Prosecution Insights
Last updated: May 29, 2026
Application No. 19/071,983

ULTRASONIC WELDING SYSTEMS, AND SONOTRODES FOR ULTRASONIC WELDING SYSTEMS

Non-Final OA §102§103
Filed
Mar 06, 2025
Priority
Mar 15, 2024 — provisional 63/565,931 +1 more
Examiner
PATEL, DEVANG R
Art Unit
1735
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Kulicke And Soffa Industries Inc.
OA Round
1 (Non-Final)
65%
Grant Probability
Favorable
1-2
OA Rounds
1y 7m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 65% — above average
65%
Career Allowance Rate
663 granted / 1018 resolved
At TC average
Strong +39% interview lift
Without
With
+39.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 10m
Avg Prosecution
47 currently pending
Career history
1078
Total Applications
across all art units

Statute-Specific Performance

§103
90.1%
+50.1% vs TC avg
§102
3.7%
-36.3% vs TC avg
§112
2.2%
-37.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1018 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, Species A (claims 1-3, 5-6, 9-10 and 39-49) in the reply filed on 3/13/26 is acknowledged. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-2 and 41-42 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Keisling (US 3623649). Regarding claim 1, Keisling discloses a sonotrode 10 configured for use in an ultrasonic welding system (fig. 1) comprising: a body portion terminating at a tip portion 14, the tip portion including a working surface (fig. 2- bottom surface), the working surface defining an aperture (center- connected to channel 24- fig. 4, configured to hold a conductive pin (holds lead/pin 34- fig. 5) during an ultrasonic welding process (figs. 6-8), the working surface defining a plurality of linear depressions/grooves 30-32 having varied dimensions (col. 2, lines 67-75), each of the linear depressions following a path (path extends away toward a peripheral edge- figs. 2, 4) that does not intersect the aperture. Examiner notes that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. As to claim 2, Keisling shows that each of the plurality of linear depressions 30-32 extending across the working surface of the tip portion (fig. 2). It is noted that extending any length across the working surface meets the claim. Regarding claim 41, Keisling discloses an ultrasonic welding system (fig. 1) comprising a support structure 40 for supporting a workpiece 36 (fig. 4); and a weld head assembly including an ultrasonic converter (not shown) carrying a sonotrode 10 configured for use in the ultrasonic welding system, the sonotrode including a body portion terminating at a tip portion 14, the tip portion including a working surface (fig. 2- bottom surface), the working surface defining an aperture (center- connected to channel 24- fig. 4, configured to hold a conductive pin (holds lead/pin 34- fig. 5) during an ultrasonic welding process (figs. 6-8), the working surface defining a plurality of linear depressions/grooves 30-32 having varied dimensions (col. 2, lines 67-75), each of the linear depressions following a path (path extends away toward a peripheral edge- figs. 2, 4) that does not intersect the aperture. Examiner notes that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. As to claim 42, Keisling shows that each of the plurality of linear depressions 30-32 extending across the working surface of the tip portion (fig. 2). Claims 1-2, 5, 41-42 and 45 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Interrante et al. (US 5193732, hereafter “Interrante”). Regarding claim 1, Interrante discloses a sonotrode 50 (fig. 2) configured for use in an ultrasonic welding system (col. 10, lines 3-20) comprising: a body portion terminating at a tip portion, the tip portion including a working surface (fig. 2B shows bottom surface), the working surface defining an aperture 52 (in center) configured to hold a conductive pin (e.g. staple or wire 40- fig. 5) during an ultrasonic welding process (figs. 6-8), the working surface defining a plurality of linear depressions/grooves 54, each of the linear depressions following a path (path extends away toward a peripheral edge- fig. 2B) that does not intersect the aperture. It is noted that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. As to claim 2, Interrante shows that each of the plurality of linear depressions extending across the working surface of the tip portion. Any length extending across the working surface meets the claim. As to claim 5, Interrante shows that the working surface includes a smooth portion and the plurality of linear depressions are disposed around a peripheral portion of the working surface (fig. 2B). Regarding claim 41, Interrante discloses an ultrasonic welding system (figs. 2-5) comprising a support structure for supporting a workpiece (fig. 5); and a weld head assembly including an ultrasonic converter (not shown) carrying a sonotrode 50 (fig. 2) configured for use in the ultrasonic welding system (col. 10, lines 3-20), the sonotrode including: a body portion terminating at a tip portion, the tip portion including a working surface (fig. 2B shows bottom surface), the working surface defining an aperture 52 (in center) configured to hold a conductive pin (e.g. staple or wire 40- fig. 5) during an ultrasonic welding process (figs. 6-8), the working surface defining a plurality of linear depressions/grooves 54, each of the linear depressions following a path (path extends away toward a peripheral edge- fig. 2B) that does not intersect the aperture. It is noted that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. As to claim 42, Interrante shows that each of the plurality of linear depressions extending across the working surface of the tip portion (fig. 2B). As to claim 45, Interrante shows that the working surface includes a smooth portion and the plurality of linear depressions are disposed around a peripheral portion of the working surface (fig. 2B). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1-3, 5, 9-10. 39-45 and 47-49 are rejected under 35 U.S.C. 103 as being unpatentable over Distefano et al. (US 5868301, “Distefano”) in view of Pitts et al. (US 4776509, “Pitts”). Regarding claim 1, Distefano discloses a sonotrode configured for use in an ultrasonic welding system comprising: a body portion terminating at a tip portion 110, the tip portion including a working surface 120 (fig. 2A), the working surface defining an aperture 150 configured to hold a conductive pin during an ultrasonic welding process (figs. 2A-2C). Examiner again notes that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. Concerning linear depressions, Distefano discloses that the working surface also includes a plurality of grooves 210 (depressions) extending on the working surface, the grooves adapted to receive and engage the elongated leads being bonded to respective chip contacts for accurate alignment (fig. 3; col. 7, lines 35- 50); exemplary figure 3C-3D shows 4 such guides/grooves which appears to be linear depressions that do not intersect the aperture 150 (col. 7, lines 45-55). Nonetheless, providing such depressions is known in the ultrasonic bonding tools. Pitts discloses an ultrasonic bonding tool 30 comprising a body portion and a tip portion 32 (fig. 7), wherein the tip portion working surface includes a plurality of linear depressions or grooves 34/44/54 (see figs. 8-15). Pitts further teaches that the cross-pattern grooves configuration maximizes the coupling of ultrasonic energy and improves lead bonding (col. 4, lines 7-20, 60-62). By more efficiently coupling the ultrasonic energy to the interface, the parameters of pressure force and ultrasonic powder could be reduced, avoiding cratering and poor bonding (col. 4, lines 46-52). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide linear depressions on the working surface in the tip of Distefano because they would assist in accurate alignment of the leads being bonded (as desired by Distefano) and result in efficient coupling of ultrasonic energy to the interface, reducing the parameters of pressure force & ultrasonic powder and thereby avoiding cratering and poor bonding, as suggested by Pitts. Thus, Distefano as modified by Pitts discloses the working surface including a plurality of linear depressions, each of the linear depressions following a path that does not intersect the aperture. As to claim 2, Distefano and Pitts discloses each of the plurality of linear depressions extending across the working surface of the tip portion. Examiner notes that extending any length across the working surface meets the claim. As to claim 3, in one embodiment, Pitts shows that the plurality of linear depressions collectively define a star-shaped pattern (fig. 11). It is noted that “star-shaped” pattern is generally subjective and not limited by specific geometry. Distefano teaches that any suitable orientation of grooves/depressions can be selected that facilitate the alignment of the leads to the chip contacts with capturing the lead withing the grooves, depending on the chip-package assembly (col. 9, lines 22-50). Accordingly, it would have been obvious to one of ordinary skill in the art to utilize a star-shaped depressions pattern on the working surface in the combination of Distefano & Pitts with a motivation to align the leads for a desired chip-package assembly. As to claim 5, Distefano shows that the working surface includes a smooth portion (fig. 2A). Distefano as modified by Pitts above includes the plurality of linear depressions disposed around a peripheral portion of the working surface. As to claims 9-10, Distefano shows that the tip portion 110 includes a chamfered portion 140 (see fig. 2A- transition radius) between the working surface and a terminal end of the sonotrode, wherein the chamfered portion is configured to align the conductive pin with respect to the aperture in connection with the ultrasonic welding process. As to claim 39, in one embodiment, Pitts shows that the plurality of linear depressions collectively define a plurality of V-shaped patterns around a peripheral portion of the working surface a star-shaped pattern (fig. 11). Distefano teaches that any suitable orientation of grooves/depressions can be selected that facilitate the alignment of the leads to the chip contacts with capturing the lead withing the grooves, depending on the chip-package assembly (col. 9, lines 22-50). Accordingly, it would have been obvious to one of ordinary skill in the art to utilize V-shaped depressions pattern on the working surface in the combination of Distefano & Pitts in order to align the leads for a desired chip-package assembly. As to claim 40, Distefano discloses that the body portion and the tip portion are separate pieces coupled together (fig. 2A). Regarding claim 41, Distefano discloses an ultrasonic welding system comprising: a weld head assembly carrying a sonotrode (fig. 2), the sonotrode including a body portion terminating at a tip portion 110, the tip portion including a working surface 120 defining an aperture 150 configured to hold a conductive pin during an ultrasonic welding process (fig. 2A). Examiner takes official notice with respect to a support structure for supporting a workpiece; and a weld head assembly including an ultrasonic converter, which is a conventional feature known in the ultrasonic welding system. Examiner notes that “a conductive pin” is material worked upon that does not structurally limit the sonotrode and said pin is open to any shape or dimension. Concerning linear depressions, Distefano discloses that the working surface also includes a plurality of grooves 210 (depressions) extending on the working surface, the grooves adapted to receive and engage the elongated leads being bonded to respective chip contacts for accurate alignment (fig. 3; col. 7, lines 35- 50); exemplary figure 3C-3D shows 4 such guides/grooves which appears to be linear depressions that do not intersect the aperture 150 (col. 7, lines 45-55). Nonetheless, providing such depressions is known in the ultrasonic bonding tools. Pitts discloses an ultrasonic bonding tool 30 comprising a body portion and a tip portion 32 (fig. 7), wherein the tip portion working surface includes a plurality of linear depressions or grooves 34/44/54 (see figs. 8-15). Pitts further teaches that the cross-pattern grooves configuration maximizes the coupling of ultrasonic energy and improves lead bonding (col. 4, lines 7-20, 60-62). By more efficiently coupling the ultrasonic energy to the interface, the parameters of pressure force and ultrasonic powder could be reduced, avoiding cratering and poor bonding (col. 4, lines 46-52). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide linear depressions on the working surface in the tip of Distefano because they would assist in accurate alignment of the leads being bonded (as desired by Distefano) and results in efficient coupling of ultrasonic energy to the interface, reducing the parameters of pressure force and ultrasonic powder and thereby avoiding cratering and poor bonding, as suggested by Pitts. Thus, Distefano as modified by Pitts discloses the working surface including a plurality of linear depressions, each of the linear depressions following a path that does not intersect the aperture. As to claim 42, Distefano and Pitts discloses each of the plurality of linear depressions extending across the working surface of the tip portion. Examiner notes that extending any length across the working surface meets the claim. As to claims 43-44, in one embodiment, Pitts shows that the plurality of linear depressions collectively define a star-shaped pattern, which encompasses V-shape (fig. 11). It is noted that “star-shaped” pattern is generally subjective and not limited by specific geometry. Distefano teaches that any suitable orientation of grooves/depressions can be selected that facilitate the alignment of the leads to the chip contacts with capturing the lead withing the grooves, depending on the chip-package assembly (col. 9, lines 22-50). Accordingly, it would have been obvious to one of ordinary skill in the art to utilize a star-shaped or V-shaped depressions pattern on the working surface in the combination of Distefano & Pitts with a motivation to align the leads for a desired chip-package assembly. As to claim 45, Distefano shows that the working surface includes a smooth portion (fig. 2A). Distefano as modified by Pitts above includes the plurality of linear depressions disposed around a peripheral portion of the working surface. As to claim 47, Distefano discloses that the body portion and the tip portion are separate pieces coupled together (fig. 2A). As to claims 48-49, Distefano shows that the tip portion 110 includes a chamfered portion 140 (see fig. 2A- transition radius) between the working surface and a terminal end of the sonotrode, wherein the chamfered portion is configured to align the conductive pin with respect to the aperture in connection with the ultrasonic welding process. Allowable Subject Matter Claims 6 and 46 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including ALL of the limitations of the base claim and any intervening claims. Information Disclosure Statement The information disclosure statement (IDS) submitted on 3/6/25, 6/19/25 complies with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Inquiry Any inquiry concerning this communication or earlier communications from the examiner should be directed to DEVANG R PATEL whose telephone number is (571) 270-3636. The examiner can normally be reached on Monday-Friday 8am-5pm, EST. To schedule an interview, Applicant is encouraged to use the USPTO Automated Interview Request (AIR) at https://www.uspto.gov/patents/laws/interview-practice. Communications via Internet email are at the discretion of Applicant. If Applicant wishes to communicate via email, a written authorization form must be filed by Applicant: Form PTO/SB/439, available at www.uspto.gov/patent/patents-forms. The form may be filed via the Patent Center and can be found using the document description Internet Communications, see https://www.uspto.gov/patents/apply/forms. In limited circumstances, the Applicant may make an oral authorization for Internet communication. See MPEP § 502.03. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Keith Walker can be reached on 571-272-3458. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Center. For more information, see https://patentcenter.uspto.gov. For questions, technical issues or troubleshooting, please contact the Patent Electronic Business Center at ebc@uspto.gov or 1-866-217-9197 (toll-free). /DEVANG R PATEL/ Primary Examiner, AU 1735
Read full office action

Prosecution Timeline

Mar 06, 2025
Application Filed
May 11, 2026
Non-Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12636738
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT
5y 9m to grant Granted May 26, 2026
Patent 12629753
Copper Powder, and Method for Manufacturing Copper Powder
3y 2m to grant Granted May 19, 2026
Patent 12625013
Method for Determining the Temperature in a Joining Zone
2y 6m to grant Granted May 12, 2026
Patent 12615720
ASSEMBLING METHOD OF ELECTRONIC MODULE
2y 11m to grant Granted Apr 28, 2026
Patent 12616051
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE LOOPS IN CONNECTION WITH A WORKPIECE
1y 5m to grant Granted Apr 28, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
65%
Grant Probability
99%
With Interview (+39.3%)
2y 10m (~1y 7m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1018 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month