Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claim 4 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 4 recites the limitation "the transfer head". There is insufficient antecedent basis for this limitation in the claim.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-4 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by McLaurin et al. (USPN 2015/0229107).
With regard to claim 1,
McLaurin et al. disclose in at least figure 7 a method to operate a shared alignment system between multiple transfer heads, the method comprising: aligning each transfer head (107) with an associated area in a system substrate (106) using a shared alignment head (100); transferring a set of microdevices (102) from at least one transfer head (107) into the system substrate (iteration #1); moving each transfer head or the system substrate to enable an offset between the transfer head and the system substrate (see iteration #2); and having a new set of microdevices from the at least one transfer head into a new area in the system substrate (See iteration 2).
With regard to claim 2,
McLaurin et al. disclose the method of claim 1, wherein alignment marks (108 of 100) on a donor substrate are aligned with corresponding alignment marks (108 of 106) in the system substrate.
With regard to claim 3,
McLaurin et al. disclose the method of claim 1, wherein the microdevices in the donor substrate are directly aligned to an intended position in the system substrate (see iteration #1, #2).
With regard to claim 4,
McLaurin et al. disclose the method of claim 1, wherein the transfer head (107) is loaded and aligned to a fixed area in the system substrate (see iteration #1, #2).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. USPN 2021/0219476, 2019/0333791, 10177113.
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/CHRISTOPHER M RAABE/Primary Examiner, Art Unit 2875