Prosecution Insights
Last updated: August 08, 2026
Application No. 18/990,359

ELECTROMAGNETIC COIL, MOLD, AND ELECTROMAGNETIC COIL MANUFACTURING METHOD

Non-Final OA §103
Filed
Dec 20, 2024
Priority
Nov 30, 2018 — CN 201811458385.0 +3 more
Examiner
GONZALEZ QUINONES, JOSE A
Art Unit
Tech Center
Assignee
Zhejiang Sanhua Intelligent Controls Co. Ltd.
OA Round
1 (Non-Final)
76%
Grant Probability
Favorable
1-2
OA Rounds
10m
Est. Remaining
89%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allowance Rate
895 granted / 1177 resolved
+16.0% vs TC avg
Moderate +13% lift
Without
With
+12.9%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
35 currently pending
Career history
1196
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
66.5%
+26.5% vs TC avg
§102
27.4%
-12.6% vs TC avg
§112
4.3%
-35.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1177 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Information Disclosure Statement The information disclosure statements (IDS) submitted on 12/20/2024 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-2, 4 is/are rejected under 35 U.S.C. 103 as being unpatentable over Umezawa (CN 105299290) in view of Nomura (JP2009090482) and Arai et al. (US PG Pub 2015/0302963). As to independent claim 1,Umezawa teaches an electromagnetic coil, comprising an annular body, wherein an inner peripheral wall of the annular body comprises a plurality of claw poles (51C-54C) spaced apart in a circumferential direction, the electromagnetic coil further comprises an encapsulation layer (10) and a frame (55), and the encapsulation layer (60) encapsulates an upper annular wall (see annotated figure 2), a lower annular wall (see annotated figure 2), and an outer peripheral wall (see annotated figure 2) of the annular body, the encapsulation layer (60) is not disposed between the claw poles (51C-54C); the encapsulation layer (60) is formed of a resin material by injection molding, as shown in figure 2 PNG media_image1.png 452 759 media_image1.png Greyscale However Umezawa teaches the claimed limitation as discussed above except wherein the mold comprises an upper mold and a lower mold, wherein the mold defines a mold cavity, the upper mold comprises a first abutting part and a first groove part, and the lower mold comprises a second abutting part and a second groove part; the mold further comprises an injection port, and the injection port communicates with the mold cavity; during the injection molding, the second abutting part is axially abutted against the lower annular wall of the annular body, and the first abutting part is axially abutted against the upper annular wall of the annular body; and a space between the first groove part and the upper annular wall of the annular body is configured to accommodate the resin material that encapsulates the upper annular wall, and a space between the second groove part and the lower annular wall of the annular body is configured to accommodate the resin material that encapsulates the lower annular wall, and the upper annular wall, the lower annular wall and the outer periphery wall of the annular body are provided therein with the encapsulation layer. Nomura teaches mold (10) comprises an upper mold (12) and a lower mold (14), wherein the mold defines a mold cavity (30) , the upper mold (12) comprises a first abutting part (see annotated figure 2) and a first groove part (see annotated figure 2), and the lower mold (14) comprises a second abutting part (see annotated figure 2) and a second groove part (see annotated figure 2); the mold further comprises an injection port (34), and the injection port (34) communicates with the mold cavity (30); during the injection molding, the second abutting part is axially abutted against the lower annular wall of the annular body, and the first abutting part is axially abutted against the upper annular wall (102) of the annular body (100) ; and a space (44) between the first groove part (see annotated figure 2) and the upper annular wall (102) of the annular body (100) is configured to accommodate the resin material (200, see figure 4) that encapsulates the upper annular wall (102), and a space between the second groove part (see annotated figure 2) and the lower annular wall (104) of the annular body is configured to accommodate the resin material (200, see figure 4) that encapsulates the lower annular wall (104), and the upper annular wall (102), the lower annular wall (104) as shown in figure 2 and 4, for the advantageous benefit of providing a resin molding method and a resin molding of a solenoid capable of securing the property. PNG media_image2.png 536 744 media_image2.png Greyscale Arai et al. teaches the outer periphery wall (110) of the annular body (100) are provided therein with the encapsulation layer (20) as shown in figures 1 and 4, for the advantageous benefit of providing an electromagnetic drive coil unit with waterproof properties and strength secured. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention was made to modify Umezawa by using the mold comprises an upper mold and a lower mold, wherein the mold defines a mold cavity, the upper mold comprises a first abutting part and a first groove part, and the lower mold comprises a second abutting part and a second groove part; the mold further comprises an injection port, and the injection port communicates with the mold cavity; during the injection molding, the second abutting part is axially abutted against the lower annular wall of the annular body, and the first abutting part is axially abutted against the upper annular wall of the annular body; and a space between the first groove part and the upper annular wall of the annular body is configured to accommodate the resin material that encapsulates the upper annular wall, and a space between the second groove part and the lower annular wall of the annular body is configured to accommodate the resin material that encapsulates the lower annular wall, and the upper annular wall, the lower annular wall and the outer periphery wall of the annular body are provided therein with the encapsulation layer, as taught by Nomura and Arai et al., to provide a resin molding method and a resin molding of a solenoid capable of securing the property and provide an electromagnetic drive coil unit with waterproof properties and strength secured. As to claim 2/1, Umezawa in view of Nomura and Arai et al. teaches the claimed limitation as discussed above except wherein the lower mold comprises a second protrusion part, the second protrusion part protrudes along an axial direction of the second abutting part, a radial size of the second protrusion part is smaller than a radial size of the second abutting part. However Nomura teaches the lower mold (14) comprises a second protrusion part (see annotated figure 2), the second protrusion part (see annotated figure 2) protrudes along an axial direction of the second abutting part (see annotated figure 2), a radial size of the second protrusion part (see annotated figure 2) is smaller than a radial size of the second abutting part (see annotated figure 2) as shown in figure 2, for the advantageous benefit of providing a resin molding method and a resin molding of a solenoid capable of securing the property. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention was made to modify Umezawa in view of Nomura and Arai et al. by using the lower mold comprises a second protrusion part, the second protrusion part protrudes along an axial direction of the second abutting part, a radial size of the second protrusion part is smaller than a radial size of the second abutting part, as taught by Nomura, to provide a resin molding method and a resin molding of a solenoid capable of securing the property. As to claim 4/2, Umezawa in view of Nomura and Arai et al. teaches the claimed limitation as discussed above except wherein the upper mold comprises a first recess part, the first recess part is recessed axially along the first abutting part, a radial size of the first recess part is smaller than a radial size of the first abutting part. However Nomura teaches the upper mold (12) comprises a first recess part (see annotated figure 2), the first recess part (see annotated figure 2) is recessed axially along the first abutting part (see annotated figure 2), a radial size of the first recess part (see annotated figure 2)is smaller than a radial size of the first abutting part (see annotated figure 2) as shown in figure 2, for the advantageous benefit of providing a resin molding method and a resin molding of a solenoid capable of securing the property. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention was made to modify Umezawa in view of Nomura and Arai et al. by using the upper mold comprises a first recess part, the first recess part is recessed axially along the first abutting part, a radial size of the first recess part is smaller than a radial size of the first abutting part, as taught by Nomura, to provide a resin molding method and a resin molding of a solenoid capable of securing the property. Claim(s) 3 is/are rejected under 35 U.S.C. 103 as being unpatentable over Umezawa (CN 105299290), Nomura (JP2009090482) and Arai et al. (US PG Pub 2015/0302963) as applied in claim 2 above, and further in view of Keiji (JP 3999909) As to claim 3/2, Umezawa in view of Nomura and Arai et al. teaches the claimed limitation as discussed above except wherein the upper mold comprises a first protrusion part, the first protrusion part protrudes along an axial direction of the first abutting part, a radial size of the first protrusion part is smaller than a radial size of the first abutting part. However Keiji teaches the upper mold (1) comprises a first protrusion part (see annotated figure 1) , the first protrusion part (see annotated figure 1) protrudes along an axial direction of the first abutting part (see annotated figure 1), a radial size of the first protrusion part is smaller than a radial size of the first abutting part (see annotated figure 1) as shown in figure 1, for the advantageous benefit of providing a resin sealing device and a sealing method capable of resin sealing with a simplified mechanism. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention was made to modify Umezawa in view of Nomura and Arai et al. by using the upper mold comprises a first recess part, the first recess part is recessed axially along the first abutting part, a radial size of the first recess part is smaller than a radial size of the first abutting part, as taught by Keiji, to provide a resin sealing device and a sealing method capable of resin sealing with a simplified mechanism. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOSE A GONZALEZ QUINONES whose telephone number is (571)270-7850. The examiner can normally be reached Monday-Friday: 6:30-2:30 EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, OLUSEYE IWARERE can be reached on (571)270-5112. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /JOSE A GONZALEZ QUINONES/ Primary Examiner, Art Unit 2834 July 10, 2026
Read full office action

Prosecution Timeline

Dec 20, 2024
Application Filed
Jul 15, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
76%
Grant Probability
89%
With Interview (+12.9%)
2y 5m (~10m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1177 resolved cases by this examiner. Grant probability derived from career allowance rate.

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