Prosecution Insights
Last updated: October 02, 2026
Application No. 18/892,761

CHUCK FOR WAFER BONDING DEVICE

Non-Final OA §103
Filed
Sep 23, 2024
Priority
Jan 02, 2024 — RE 10-2024-0000199
Examiner
ADDISU, SARA
Art Unit
3722
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Samsung Electronics Co., Ltd.
OA Round
1 (Non-Final)
85%
Grant Probability
Favorable
1-2
OA Rounds
10m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 85% — above average
85%
Career Allowance Rate
694 granted / 813 resolved
+15.4% vs TC avg
Moderate +11% lift
Without
With
+10.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 10m
Avg Prosecution
28 currently pending
Career history
831
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
42.1%
+2.1% vs TC avg
§102
27.3%
-12.7% vs TC avg
§112
26.1%
-13.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 813 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1, 9-11, 17 and 18 are rejected under 35 U.S.C. 103 as being unpatentable over Mori et al. (US Pub. No. 2023/0197672). Regarding claim 1, Mori discloses a chuck for a wafer bonding device, the chuck comprising: a body (71); a chuck portion (72) installed on the body and that forms an internal space (S) together with the body, and includes a partition (74) that divides the internal space; a valve (77a) installed on the body that provides pneumatic pressure to each divided internal space; and, wherein the valve adjusts and supplies pneumatic pressure to the divided internal space so that a shape of an upper surface of a deformable plate of the chuck portion is deformed (figures 5A/B). Mori is silent about having a sensor, however, Examiner takes Official Notice that it is old and well known in the chucking environment to have a sensor for measuring and adjusting pneumatic pressure. Regarding claims 9 and 18, Mori discloses the valve and the sensor are connected to a controller (30), and the controller determines a deformation state of the upper surface of the deformable plate from a distance to the partition extracted from a signal received from the sensor, and adjusts a shape of the upper surface of the deformable plate by adjusting the pneumatic pressure (abstract). Regarding claims 10 and 11, Mori discloses wherein the deformable plate has a thickness that decreases from a center toward an edge and a bottom of the deformable plate is downwardly convex (figure 5A). Regarding claim 17, it would have been obvious to one having ordinary skill in the art at the time the invention was made to increase the number of valves, sensors, inlet/outlets depending on the size of the chuck/wafer, since it has been held that mere duplication of the essential working parts of a device involves only routine skill in the art. St. Regis Paper Co. v. Bemis Co., 193 USPQ 8. Allowable Subject Matter Claims 2-8, 12-16, 19 and 20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SARA ADDISU at (571) 272-6082. The examiner can normally be reached on Monday - Friday 9:00 am - 5:00 pm (Mondays and Wednesday-Friday). If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Sunil K. Singh can be reached on (571) 272-3460. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SARA ADDISU/Primary Examiner, Art Unit 3722 9/4/26
Read full office action

Prosecution Timeline

Sep 23, 2024
Application Filed
Sep 10, 2026
Non-Final Rejection mailed — §103
Sep 29, 2026
Interview Requested

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
85%
Grant Probability
96%
With Interview (+10.7%)
2y 10m (~10m remaining)
Median Time to Grant
Low
PTA Risk
Based on 813 resolved cases by this examiner. Grant probability derived from career allowance rate.

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