DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
Claim 3-6, 11, 13, 14, and 15 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Regarding claim 3-6, 11, 13, 14, and 15, the phrase "for example" renders the claim indefinite because it is unclear whether the limitation(s) following the phrase are part of the claimed invention. See MPEP § 2173.05(d).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 1-14 is/are rejected under 35 U.S.C. 103 as being unpatentable over Shi (20220066036) in view of Raybe (7116557).
Referring to claim 1, Shi shows an optical sensor module (see figure 1) comprising:
a light-emitting device (see figure 1A and 1B note Ref 120);
a module cap adapted to at least partially cover the light-emitting device (see figure 1a Ref 104), the module cap comprising a first opening located over the light-emitting device (see the opening over the light source shown in figure 1A over the light source also see figure 3A note the opening in the cover);
at least a conductive strip assembled with, or included in, the module cap (see the conductive strip as shown in figure 5A and 5B note the conductive strips 510);
a glass positioned in the first opening or between the first opening and the light-emitting device, and/or covering the first opening, and adapted to transmit light signals emitted by the light-emitting device (see figure 2A Ref 214 also see paragraph 18 note the glass), the glass including a conductive trace (see paragraph 18 note the transparent conductive circuit); and
at least a conductive bond
Raybe shows similar prior art that solves a common problem of electrical connections to multiple elements that includes the use a wire bond to electrically connect multiple electrical components (see column 2 lines 15-35). It would have been obvious to include the use of the wire bonding as shown by Raybe because this allows for a flexible connection between the rigid electrical connections. It is well known that optical sensors like the sensor shown by Shi are in vehicle borne environments that may induce vibrations that would otherwise generate an unstable electrical connection. The flexible connection as shown by Raybe would allow for better longevity of the EM shield in a vehicle borne environment.
Referring to claim 2, the combination of Shi and Raybe renders obvious the material of each conductive wire comprises one or a plurality of the following materials: gold, copper, aluminum, silver, or a tin alloy (see paragraph 61 of Shi note the connection can be made with gold also see column 5 lines 60-column 6 line 14).
Referring to claim 3, the combination of Shi and Raybe shows the at least one conductive wire has a thickness lower than or equal to 40 μm, for example lower than or equal to 20 μm, and/or a length lower than or equal to 2 mm (see Raybe column 5 line 60-column 6 line 14).
Referring to claim 4, Shi shows a substrate with which the module cap is assembled, the at least one conductive strip being coupled to at least a first conductive pad of the substrate, for example using a conductive adhesive material (see paragraph 62).
Referring to claim 5, Shi shows the substrate comprises a conductive rail configured to be at a fixed voltage, for example ground, the conductive rail being coupled to one of the at least one first conductive pad (see paragraph 62).
Referring to claim 6, Shi shows the glass further includes at least a second conductive pad coupled to the conductive trace, for example the at least one second conductive pad is connected to an end of the conductive trace, the at least one conductive strip being coupled to the at least one second conductive pad using the at least one conductive wire (see paragraph 18).
Referring to claim 7, Shi shows the at least one conductive wire and/or the bonding of the at least one conductive wire is arranged to be broken if the glass becomes detached from the module cap (see paragraph 18).
Referring to claim 8, Shi shows a detection circuit adapted to detect when a conductive loop formed by the at least one conductive strip, the at least one conductive wire and the conductive trace is broken, the detection circuit being configured to deactivate the light-emitting device if it detects an open circuit in the conductive loop (note the preventions of further emitters of the emitter array in paragraph 18).
Referring to claim 9, Shi shows the conductive trace provides electromagnetic interference shielding (see paragraph 23).
Referring to claim 10, Shi shows the at least one conductive strip is inserted into at least one channel of the module cap (see paragraph 23 note the LDS trace also see figures 1A-1B).
Referring to claim 11, Shi shows the at least one conductive strip is at least one conductive lead, for example at least one lead frame (see paragraph 23-24).
Referring to claim 12, Shi shows the at least one conductive strip is at least one connecting flex overmolded in the module cap (see the flex in the conductive strip as shown in figures 1A and 1B Ref 210 also note the flex shown in figure 5B Ref 510).
Referring to claim 13, Shi shows the glass is a lens, or a lens pad, the glass for example comprising at least a beam shaper (see paragraph 17).
Referring to claim 14, Shi shows is an injection molded cap, the molding material being for example a resin; and/or
is a plastic module cap; and/or
comprises a material suitable for providing electromagnetic interference shielding (see paragraph 18).
Claim(s) 15 is/are rejected under 35 U.S.C. 103 as being unpatentable over Shi (20220066036) in view of Raybe (7116557) and Saxod (20190157469).
Referring to claim 15, Shi fails to specifically show but Saxod shows a light-receiving sensor at least partially covered by the module cap, the module cap comprising a second opening located over the light-receiving sensor (see figure 1 Ref 28 and 29); and
a filter in the second opening, or covering the second opening, and adapted to transmit the light signals reflected towards the light-receiving sensor; the filter for example including a second conductive trace providing electromagnetic interference shielding (see paragraph 61).
It would have been obvious to include the second opening and the filter as shown by Saxod because this allows for isolation between the transmitter and receiver as shown by Saxod (see figure 1) and allowing for filtering out light from other sources as shown by Saxod.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to LUKE D RATCLIFFE whose telephone number is (571)272-3110. The examiner can normally be reached M-F 9:00AM-5:00PM EST.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Isam Alsomiri can be reached at 571-272-6970. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/LUKE D RATCLIFFE/Primary Examiner, Art Unit 3645
Prosecution Insights