DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1-2, 8, 11-12 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Islam et al. (US 20200057218; “Islam”).
Regarding claim 1, Islam teaches a photonics package, comprising: a substrate 412 (e.g., fig. 4B) having an opening (e.g., fig. 4B; ¶ 0039) therein; a photonics die coupled to the substrate, the photonics die 402 having a top and a bottom (e.g., fig. 4B), and the photonics die having an optical interconnect therein (e.g., fig. 4B, ¶ 0038), the optical interconnect exposed at the bottom of the photonics die and overlapping with the opening in the substrate (e.g., fig. 4B, ¶ 0038-0039); and a die 202 coupled to the top of the photonics die 402, the die outside of a footprint of the optical interconnect in the photonics die (e.g., fig. 4B; ASICS 202 is outside footprint of where light is transmitted from element 402 from the lens 410).
Regarding claim 2, Islam teaches photonics package of claim 1, further comprising: an optical coupler 410 in the opening in the substrate 412, the optical coupler coupled to the optical interconnect in the photonics die (e.g., fig. 4B, ¶ 0038-0039).
Regarding claim 8, Islam teaches photonics package of claim 1, further comprising: a heat spreader (e.g., fig. 4B see heat spreader in fig. 4B analogous to heat spreader 510in fig. 5) over the substrate 412, the photonics die 402 , and the die/ASICS 202.
Regarding claim 2, Islam teaches a photonics system, comprising: a board 404 (e.g., fig. 4B); and a photonics package coupled to the board 404 (e.g., fig. 4B), the photonics package comprising: a substrate 412 having an opening therein (e.g., fig. 4B, ¶ 0038-0039); a photonics die coupled to the substrate, the photonics die having a top and a bottom, and the photonics die having an optical interconnect therein, the optical interconnect exposed at the bottom of the photonics die and overlapping with the opening in the substrate (e.g., fig. 4B, ¶ 0038-0039); and a die coupled to the top of the photonics die, the die outside of a footprint of the optical interconnect in the photonics die (e.g., fig. 4B, ¶ 0038-0039).
Regarding claim 12, Islam teaches the photonics system of claim 11, further comprising: an optical coupler in the opening in the substrate (e.g., fig. 4B, ¶ 0038-0039), the optical coupler coupled to the optical interconnect in the photonics die (e.g., fig. 4B, ¶ 0038-0039).
Allowable Subject Matter
Claims 3-7, 9-10, 13-20 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to Mr. Michael Mooney whose telephone number is 571-272-2422. The examiner can normally be reached during weekdays, M-F.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Uyen-Chau Le can be reached on 571-272-2397. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of an application may be obtained from the Patent Center. Should you have questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). For checking the filing status of an application, please refer to <https://www.uspto.gov/patents/apply/checking-application-status/check-filing-status-your-patent-application>.
/MICHAEL P MOONEY/Primary Examiner, Art Unit 2874
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