DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
This action is in response to the CON filed on 01/09/2025
This application is a CON of 17/986,669 now a PAT 12,231,754 B2
Claim 1 is independent
Claims 1-9 are pending
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 01/29/2025 and 09/30/2025 are in compliance with the provisions of 37 CFR 1.97 and 37 CFR 1.98(a)(4). Accordingly, the information disclosure statement is being considered by the examiner.
Priority
Acknowledgment is made of applicant’s claim for foreign priority under 35 U.S.C. 119 (a)-(d). The certified copy has been filed in parent and instant application.
Specification
The title of the invention is not descriptive. A new title is required that is clearly indicative of the invention to which the claims are directed.
Double Patenting
The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the claims at issue are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); and In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on a nonstatutory double patenting ground provided the reference application or patent either is shown to be commonly owned with this application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP §§ 706.02(l)(1) - 706.02(l)(3) for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/forms/. The filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to http://www.uspto.gov/patents/process/file/efs/guidance/eTD-info-I.jsp.
Claims 1-2 and 4-9 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-6 of U.S. Patent Number 12,231,754 B2. Although the claims at issue are not identical, they are not patentably distinct from each other as shown in the following table.
1. Application: A vehicular camera comprising:
1. Patent 12,231,754 B2: A vehicular camera comprising:
a lens barrel including at least one optical lens; a sensor board having a first surface facing the at least one optical lens and a second surface opposing to the first surface; an imaging sensor disposed on the sensor board;
1. Patent 12,231,754 B2: a lens barrel including at least one optical lens; a sensor board having a first surface facing the at least one optical lens and a second surface opposing to the first surface; an imaging sensor disposed on the sensor board;
a board mounted connector disposed on the second surface of the sensor board; a case accommodating at least the sensor board; and a case connector located on a part of the case that is coupled to the board mounted connector, the case connector configured to connect to an external cable, wherein the case includes:
1. Patent 12,231,754 B2: a board mounted connector disposed on the second surface of the sensor board; a case accommodating at least the sensor board; and a case connector disposed on a part of the case that is coupled to the board mounted connector, the case connector configured to connect to an external cable, wherein the case includes:
a first component supporting the lens barrel, the first component having a third surface, a fourth surface opposing to the third surface and facing at least a part of the first surface of the sensor board, and end surfaces located between the third surface and the fourth surface, the end surfaces including a first end surface, a second end surface, a third end surface, and a fourth end surface;
1. Patent 12,231,754 B2: a first component having a higher light transmittance; and supporting the lens barrel, the first component having a third surface, a fourth surface opposing to the third surface and facing at least a part of the first surface of the sensor board, and end surfaces arranged between the third surface and the fourth surface, the end surfaces including a first end surface, a second end surface, a third end surface, and a fourth end surface;
a second component including a rear portion, a first side wall portion, a second side wall portion, a third side wall portion, a fourth side wall portion, the rear portion facing at least a part of the second surface of the sensor board, the case connector located on the rear portion, and the rear portion having a rectangular shape,
1. Patent 12,231,754 B2: a second component having a lower light transmittance, wherein including a rear portion, a first side wall portion, a second side wall portion, a third side wall portion, a fourth side wall portion, the rear portion facing at least a part of the second surface of the sensor board, the case connector disposed on the rear portion, and the rear portion having a rectangular shape,
the first side wall portion, the second side wall portion, the third side wall portion, and the fourth side wall portion extending from respective sides of the rear portion toward the fourth surface of the first component,
1 Patent 12,231,754 B2: the first side wall portion, the second side wall portion, the third side wall portion, and the fourth side wall portion extending from respective sides of the rear portion toward the fourth surface of the first component,
the first side wall portion having a first outer surface, a first inner surface, and a first end portion opposing to the rear portion, the second side wall portion having a second outer surface, a second inner surface, and a second end portion opposing to the rear portion, the third side wall portion having a third outer surface, a third inner surface, and a third end portion opposing to the rear portion, and
1. Patent 12,231,754 B2: the first side wall portion having a first outer surface, a first inner surface, and a first end portion opposing to the rear portion, the second side wall portion having a second outer surface, a second inner surface, and a second end portion opposing to the rear portion, the third side wall portion having a third outer surface, a third inner surface, and a third end portion opposing to the rear portion, and
wherein at least a part of the sensor board is located between the first inner surface of the first side wall portion and the third inner surface of the third side wall portion, and at least a part of the sensor board is located between the second inner surface of the second side wall portion and the fourth inner surface of the fourth side wall portion,
1. Patent 12,231,754 B2: wherein at least a part of the sensor board is disposed between the first inner surface of the first side wall portion and the third inner surface of the third side wall portion, and at least a part of the sensor board is disposed between the second inner surface of the second side wall portion and the fourth inner surface of the fourth side wall portion,
wherein the fourth surface of the first component includes a first facing portion facing the first end portion of the first side wall portion of the second component, a second facing portion facing the second end portion of the second side wall portion of the second component, a third facing portion facing the third end portion of the third side wall portion of the second component, and a fourth facing portion facing the fourth end portion of the fourth side wall portion of the second component,
1. Patent 12,231,754 B2: wherein the fourth surface of the first component includes a first contact portion contacting the first end portion of the first side wall portion of the second component, a second contact portion contacting the second end portion of the second side wall portion of the second component, a third contact portion contacting the third end portion of the third side wall portion of the second component, and a fourth contact portion contacting the fourth end portion of the fourth side wall portion of the second component,
wherein the case includes a groove and a ring-shaped component,
the groove extending across the first end surface, the second end surface, the third end surface, and the fourth end surface of the first component, and
1. Patent 12,231,754 B2: wherein the case includes a groove and a ring-shaped component, the groove extending across the first end surface, the second end surface, the third end surface, and the fourth end surface of a joint is included in the first component, and
extending across the first outer surface of the first side wall portion, the second outer surface of the second side wall portion, the third outer surface of the third side wall portion, and the fourth outer surface of the fourth side wall portion of the second component, the groove including a first side surface, a second side surface facing the first side surface, and a base surface, the ring-shaped component located in the groove,
1. Patent 12,231,754 B2: extending across the first outer surface of the first side wall portion, the second outer surface of the second side wall portion, the third outer surface of the third side wall portion, and the fourth outer surface of the fourth side wall portion of the second component, the groove including a first side surface, a second side surface facing the first side surface, and a base surface, the ring-shaped component arranged in the groove,
wherein the ring-shaped component of the case includes a light transmissive material configured to partially transmit a laser beam for welding the first component and the second component together around at least a part of the base surface of the groove,
1. Patent 12,231,754 B2: wherein the ring-shaped component of the case includes a light transmissive material configured to partially transmit the laser beam for welding the first component and the second component together around at least a part of the base surface of the groove,
wherein a light absorptive material configured to absorb the laser beam and convert the laser beam to heat is located between a portion of the ring-shaped component located in the groove and the imaging sensor.
1. Patent 12,231,754 B2: wherein the first component and the second component of the case includes a light absorptive material configured to absorb a laser beam and convert the laser beam to heat,
2. Application: wherein the first component and second component includes the light absorptive material.
1. Patent 12,231,754 B2: wherein the first component and second component of the case includes the light absorptive material.
4. Application: wherein each of the first part of the light absorptive material, the second part of the light absorptive material, the third part of the light absorptive material, and the fourth part of the light absorptive material is a part of the first component or the second component of the case.
1. Patent 12,231,754 B2: wherein the first component and the second component of the case includes a light absorptive material configured to absorb a laser beam and convert the laser beam to heat
5. Application: comprising: a sealing material located between the first component of the case and the lens barrel.
2. Patent 12,231,754 B2: a sealing material disposed between the first component of the case and the lens barrel.
6. Application: wherein the first component of the case and the lens barrel are attached around an optical axis of the lens barrel.
3. Patent 12,231,754 B2: wherein the first component of the case and the lens barrel are attached around an optical axis of the lens barrel.
7. Application: wherein the sensor board and the lens barrel are fixed to each other by a fixing unit at two or more places.
4. Patent 12,231,754 B2: wherein the sensor board and the lens barrel are fixed to each other by a fixing unit at two or more places.
8. Application: wherein the fixing unit includes at least one of an adhesive, a screw, or solder.
5. Patent 12,231,754 B2: wherein the fixing unit includes at least one of an adhesive, a screw, or solder.
9. Application: wherein a transmittance of the light absorptive material with respect to the laser beam is less than 10%, and a transmittance of the light transmissive material with respect to the laser beam is 20% or more.
6. Patent 12,231,754 B2: wherein a transmittance of the light absorptive material with respect to the laser beam is less than 10%, and a transmittance of the light transmissive material with respect to the laser beam is 20% or more.
Conclusion
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/PADMA HALIYUR/Primary Examiner, Art Unit 2639 June 17, 2026
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