DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Claims 3 and 5-13 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 23 July 2026.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 2 and 4 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hirai et al. (U.S. 20180065365 A1).
1. A liquid ejecting head (figs. 1 and 6) comprising:
a nozzle substrate (20) provided with a nozzle (21) for ejecting a liquid;
a pressure chamber substrate (15) provided with a plurality of pressure chambers (12, fig. 6) for applying pressure to the liquid;
a piezoelectric element (150) including a piezoelectric body (70, fig. 3), an individual electrode (60, [0044] ) individually provided for each of the plurality of pressure chambers, and a common electrode (80, [0048] ) provided in common to the plurality of pressure chambers; and
a wiring substrate (30) provided with an individual wiring line (31) for applying a voltage to the individual electrode, a common wiring line (32) for applying a voltage to the common electrode, and an auxiliary wiring line (33) that is electrically coupled to the common wiring line ( [0083], [0084] ) to reduce resistance of the common electrode (since Hirai et al. discloses the claimed structure, it also reduces resistance of the common electrode).
2. The liquid ejecting head according to claim 1, wherein the individual wiring line and the common wiring line are provided on a first surface of the wiring substrate, and the auxiliary wiring line is provided on a second surface on a back of the first surface of the wiring substrate [0088].
4. The liquid ejecting head according to claim 2, wherein the wiring substrate is further provided with an integrated circuit (120) to which the individual wiring line is coupled, and when the wiring substrate is viewed in plan view, the auxiliary wiring line and the integrated circuit are installed at positions that overlap each other (fig. 6, wiring substrate 33 and IC 120 overlap).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to Julian D Huffman whose telephone number is (571)272-2147. The examiner can normally be reached Monday through Friday 9am-6pm.
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JULIAN D. HUFFMAN
Supervisory Patent Examiner
Art Unit 2859
/JULIAN D HUFFMAN/Supervisory Patent Examiner, Art Unit 2859
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