DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Priority
Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim(s) 1, 2, 5-8 is/are rejected under 35 U.S.C. 103 as being unpatentable over Lee et al. (US 20100288726 hereinafter Lee).
In regards to claim 1, Lee discloses;” A printed circuit board (PCB) (abstract) core laminate , the PCB core laminate comprising: a heat-dissipating material (Fig. 2 (20)); and a PCB core (Fig. 2 ( 4 layers of (10)) embedded in the heat-dissipating material (Fig. 2 (shown)), wherein the PCB core comprises a PCB substrate and printed circuit patterns located on surfaces of the PCB substrate (Fig. 2 (12)).”
But does not directly disclose;” for a wireless power charger”, But it has been held that a recitation with respect to the manner in which a claimed apparatus is intended to be employed does not differentiate the claimed apparatus from a prior art apparatus satisfying the claimed structural limitations Ex parte Masham, 2 USPQ 2d 1647 (1987). Therefore the claimed invention is disclosed.
In regards to claim 2, a modified Lee discloses;” The PCB core laminate of claim 1, wherein: a plurality of PCB cores are embedded in the heat-dissipating material; and the plurality of PCB cores are stacked (Fig. 2 (shown)).”
In regards to claim 5, a modified Lee discloses;” The PCB core laminate of claim 4, wherein the heat-dissipating material further comprises one or more types of inorganic materials that include BN or Al203 (paragraph 0035).”
In regards to claim 6, a modified Lee discloses;” The PCB core laminate of claim 1, wherein, in the PCB core, the printed circuit patterns are disposed on upper and lower surfaces of the PCB substrate (Fig. 2 (shows conductors on both side of insulator (10)).”
In regards to claim 7, a modified Lee discloses;” The PCB core laminate of claim 6, wherein, in a cross-section of the PCB core laminate, the printed circuit pattern disposed on the upper surface of the PCB substrate and the printed circuit pattern disposed on the lower surface of the PCB substrate are arranged to correspond to each other (Fig. 2 (shown)).”
In regards to claim 8, a modified Lee discloses;” The PCB core laminate of claim 6, wherein, in a cross-section of the PCB core laminate, a difference in pattern width between the printed circuit pattern disposed on the upper surface of the PCB substrate and the printed circuit pattern disposed on the lower surface of the PCB substrate is smaller than or equal to 5% (Fig. 2 (shows conductors are the same size)).”
Allowable Subject Matter
Claims objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Claims 16-20 are allowed.
REASON FOR ALLOWANCE
The following is a statement of reasons for the indication of allowable subject matter: The prior art taken singularly or in combination fails to anticipate or fairly suggest the limitation of the independent claim, in such a manner that a rejection under 35 U.S.C. 102 or 103 would be proper. The prior art fails to teach a combination of all the features as presented in independent claim 16 with the allowable feature being:” A method of manufacturing a printed circuit board (PCB) core laminate for a wireless power charger, the method comprising: integrating a PCB core into a heat-dissipating material by insert-injection.”
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance”
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MICHAEL F MCALLISTER whose telephone number is (571)272-2453. The examiner can normally be reached Monday-Friday 7 AM-4 PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at 571-272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/MICHAEL F MCALLISTER/Examiner, Art Unit 2847
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