DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1 – 7 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
As to claim 1, it is unclear how the first layer of the wiring sheet is being elastically deformed such that the first connection portion of the wiring sheet receiving a pressing force from the proximal end of the probe and comes in contact with the electrode pad? The claim attempts to define the subject matter in terms of the result to be achieved (elastically deforming the first layer…), but in so doing merely states the problem to be solved, without indicating the technical features necessary for achieving this result
Claims 2 - 7 are rejected by virtue of their dependency on claim 1.
Claims 1 - 7 have not been rejected over the prior art because, in light of the 35 U.S.C. 112 rejection supra, a thorough search and consideration of the prior art could not be reasonably made by the Examiner due to the interpretation of the limitations of the claim, hence, it would not be proper to reject the claims on the basis of prior art. However, any subsequently presented claims, in definite form will be subject to prior art rejection.
Prior Art of Record
The prior art made of record and not relied upon is considered pertinent to applicant s disclosure.
MORI (20250027973) is cited for its disclosure of a probe card wherein the probes of the probe group is capable of independently buckling deformation between the upper guide plate and the lower guide plate, and their lower ends are capable of moving independently in a vertical direction each other.
KANOSUE et al. (20240426903) is cited for its disclosure of an electrical connection apparatus including probes, a wiring board, a wiring sheet, and a printed board. The wiring board includes first electrodes each of which is connected to any one of the probes, and second electrodes each of which is electrically connected to any one of the first electrodes. The wiring sheet includes a first connection portion arranged on a first main surface, a second connection portion arranged on a second main surface facing the first main surface, and an internal circuit electrically connected to the first connection portion.
WU et al. (20240151764) is cited for its disclosure of a composite intermediary device using vertical probe for wafer testing, comprising: a printed circuit board, having a testing circuit, for connecting to a measuring apparatus, the bottom of the printed circuit board has a first contact; a glass interposer arranged below the printed circuit board, the upper surface of the glass interposer has a printed circuit, the lower surface has multiple contact pads, multiple through holes set through the upper surface and the lower surface, and the through holes are filled with a conductive material, so as to electrically connect the printed circuit and the contact pads, and the top of the glass interposer is provided with a second contact which connects with the printed circuit; at least one flexible connecting plate.
Park (20190041430) is cited for its disclosure of test device comprising a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes each comprising a main sliding contact portion to be slidably inserted in the guide hole, a main terminal contact portion to be inserted in the terminal hole, and a main elastic deformation portion connecting the main sliding contact portion and the main terminal contact portion and elastically deformed by compression of a lengthwise direction.
Yamada et al. (8149008) is cited for its disclosure of a probe card electrically connectable with a semiconductor wafer wherein each probe is made of a conductive material and is extensible and compressible by elastic force along a longitudinal direction thereof, the probe card comprising: a probe head that holds the plurality of probes; a wiring board that has a wiring pattern corresponding to the circuit structure; a flat interposer that is stacked on the wiring board and relays wirings of the wiring board.
Chraft et al. (6911835) is cited for its disclosure of a high performance probe system comprising a probe board comprising tester contacts; a tile; a plurality of probes disposed on said tile; and conductive paths electrically connecting ones of said tester contacts and ones of said probes, said electrically conductive paths comprising conductive traces of a flex strip disposed at least in part between said probe board.
Pietzschmann (6784678) is cited for its disclosure of test apparatus for semiconductor circuit and method of testing semiconductor circuits wherein probe card is made from a material that is capable of flexibly following movements of said actuators.
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/REENA AURORA/Primary Examiner, Art Unit 2858