DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1, 2,3,4,5,6,8, 9, 10-12, 14,16, 17 and 19 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Chung et al. US 2016/0108535
Re claims 1, 9, and 10:
The reference to Chung et al shows an electronic device, see figures below, where a non-conductive housing component(110) ; a conductive seed material( 110D) formed over an external surface of the non-conductive housing component; a bulk conductive contact material(110e ) formed over the conductive seed material; and an electronic component (62) and strain sensing (sensing assembly)are connected to the bulk conductive contact material and the conductive seed material. A conductive VIA passing through the non-conductive housing component and connecting the bulk conductive contact material and the conductive seed material to the electronic component(62) by way of the strips(140).
The method steps being inherent.
Re claims 2 and 11:The electronic device shows a conductive via passing through the non-conductive housing component and connecting the bulk conductive contact material and the conductive seed material to the electronic component. The method steps of forming a conductive via through at least a portion of the non-conductive housing(110) component and forming the conductive seed material(110D) in electrical contact with the conductive via is part and parcel of such a configuration shown in figure 4B.
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Re claim 3: a conductive connection, comprising at least one of: a conductive post through the non-conductive housing component; a conductive plating on a surface of the non-conductive housing component; or a conductive strip(140) molded in the non-conductive housing component(110), the conductive connection connecting the bulk conductive contact material and the conductive seed material to the electronic component.
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RE claim 4: The electronic device, phone, inherently has a battery and the bulk conductive contact material comprises charging contacts for the battery that is by way of the conductive strips(140) that send power on/off signals via the strain sensing without using buttons. See background and summary of invention.
Re claims 5, 16 and 19: One conductive coating material over at least a portion of the bulk conductive contact material, is identified as silver. See ¶ (0022-0025)
Re claim 6:The electronic component with sensing circuit and the bulk conductive contact material has a sensor electrode(strain type 120,130) for the sensing circuit.
Re claim 8. The electronic device includes the bulk conductive contact material with multiple( two )electrodes on the block 116.
Re claim 12:
As shown in figures above, a conductive strip(140) is formed in the non-conductive housing component(110); the conductive seed material(110d) is in electrical contact with the conductive strip(140); and electrically connecting the conductive strip to the electronic component(62) or strain sensors.(also electrical components)
Re claim 14:The electronic component comprises a sensing circuit(strain sensors)as noted above.
Re claim 17: Nickel is used in the sensing assemblies.
“ [0022] Generally, the electronic device 50 is, for example, a smart phone, a PDA, a table PC, and the casing body 110 of the casing 100 is, for example, a plastic casing body or a carbon fiber casing body, or a complex casing body composed of plastic and metal. On the other hand, a material of the sensing assemblies 120 and 130 may be, for example, a metal with favorable conductivity such as copper, nickel or silver”
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Allowable Subject Matter
Claims 7, 13, 15, 18 and 20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ARNOLD M KINKEAD whose telephone number is (571)272-1763. The examiner can normally be reached M-F 7am-5:30pm(Fri-Flex).
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Menatoallah Youssef can be reached at 571-270-3684. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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ARNOLD M. KINKEAD
Primary Examiner
Art Unit 2849
/ARNOLD M KINKEAD/Primary Examiner, Art Unit 2849
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