg
§102
30.0%
-10.0% vs TC avg
§112
12.3%
-27.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 92 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 11-13, 15, 17 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Wu et al. (CN-118520588-A). Regarding Claim 11, Wu et al. discloses an acoustic black hole plate for use with an integrated power electronics (IPE) module (Integrated electric drive system with motor, reducer, inverter; Para. 0004. (See Examiner Annotated Wu Fig. 5: Panel A with three plate levels of 20 acoustic black holes B), comprising: at least one acoustic black hole for targeting panel resonant hot spots and contributes to noise, vibration, and harshness (NVH) performance (In structure of plurality of acoustic black holes B controlling accumulation of elastic waves at specific locations of the plate to reduce noise and vibration; Para. 00005-0006. Based on peak frequency vibrations; Para. 0010), each acoustic black hole including a geometric center, wherein the acoustic black hole plate has a decreasing acoustic black hole plate thickness from an outer edge of the acoustic black hole to the geometric center, wherein the decreasing acoustic black hole plate thickness traps vibration energy for efficiency attenuation (In Fig. 2: Thickness “hp” of outer edge decreases to thickness “hr” of geometric center C of acoustic black hole; Para. 0041-0042, 0056; Fig. 2; Examiner Annotated Wu Fig. 5. 70% of vibrational energy is concentrated acoustic black hole; Para. 0048); and a damper located at the geometric center (Damper C located at surface of acoustic black hole; Para. 0041;Examiner Annotated Wu Fig. 5 ). PNG media_image1.png 588 777 media_image1.png Greyscale Examiner Annotated Wu Fig. 5 Regarding claim 12, Wu et al. discloses the acoustic black hole pate of claim 11, wherein at least one acoustic black hole is at least one of circular or elliptical (In structure of a circle when described as having a radius; Para. 0019). Regarding claim 13, Wu et al. discloses the acoustic black hole pate of claim 11, wherein at least one acoustic black hole is a machined acoustic black hole (In structure of subtractive manufacturing; Para. 0049). Regarding claim 15, Wu et al. discloses the acoustic black hole pate of claim 11, wherein the acoustic black hole zone includes a 2X2 acoustic black hole array (2x2 array is included in the 5x4 array of acoustic black holes B; Examiner Annotated Wu Fig. 5). Regarding claim 17, Wu et al. discloses the acoustic black hole pate of claim 11, wherein the decreasing acoustic black hole plate thickness extends from a first surface to a second surface of the acoustic black hole plate (First surface with height “hp” to second surface with height “hr”; Fig. 2). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 16 and 18-19 is/are rejected under 35 U.S.C. 103 as being unpatentable over Wu et al. (CN-118520588-A) in view of Daley et al. (US 2022/0170526 A1). Regarding Claim 16, Wu et al. discloses the acoustic black hole pate of claim 11. Wu et al. fails to explicitly disclose wherein the decreasing acoustic black hole plate thickness has a power law tapered profile. However, Daley et al. (US 2022/0170526 A1) teaches wherein the decreasing acoustic black hole plate thickness has a power law tapered profile (Daley: Acoustic black hole effect typically achieved by decreasing height with power law taper Para. 0003-0006,0133). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the decreasing acoustic black hole plate thickness has a power law tapered profile for the purpose of causing flexural waves propagating along the direction of the acoustic black hole to decrease in wave speed (Daley: Para. 0003). Regarding Claim 18, Wu et al. discloses the acoustic black hole pate of claim 11. Wu et al. fails to explicitly disclose wherein the damper (C; Examiner Annotated Wu Fig. 5) is a single material. However, Daley et al. (US 2022/0170526 A1) teaches the damper is a single material (Daley: One or more layers of damping material; Para. 0033). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the damper is a single material for the purpose of improving performance of the acoustic black hole with a taper longer than one flexural wavelength (Daley: Para. 0007). Regarding Claim 19, Wu et al. discloses the acoustic black hole pate of claim 11. Wu et al. fails to explicitly disclose wherein the damper (C; Examiner Annotated Wu Fig. 5) is a multi-layer damper. However, Daley et al. (US 2022/0170526 A1) teaches the damper is a multi-layer damper (Daley: One or more layers of damping material; Para. 0033. Damper 2 with layers 7 and 8; Para. 0136-0140;Fig. 1). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the damper is a multi-layer damper for the purpose of optimizing absorbing energy of vibration (Daley: Para. 0033-0034), since it has been held that discovering the optimum value of a result effective variable involves only routine skill in the Art. In re Boesch, 617 F.2d 272, 205 USPQ 215 (CCPA 1980). Claim(s) 1-6, 8, 14 is/are rejected under 35 U.S.C. 103 as being unpatentable over Wu et al. (CN-118520588-A) in view of Wang et al. (US 11,116,097 B2). Regarding Claim 1, Wu et al. (CN-118520588-A) discloses an integrated power electronics (IPE) module in a vehicle (Integrated electric drive system with motor, reducer, inverter; Para. 0004), the IPE module comprising: at least one panel (Panel as inverter cover body A in Examiner Annotated Wu Fig. 5); a power inverter module (PIM) (Electric driver inverter; Para. 0010); and the at least one panel including an acoustic black hole plate, the acoustic black hole plate having an acoustic black hole zone including at least one acoustic black hole (See Examiner Annotated Wu Fig. 5: Panel A with three plate levels of 20 acoustic black holes B), wherein each acoustic black hole targets panel resonant hot spots and contributes to noise, vibration, and harshness (NVH) performance (In structure of plurality of acoustic black holes B controlling accumulation of elastic waves at specific locations of the plate to reduce noise and vibration; Para. 00005-0006. Based on peak frequency vibrations; Para. 0010), wherein each acoustic black hole includes a geometric center, wherein the acoustic black hole plate has a decreasing acoustic black hole plate thickness from an outer edge of the acoustic black hole to the geometric center, wherein the decreasing acoustic black hole plate thickness traps vibration energy for efficiency attenuation (In Fig. 2: Thickness “hp” of outer edge decreases to thickness “hr” of geometric center C of acoustic black hole; Para. 0041-0042, 0056; Fig. 2; Examiner Annotated Wu Fig. 5. 70% of vibrational energy is concentrated acoustic black hole; Para. 0048); and a damper coupled to the acoustic black hole plate and located at the geometric center (Damper C located at surface of acoustic black hole; Para. 0041;Examiner Annotated Wu Fig. 5 ). Wu et al. fails to explicitly disclose an IPE casing including at least one panel (A); a power inverter module (PIM) (Electric driver inverter; Para. 0010) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber. However, Wang et al. (US 11,116,097 B2) teaches an IPE casing including at least one panel; a power inverter module (PIM) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber (Wang: IPE casing 12 with panel 50; Col. 3, Lines 10-50; Col. 4, Lines 1-25. PIM 30 carrying casing 12, with 30 housed internally; Fig. 1-2,3A). Wang et al. and Wu et al. are in similar fields comprising damping covers for power electronic modules. Modifying Wu et al. with teachings of Wang et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein an IPE casing including at least one panel; a power inverter module (PIM) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber for the purpose of housing electrical components in a dry location while damping undesirable noise and providing electromagnetic shielding (Wang: Col. 3, Lines 44-50;Col. 4, Lines 4-10). Regarding Claim 2, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein the panel is aluminum (Panel as inverter cover body A in Examiner Annotated Wu Fig. 5 is typically an aluminum alloy; Para. 0004 ). Regarding Claim 3, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein at least one acoustic black hole is at least one of circular or elliptical (In structure of a circle when described as having a radius; Para. 0019). Regarding Claim 4, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein at least one acoustic black hole is a machined acoustic black hole (In structure of subtractive manufacturing; Para. 0049). Regarding Claim 5, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein at least one acoustic black hole (B; Examiner Annotated Wu Fig. 5) is a stamped acoustic black hole. However, Wang et al. additionally teaches wherein nonplanar geometry is stamped (Wang: Core 53 Col. 4, Lines 10-25; Fig. 3A. Acoustic black holes have nonplanar geometry). Modifying Wu et al. as modified by Wang et al. with additional teachings of Wang et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein at least one acoustic black hole is a stamped acoustic black hole for the purpose of being a commonly used method of manufacturing. Regarding Claim 6, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein the acoustic black hole zone includes a 2X2 acoustic black hole array (2x2 array is included in the 5x4 array of acoustic black holes B; Examiner Annotated Wu Fig. 5). Regarding Claim 8, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1, wherein the decreasing acoustic black hole plate thickness extends from a first surface to a second surface of the acoustic black hole plate (First surface with height “hp” to second surface with height “hr”; Fig. 2). Regarding claim 14, Wu et al. discloses the acoustic black hole pate of claim 11. Wu et al. fails to explicitly disclose wherein at least one acoustic black hole (B; Examiner Annotated Wu Fig. 5) is a stamped acoustic black hole. However, Wang et al. teaches wherein nonplanar geometry is stamped (Wang: Core 53 Col. 4, Lines 10-25; Fig. 3A. Acoustic black holes have nonplanar geometry). Modifying Wu et al. with teachings of Wang et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein at least one acoustic black hole is a stamped acoustic black hole for the purpose of being a commonly used method of manufacturing. Claim(s) 7, 9-10, and 20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Wu et al. (CN-118520588-A) in view of Wang et al. (US 11,116,097 B2) and Daley et al. (US 2022/0170526 A1). Regarding Claim 7, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1. Wu et al. as modified by Wang et al. fails to explicitly disclose wherein the decreasing acoustic black hole plate thickness has a power law tapered profile. However, Daley et al. (US 2022/0170526 A1) teaches wherein the decreasing acoustic black hole plate thickness has a power law tapered profile (Daley: Acoustic black hole effect typically achieved by decreasing height with power law taper Para. 0003-0006,0133). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. as modified by Wang et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the decreasing acoustic black hole plate thickness has a power law tapered profile for the purpose of causing flexural waves propagating along the direction of the acoustic black hole to decrease in wave speed (Daley: Para. 0003). Regarding Claim 9, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1. Wu et al. as modified by Wang et al. fails to explicitly disclose wherein the damper (C; Examiner Annotated Wu Fig. 5) is a single material. However, Daley et al. (US 2022/0170526 A1) teaches the damper is a single material (Daley: One or more layers of damping material; Para. 0033). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. as modified by Wang et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the damper is a single material for the purpose of improving performance of the acoustic black hole with a taper longer than one flexural wavelength (Daley: Para. 0007). Regarding Claim 10, Wu et al. as modified by Wang et al. disclose the integrated power electronics (IPE) module of claim 1. Wu et al. as modified by Wang et al. fails to explicitly disclose wherein the damper (C; Examiner Annotated Wu Fig. 5) is a multi-layer damper. However, Daley et al. (US 2022/0170526 A1) teaches the damper is a multi-layer damper (Daley: One or more layers of damping material; Para. 0033. Damper 2 with layers 7 and 8; Para. 0136-0140;Fig. 1). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. as modified by Wang et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the damper is a multi-layer damper for the purpose of optimizing absorbing energy of vibration (Daley: Para. 0033-0034), since it has been held that discovering the optimum value of a result effective variable involves only routine skill in the Art. In re Boesch, 617 F.2d 272, 205 USPQ 215 (CCPA 1980). Regarding Claim 20, Wu et al. discloses an integrated power electronics (IPE) module (Integrated electric drive system with motor, reducer, inverter; Para. 0004), the IPE module comprising: at least one panel (Panel as inverter cover body A in Examiner Annotated Wu Fig. 5); a power inverter module (PIM) (Electric driver inverter; Para. 0010); and the at least one panel including an acoustic black hole plate formed of aluminum (See Examiner Annotated Wu Fig. 5: Panel A with three plate levels of 20 acoustic black holes B being typically an aluminum alloy; Para. 0004), the acoustic black hole plate having an acoustic black hole zone including a 2x2 acoustic black hole array (2x2 array is included in the 5x4 array of acoustic black holes B; Examiner Annotated Wu Fig. 5), wherein each acoustic black hole targets panel resonant hot spots and contributes to noise, vibration, and harshness (NVH) performance (In structure of plurality of acoustic black holes B controlling accumulation of elastic waves at specific locations of the plate to reduce noise and vibration; Para. 00005-0006. Based on peak frequency vibrations; Para. 0010), and wherein each acoustic black hole includes a geometric center, wherein the acoustic black hole plate has a decreasing acoustic black hole plate thickness having a profile, the decreased acoustic black hole plate thickness extending from an outer edge of the acoustic black hole to the geometric center, wherein the decreasing acoustic black hole plate thickness traps vibration energy for efficiency attenuation (In Fig. 2: Thickness “hp” of outer edge decreases to thickness “hr” of geometric center C of acoustic black hole; Para. 0041-0042, 0056; Fig. 2; Examiner Annotated Wu Fig. 5. 70% of vibrational energy is concentrated acoustic black hole; Para. 0048). Wu et al. fails to explicitly disclose an IPE casing including at least one panel (A); a power inverter module (PIM) (Electric driver inverter; Para. 0010) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber; wherein the acoustic black hole plate has a decreasing acoustic black hole plate thickness having a power law profile; and a multi-layer damper located at the geometric center, wherein the multi-layer damper includes at least a first layer of aluminum and another layer of rubber. However, Wang et al. (US 11,116,097 B2) teaches an IPE casing including at least one panel; a power inverter module (PIM) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber (Wang: IPE casing 12 with panel 50; Col. 3, Lines 10-50; Col. 4, Lines 1-25. PIM 30 carrying casing 12, with 30 housed internally; Fig. 1-2,3A). Wang et al. and Wu et al. are in similar fields comprising damping covers for power electronic modules. Modifying Wu et al. with teachings of Wang et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein an IPE casing including at least one panel; a power inverter module (PIM) carrying the IPE casing, the IPE casing defining an internal chamber, wherein the PIM is housed within the internal chamber for the purpose of housing electrical components in a dry location while damping undesirable noise and providing electromagnetic shielding (Wang: Col. 3, Lines 44-50;Col. 4, Lines 4-10). Moreover, Daley et al. (US 2022/0170526 A1) teaches wherein the decreasing acoustic black hole plate thickness has a power law tapered profile (Daley: Acoustic black hole effect typically achieved by decreasing height with power law taper Para. 0003-0006,0133); and a multi-layer damper located at the geometric center (Daley: One or more layers of damping material; Para. 0033. Damper 2 with layers 7 and 8; Para. 0136-0140;Fig. 1). Daley et al. and Wu et al. are in similar fields comprising acoustic black holes. Modifying Wu et al. as modified by Wang et al. with teachings of Daley et al. would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention wherein the decreasing acoustic black hole plate thickness has a power law tapered profile for the purpose of causing flexural waves propagating along the direction of the acoustic black hole to decrease in wave speed (Daley: Para. 0003) and a multi-layer damper located at the geometric center for the purpose of optimizing absorbing energy of vibration (Daley: Para. 0033-0034), since it has been held that discovering the optimum value of a result effective variable involves only routine skill in the Art. In re Boesch, 617 F.2d 272, 205 USPQ 215 (CCPA 1980). Wu et al. as modified by Wang et al. and Daley et al. fail to explicitly disclose wherein the multi-layer damper (Daley: One or more layers of damping material; Para. 0033. Damper 2 with layers 7 and 8; Para. 0136-0140;Fig. 1) includes at least a first layer of aluminum and another layer of rubber. However, this would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention for the purpose of being commonly used materials for panel construction to reduce noise, since it has been held to be within the general skill of a worker in the art to select a known material on the basis of its suitability for the intended use as a matter of obvious design choice. In re Leshin, 125 USPQ 416. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure: US-11514878-B2. Any inquiry concerning this communication or earlier communications from the examiner should be directed to JENNIFER B OLSON whose telephone number is (571)272-3041. The examiner can normally be reached Monday - Friday, 8:00am -4:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dedei Hammond can be reached at (571)270-7938. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /JENNIFER B OLSON/Examiner, Art Unit 2837 /DEDEI K HAMMOND/Supervisory Patent Examiner, Art Unit 2837
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Prosecution Timeline

Aug 23, 2024
Application Filed
Jul 30, 2026
Non-Final Rejection mailed — §102, §103
Oct 02, 2026
Interview Requested
Oct 08, 2026
Examiner Interview Summary
Oct 08, 2026
Applicant Interview (Telephonic)
Oct 09, 2026
Response Filed

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
55%
Grant Probability
77%
With Interview (+21.2%)
3y 2m (~1y 0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 92 resolved cases by this examiner. Grant probability derived from career allowance rate.

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