Prosecution Insights
Last updated: April 19, 2026
Application No. 18/869,744

CAMERA MODULE AND ELECTRONIC DEVICE

Non-Final OA §102
Filed
Nov 26, 2024
Examiner
TISSIRE, ABDELAAZIZ
Art Unit
2638
Tech Center
2600 — Communications
Assignee
Honor Device Co., Ltd.
OA Round
1 (Non-Final)
84%
Grant Probability
Favorable
1-2
OA Rounds
2y 3m
To Grant
98%
With Interview

Examiner Intelligence

Grants 84% — above average
84%
Career Allow Rate
584 granted / 693 resolved
+22.3% vs TC avg
Moderate +13% lift
Without
With
+13.2%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
23 currently pending
Career history
716
Total Applications
across all art units

Statute-Specific Performance

§101
3.4%
-36.6% vs TC avg
§103
49.3%
+9.3% vs TC avg
§102
27.0%
-13.0% vs TC avg
§112
7.6%
-32.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 693 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Information Disclosure Statement The information disclosure statement (lDS) submitted are in compliance with the provisions of 37 CFR 1.97 and have been considered by the Examiner. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-6, 18 and 19 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by CHEN et al. (US 20210006144 A1, hereinafter “CHEN”). Regarding claim 1, CHEN teaches a camera module (Figs. 1-3&6: a camera module 100), applied to an electronic device (Figs. 1-3&6, [0029]: the camera module 100 can be applied to various electronic devices 200 having imaging capturing functions, such as mobile phones, computers, or cameras, etc.), and comprising: a lens (as illustrated by Figs. 1-3,: the camera module 100 includes housing 11 with one lens or multiple lenses); a camera circuit board, fixed to the lens (as illustrated by Figs. 1-3: the camera module 100 includes a circuit board 30); and a ground member, arranged on the camera circuit board and electrically connected to the camera circuit board, wherein the ground member is electrically connected to a ground terminal of a circuit board of the electronic device (Figs. 1-3&5, [0014]: the circuit board 30 comprises a shielded wire 310, a ground pad 311, and a closed ground loop 312 surrounding the shielded wire 310 and the ground pad 311. The ground loop 312 is electrically connected to the ground pad 311.). Regarding claim 2, CHEN teaches the camera module according to claim 1, in addition CHEN discloses further comprising: a connection structure, wherein a first end of the connection structure is electrically connected to the camera circuit board (as illustrated by Figs. 2-3, [0022]-[0023]: third portion 33 of the circuit board 30, connecting a first portion 31 and a second portion 32), and a second end of the connection structure is electrically connected to the circuit board of the electronic device (as illustrated by Figs. 2-3, [0027]: The second portion 32 further carries a connector 322, the connector 322 is used as an interface to connect the camera module 100 and an external circuit.); a distribution direction of the connection structure and the camera circuit board is a first direction, and two edges distributed on the camera circuit board along a direction perpendicular to the first direction are first edges (as illustrated by Figs. 2-3); and the ground member extends out of the camera circuit board from each of the first edges, and is electrically connected to the ground terminal of the circuit board of the electronic device (as illustrated by Fig. 2, [0014]&[0023]: ground loop 312 is electrically connected to a ground pad 311 to provide a common end with low potential for the circuit board 30). Regarding claim 3, CHEN teaches the camera module according to claim 2, in addition CHEN discloses wherein a conductive region is formed on a surface of the camera circuit board away from the lens (as illustrated by Figs. 2-3, [0028]: the third portion 33 carries two conductive layers 332), the ground member is attached to the conductive region and is electrically connected to the camera circuit board (as illustrated by Figs. 2-3, [0028]: The conductive layers 332 respectively cover two sides of the shielded wire 310, and are electrically connected to the ground pad 311 on the third portion 33.), and the ground member extends out of the camera circuit board from the first edge, and is electrically connected to the ground terminal of the circuit board of the electronic device (as illustrated by Fig. 2, [0014]: ground loop 312 is electrically connected to a ground pad 311 to provide a common end with low potential for the circuit board 30). Regarding claim 4, CHEN teaches the camera module according to claim 3, in addition CHEN discloses wherein the conductive region comprises a ground layer of the camera circuit board (as illustrated by Fig. 2, [0014]&[0023]: the ground loop 312 is electrically connected to the ground pad 311 to provide a common end with low potential for the circuit board 30). Regarding claim 5, CHEN teaches the camera module according to claim 3, in addition CHEN discloses wherein two ends of the ground member extend out of the camera circuit board respectively from the two first edges, and are electrically connected to the ground terminal of the circuit board of the electronic device (as illustrated by Fig. 2, [0014]&[0023]: the ground loop 312 is electrically connected to the ground pad 311 to provide a common end with low potential for the circuit board 30). Regarding claim 6, CHEN teaches the camera module according to claim 2, in addition CHEN discloses wherein the ground member comprises a conductive fabric or a copper sheet (as illustrated by Figs. 2-3, [0028]: The conductive layers 33 are parts of the shield structure 40. The conductive layer 332 comprises a silver foil, an aluminum foil, a copper foil, or any combination thereof.). Regarding claim 18, CHEN teaches the camera module according to claim 1, in addition CHEN discloses comprising a front camera module (Figs. 1-3&6, [0029]: the camera module 100 can be applied to various electronic devices 200 having imaging capturing functions, such as mobile phones, computers, or cameras, etc.). Regarding claim 19, claim 19 has been analyzed with regard to claim 1 and is rejected for the same reasons of anticipation as used above. Allowable Subject Matter Claims 7-17 and 20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Contact Any inquiry concerning this communication or earlier communications from the examiner should be directed to ABDELAAZIZ TISSIRE whose telephone number is (571)270-7204. The examiner can normally be reached on Monday through Friday from 8 AM to 5 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Ye Lin can be reached on 571-272-7372. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ABDELAAZIZ TISSIRE/ Primary Examiner, Art Unit 2638
Read full office action

Prosecution Timeline

Nov 26, 2024
Application Filed
Feb 20, 2026
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12593518
IMAGE SENSOR AND OPERATION METHOD THEREOF
2y 5m to grant Granted Mar 31, 2026
Patent 12587749
CONTROL APPARATUS AND CONTROL METHOD THEREFOR
2y 5m to grant Granted Mar 24, 2026
Patent 12587757
SOLID-STATE IMAGING DEVICE
2y 5m to grant Granted Mar 24, 2026
Patent 12581204
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM
2y 5m to grant Granted Mar 17, 2026
Patent 12581177
CAMERA DEVICE
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
84%
Grant Probability
98%
With Interview (+13.2%)
2y 3m
Median Time to Grant
Low
PTA Risk
Based on 693 resolved cases by this examiner. Grant probability derived from career allow rate.

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