Prosecution Insights
Last updated: July 17, 2026
Application No. 18/947,146

STORAGE DEVICE, BUFFER CHIP, AND METHOD OF OPERATING STORAGE DEVICE

Non-Final OA §102
Filed
Nov 14, 2024
Priority
Dec 06, 2023 — RE 10-2023-0175934
Examiner
CHOI, CHARLES J
Art Unit
2133
Tech Center
2100 — Computer Architecture & Software
Assignee
Samsung Electronics Co., Ltd.
OA Round
1 (Non-Final)
83%
Grant Probability
Favorable
1-2
OA Rounds
10m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 83% — above average
83%
Career Allowance Rate
263 granted / 318 resolved
+27.7% vs TC avg
Moderate +5% lift
Without
With
+5.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
7 currently pending
Career history
325
Total Applications
across all art units

Statute-Specific Performance

§101
1.7%
-38.3% vs TC avg
§103
61.9%
+21.9% vs TC avg
§102
16.0%
-24.0% vs TC avg
§112
11.0%
-29.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 318 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1-20 is/are rejected under 35 U.S.C. 102(a)(1) and (a)(2) as being anticipated by Feeley (US 2019/0266114). Regarding claim(s) 1, 8 and 16, Feeley teaches: A storage device comprising: a memory controller configured to generate at least one of a chip enable signal and a command/address signal; a buffer chip configured to receive the chip enable signal, the command/address signal, and a data signal from the memory controller; Fig. 2 and [0027] a data bus 32, address bus 34, command bus 36, and various discrete lines representing a NAND flash interface 38 coupled to the control logic 40. [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. [0031] The NAND flash memory device 30 may also include a column decoder 52 for receiving and decoding column address signals provided to the address register 48. [0032] A command register 56 may store incoming commands received on the command bus 36 which are then executed by the control logic 40, which includes the above-discussed read/write logic 44. As will be appreciated, the execution of commands received on the command bus 36 may be based upon the state of the control signals 38 provided by the processor 12. and a memory device including at least one storage area, the at least one storage area configured to perform at least one of a write operation and a read operation, based on the command/address signal and the data signal received by the buffer chip, Fig. 2 and [0032] Program and read operations to the memory array 46 may be determined based on commands received on the command bus 36. A command register 56 may store incoming commands received on the command bus 36 which are then executed by the control logic 40, which includes the above-discussed read/write logic 44. As will be appreciated, the execution of commands received on the command bus 36 may be based upon the state of the control signals 38 provided by the processor 12. wherein the buffer chip comprises a first channel configured to receive the chip enable signal or the command/address signal, and a second channel configured to receive the data signal, [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. [0032] A command register 56 may store incoming commands received on the command bus 36 which are then executed by the control logic 40. [0034] The data I/O circuitry 60 may also include one or more buffers for delaying, regenerating, and storing data signals communicated between the processor 12 and the NAND flash memory device 30. wherein the first channel and the second channel are configured to transmit signals received through separate paths to respective ones of the at least one storage area. Fig. 2 and [0027] a data bus 32, address bus 34, command bus 36, and various discrete lines representing a NAND flash interface 38 coupled to the control logic 40. [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. [0034] The data I/O circuitry 60 may also include various caches 62 and registers 64 which may serve as page buffers for reading data from and writing data to the memory array 46. Regarding claim(s) 2, 9, 10 and 17, Feeley teaches: wherein the buffer chip further comprises a decoder for decoding the command/address signal, and wherein the buffer chip is configured to determine a first storage area with which the first channel communicates based on a result of decoding the command/address signal. [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. The row decoder 50 typically includes a word line driver, an address decoder tree, and circuitry which translates a given row address received on the address bus 34 and selectively activates an appropriate word line or word lines by way of the word line drivers. [0031] The NAND flash memory device 30 may also include a column decoder 52 for receiving and decoding column address signals provided to the address register 48. In some implementations, the column decoder 52 may also determine when a column within the memory array 46 is defective, as well as the address of a replacement column. The column decoder 52 is coupled to sense amplifiers 54, each of which may be coupled to complementary pairs of bit lines of the memory array 46. Regarding claim(s) 3, 11 and 18, Feeley teaches: wherein the buffer chip is configured to determine a second storage area with which the second channel communicates based on a result of decoding the command/address signal. [0031] The NAND flash memory device 30 may also include a column decoder 52 for receiving and decoding column address signals provided to the address register 48. In some implementations, the column decoder 52 may also determine when a column within the memory array 46 is defective, as well as the address of a replacement column. The column decoder 52 is coupled to sense amplifiers 54, each of which may be coupled to complementary pairs of bit lines of the memory array 46. [0034] The sense amplifiers 54 receive the data from the data I/O circuitry 60 and store the data to corresponding cells or pages in the memory array 46. Fig. 4B and [0041] During the programming operation, the memory cells corresponding to the data values in the data pattern having a binary value of 0 have changed state. In the illustrated example, the successfully programmed page 74 may include 32 occurrences of a binary value of 0 in the page and 32 occurrences of a binary value of 1 in the page. Regarding claim(s) 4, 12 and 19, Feeley teaches: wherein the buffer chip is configured to communicate the data signal with a second storage area through the second channel [0034] during a write operation, the data bus 32 provides data to the data I/O circuitry 60. The sense amplifiers 54 receive the data from the data I/O circuitry 60 and store the data to corresponding cells or pages in the memory array 46. In some embodiments, the data bus 32 may include an 8-bit or 16-bit data bus. The data I/O circuitry 60 may also include various caches 62 and registers 64 which may serve as page buffers for reading data from and writing data to the memory array 46. while the command/address signal is transmitted to a first storage area through the first channel. [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. Regarding claim(s) 5, 13 and 20, Feeley teaches: wherein the memory device comprises a plurality of chips, and wherein the buffer chip is configured to independently exchange signals with each of the plurality of chips. [0027] the aforementioned inputs are represented separately in the present figure by a data bus 32, address bus 34, command bus 36, and various discrete lines representing a NAND flash interface 38 coupled to the control logic 40. [0047] a separate error correction algorithm may be executed by the ECC logic 42 to perform error correction on the expected count value data independently of the program data. Regarding claim(s) 6 and 14, Feeley teaches: wherein the first channel comprises a first switch configured to control transmission of the command/address signal and a second switch configured to control transmission of the data signal, and wherein the second channel comprises a third switch configured to control transmission of the command/address signal and a fourth switch configured to control transmission of the data signal. Fig. 2 and [0028] The processor 12 may provide a number of control signals to the NAND flash memory device 30 using the NAND flash interface 38. In the illustrated embodiment, the control signals may include the following input signals: a chip enable signal (CE#), a command latch enable signal (CLE), an address latch enable signal (ALE), a write enable signal (WE#), a read enable signal (RE#), and a write-protect signal (WP#). Regarding claim(s) 7 and 15, Feeley teaches: wherein the first channel is configured to transmit the command/address signal to a plurality of dies included in the memory device. Fig. 2 and [0027] a data bus 32, address bus 34, command bus 36, and various discrete lines representing a NAND flash interface 38 coupled to the control logic 40. [0030] To access the memory array 46, an address register 48 may receive memory address signals using the address bus 34. A row decoder 50 may receive and decode row addresses from address values received by the address register 48. [0031] The NAND flash memory device 30 may also include a column decoder 52 for receiving and decoding column address signals provided to the address register 48. [0032] A command register 56 may store incoming commands received on the command bus 36 which are then executed by the control logic 40, which includes the above-discussed read/write logic 44. As will be appreciated, the execution of commands received on the command bus 36 may be based upon the state of the control signals 38 provided by the processor 12. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Lee (US 2019/0266114): discloses a memory module including a buffer with separate signal lines for transmitting alerts, commands, addresses and data. Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHARLES J CHOI whose telephone number is (571)270-0605. The examiner can normally be reached MON-FRI: 9AM-5PM EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, ROCIO DEL MAR PEREZ-VELEZ can be reached at 571-270-5935. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /CHARLES J CHOI/Primary Examiner, Art Unit 2133
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Prosecution Timeline

Nov 14, 2024
Application Filed
May 21, 2026
Non-Final Rejection mailed — §102
Jun 22, 2026
Examiner Interview Summary
Jun 22, 2026
Applicant Interview (Telephonic)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
83%
Grant Probability
88%
With Interview (+5.4%)
2y 6m (~10m remaining)
Median Time to Grant
Low
PTA Risk
Based on 318 resolved cases by this examiner. Grant probability derived from career allowance rate.

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