Prosecution Insights
Last updated: October 01, 2026
Application No. 18/891,242

JUNCTION BARRIER SCHOTTKY DIODE

Non-Final OA §102
Filed
Sep 20, 2024
Priority
Mar 23, 2022 — JP 2022-047239 +1 more
Examiner
MCCALL SHEPARD, SONYA D
Art Unit
Tech Center
Assignee
TDK Corporation
OA Round
1 (Non-Final)
93%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 93% — above average
93%
Career Allowance Rate
1110 granted / 1196 resolved
+32.8% vs TC avg
Minimal +4% lift
Without
With
+3.5%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 0m
Avg Prosecution
41 currently pending
Career history
1208
Total Applications
across all art units

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
50.4%
+10.4% vs TC avg
§102
33.0%
-7.0% vs TC avg
§112
13.3%
-26.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1196 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Specification The lengthy specification has not been checked to the extent necessary to determine the presence of all possible minor errors. Applicant’s cooperation is requested in correcting any errors of which applicant may become aware in the specification. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 3-5 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ren et al. US 2018/0358478. PNG media_image1.png 530 543 media_image1.png Greyscale Ren et al. US 2018/0358478 Regarding claim 1, Ren et al. Fig. 1 and [0018]-[0026] disclose a junction barrier Schottky diode comprising: a semiconductor substrate 1 [0018]; a drift layer 2 [0018] provided on the semiconductor substrate 1; an anode electrode 5 [0018] and a p-type semiconductor layer 4 [0018] each contacting the drift layer 2 Figs. 2A-2F; an n-type semiconductor layer 8 [0018] contacting the anode electrode 5 and the drift layer 2; a metal layer (e.g. metal layer of metal layer 5) [0021] provided between the n-type semiconductor layer 8 and the p-type semiconductor layer 4; and a cathode electrode 6 [0019] contacting the semiconductor substrate. Regarding claim 3, Ren et al. Fig. 1 and [0018]-[0026] disclose the junction barrier Schottky diode as claimed in claim 1, wherein the p-type semiconductor layer 4 and the metal layer (e.g. metal layer of metal layer 5) [0021] are stacked in this order on a flat surface of the drift layer 2 Figs. 2C-2F, and wherein the n-type semiconductor layer 8 Fig. 2F covers a surface of a stacked body of the p-type semiconductor layer 4 and the metal layer (e.g. metal layer of metal layer 5) [0021] . Regarding claim 4, Ren et al. Fig. 1 and [0018]-[0026] disclose the junction barrier Schottky diode as claimed in claim 1, wherein the drift layer 2 has a trench 3 [0018] Fig. 2B, and wherein at least a part of the p-type semiconductor layer 4 [0020] is embedded in the trench 3. Regarding claim 5, Ren et al. Fig. 1 and [0018]-[0026] disclose the junction barrier Schottky diode as claimed in claim 4, wherein at least a part of the n-type semiconductor layer 8 [0020] is embedded in the trench 3. Allowable Subject Matter Claims 2 and 6 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The prior art neither anticipates nor renders obvious, in the context of the claims, Regarding claim 2, wherein the metal layer includes a first metal layer which makes ohmic contact with the n-type semiconductor layer and a second metal layer which makes ohmic contact with the p-type semiconductor layer. Regarding claim 6, wherein the p-type semiconductor layer is provided along an inner wall of the trench, and wherein the metal layer is provided between an inner wall of the p-type semiconductor layer and an outer wall of the n-type semiconductor layer. Although various prior art references disclose several individual limitations in the claims, these references, and their combinations, neither anticipate nor render obvious the above identified limitation(s), as structured and interrelated in the context of the claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SONYA D MCCALL-SHEPARD whose telephone number is (571)272-9801. The examiner can normally be reached M-F: 8:30 AM-5:00 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Julio J. Maldonado can be reached at (571)272-1864. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Sonya McCall-Shepard/ Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Sep 20, 2024
Application Filed
Sep 22, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
93%
Grant Probability
96%
With Interview (+3.5%)
2y 0m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1196 resolved cases by this examiner. Grant probability derived from career allowance rate.

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