DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Double Patenting
The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13.
The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer.
Claims 1-14 are rejected on the ground of nonstatutory double patenting as being unpatentable over claim 1 of U.S. Patent No. 11,735,369 in view of U.S. Patent 12,198,864.
In re claim 1, U.S. Patent No. 11,735,369 discloses a multilayer ceramic capacitor comprising:
a multilayer body including dielectric layers and internal electrode layers alternately laminated therein (Claim 1); and
external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including an inner region, an intermediate region, and an outer region divided therein, in order from the multilayer body (Claim 1; Note that the ‘first region’ coincides with the inner region, the ‘second region’ coincides with the intermediate region, and the ‘third region’ coincides with the ‘outer region’.);
wherein the intermediate region includes glass in a higher amount than the outer region (Claim 1);
the outer region includes copper in a higher amount than the intermediate region (Claim 1)
U.S Patent 11,735,369 does not disclose a particle size of Cu in the inner region is larger than a particle size of Cu in the outer region.
U.S. Patent 12,198,864 discloses a particle size of Cu in the inner region is larger than a particle size of Cu in the outer region (Claim 1).
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to adjust the particle size of Cu, and thus amount of Cu, in varying regions to provide for improved mounting characteristics and internal electrode connectivity.
US Application 18/966,314
U.S. Patent 11,735,369
Claim 2
Claim 4
Claim 3
Claim 5
Claim 4
Claim 5
Claim 5
Claim 6
Claim 6
Claim 6
Claim 7
Claim 6
In re claim 8, U.S. Patent No. 11,735,369 discloses a multilayer ceramic capacitor comprising:
a multilayer body including dielectric layers and internal electrode layers alternately laminated therein (Claim 1); and
external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including an inner region, an intermediate region, and an outer region divided therein, in order from the multilayer body (Claim 1; Note that the ‘first region’ coincides with the inner region, the ‘second region’ coincides with the intermediate region, and the ‘third region’ coincides with the ‘outer region’.); wherein
the intermediate region includes glass in a higher amount than the inner region (Claim 1);
the inner region includes a metal, which is included in each of the internal electrode layers, in a higher amount than the intermediate region (Claim 1).
U.S Patent 11,735,369 does not disclose a particle size of Cu in the inner region is larger than a particle size of Cu in the outer region.
U.S. Patent 12,198,864 discloses a particle size of Cu in the inner region is larger than a particle size of Cu in the outer region (Claim 1).
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to adjust the particle size of Cu, and thus amount of Cu, in varying regions to provide for improved mounting characteristics and internal electrode connectivity.
US Application 18/966,314
U.S. Patent 11,735,369
Claim 9
Claim 4
Claim 10
Claim 5
Claim 11
Claim 5
Claim 12
Claim 6
Claim 13
Claim 6
Claim 14
Claim 6
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Park et al. (US Publication 2013/0050896) [¶43-47], Figure 2
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ARUN RAMASWAMY whose telephone number is (571)270-1962. The examiner can normally be reached Monday - Friday, 9:00 am - 5:00 pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Dole can be reached at 571-272-2229. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/ARUN RAMASWAMY/Primary Examiner, Art Unit 2847
Prosecution Insights