CTNF 18/983,561 CTNF 79573 DETAILED ACTION Notice of Pre-AIA or AIA Status 07-03-aia AIA 15-10-aia The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA. Claim Rejections - 35 USC § 102 07-07-aia AIA 07-07 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – 07-08-aia AIA (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. 07-15-aia AIA Claim(s) 1-12 is/are rejected under 35 U.S.C. 102 a1 as being anticipated by Tsutsumi (U.S. Patent Application Publication 2020/0285159). Regarding Claim 1, Tsutsumi shows a shaping apparatus comprising: a film forming device including a holding member to hold a mold, and configured to form a composition between the mold and a substrate by performing a process of driving the holding member holding the mold to bring the mold into contact with the composition on the substrate and then releasing holding of the mold by the holding member (element 10; 0026, 0028); and a curing device configured to cure the composition formed by the film forming device (element 30; 0026, 0030), wherein, after the process, the film forming device performs a press operation of pressing the mold by a member that comes into partial contact with the mold (0075) . Regarding Claim 2, Tsutsumi shows the apparatus of claim 1, including one wherein the film forming device performs the press operation using the holding member as the member that comes into partial contact with the mold (Figure 1; 0028). Regarding Claim 3, Tsutsumi shows the apparatus of claim 2 above, including one wherein the holding member is configured to hold an outer peripheral portion of the mold, and the film forming device performs the press operation so as to press the outer peripheral portion of the mold by the holding member (Figure 1). Regarding Claim 4, Tsutsumi shows the apparatus of claim 1 above, including one wherein the member that comes into partial contact with the mold to perform the press operation is different from the holding member (element 11). Regarding Claim 5, Tsutsumi shows the apparatus of claim 1 above, including one wherein the member is configured to press the mold to reduce a nonuniform thickness of a liquid film that is formed between the mold and a substrate (element 10). Regarding Claim 6, Tsutsumi shows the apparatus of claim 5 above, including one further comprising a first detector configured to detect an abnormal portion with a nonuniform thickness in the liquid film, wherein the film forming device performs the press operation to press a part of the mold corresponding to the abnormal portion detected by the first detector (element 51; 0032-0035). Regarding Claim 7, Tsutsumi shows the apparatus of claim 5 above, including one further comprising a second detector configured to detect a pressing force against the mold in the press operation, wherein the film forming device performs, based on a detection result of the second detector, the press operation SO as to achieve a pressing force corresponding to a target thickness of the liquid film (element 52; 0032-0035). Regarding Claim 8, Tsutsumi shows the apparatus of claim 1 above, including one wherein the mold has a first surface to contact the composition on the substrate, and a second surface on an opposite side of the first surface, and in the press operation, the film forming device presses the second surface of the mold by a member that comes into contact with the second surface of the mold (Figure 1, 12, element 4z; 0075-0076). Regarding Claim 9, Tsutsumi shows the apparatus of claim 1 above, including a curing device (element 30). Regarding Claim 10, Tsutsumi shows the apparatus of claim 1 above, including one wherein the mold has a flat surface, and the shaping apparatus is configured to planarize the composition on the substrate by bringing the flat surface of the mold into contact with the composition on the substrate (Figure 12). Regarding Claim 11, Tsutsumi shows a shaping method comprising: forming a composition between a mold and a substrate by performing a process of driving a holding member holding the mold to bring the mold into contact with the composition on the substrate and then releasing holding of the mold by the holding member (0026, 0028); and curing the composition formed in the forming (0026, 0030), wherein the forming includes a press operation of, after the process, pressing the mold by a member that comes into partial contact with the mold (0075). Regarding Claim 12, Tsutsumi shows an article manufacturing method comprising: shaping a composition on a substrate using a shaping method defined in claim 11; processing the substrate including the composition shaped in the shaping; and manufacturing an article from the substrate processed in the processing (0077). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MONICA HUSON whose telephone number is (571)272-1198. The examiner can normally be reached M-F 8a-4p. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Christina Johnson can be reached at 571-272-1176. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. MONICA ANNE HUSON Primary Examiner Art Unit 1742 /MONICA A HUSON/Primary Examiner, Art Unit 1742 Application/Control Number: 18/983,561 Page 2 Art Unit: 1742 Application/Control Number: 18/983,561 Page 3 Art Unit: 1742
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