Prosecution Insights
Last updated: October 04, 2026
Application No. 18/842,799

ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE

Non-Final OA §102§103
Filed
Aug 30, 2024
Priority
Mar 31, 2022 — JP 2022-061179 +1 more
Examiner
NGO, HUNG V
Art Unit
Tech Center
Assignee
Shindengen Electric Manufacturing Co., Ltd.
OA Round
1 (Non-Final)
81%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
46%
With Interview

Examiner Intelligence

Grants 81% — above average
81%
Career Allowance Rate
776 granted / 957 resolved
+21.1% vs TC avg
Minimal -35% lift
Without
With
+-34.9%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 2m
Avg Prosecution
18 currently pending
Career history
967
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
56.3%
+16.3% vs TC avg
§102
36.7%
-3.3% vs TC avg
§112
2.9%
-37.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 957 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Objections Claims 15-16 are objected to because of the following informalities: “the protrusion” lacks antecedent basis. Appropriate correction is required. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1-4, 6-8 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Besshi (WO 2017/221730). Re claim 1, Besshi discloses an electrical connecting member (30) having a plate shape that is used for connecting an electrode of a semiconductor element (21) having the electrode and a wiring pattern (51) to each other, the electrical connecting member comprising: a semiconductor connection region (33) that is connected to the electrode of the semiconductor element via a conductive bonding material (63); a semiconductor non-connection region that is not connected to the electrode of the semiconductor element (Fig 3); and a wiring pattern connection region (32) that is connected to the wiring pattern, wherein a plurality of protrusions (34) are formed in the semiconductor connection region, and a first through hole (35) is formed between two protrusions disposed adjacently to each other out of the plurality of protrusions. Re claim 2, wherein the semiconductor element is a semiconductor element that has a plurality of electrodes (front main electrodes, line 192) on one surface thereof, and the electrical connecting member is used for connecting the plurality of electrodes and the wiring pattern to each other (Fig 3). Re claim 3, wherein the semiconductor element is a semiconductor element that has plural kinds of electrodes (front main electrodes, line 192) on one surface thereof, and the electrical connecting member is used for connecting one kind of electrode out of the plural kinds of electrodes and the wiring pattern to each other (Fig 3). Re claim 4, wherein the one kind of electrode is divided into a plurality of individual electrodes (front main electrodes, line 192), and the plurality of respective protrusions are formed in regions of the plurality of respective individual electrodes that correspond to the plurality of respective individual protrusions (Fig 3). Re claim 6, wherein the protrusion has a conical shape, a pyramidal shape, a circular columnar shape (tube, line 206), a prismatic shape or a semispherical shape. Re claim 7, wherein a second through hole (35) is formed in the semiconductor non-connection region (Fig 3). Re claim 8, Besshi discloses a semiconductor device comprising: a semiconductor element (21) that has an electrode; a wiring pattern (51); and an electrical connecting member (30) having a plate shape that connects the electrode of the semiconductor element and the wiring pattern, wherein the electrical connecting member is the electrical connecting member (Fig 3) Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 5 is/are rejected under 35 U.S.C. 103 as being unpatentable over Besshi (WO 2017/221730). The teaching as discussed above does not disclose wherein an area (a plane area) of the first through hole is smaller than an area (a plane area) of the protrusion. It would have been obvious to one of ordinary skill in the art at the time the invention was made to select the specific area for through hole and the protrusion of Besshi for intended use, since such a modification would have involved a mere change in the size of a component. A change in size is generally recognized as being within the level of ordinary skill in the art. In re Rose, 105 USPQ 237 (CCPA 1955). Communication Any inquiry concerning this communication or earlier communications from the examiner should be directed to HUNG V NGO whose telephone number is (571)272-1979. The examiner can normally be reached 9-5:30 M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Imani Hayman can be reached at (571) 270-5528. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /HUNG V NGO/Primary Examiner, Art Unit 2841
Read full office action

Prosecution Timeline

Aug 30, 2024
Application Filed
Aug 27, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
81%
Grant Probability
46%
With Interview (-34.9%)
2y 2m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 957 resolved cases by this examiner. Grant probability derived from career allowance rate.

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