Prosecution Insights
Last updated: October 02, 2026
Application No. 18/847,030

GRINDING WHEEL, ASSEMBLIES AND PROCESSES FOR ASSEMBLING A GRINDING WHEEL

Non-Final OA §102§103§112
Filed
Sep 13, 2024
Priority
Mar 14, 2022 — EU 22161840.8 +1 more
Examiner
MARKMAN, MAKENA
Art Unit
Tech Center
Assignee
3M Innovative Properties Company
OA Round
1 (Non-Final)
60%
Grant Probability
Moderate
1-2
OA Rounds
1y 1m
Est. Remaining
98%
With Interview

Examiner Intelligence

Grants 60% of resolved cases
60%
Career Allowance Rate
198 granted / 331 resolved
At TC average
Strong +39% interview lift
Without
With
+38.6%
Interview Lift
resolved cases with interview
Typical timeline
3y 2m
Avg Prosecution
44 currently pending
Career history
368
Total Applications
across all art units

Statute-Specific Performance

§101
0.6%
-39.4% vs TC avg
§103
44.9%
+4.9% vs TC avg
§102
23.4%
-16.6% vs TC avg
§112
27.4%
-12.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 331 resolved cases

Office Action

§102 §103 §112
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Information Disclosure Statement The Information Disclosure Statements filed on 12/27/2024 and 4/8/2026 are being considered by the Examiner. Specification Applicant is reminded of the proper content of an abstract of the disclosure. A patent abstract is a concise statement of the technical disclosure of the patent and should include that which is new in the art to which the invention pertains. The abstract should not refer to purported merits or speculative applications of the invention and should not compare the invention with the prior art. If the patent is of a basic nature, the entire technical disclosure may be new in the art, and the abstract should be directed to the entire disclosure. If the patent is in the nature of an improvement in an old apparatus, process, product, or composition, the abstract should include the technical disclosure of the improvement. The abstract should also mention by way of example any preferred modifications or alternatives. Where applicable, the abstract should include the following: (1) if a machine or apparatus, its organization and operation; (2) if an article, its method of making; (3) if a chemical compound, its identity and use; (4) if a mixture, its ingredients; (5) if a process, the steps. Extensive mechanical and design details of an apparatus should not be included in the abstract. The abstract should be in narrative form and generally limited to a single paragraph within the range of 50 to 150 words in length. See MPEP § 608.01(b) for guidelines for the preparation of patent abstracts. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 5 and 6 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 5 recites: “an upper perimetral surface whose surface normal is parallel, within +−10°,” and “surface normal is antiparallel, within +−10°, to the axis of rotation”. Claim 6 recites: “surface normal is orthogonal, within +−20°”. It is unclear how the surfaces are both parallel, antiparallel, and orthogonal while simultaneously within a degree range. Given the claims do not recite “substantially parallel/antiparallel/orthogonal”, the scope is limited to what is understood to be parallel/antiparallel/orthogonal. The claims then imparting a degree range contradict what is understood as parallel/antiparallel/orthogonal, i.e. cannot coexist. It is thus unclear what is the scope of the claimed invention. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1 and 4-11 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Uchida (JP 2004330319A); please also refer to the attached English Translation. Regarding claim 1, Uchida discloses a method of assembling an abrasive grinding wheel for rotating about an axis of rotation (see Figures 1 and 4), comprising: providing a base disk, axially symmetric about the axis of rotation of the abrasive grinding wheel (wherein surface processing roll 1 has a main body 9, which is axially symmetric about the main axis of rotation, see at least Figures 1-4), the axis of rotation defining axial directions parallel thereto and radial directions orthogonal thereto, and a radially outermost circumferential portion of the base disk defining a perimeter portion of the base disk (wherein as can be seen in Figures 1-4, there is a main axis of rotation and wherein there are axial and radial directions, and wherein there is also an outermost circumferential portion defining a perimeter), providing a first abrasive element having an abrasive surface for grinding a workpiece (see cutting and polishing band 17 having polishing grains 21 on a surface thereof, [0022]), and a major attachment surface for attaching the first abrasive element to the base disk at the perimeter portion (see Figure 1; wherein the surface opposite to grains is configured for attaching to the main body 9, see also [0022]); and providing a double-sided adhesive tape comprising a major first adhesive surface, an opposed major second adhesive surface, and a first layer of adhesive forming the major first adhesive surface ([0022]: double sided adhesive tape 15 having a thickness of 0.1-0.55mm, i.e. wherein there are opposing adhesive surfaces and a first layer of adhesive comprising the main thickness disclosed in [0022]); (b) adhering the major first adhesive surface to the base disk at the perimeter portion; (c) before or after step (b), adhering the major second adhesive surface to the attachment surface of the first abrasive element (see Figures 1-3, as well as [0016] and [0022]). Regarding claim 4, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses wherein the perimeter portion is the portion of the base disk located radially between 30 percent of the radius of the perimeter and 100 percent of the radius of the perimeter of the base disk (wherein there is a perimeter portion of the main body 9; wherein as can be seen in Figures 1-3, the perimeter portion is located about a circumferential surface of element 9, i.e. located at 100% of the radius of the perimeter of roll body 9). Regarding claim 5, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses wherein the perimeter portion comprises an upper perimetral surface whose surface normal is parallel, within +−10°, to the axis of rotation, an opposed lower perimetral surface whose surface normal is antiparallel, within +−10°, to the axis of rotation, and wherein step (b) comprises adhering the major first adhesive surface to the upper perimetral surface or to the lower perimetral surface ([0022]: wherein the band 17 is wider than the roll body 9 and protrudes from one side by about 1 to 2.5mm, and thus the adhering between the band 17 and roll body 9 as provided by double sided adhesive tape 15 include adhering at one of the perimeters). Regarding claim 6, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses wherein the perimeter portion comprises a perimetral face whose surface normal is orthogonal, within +−20°, to the axis of rotation, and wherein step (b) comprises adhering the major first adhesive surface to the perimetral face ([0022]: wherein the band 17 is wider than the roll body 9 and protrudes from one side by about 1 to 2.5mm, and thus the adhering between the band 17 and roll body 9 as provided by double sided adhesive tape 15 include adhering at one of the perimeters). Regarding claim 7, Uchida discloses abrasive element assembly (see Figures 1-3) comprising: a) an abrasive element (17) having an abrasive surface for grinding a workpiece, and a major attachment surface for attaching the abrasive element to a base disk (9) at a perimeter portion of the base disk (see cutting and polishing band 17 having polishing grains 21 on a surface thereof, [0022], configured to be attached to the main body 9 at a perimeter of the main body 9; see also Figures 1-3); and b) a double-sided adhesive tape comprising a major first adhesive surface, adapted to adhere to the perimeter portion, an opposed major second adhesive surface, and a first layer of adhesive forming the major first adhesive surface, wherein the major second adhesive surface is adhered to the major attachment surface of the abrasive element ([0022]: double sided adhesive tape 15 having a thickness of 0.1-0.55mm, i.e. wherein there are opposing adhesive surfaces and a first layer of adhesive comprising the main thickness disclosed in [0022]; see also Figures 1-4 and [0016]). Regarding claim 8, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses wherein the major attachment surface is a curved surface (see at least the curved surface on the exterior of roll 9, wherein the attachment surface of the polishing band 17 is curved when assembled on the roll 9 and tape 15). Regarding claim 9, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses wherein the major attachment surface is a flat surface (wherein the surface of the band 17 which attaches to the tape 15 is in a flat configuration when unassembled, as the band 17 comprises a belt like nonwoven fabric as the base material 19 which carries abrasive grains 21, see also the flexibility disclosed in [0035]). Regarding claim 10, Uchida discloses a base disk assembly comprising: a) a base disk (9) axially symmetric about an axis of rotation, the axis of rotation defining axial directions parallel thereto and radial directions orthogonal thereto, the base disk comprising a radially outermost circumferential portion defining a perimeter portion of the base disk (wherein surface processing roll 1 has a main body 9, which is axially symmetric about the main axis of rotation, see at least Figures 1-4; wherein as can be seen in Figures 1-4, there is a main axis of rotation and wherein there are axial and radial directions, and wherein there is also an outermost circumferential portion defining a perimeter); and b) a double-sided adhesive tape (15; see Figures 1-3) comprising: i) a major first adhesive surface, ii) a first layer of adhesive forming the major first adhesive surface, and iii) an opposed major second adhesive surface, adapted to be adhered to a major attachment surface of an abrasive element ([0022]: double sided adhesive tape 15 having a thickness of 0.1-0.55mm, i.e. wherein there are opposing adhesive surfaces and a first layer of adhesive comprising the main thickness disclosed in [0022]), wherein the major first adhesive surface is adhered to the base disk at the perimeter portion (see Figures 1-3, as well as [0016] and [0022]). Regarding claim 11, Uchida discloses an abrasive grinding wheel for rotating about an axis of rotation (see Figures 1-3), comprising: a) a base disk (9) axially symmetric about an axis of rotation of the abrasive grinding wheel, the axis of rotation defining axial directions parallel thereto and radial directions orthogonal thereto, and a radially outermost circumferential portion of the base disk defining a perimeter portion of the base disk (wherein surface processing roll 1 has a main body 9, which is axially symmetric about the main axis of rotation, see at least Figures 1-4; wherein as can be seen in Figures 1-4, there is a main axis of rotation and wherein there are axial and radial directions, and wherein there is also an outermost circumferential portion defining a perimeter); b) an abrasive element having an abrasive surface for grinding a workpiece, and a major attachment surface for attaching the abrasive element to the base disk at the perimeter portion (see cutting and polishing band 17 having polishing grains 21 on a surface thereof, [0022], configured to be attached to the main body 9 at a perimeter of the main body 9; see also Figures 1-3); and c) a double-sided adhesive tape (15; see Figures 1-3) comprising: i) a major first adhesive surface, ii) a first layer of adhesive forming the first adhesive surface, iii) an opposed major second adhesive surface ([0022]: double sided adhesive tape 15 having a thickness of 0.1-0.55mm, i.e. wherein there are opposing adhesive surfaces and a first layer of adhesive comprising the main thickness disclosed in [0022]), wherein the major first adhesive surface is adhered to the perimeter portion of the base disk, and wherein the major second adhesive surface is adhered to the major attachment surface of the abrasive element, wherein the abrasive element is secured to the perimeter portion by the double-sided adhesive tape (see Figures 1-3, as well as [0016] and [0022]). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claim(s) 2 is/are rejected under 35 U.S.C. 103 as being unpatentable over Uchida (JP 2004330319A) in view of Keipert (US 2018029194). Regarding claim 2, Uchida discloses the claimed invention as applied above. However, Uchida does not explicitly teach wherein step (b) and/or step (c) is performed by a robot. However, from the same or similar field of endeavor, Keiper teaches of a method of producing an element which is performed by a robot (see [0095]: the batch process can be practiced using automated robotic equipment; see also [0102]). It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to have incorporated the robotic automated feature taught by Keipert into the invention of Uchida. One would be motivated to do so in order to reduce operation costs (i.e. employing an operator versus an automated machine). This modification would be recognized as using a known technique, i.e. robotics in the context of manufacturing, to improve a similar device in the same manner, and would yield predictable results with a reasonable expectation of success. Claim(s) 3 is/are rejected under 35 U.S.C. 103 as being unpatentable over Uchida (JP 2004330319A) in view of Cesena (US 6,358,133). Regarding claim 3, Uchida discloses the claimed invention as applied above, wherein Uchida further discloses after steps (b) and (c), a step of: (d) curing the first layer of adhesive (wherein [0024] discloses curing of the polishing band 17 on the main body when assembled). However, Uchida does not explicitly teach the curing is performed by using heat, i.e. by applying heat to the first layer of adhesive. However, from the same or similar field of endeavor, Cesena teaches of using tape as an adhesive for mating elements (see Col. 11, lines 19-29; Col. 20, lines 57-67; Col. 21 line 65-Col. 22, line 11), and wherein the curing process includes applying heat (Col. 20, lines 6-32 teach of thermally curing; see also heat curing in Col. 20 lines 57-67; Col. 21, lines 24-29; Col. 24, lines 25-31). It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to have incorporated the teachings of Cesena into the invention of Uchida, i.e. including heat in the curing process in the context of adhesives. One would be motivated to do so in order to provide a high strength bond (Col. 20, lines 57-67), i.e. furthering the goals as pointed out by Uchida in [0024]. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Tateno (US 20240139903), see [0072] and [0108] Duescher (US 20040235406), see Figure 10, [0011], [0297] Damgaard (US 6116998), see Figure 1. Any inquiry concerning this communication or earlier communications from the examiner should be directed to MAKENA S MARKMAN whose telephone number is (469)295-9162. The examiner can normally be reached Monday-Thursday 8:00 am-6:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, David Posigian can be reached at 313-446-6546. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MAKENA S MARKMAN/Primary Examiner, Art Unit 3723
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Prosecution Timeline

Sep 13, 2024
Application Filed
Aug 24, 2026
Non-Final Rejection mailed — §102, §103, §112 (current)

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Prosecution Projections

1-2
Expected OA Rounds
60%
Grant Probability
98%
With Interview (+38.6%)
3y 2m (~1y 1m remaining)
Median Time to Grant
Low
PTA Risk
Based on 331 resolved cases by this examiner. Grant probability derived from career allowance rate.

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