Prosecution Insights
Last updated: July 17, 2026
Application No. 18/847,554

ELECTRONIC COMPONENT, CAPACITOR, AND LAMINATE

Non-Final OA §102§103
Filed
Sep 16, 2024
Priority
Mar 18, 2022 — JP 2022-044710 +1 more
Examiner
TORRES, TIMOTHY JOSEPH
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Panasonic Holdings Corporation
OA Round
1 (Non-Final)
Grant Probability
Favorable
1-2
OA Rounds

Examiner Intelligence

Grants only 0% of cases
0%
Career Allowance Rate
0 granted / 0 resolved
-68.0% vs TC avg
Minimal +0% lift
Without
With
+0.0%
Interview Lift
resolved cases with interview
Typical timeline
Avg Prosecution
11 currently pending
Career history
6
Total Applications
across all art units

Statute-Specific Performance

§103
70.0%
+30.0% vs TC avg
§102
25.0%
-15.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 0 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. Drawings The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, wherein the capacitor element includes a metalized film including a dielectric film and an electrode film on the dielectric film. must be shown or the feature(s) canceled from the claim(s). No new matter should be entered. Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 3-6, and 9-12 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hosio et al. JP 2019150987 A, hereafter referred to as Hosio. Regarding claim 1, Hosio discloses an electronic component comprising: an electronic component element (300 – Fig. 1 paras. [0049-0050]); and a barrier layer disposed outside the electronic component element (10 – Fig. 1 para. [0050]), the barrier layer including a clay layer containing clay (2 – Fig. 1 paras. [0010] and [0050]) and a water absorbing layer containing a water absorbing material (5 – Fig. 1 paras. [0039] and [0050] or 3 and 5 – Fig. 1 paras. [0010], [0039] and [0050]; clay is known to be a water absorbing material), the water absorbing layer being disposed between the electronic component element and the clay layer (Fig. 1). Regarding claim 3, Hosio discloses the electronic component of claim 1, wherein the water absorbing layer further contains a binder (para. [0038]), and the water absorbing material includes zeolite (para. [0039]). Regarding claim 4, Hosio discloses the electronic component of claim 1, wherein a content of the water absorbing material in the water absorbing layer is greater than or equal to 2.5 parts by mass with respect to 100 parts by mass of the water absorbing layer (para. [0040] discloses complete overlap with the claimed range). Regarding claim 5, Hosio discloses the electronic component of claim 1, wherein the barrier layer includes a laminate including the clay layer and the water absorbing layer (10 – Fig. 1 para. [0050]). Regarding claim 6, Hosio discloses the electronic component of claim 1, wherein the barrier layer includes a plurality of the water absorbing layers (3 and 5 – Fig. 1 paras. [0010], [0039] and [0050]; clay is known to be a water absorbing material), and at least one of the water absorbing layers being disposed between the electronic component element and the clay layer (Fig. 1). Regarding claim 9, Hosio discloses a laminate comprising: at least one clay layer containing clay which suppresses passage of moisture (2, 3 – Fig. 1 paras. [0010] and [0016]); and at least one water absorbing layer containing a water absorbing material such that the moisture passing through the at least one clay layer is absorbed by the water absorbing material (5 – Fig. 1 paras. [0016] and [0038-0039]). Regarding claim 10, Hosio discloses the laminate of claim 9, further comprising a base material layer (1 – Fig. 1 paras. [0016] and [0043]). Regarding claim 11, Hosio discloses the laminate of claim 9, further comprising an adhesion layer (para. [0045]). Regarding claim 12, Hosio discloses the laminate of claim 9, comprising a plurality of at least one of the clay layer and the water absorption layer (2, 3 – Fig. 1 paras. [0010] and [0016]). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claim(s) 1-2, 7-8, and 17-18 is/are rejected under 35 U.S.C. 103 as being unpatentable over Matsui JP 2016157755 A (hereafter referred to as Matsui) in view of Goto JP 2014022508 A (hereafter referred to as Goto). Regarding claim 1, Matsui discloses an electronic component comprising: an electronic component element (2 – Fig.2 para. [0026]); and a barrier layer disposed outside the electronic component element (6, 7, 3 – Fig. 2), the barrier layer including a resin layer (7 – Fig. 2 para. [0042]) and a water absorbing layer containing a water absorbing material (6 – Fig. 2 para. [0036]), the water absorbing layer being disposed between the electronic component element and the resin layer (Fig. 2). Matsui fails to disclose wherein the resin layer contains clay. Goto discloses a resin layer containing clay (6 – Fig. 2 para. [0024]). Therefore, it would have been obvious to one of ordinary skill in the art prior to the effective filing date of the claimed invention to include the clay particles of Goto in the resin layer of Matsui to improve the gas permeation resistance of the electronic component (para. [0024] of Goto). Regarding claim 2, Matsui as modified by Goto discloses the electronic component of claim 1, wherein the clay layer further contains a binder (the resin of Matsui is a binder), but fails to disclose that the clay contains mineral particles including a plate-shaped or thin-flake-shaped particle. Goto further discloses the clay contains mineral particles including a plate-shaped or thin-flake-shaped particle (11 – Fig. 2 paras. [0024] and [0027]). Therefore, it would have been obvious to one of ordinary skill in the art prior to the effective filing date of the claimed invention to have the clay contain mineral particles including a plate-shaped or thin-flake-shaped particle to increase the permeation path of gas, resulting in further improved gas barrier properties and protection of the electronic component element (para. [0027] or Goto). Regarding claim 7, Matsui as modified by Goto further discloses a capacitor being the electronic component of claim 1, wherein the electronic component element of the electronic component is a capacitor element (2 – Fig. 2 para. [0028] of Matsui). Regarding claim 8, Matsui as modified by Goto further discloses the capacitor of claim 7, wherein the capacitor element includes a metalized film including a dielectric film and an electrode film on the dielectric film (para. [0028] of Matsui). Regarding claim 17, Matsui as modified by Goto further discloses a capacitor being the electronic component of claim 2, wherein the electronic component element of the electronic component is a capacitor element (2 – Fig. 2 para. [0028] of Matsui). Regarding claim 18, Matsui as modified by Goto further discloses the capacitor of claim 17, wherein the capacitor element includes a metalized film including a dielectric film and an electrode film on the dielectric film (para. [0028] of Matsui). Claim(s) 2 and 13-16 is/are rejected under 35 U.S.C. 103 as being unpatentable over Hosio in view of Goto. Regarding claim 2, Hosio discloses the electronic component of claim 1, wherein the clay layer further contains a binder (para. [0026]), but fails to explicitly disclose that the clay contains mineral particles including a plate-shaped or thin-flake-shaped particle. Goto discloses the clay contains mineral particles including a plate-shaped or thin-flake-shaped particle (11 – Fig. 2 paras. [0024] and [0027]). Therefore, it would have been obvious to one of ordinary skill in the art prior to the effective filing date of the claimed invention to have the clay contain mineral particles including a plate-shaped or thin-flake-shaped particle to increase the permeation path of gas (such a s water vapor), resulting in further improved gas barrier properties and protection of the electronic component element (para. [0027] of Goto). Regarding claim 13, Hosio as modified by Goto further discloses the electronic component of claim 2, wherein the water absorbing layer further contains a binder (para. [0036] of Hosio), and the water absorbing material includes zeolite (para. [0039] of Hosio). Regarding claim 14, Hosio as modified by Goto further discloses the electronic component of claim 2, wherein a content of the water absorbing material in the water absorbing layer is greater than or equal to 2.5 parts by mass with respect to 100 parts by mass of the water absorbing layer (para. [0040] of Hosio discloses complete overlap with the claimed range). Regarding claim 15, Hosio as modified by Goto further discloses the electronic component of claim 1, wherein the barrier layer includes a laminate including the clay layer and the water absorbing layer (10 – Fig. 1 para. [0050] of Hosio). Regarding claim 16, Hoisio as modified by Goto further discloses the electronic component of claim 2, wherein the barrier layer includes a plurality of the water absorbing layers (3 and 5 – Fig. 1 paras. [0010], [0039] and [0050] of Hosio; clay is known to be a water absorbing material), and at least one of the water absorbing layers being disposed between the electronic component element and the clay layer (Fig. 1 of Hosio). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Biler et al. US 20150049419 A1 – teaches a housing with zeolite and a moisture barrier layer with clay; [0066] Majima et al. US 20200294718 A1 – teaches plate shaped mica Nagayama et al. US 20130149513 A1 – teaches plate shaped clay particles Hosomi et al. US 20150239197 A1 – Fig. 10; teaches three-layer laminates with layers that may contain clay and/or zeolite Yoon et al. CN 105378012 A – Fig. 1a; teaches plate shaped clay particles to increase path taken by moisture Takeoka et al. US 20100091425 A1 – teaches casing containing clay to protect capacitor from moisture; [0005] Communication Any inquiry concerning this communication or earlier communications from the examiner should be directed to Timothy Torres whose telephone number is (571)272-9896. The examiner can normally be reached Mon-Fri 7:30-5:00. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Dole can be reached at (571) 272-2229. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /T.J.T./Examiner, Art Unit 2847 /Timothy J. Dole/Supervisory Patent Examiner, Art Unit 2847
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Prosecution Timeline

Sep 16, 2024
Application Filed
Jun 04, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Prosecution Projections

1-2
Expected OA Rounds
Grant Probability
Low
PTA Risk
Based on 0 resolved cases by this examiner. Grant probability derived from career allowance rate.

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