DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Double Patenting
The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13.
The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer.
Claims 31-62 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-13, 15-17, 19-27 of U.S. Patent No. 12,142,399. Although the claims at issue are not identical, they are not patentably distinct from each other because see below.
Application: 18/911,139
Patent No. US 12,142,399
31. (New) An apparatus, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer, the second layer different than the first layer; an outer member on the inner member, the outer member being electrically conductive; and a thermal management feature on the outer member, the thermal management feature configured to provide a solar absorptivity not exceeding about 0.6 at a wavelength not exceeding about 2.5 µm, at an operating temperature of at least about 60 0C such that the thermal management feature is configured to maintain a temperature of the first layer below the glass transition temperature or melting temperature of the first layer.
32. (New) The apparatus of claim 31, wherein the thermal management feature is configured to provide a radiative emissivity of at least about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm at the operating temperature of at least about 60 0C.
1. An apparatus, comprising: a strength member, including: a core having a glass transition temperature or melting temperature and an encapsulation layer disposed around the core; a conductor layer disposed around the strength member; and an outer layer disposed on the conductor layer, the outer layer having a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius such that the outer layer is configured to maintain the core of the strength member below its glass transition temperature or melting temperature.
33. (New) The apparatus of claim 32, wherein the thermal management feature is configured to provide a radiative emissivity of at least about 0.75 at a wavelength of about 6 µm, and a solar absorptivity not exceeding about 0.3 at a wavelength of less than about 2.5 µm, at an operating temperature in a range of about 60 0C to about 250 °C.
2. The apparatus of claim 1, wherein the coating is formulated to have a radiative emissivity of equal to or greater than 0.75 at a wavelength of about 6 microns, and a solar absorptivity of less than 0.3 at a wavelength of less than 2.5 microns at an operating temperature of about 200 degrees Celsius.
34. (New) The apparatus of claim 31, wherein the thermal management feature includes: microstructures sized between about 3 µm to about 15 µm and nanostructures sized between about 50 nm to about 700 nm, the microstructures and nanostructures configured to enable the thermal management feature to achieve a radiative emissivity of at least about 0.5 and a solar absorptivity not exceeding about 0.5.
3. The apparatus of claim 1, wherein the coating includes: microstructures having a size in a range of 3 microns to 15 microns, the microstructures configured to cause the coating to have the radiative emissivity of greater than 0.5; and nanoporosities having a size in a range of 50 nm to 700 nm, the nanostructures configured to cause the coating to have the solar absorptivity in the range of less than 0.5.
35. (New) The apparatus of claim 34, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
5. The apparatus of claim 3, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
36. (New) The apparatus of claim 35, wherein the microstructures include a carbonate.
6. The apparatus of claim 5, wherein the microstructures include a carbonate.
37. (New) The apparatus of claim 31, wherein the thermal management feature includes a fluoropolymer and/or polyurethane.
4. The apparatus of claim 3, wherein the coating includes a fluoropolymer and/or polyurethane.
38. (New) The apparatus of claim 32, wherein the thermal management feature includes: an inner layer disposed on the outer member, the inner layer configured to provide the radiative emissivity of at least about 0.5; and an outer layer disposed on the inner layer, the outer layer configured to provide the solar absorptivity of less than 0.5.
7. The apparatus of claim 1, wherein the coating includes: a first layer disposed on the conductor layer, the first layer having the radiative emissivity of greater than 0.5; and a second layer disposed over the first layer, the second layer having the solar absorptivity of less than 0.5.
39. (New) The apparatus of claim 31, further comprising: an inner coating disposed between the second layer of the inner member and the outer member, the inner coating configured to provide a heat absorptivity not exceeding about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm, at an operating temperature in a range of 60 0C to 250 °C.
8. The apparatus of claim 1, wherein the apparatus further includes: an inner coating disposed between the encapsulation layer and the conductor layer, the inner coating formulated to have a heat absorptivity of less than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
40. (New) The apparatus of claim 31, wherein the outer member includes a plurality of conductive strands disposed around the inner member.
9. The apparatus of claim 1, wherein the conductor layer includes a plurality of conductive strands disposed around the strength member.
41. (New) The apparatus of claim 31, wherein the thermal management feature is configured to provide an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
10. The apparatus of any one of claim 1, wherein the coating is formulated to have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
42. (New) The apparatus of claim 31, wherein the thermal management feature is hydrophilic.
11. The apparatus of any one of claim 1, wherein the coating is hydrophilic.
43. (New) An apparatus, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer, an outer surface of the second layer configured to provide a radiative absorptivity not exceeding about 0.6 at a wavelength of at least about 2.5 µm corresponding to an operating temperature of at least about 60 °C; and an outer member on the inner member, wherein the radiative absorptivity provided by the outer surface enables a temperature of the first layer to remain below its glass transition temperature or melting temperature.
12. An apparatus, comprising: a strength member, including: a core having a glass transition temperature or melting temperature and an encapsulation layer disposed around the core, an outer surface of the encapsulation layer having a radiative absorptivity of less than 0.6 at a wavelength in a range of 2.5 microns to 15 microns corresponding to an operating temperature of greater than 90 degrees Celsius; a conductor layer disposed around the strength member and configured to transmit electrical signals therethrough, wherein the reflectivity of the outer surface is configured to cause a temperature of the core to be maintained below its glass transition temperature or melting temperature.
44. (New) The apparatus of claim 43, wherein the outer surface of the second layer is treated so as to provide a reflectivity of greater than or equal to 50% at the wavelength of at least about 2.5 µm.
13. The apparatus of claim 12, wherein the outer surface of the encapsulation layer is treated so as to have the reflectivity of greater than 50%.
45. (New) The apparatus of claim 43, further comprising: a thermal management layer disposed on the outer member, the thermal management layer configured to provide a solar absorptivity of equal to or less than about 0.6 at a wavelength not exceeding about 2.5 µm, and a radiative emissivity of equal to or greater than about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm, at an operating temperature of at least about 60 °C.
15. The apparatus of claim 12, wherein a coating is disposed on the conductor layer, the coating formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
46. (New) The apparatus of claim 45, wherein the thermal management layer is configured to provide a radiative emissivity of equal to or greater than about 0.75 at a wavelength of about 6 µm, and a solar absorptivity of less than about 0.3 at a wavelength of less than 2.5 µm at an operating temperature of about 200 °C.
16. The apparatus of claim 15, wherein the coating is formulated to have a radiative emissivity of equal to or greater than 0.75 at a wavelength of about 6 microns, and a solar absorptivity of less than 0.3 at a wavelength of less than 2.5 microns at an operating temperature of about 200 degrees Celsius.
47. (New) The apparatus of claim 45, wherein the thermal management layer includes: microstructures sized between about 3 µm to about 15 µm and nanostructures sized between about 50 nm to about 700 nm, the microstructures and nanostructures configured to enable the thermal management layer to achieve a radiative emissivity of at least about 0.5 and a solar absorptivity not exceeding about 0.5.
17. The apparatus of claim 15, wherein the coating includes: microstructures having a size in a range of 3 microns to 15 microns, the microstructures configured to cause the coating to have the radiative emissivity of greater than 0.5; and nanoporosities having a size in a range of 50 nm to 700 nm, the nanostructures configured to cause the coating to have the solar absorptivity in the range of less than 0.5.
48. (New) The apparatus of claim 47, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
19. The apparatus of claim 17, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
49. (New) The apparatus of claim 48, wherein the microstructures include a carbonate.
20. The apparatus of claim 19, wherein the microstructures include a carbonate.
50. (New) The apparatus of claim 45, wherein the thermal management layer is configured to provide an erosion resistance that is at least about 100% greater than the erosion resistance of aluminum or aluminum alloys.
21. The apparatus of claim 12, wherein the coating has an erosion resistance that is at least about 100% greater than the erosion resistance of aluminum or aluminum alloys.
51. (New) The apparatus of claim 45, wherein the thermal management layer is configured to have a Vicker hardness of at least about 175 MPa.
22. The apparatus of claim 12, wherein the coating has a Vicker hardness of greater than 175 MPa.
52. (New) An assembly, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer; an outer member on the inner member; a coupler coupled to an axial end of at least one of the inner member or the outer member; and a thermal management layer on an outer surface of the coupler, the thermal management layer configured to provide a solar absorptivity of not exceeding about 0.6 at a wavelength of not exceeding about 2.5 µm and an operating temperature of at least about 60 °C such that the thermal management layer maintains the first layer below its glass transition temperature or melting temperature.
53. (New) The assembly of claim 52, wherein the thermal management layer is configured to provide a radiative emissivity of at least about 0.5 at a wavelength of at least about 2.5 µm at the operating temperature of at least about 60 °C.
23. An assembly, comprising: a conductor, including: a strength member, including: a core formed having a glass transition temperature or melting temperature and an encapsulation layer disposed around the core; a conductor layer disposed around the strength member; a coupler coupled to an axial and of the conductor; and a coating disposed on an outer surface of the coupler, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius such that the coating is configured to maintain the core of the strength member below its glass transition temperature or melting temperature.
54. (New) The assembly of claim 52, wherein the thermal management layer is a first thermal management layer, the assembly further comprising: a second thermal management layer on at least a portion of an outer surface of the outer member, the second thermal management layer configured to provide a solar absorptivity of less than 0.5 at a wavelength of less than about 2.5 µm, at an operating temperature in a range of 60 °C to 250 °C.
55. (New) The assembly of claim 54, wherein the second thermal management layer is configured to provide a radiative emissivity of greater than about 0.5 at a wavelength in a range of 2.5 µm to 15 µm, at an operating temperature in a range of 60 °C to 250 °C.
24. The assembly of claim 23, wherein the coating is a first coating, the assembly further comprising: a second coating disposed on at least a portion of an outer surface of the conductor layer of the conductor, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
56. (New) The assembly of claim 54, wherein the second thermal management layer is disposed on a portion of the outer member that is disposed axially outwards of the coupler.
25. The assembly of claim 24, wherein the second coating is disposed on a portion of the conductor layer that is disposed axially outwards of the coupler.
57. (New) The assembly of claim 52, wherein the coupler is crimped to the axial end of at least one of the inner member or the outer member.
26. The assembly of any one of claim 23, wherein the coupler is crimped to the axial end of the conductor.
58. (New) The assembly of claim 57, wherein a predetermined length of the outer member at an axial end thereof is removed before coupling the coupler such that coupler is crimped to the inner member.
27. The assembly of claim 26, wherein a predetermined length of the conductor layer at the axial end of the conductor is removed before coupling the coupler to the conductor such that coupler is crimped to the strength member.
59. (New) An apparatus, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer, the second layer different than the first layer;an outer member on the inner member, the outer member being electrically conductive; and a thermal management feature on the outer member, the thermal management feature configured to provide a radiative emissivity of at least about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm, at an operating temperature of at least about 60 °C, such that the thermal management feature is configured to maintain a temperature of the first layer below the glass transition temperature or melting temperature of the first layer.
61. (New) The apparatus of claim 59, wherein the thermal management feature is configured to provide a solar absorptivity of not exceeding about 0.6 at a wavelength of not exceeding about 2.5 µm at the operating temperature of at least about 60 °C.
1. An apparatus, comprising: a strength member, including: a core having a glass transition temperature or melting temperature and an encapsulation layer disposed around the core; a conductor layer disposed around the strength member; and an outer layer disposed on the conductor layer, the outer layer having a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius such that the outer layer is configured to maintain the core of the strength member below its glass transition temperature or melting temperature.
60. (New) The apparatus of claim 59, wherein the thermal management feature includes: microstructures having a size in a range of about 3 µm to about 15 µm, the microstructures configured to enable the thermal management feature to have the radiative emissivity of at least about 0.5.
3. The apparatus of claim 1, wherein the coating includes: microstructures having a size in a range of 3 microns to 15 microns, the microstructures configured to cause the coating to have the radiative emissivity of greater than 0.5; and nanoporosities having a size in a range of 50 nm to 700 nm, the nanostructures configured to cause the coating to have the solar absorptivity in the range of less than 0.5.
62. (New) The apparatus of claim 61, wherein the thermal management feature includes: nanostructures having a size in a range of about 50 nm to about 700 nm, the nanostructures configured to enable the thermal management feature to have the solar absorptivity of not exceeding about 0.6.
3. The apparatus of claim 1, wherein the coating includes: microstructures having a size in a range of 3 microns to 15 microns, the microstructures configured to cause the coating to have the radiative emissivity of greater than 0.5; and nanoporosities having a size in a range of 50 nm to 700 nm, the nanostructures configured to cause the coating to have the solar absorptivity in the range of less than 0.5.
Claims 31-42, 52-58 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-11, 24-28 of U.S. Patent No. US 11,854,721. Although the claims at issue are not identical, they are not patentably distinct from each other because see below.
Application: 18/911,139
Patent No. US 11,854,721
31. (New) An apparatus, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer, the second layer different than the first layer; an outer member on the inner member, the outer member being electrically conductive; and a thermal management feature on the outer member, the thermal management feature configured to provide a solar absorptivity not exceeding about 0.6 at a wavelength not exceeding about 2.5 µm, at an operating temperature of at least about 60 0C such that the thermal management feature is configured to maintain a temperature of the first layer below the glass transition temperature or melting temperature of the first layer.
1. An apparatus, comprising: a strength member, including: a core formed of a composite material having a glass transition temperature or melting temperature in a range of 70° C. to 250° C., and an encapsulation layer disposed around the core, the encapsulation layer formed of a conductive material; a conductor layer disposed around the strength member; and a coating disposed on the conductor layer, the coating formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius such that the coating is configured to maintain the core of the strength member below its glass transition temperature or melting temperature.
32. (New) The apparatus of claim 31, wherein the thermal management feature is configured to provide a radiative emissivity of at least about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm at the operating temperature of at least about 60 0C.
2. The apparatus of claim 1, wherein the coating is formulated to have a radiative emissivity of equal to or greater than 0.75 at a wavelength of about 6 microns, and a solar absorptivity of less than 0.3 at a wavelength of less than 2.5 microns at an operating temperature of about 200 degrees Celsius.
33. (New) The apparatus of claim 32, wherein the thermal management feature is configured to provide a radiative emissivity of at least about 0.75 at a wavelength of about 6 µm, and a solar absorptivity not exceeding about 0.3 at a wavelength of less than about 2.5 µm, at an operating temperature in a range of about 60 0C to about 250 °C.
2. The apparatus of claim 1, wherein the coating is formulated to have a radiative emissivity of equal to or greater than 0.75 at a wavelength of about 6 microns, and a solar absorptivity of less than 0.3 at a wavelength of less than 2.5 microns at an operating temperature of about 200 degrees Celsius.
34. (New) The apparatus of claim 31, wherein the thermal management feature includes: microstructures sized between about 3 µm to about 15 µm and nanostructures sized between about 50 nm to about 700 nm, the microstructures and nanostructures configured to enable the thermal management feature to achieve a radiative emissivity of at least about 0.5 and a solar absorptivity not exceeding about 0.5.
3. The apparatus of claim 1, wherein the coating includes: microstructures having a size in a range of 3 microns to 15 microns, the microstructures configured to cause the coating to have the radiative emissivity of greater than 0.5; and nanoporosities having a size in a range of 50 nm to 700 nm, the nanostructures configured to cause the coating to have the solar absorptivity in the range of less than 0.5.
35. (New) The apparatus of claim 34, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
5. The apparatus of claim 3, wherein the microstructures include at least one of metal oxides, metal nitrides, metal fluorides, metal carbides, metal carbonates, or rare earth elements.
36. (New) The apparatus of claim 35, wherein the microstructures include a carbonate.
6. The apparatus of claim 5, wherein the microstructures include a carbonate.
37. (New) The apparatus of claim 31, wherein the thermal management feature includes a fluoropolymer and/or polyurethane.
4. The apparatus of claim 3, wherein the coating includes a fluoropolymer and/or polyurethane.
38. (New) The apparatus of claim 32, wherein the thermal management feature includes: an inner layer disposed on the outer member, the inner layer configured to provide the radiative emissivity of at least about 0.5; and an outer layer disposed on the inner layer, the outer layer configured to provide the solar absorptivity of less than 0.5.
7. The apparatus of claim 1, wherein the coating includes: a first layer disposed on the conductor layer, the first layer having the radiative emissivity of greater than 0.5; and a second layer disposed over the first layer, the second layer having the solar absorptivity of less than 0.5.
39. (New) The apparatus of claim 31, further comprising: an inner coating disposed between the second layer of the inner member and the outer member, the inner coating configured to provide a heat absorptivity not exceeding about 0.5 at a wavelength in a range of about 2.5 µm to about 15 µm, at an operating temperature in a range of 60 0C to 250 °C.
8. The apparatus of any one of claims 1, wherein the apparatus further includes: an inner coating disposed between the encapsulation layer and the conductor layer, the inner coating formulated to have a heat absorptivity of less than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
40. (New) The apparatus of claim 31, wherein the outer member includes a plurality of conductive strands disposed around the inner member.
9. The apparatus of any one of claims 1, wherein the conductor layer includes a plurality of conductive strands disposed around the strength member.
41. (New) The apparatus of claim 31, wherein the thermal management feature is configured to provide an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
10. The apparatus of any one of claims 1, wherein the coating is formulated to have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.
42. (New) The apparatus of claim 31, wherein the thermal management feature is hydrophilic.
11. The apparatus of any one of claims 1, wherein the coating is hydrophilic.
52. (New) An assembly, comprising: an inner member, including: a first layer having a glass transition temperature or melting temperature; and a second layer on the first layer; an outer member on the inner member; a coupler coupled to an axial end of at least one of the inner member or the outer member; and a thermal management layer on an outer surface of the coupler, the thermal management layer configured to provide a solar absorptivity of not exceeding about 0.6 at a wavelength of not exceeding about 2.5 µm and an operating temperature of at least about 60 °C such that the thermal management layer maintains the first layer below its glass transition temperature or melting temperature.
24. An assembly, comprising: a conductor, including: a strength member, including: a core formed of a composite material having a glass transition temperature or melting temperature in a range of 70° C. to 250° C., and an encapsulation layer disposed around the core, the encapsulation layer formed of a conductive material; a conductor layer disposed around the strength member; a coupler coupled to an axial and of the conductor; and a coating disposed on an outer surface of the coupler, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius such that the coating is configured to maintain the core of the strength member below its glass transition temperature or melting temperature.
53. (New) The assembly of claim 52, wherein the thermal management layer is configured to provide a radiative emissivity of at least about 0.5 at a wavelength of at least about 2.5 µm at the operating temperature of at least about 60 °C.
25. The assembly of claim 24, wherein the coating is a first coating, the assembly further comprising: a second coating disposed on at least a portion of an outer surface of the conductor layer of the conductor, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
54. (New) The assembly of claim 52, wherein the thermal management layer is a first thermal management layer, the assembly further comprising: a second thermal management layer on at least a portion of an outer surface of the outer member, the second thermal management layer configured to provide a solar absorptivity of less than 0.5 at a wavelength of less than about 2.5 µm, at an operating temperature in a range of 60 °C to 250 °C.
25. The assembly of claim 24, wherein the coating is a first coating, the assembly further comprising: a second coating disposed on at least a portion of an outer surface of the conductor layer of the conductor, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
55. (New) The assembly of claim 54, wherein the second thermal management layer is configured to provide a radiative emissivity of greater than about 0.5 at a wavelength in a range of 2.5 µm to 15 µm, at an operating temperature in a range of 60 °C to 250 °C.
25. The assembly of claim 24, wherein the coating is a first coating, the assembly further comprising: a second coating disposed on at least a portion of an outer surface of the conductor layer of the conductor, the coating formulated to have at least one of a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns or a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
56. (New) The assembly of claim 54, wherein the second thermal management layer is disposed on a portion of the outer member that is disposed axially outwards of the coupler.
26. The assembly of claim 25, wherein the second coating is disposed on a portion of the conductor layer that is disposed axially outwards of the coupler.
57. (New) The assembly of claim 52, wherein the coupler is crimped to the axial end of at least one of the inner member or the outer member.
27. The assembly of any one of claims 24, wherein the coupler is crimped to the axial end of the conductor.
58. (New) The assembly of claim 57, wherein a predetermined length of the outer member at an axial end thereof is removed before coupling the coupler such that coupler is crimped to the inner member.
28. The assembly of claim 27, wherein a predetermined length of the conductor layer at the axial end of the conductor is removed before coupling the coupler to the conductor such that coupler is crimped to the strength member.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Ranganathan et al. (Pub. No. US 2018/0211746) discloses a power transmission cable having a coating having a solar absorptivity of about 0.4 or greater and a heat emissivity greater than or equal to 0.5.
Ranganathan et al. (Pub. No. US 2015/0194240) discloses a overhead conductor having a coating with an emissivity of 0.5 or greater and a solar absorptivity of 0.6 or less.
Coogan et al. (Pub. No. US 2021/0246320) discloses a coating disposed on a conductor layer, wherein the coating has a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to AMOL H PATEL whose telephone number is (571)270-7833. The examiner can normally be reached 9:30AM-6:00PM.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, TIMOTHY THOMPSON can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/AMOL H PATEL/Examiner, Art Unit 2847
/TIMOTHY J THOMPSON/Supervisory Patent Examiner, Art Unit 2847
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