Prosecution Insights
Last updated: October 02, 2026
Application No. 18/932,112

CAMERA MODULE

Non-Final OA §102
Filed
Oct 30, 2024
Priority
Nov 16, 2011 — RE 10-2011-0119351 +7 more
Examiner
MATES, ROBERT E
Art Unit
2834
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
LG Innotek Co., Ltd.
OA Round
1 (Non-Final)
57%
Grant Probability
Moderate
1-2
OA Rounds
1y 2m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 57% of resolved cases
57%
Career Allowance Rate
265 granted / 465 resolved
-11.0% vs TC avg
Strong +35% interview lift
Without
With
+35.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 1m
Avg Prosecution
31 currently pending
Career history
503
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
62.2%
+22.2% vs TC avg
§102
20.0%
-20.0% vs TC avg
§112
14.9%
-25.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 465 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application is being examined under the pre-AIA first to invent provisions. Priority Acknowledgment is made of applicant’s claim for foreign priority under 35 U.S.C. 119 (a)-(d). The certified copy has been filed in parent Application No. 15/065,190, filed on 4/1/2016. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of pre-AIA 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a) the invention was known or used by others in this country, or patented or described in a printed publication in this or a foreign country, before the invention thereof by the applicant for a patent. (b) the invention was patented or described in a printed publication in this or a foreign country or in public use or on sale in this country, more than one year prior to the date of application for patent in the United States. Claim(s) 1-19 is/are rejected under pre-AIA 35 U.S.C. 102(a) as being anticipated by Wade (WO 2011155318 A1; see US 2013/0076924 A1 for English Translation). As to claim 1, Wade shows (FIG. 2): PNG media_image1.png 542 815 media_image1.png Greyscale A camera module comprising: a circuit board comprising a first board unit 23A, a second board unit 22, and a connection board unit 23B connecting the first board unit and the second board unit 22; an image sensor configured to move together with the first board unit 23A of the circuit board; a lens 5 disposed at a position corresponding with the image sensor; and a first magnet 39 and a first coil 38 configured to tilt both the lens and the image sensor, wherein at least a part of the connection board 23B is disposed higher than the first board unit 23A and the lens 5 is disposed higher than the image sensor (imaging element is on circuit board 22 ¶ 65; movable body 5 holds the lens ¶ 55). As to claim 2/1, Wade further shows (FIG. 2 above) wherein the connection board unit 23B comprises a bent part, wherein the bent part comprises a first area 23B1 where the bent part begins and a second area 23B2 where the bent part ends, wherein the first area 23B1 of the bent part is disposed closer to the first board unit 23A than is the second area 23B2 of the bent part, and wherein the second area 23B2 of the bent part is disposed higher than the first area 23B1 of the bent part. As to claim 3/2/1, Wade further shows (FIG. 2 above) wherein the first area 23B1 of the bent part is overlapped with the first board unit 23A in a direction perpendicular to an optical axis direction L. As to claim 4/1, Wade further shows (FIG. 2 above) wherein a gap is formed between the image sensor 22 and the lens 5, and wherein the circuit board comprises a flexible circuit board (¶ 65) . As to claim 5/4/1, Wade further shows (FIG. 2 above) wherein a shape of the flexible circuit board is changeable to movably support the first board unit 23A (¶ 65). As to claim 6/1, Wade further shows (FIG. 2 above) comprising a second magnet 19 and a second coil 18 configured to move the lens 5 with respect to the image sensor 22 in an optical axis direction L. As to claim 7/6/1, Wade further shows (FIG. 2 above) wherein the second coil 18 is overlapped with the first coil 38 in a direction perpendicular to the optical axis direction L. As to claim 8/6/1, Wade further shows (FIG. 2 above) wherein the second coil 18 is overlapped with the first magnet 39 in a direction perpendicular to the optical axis direction L. As to claim 9/1, Wade further shows (FIG. 2 above) wherein the first coil 38 comprises a first coil part 38a1 and a second coil part 38a2, wherein the first board unit 23A is configured to move in a first direction when a current is applied to the first coil part 38a1, and wherein the first board unit 23A is configured to move in a second direction different from the first direction when a current is applied to the second coil part 38a2. As to claim 10/1, Wade further shows (FIG. 2 above) wherein the connection board unit 23B comprises two leg parts 23B1, 23B2, wherein each of the two leg parts 23B1, 23B2 connects the first board unit 23A and the second board unit 22, wherein a gap is formed between the two leg parts 23B1, 23B2, and wherein the gap between the two leg parts 23B1, 23B2 is formed between the first board unit 23A and the second board unit 22 when viewed from below. As to claim 12/1, Wade further shows (FIG. 2 above) wherein the connection board unit 23B of the circuit board elastically connects the first board unit 23A and the second board unit 22. As to claim 13/6/1, Wade further shows (FIG. 2 above) wherein the image sensor is electrically connected with the circuit board, and wherein the second coil is electrically connected with the circuit board (all electrical parts of the camera are coupled to the circuit board). As to claim 14/6/1, Wade further shows (FIG. 2 above): a first housing 4; a second housing 14 disposed in the first housing 4; and a bobbin 13 disposed in the second housing 14 and coupled with the lens 5, wherein the first coil 38 is disposed on the first housing 4, wherein the first magnet 39 is disposed on the second housing 14, wherein the second coil 18 is disposed on the bobbin 13, and wherein the second magnet 19 is disposed on the second housing 14 (sleeve 13 ¶ 60). As to claim 15/1, Wade further shows A mobile phone comprising the camera module of claim 1 (¶ 3). As to claim 16, Wade shows (FIG. 2 above) A camera module comprising: a circuit board comprising a first board unit 23A, a second board unit 22, and a connection board unit 23B connecting the first board unit 23A and the second board unit 22; an image sensor configured to move together with the first board unit 23A of the circuit board; and a first magnet 39 and a first coil 38 configured to tilt the image sensor, wherein at least a part of the connection board 23B is disposed higher than the first board unit 23A and light is incident on an upper surface of the image sensor (imaging element is on circuit board 22 ¶ 65; movable body 5 holds the lens ¶ 55). As to claim 17/16, Wade shows (FIG. 2 above) wherein the connection board unit 23B comprises a bent part, wherein the bent part comprises a first area 23B1 where the bent part begins and a second area 23B2 where the bent part ends, wherein the first area 23B1 of the bent part is disposed closer to the first board unit 23A than is the second area 23B2 of the bent part, and wherein the second area 23B2 of the bent part is disposed higher than the first area 23B1 of the bent part. As to claim 18/17/16, Wade shows (FIG. 2 above) wherein the first area 23B1 of the bent part is overlapped with the first board unit 23A in a direction perpendicular to an optical axis direction L. As to claim 19/16, Wade shows (FIG. 2 above) wherein a gap is formed between the image sensor and the lens, and wherein the circuit board comprises a flexible circuit board (¶ 65). Claim(s) 20 is/are rejected under pre-AIA 35 U.S.C. 102(b) as being anticipated by Tsuruta et al. (US 2011/0097062 A1, hereinafter Tsuruta, of record). As to claim 20, Tsuruta shows A camera module comprising: a circuit board 188; an image sensor 155 configured to move together with at least a part of the circuit board 188; and a first magnet 17 and a first coil 30 configured to tilt the image sensor 155 (¶ 67, 70, 72, 73, 103, 104, 180, 181, 184) . Allowable Subject Matter Claim 11 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The prior art does not show or suggest the two leg parts meet and are integrated. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ROBERT E MATES whose telephone number is (571)270-5293. The examiner can normally be reached M to F 12:00pm to 8pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, TULSIDAS PATEL can be reached at (571)272-2098. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ROBERT E MATES/Examiner, Art Unit 2834 /TULSIDAS C PATEL/Supervisory Patent Examiner, Art Unit 2834
Read full office action

Prosecution Timeline

Oct 30, 2024
Application Filed
Jan 31, 2025
Response after Non-Final Action
Sep 16, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
57%
Grant Probability
92%
With Interview (+35.0%)
3y 1m (~1y 2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 465 resolved cases by this examiner. Grant probability derived from career allowance rate.

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