Prosecution Insights
Last updated: October 02, 2026
Application No. 19/061,127

COMPUTING DEVICES WITH IMPROVED THERMAL MANAGEMENT

Non-Final OA §102
Filed
Feb 24, 2025
Priority
Oct 18, 2022 — continuation of 12/262,502
Examiner
LEA EDMONDS, LISA S
Art Unit
Tech Center
Assignee
Mellanox Technologies Ltd.
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
3m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
671 granted / 772 resolved
+26.9% vs TC avg
Minimal +5% lift
Without
With
+4.9%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 10m
Avg Prosecution
16 currently pending
Career history
775
Total Applications
across all art units

Statute-Specific Performance

§101
1.4%
-38.6% vs TC avg
§103
24.3%
-15.7% vs TC avg
§102
52.9%
+12.9% vs TC avg
§112
16.3%
-23.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 772 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 2, 5-11, 13-15, 18, and 20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Grossmann et al. (2022/0350382). With respect to claim 1, Grossmann et al. discloses a thermal management apparatus (400) comprising: a housing (404) defining: a first end (402b); and a second end (402a) opposite the first end (402b); an electronic component (408,410) supported within the housing (404); a primary inlet (430a, 434a) configured to receive a primary airflow (700, 702, 704, 706) having a first temperature; and a secondary inlet (432a, 436a) configured to receive a secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) having a second temperature, wherein the second temperature is different than the first temperature, wherein the primary airflow (700, 702, 704, 706) and the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) are collectively configured to dissipate heat generated by the electronic component (408, 410). With respect to claim 2, Grossmann et al. discloses the thermal management apparatus (400) of Claim 1, wherein the primary inlet (430a, 434a) and the secondary inlet (432a, 436a) are disposed proximate the first end (402b) of the housing (404). With respect to claim 5, Grossmann et al. discloses the thermal management apparatus (400) of Claim 1, wherein the second temperature is less than the first temperature (see claim 14 for example). With respect to claim 6, Grossmann et al. discloses the thermal management apparatus (400) of Claim 1, wherein a temperature of the airflow exiting the housing (404) via the second end (402b) is greater than the dew point of the external environment of the housing (404). With respect to claim 7, Grossmann et al. discloses the thermal management apparatus (400) of Claim 1, further comprising a computing device (400) communicably coupled to the primary airflow (700, 702, 704, 706) and the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b). With respect to claim 8, Grossmann et al. discloses the thermal management apparatus (400) of Claim 7, wherein the computing device (400) is configured to modify one or more parameters of the primary airflow (700, 702, 704, 706) or the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) based upon one or more operating characteristics of the electronic component (408, 410). With respect to claim 9, Grossmann et al. discloses the thermal management apparatus (400) of Claim 8, wherein the computing device (400) is configured to modify the second temperature of the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b). With respect to claim 10, Grossmann et al. discloses the thermal management apparatus (400) of Claim 8, wherein the computing device (400) is configured to modify a flow rate of the primary airflow or the secondary airflow. With respect to claim 11, Grossmann et al. discloses the thermal management apparatus (400) of Claim 1, further comprising a plurality of electronic components (408, 410, 422, 424) including the electronic component (408, 410). With respect to claim 13, Grossmann et al. discloses the thermal management apparatus of Claim 1, wherein the electronic component(408, 410) is a graphics processing unit (GPU). With respect to claim 14, Grossmann et al. discloses a method for thermal management comprising: providing a primary airflow (700, 702, 704, 706) having a first temperature to a housing (404); and providing to the housing (404) a secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) having a second temperature, wherein the second temperature is different than the first temperature, wherein the primary airflow (700, 702, 704, 706), and the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) are collectively configured to dissipate heat generated by an electronic component (408, 410) supported within the housing (404) while maintaining an air temperature internal to the housing (404) greater than a dew point associated with an interior of the housing (404). With respect to claim 15, Grossmann et al. discloses the method of Claim 14, wherein the housing (404) defines a first end (402b) and a second end (402a) opposite the first end (402b), the primary airflow (700, 702, 704, 706) and the secondary airflow (800a, 802a, 804a, 806a, 800b, 802b, 804b, 806b) provided to the housing (404) proximate the first end (402b). With respect to claim 18, Grossmann et al. discloses the method of Claim 14, wherein the second temperature is less than the first temperature (see claim 14 for example). With respect to claim 20, Grossmann et al. discloses the method of Claim 14, wherein the electronic component (408, 410) is a graphics processing unit (GPU). Allowable Subject Matter Claims 3, 4, 12, 16, 17, and 19 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: as to claims 3, 4, 12, 16, 17, and 19, patentability resides, at least in part, in each and every limitations as presently claimed and including all of the other limitations of the base claim(s) respectfully. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Any inquiry concerning this communication or earlier communications from the examiner should be directed to LISA LEA-EDMONDS whose telephone number is (571)272-2043. The examiner can normally be reached M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at 571-272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. LISA LEA-EDMONDS Primary Examiner Art Unit 2847 /LISA LEA-EDMONDS/Primary Examiner, Art Unit 2847 2026-08-28
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Prosecution Timeline

Feb 24, 2025
Application Filed
Sep 02, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
92%
With Interview (+4.9%)
1y 10m (~3m remaining)
Median Time to Grant
Low
PTA Risk
Based on 772 resolved cases by this examiner. Grant probability derived from career allowance rate.

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