DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of group I, in the reply filed on 2/2/26 is acknowledged.
Claims 13-20 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 2/2/26.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-12 is/are rejected under 35 U.S.C. 102a1 as being anticipated by JP 4840117.
With regards to claim 1, ‘117 teaches an electronic component comprising: a package (S1); an electronic chip (20) housed within an enclosure inside the package; a first bonding pad (21); a second bonding pad (surface on 30) configured to establish an electrical connection between the electronic chip and surrounding circuitry; a bond (40) connected to at least one of the first bonding pad or the second bonding pad; and a cleaning pad (50) housed in the package, wherein the cleaning pad is spaced from the first bonding pad and the second bonding pad (figure 1 show the spacing between 50 and 20) , and the cleaning pad is configured to be electrically disconnected from other structures or components and to enable cleaning of a bonding tool.
With regards to claim 2, the cleaning pad comprises a wire bondable material (gold or copper).
With regards to claim 3 and 4, wherein the cleaning pad comprises at least one of gold, nickel, silver, copper, cobalt, aluminum, tungsten, titanium, or a combination thereof (gold and copper).
With regards to claim 5 and 6, the first bonding pad, the second bonding pad, and the cleaning pad comprise at least one of gold, nickel, silver, copper, cobalt, aluminum, tungsten, titanium, or a combination thereof (gold or copper).
With regards to claim 7, the bond comprises a wire bond (40).
With regards to claim 8, the cleaning pad is configured to enable cleaning of the bonding tool by forming a second bond on the cleaning pad, and wherein the second bond only extends within an area of the cleaning pad (figure 3a-b and 4a-b).
With regards to claim 9, a surface area of the cleaning pad is at least two times as large as a surface area of a smallest bonding pad from the first bonding pad or the second bonding pad (the cleaning pad 50 is at least two times as large as the first bonding pad 21).
With regards to claim 10 and 11, the surface area of the cleaning pad is at least two times as large as a surface area of a largest bonding pad from the first bonding pad or the second bonding pad (the cleaning pad 50 is at least two times as large as the first bonding pad 21).
With regards to claim 12, the electronic component comprises a single case component (figure 1).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHAY LYNN KARLS whose telephone number is (571)272-1268. The examiner can normally be reached M-Th (6am-5pm).
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/SHAY KARLS/Primary Examiner, Art Unit 3723