DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 1/24/2025 was filed. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of pre-AIA 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 16, 20 and 21 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Gagon et al US Patent Application Publication 2008/0116991 .
Gagon et al discloses a filter, comprising: a substrate carrier 110 (carrier) with ground layer 108 (a first metal layer) , which is formed on a top surface of the carrier and includes matching transmission lines 106 107 in figure 1A and 632 634 in figure 9 ( at least a connection trace) ; an acoustic device die (As depicted in FIG. 9, a substrate carrier 110 with the filter device 102 (e.g., in the form of an acoustic or microelectromechanical systems die) is provided inside the package 600. Paragraph [0045]) mounted on the top surface of the carrier and including a plurality of resonators (The filter device 102 includes various internal components 604 (e.g., resonators) and internal nodes 605 that are connected to contact terminals 606, 608, 610, 612, and 614. Paragraph [0046]) , wherein the plurality of resonators comprises at least a first resonator 604, and a first electrode of the first resonator is electrically coupled to a first end of the matching transmission line 632 634; and a bond wires 130 formed over the top surface of the carrier and in contact with of the matching transmission line 632 634, wherein: the bond wire 130 is not in contact with the acoustic device die; and at least the bond wire and the matching transmission line inherently form an inductor electrically connected to the first resonator in the acoustic device die. (paragraph [0045-0050])
With regards to claim 16, the ground layer 108 is separate from the matching transmission lines wherein the bond wires is in contact with the ground layer and configured to connect the second end of the matching transmission lines on to the ground layer , such that the first resonator is coupled to ground through the inherent inductor at least formed by the combination of the bond wire and the matching transmission lines in the carrier.
With regards to claim 20, a wireless communication network (a user element ) comprising: a mobile station (RF input circuitry ) , base station 702 (RF output circuitry) and filter package 708 714 (filter circuitry) which includes an acoustic filter connected between the mobile station and the base station , wherein the filter package 708 comprising an acoustic filter, which comprises: a substrate carrier 110 (carrier) with ground layer 108 (a first metal layer) , which is formed on a top surface of the carrier and includes matching transmission lines 106 107 in figure 1A and 632 634 in figure 9 ( at least a connection trace) ; an acoustic device die (As depicted in FIG. 9, a substrate carrier 110 with the filter device 102 (e.g., in the form of an acoustic or microelectromechanical systems die) is provided inside the package 600. Paragraph [0045]) mounted on the top surface of the carrier and including a plurality of resonators (The filter device 102 includes various internal components 604 (e.g., resonators) and internal nodes 605 that are connected to contact terminals 606, 608, 610, 612, and 614. Paragraph [0046]) , wherein the plurality of resonators comprises at least a first resonator 604, and a first electrode of the first resonator is electrically coupled to a first end of the matching transmission line 632 634; and a bond wires 130 formed over the top surface of the carrier and in contact with of the matching transmission line 632 634, wherein: the bond wire 130 is not in contact with the acoustic device die; and at least the bond wire and the matching transmission line inherently form an inductor electrically connected to the first resonator in the acoustic device die.
With regards to claim 21, a wireless communication network (a user element ) comprising: a baseband processor 710; RF transceiver 706 (receive circuitry; and transmit circuitry), wherein the transceiver includes an filter package 708 comprising an acoustic filter, which comprises: a substrate carrier 110 (carrier) with ground layer 108 (a first metal layer) , which is formed on a top surface of the carrier and includes matching transmission lines 106 107 in figure 1A and 632 634 in figure 9 ( at least a connection trace) ; an acoustic device die (As depicted in FIG. 9, a substrate carrier 110 with the filter device 102 (e.g., in the form of an acoustic or microelectromechanical systems die) is provided inside the package 600. Paragraph [0045]) mounted on the top surface of the carrier and including a plurality of resonators (The filter device 102 includes various internal components 604 (e.g., resonators) and internal nodes 605 that are connected to contact terminals 606, 608, 610, 612, and 614. Paragraph [0046]) , wherein the plurality of resonators comprises at least a first resonator 604, and a first electrode of the first resonator is electrically coupled to a first end of the matching transmission line 632 634; and a bond wires 130 formed over the top surface of the carrier and in contact with of the matching transmission line 632 634, wherein: the bond wire 130 is not in contact with the acoustic device die; and at least the bond wire and the matching transmission line inherently form an inductor electrically connected to the first resonator in the acoustic device die.
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Allowable Subject Matter
Claims 2-15, 17-19 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Wakamori et al EP 0367181 A2 titled “Surface acoustic wave filter device”. (figures 5-7)
Setsune et al US Patent 4,409,567 titled “ Surface acoustic wave device”. (figure 4)
Inoue et al CN101795118A titled “ High frequency device, filter , duplexer , communication module and communication apparatus”. (figures 19 and 20)
Pang et al CN 109861655A titled “ A piezoelectric acoustic wave filter”. (figure 6a)
Ushiroku US Patent 5,999,069 tilted “ Surface acoustic wave ladder filter having parallel resonator with a larger electrostatic capacitance”. (figure 1)
Liu et al US Patent 10, 749, 499 titled “ Wideband filter including an acoustic resonator chip integrated with 3D inductor and 3D transformer. (figure 3)
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KIMBERLY E GLENN whose telephone number is (571)272-1761. The examiner can normally be reached M-F 8:00 AM-5:00 PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Andrea Lindgren Baltzell can be reached at 571-272-5918. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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February 27, 2026
/K.E.G/Examiner, Art Unit 2843
/ANDREA LINDGREN BALTZELL/Supervisory Patent Examiner, Art Unit 2843
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