Prosecution Insights
Last updated: October 21, 2026
Application No. 18/956,904

THERMAL TESTING TOOL

Non-Final OA §102
Filed
Nov 22, 2024
Priority
Nov 27, 2023 — TW 112145846
Examiner
CURRAN, GREGORY H
Art Unit
2852
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Cooler Master Co., Ltd.
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
2m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allowance Rate
776 granted / 860 resolved
+22.2% vs TC avg
Moderate +5% lift
Without
With
+5.3%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 1m
Avg Prosecution
14 currently pending
Career history
880
Total Applications
across all art units

Statute-Specific Performance

§101
4.1%
-35.9% vs TC avg
§103
41.3%
+1.3% vs TC avg
§102
37.4%
-2.6% vs TC avg
§112
11.7%
-28.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 860 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-3 and 12 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Cooler Master Co., LTD (CN 220019636 U, Machine Translation Provided), hereinafter referred to as Cooler. With reference to claim 1, Cooler teaches a thermal testing tool, comprising: a base (Fig. 2, 11); a back plate (Fig. 2, 12), arranged on the base and, together with the base, enclosing a first accommodating recess (Fig. 2, 113) and a second accommodating recess (Fig. 2, 115), the second accommodating recess configured at a periphery of the first accommodating recess (Fig. 2); a heating assembly comprising a heating sheet, at least a portion of the heating sheet configured in the first accommodating recess (Fig. 2, 13) ; and a first sealing member configured in the second accommodating recess and at a periphery of at least a portion of the heating sheet (Fig. 3, T1, T2). With reference to claim 2, Cooler teaches the first accommodating recess and the second accommodating recess are separated by a first distance (Fig. 2). With reference to claim 3, Cooler further teaches the back plate comprises at least one first injection hole in communication with the second accommodating recess (Fig. 2, 12). With reference to claim 12, Cooler further teaches at least one fastener; at least one first fastening hole; and at least one second fastening hole, wherein the back plate comprises the at least one first fastening hole, the base comprises the at least one second fastening hole, and the at least one fastener passes through the at least one first fastening hole and the at least one second fastening hole to fix the back plate to the base (Fig. 2) Claim(s) 1-3 and 12 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Truong et al. (US 11,977,006 B2), hereinafter referred to as Truong With reference to claim 1, Truong teaches A thermal testing tool, comprising: a base (Figs. 1B, 1F, 1I; 130); a back plate (Figs. 1B, 125), arranged on the base and, together with the base, enclosing a first accommodating recess (Fig. 1F, “Opening for base portion of heater block”) and a second accommodating recess, the second accommodating recess configured at a periphery of the first accommodating recess (Fig. 1I, the opening for the thermocouple probe); a heating assembly comprising a heating sheet, at least a portion of the heating sheet configured in the first accommodating recess (Fig. 1I, 145 “heater block”); and a first sealing member configured in the second accommodating recess and at a periphery of at least a portion of the heating sheet (Fig. 1G, 1I, Thermocouple probe and base portion 190). With reference to claim 2, Truong further teaches the first accommodating recess and the second accommodating recess are separated by a first distance (Fig. 1I). With reference to claim 3, Truong further teaches the back plate comprises at least one first injection hole in communication with the second accommodating recess (Fig. 1I, 125). With reference to claim 12, Truong further teaches at least one fastener; at least one first fastening hole; and at least one second fastening hole, wherein the back plate comprises the at least one first fastening hole, the base comprises the at least one second fastening hole, and the at least one fastener passes through the at least one first fastening hole and the at least one second fastening hole to fix the back plate to the base (Fig. 1B, “connectors to connect insulator bottom and housing”). Allowable Subject Matter Claims 4-11 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The prior art does not disclose or suggest the claimed "a second sealing member; and a third accommodating recess wherein the back plate and the base enclose the third accommodating recess, the third accommodating recess is configured at one side of the first accommodating recess and adjacent to the second accommodating recess, and the second sealing member is configured in the third accommodating recess" in combination with the remaining claim elements as set forth in claims 4-11. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Hsieh et al. (US 12,137,447 B2) teach an adjustable heat source simulation assembly, chassis heat dissipation detection device and cabinet heat dissipation detection device. Heydari (US 12,563,704 B1) teaches a thermocouple arrangement in thermal test vehicles to replicate lidless computing devices. Any inquiry concerning this communication or earlier communications from the examiner should be directed to GREGORY H CURRAN whose telephone number is (571)270-7505. The examiner can normally be reached Monday-Friday, 8am-5pm, EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Walter Lindsay can be reached at (571) 272-1674. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /GREGORY H CURRAN/Primary Examiner, Art Unit 2852
Read full office action

Prosecution Timeline

Nov 22, 2024
Application Filed
Sep 29, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
96%
With Interview (+5.3%)
2y 1m (~2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 860 resolved cases by this examiner. Grant probability derived from career allowance rate.

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