DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
The examiner acknowledges the changes to the claims and a final rejection follows in light of the amended claims:
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claim(s) 1, 2,3,4,5,6,8, 9, 10-13, 14,16, 17 and 19 is/are rejected under 35 U.S.C. 103 as being unpatentable over Yi et al(US 2015/0253904), new cite, in view of Chung et al. US 2016/0108535(of record)
Re claims 1, 9, 10 and 13:
the reference to Yi et al, from same field of endeavor, shows electronic component(s), that is, a touch sensitive external non-conductive housing layers(component 1 and 2) area of the housing shown in figure 4 . The conductive seed material for this housing component is seed layer (13); the bulk conductive contact material(15,metal) is formed over the seed layer (13);
The general config is as noted in para (0031):
“[0031] Referring to FIG. 13E, in certain embodiments, the touch sensitive housing may have a structure that is dispensed with the insulator isolating layer 10 as compared to those embodiments shown in FIG. 4. In such embodiments, the first and second touch sensor layers 12, 22 are respectively formed on outer and inner surfaces 11, 16 of the inner housing part 1. The assembly of the inner housing part 1 and the patterned seed sub-layers 13, 23 of the first and second touch sensor layers 12, 22 is bent and shaped into a curved structure, and has structural characteristics indicative of the assembly of the inner housing part 1 and the patterned seed sub-layers 13, 23 of the first and second touch sensor layers 12, 22 being bent and shaped. The outer housing part 2 is molded over the first touch sensor layer 12 and the outer surface 11 of the inner housing part 1.”
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The reference to Yi et al does not show an explicit electric component(battery) formed on an internal surface of the housing section 1 and/or the conductive seed material formed on the inner surface(of housing 1) with the external component on the external surface/opposite side of the non-conductive housing.
With regards this, the reference to Chung et al shows an electronic device, see figures below, shows a non-conductive housing component(110) ; a conductive seed material( 110D) formed over a surface of the non-conductive housing component; a bulk conductive contact material(110e ) formed over the conductive seed material and an electronic component (62) and strain sensing (sensing assembly)are connected to the bulk conductive contact material and the conductive seed material. A conductive VIA passing through the non-conductive housing component and connecting the bulk conductive contact material and the conductive seed material to the electronic component(62) by way of the strips(140). With regards an electronic component(battery) on the outside of the housing, this may simply be an external battery connected thru the housing(via USB or connector) for extra supply. Official notice is taken with this.
The method steps being inherent.
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the apparatus as described by Yi et al maybe enhanced by having additional electronic components outside and/or inside the housing as shown above in the reference to Chung et al et al to allow for more flexibility in use and design for efficient portability use of the housing structure support.
Re claims 2 and 11:
The primary reference to Yi et al does not show a conductive via for further contact pathway.
The reference to Chung et al is relied on to show the following:
The reference shows a conductive via passing through the non-conductive housing component and connecting the bulk conductive contact material and the conductive seed material to the electronic component. The method steps of forming a conductive via through at least a portion of the non-conductive housing(110) component and forming the conductive seed material(110D) in electrical contact with the conductive via is part and parcel of such a configuration shown in figure 4B.
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that enhancing the functionality of the Yi et al, may include the use of a vias, as shown by Chung et al and conventional in the art, allowing for further connectivity options.
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Re claim 3: The primary reference to Yi et al does not show a conductive connection for further contact pathway.
The reference to Chung et al shows a conductive connection, comprising at least one of: a conductive post through the non-conductive housing component; a conductive plating on a surface of the non-conductive housing component; or a conductive strip(140) molded in the non-conductive housing component(110), the conductive connection connecting the bulk conductive contact material and the conductive seed material to the electronic component. See ¶ (0022-0025)
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the use of addition conductive pathways in the Yi et al reference, as shown, by Chung et al, would enhance the connectivity between electric components and the seed and conductive contacts further adds to the design flexibility as shown by the Chung et al reference.
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RE claim 4: The primary reference to Yi et al does not show a battery and charging contacts, per se, for a required supply.
The reference to Chung shows a phone which inherently has a battery and the bulk conductive contact material comprises charging contacts for the battery that is by way of the conductive strips(140) that send power on/off signals via the strain sensing without using buttons. See background and summary of invention.
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the use of addition conductive pathways in the Yi et al reference, as shown, by Chung et al, to make use of charge contacts for the battery that is by way of the conductive strips(140) that send power on/off signals via the strain sensing without using buttons, for example, a simple matter of design consideration.
Re claims 5, 16 and 19: The primary reference( Yi et al ) describes a conductive coating material, metal layer, over at least a portion of the bulk conductive contact material, is identified, See ¶[0024] “Referring back to FIGS. 1 and 2, in certain embodiments, each of the first and second touch sensor layers 12, 22 may have a structure that includes a patterned seed sub-layer 13 of a catalytically active metal, a patterned base sub-layer 14 of a base metal formed on the seed sub-layer 13, and optionally a patterned top sub-layer 15 of a metal formed on the base sub-layer 14. The catalytically active metal is useful for activating electroless plating. The catalytically active metal may be selected from the group consisting of palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron, and combinations thereof. The base metal may have structural characteristics indicative of the base sub-layer 14 being formed by electroless plating techniques. The base metal may be selected from the group consisting of nickel, silver, gold, and copper.”
Re claim 6 and 14: The primary reference does not explicitly describe an electronic component (strain type sensor)including a sensing circuit with the bulk conductive contact material having a sensor electrode for the sensing circuit.
The reference to Chung et al shows a sensing circuit and the bulk conductive contact material with sensor electrode(strain type 120,130) for the sensing circuit.
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the use of a sensing circuit that may be part of the Yi et al reference, from same field of endeavor, to include a sensing circuit as part of the electronic component(inside of button portion), of casing/housing, to allow for enhanced operation for a more efficient device as is conventional for phone devices, for example, as noted in Chung et al(see ¶ 0009).
Re claim 8. The primary reference shows an electronic device and housing but does not show explicit details on the includes the bulk conductive contact material with multiple
(two)electrodes, however, this is represented in Chung et al via the block 116(figure 5) where a pair of electrodes are shown.
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In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the use of electrodes, in the Yi et al reference, with coupling to conductive contact material, as outlined in the Chung et al reference, allowing for appropriate signals to be routed operation from contact to block component(116) in the phone device where such housing is used and efficient use of space is of concern.
Re claim 12:
The primary reference to Yi et al does not show details of a conductive strip with seed layer and electronic component arrangement, however, the Chung et reference shows (shown in figure above), a conductive strip(140) is formed in the non-conductive housing component(110); the conductive seed material(110d) is in electrical contact with the conductive strip(140); and electrically connecting the conductive strip to the electronic component(62) or strain sensors.(also electrical components)
In light of the above it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have recognized that the general housing reference to Yi et al would have electronic components that are coupled with the above conductive strip/layer and seed layer as noted in Chung et al to take advantage of such a layout for efficiency and operational functionality when, for example, being used in a phone device.
Re claim 17: The primary reference shows Nickel used in the sensing assemblies.
See ¶[0024] “Referring back to FIGS. 1 and 2, in certain embodiments, each of the first and second touch sensor layers 12, 22 may have a structure that includes a patterned seed sub-layer 13 of a catalytically active metal, a patterned base sub-layer 14 of a base metal formed on the seed sub-layer 13, and optionally a patterned top sub-layer 15 of a metal formed on the base sub-layer 14. The catalytically active metal is useful for activating electroless plating. The catalytically active metal may be selected from the group consisting of palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron, and combinations thereof. The base metal may have structural characteristics indicative of the base sub-layer 14 being formed by electroless plating techniques. The base metal may be selected from the group consisting of nickel, silver, gold, and copper.”
Allowable Subject Matter
Claims 7, 15, 18 and 20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ARNOLD M KINKEAD whose telephone number is (571)272-1763. The examiner can normally be reached M-F 7am-5:30pm(Fri-Flex).
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Menatoallah Youssef can be reached at 571-270-3684. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/ARNOLD M KINKEAD/Primary Examiner, Art Unit 2836
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