Prosecution Insights
Last updated: October 04, 2026
Application No. 19/075,570

ELECTRODE AND SHIELDING SYSTEMS AND METHODS FOR COMPLIANT SENSORS

Non-Final OA §101§DP
Filed
Mar 10, 2025
Priority
Jul 29, 2020 — provisional 63/058,098 +1 more
Examiner
PHAN, MINH Q
Art Unit
Tech Center
Assignee
Nitto Bend Technologies Inc.
OA Round
1 (Non-Final)
76%
Grant Probability
Favorable
1-2
OA Rounds
8m
Est. Remaining
71%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allowance Rate
646 granted / 852 resolved
+15.8% vs TC avg
Minimal -5% lift
Without
With
+-4.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 2m
Avg Prosecution
28 currently pending
Career history
870
Total Applications
across all art units

Statute-Specific Performance

§101
2.8%
-37.2% vs TC avg
§103
46.5%
+6.5% vs TC avg
§102
28.1%
-11.9% vs TC avg
§112
16.0%
-24.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 852 resolved cases

Office Action

§101 §DP
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Double Patenting Claims of Current application Claims of Patent No. 12,247,847 A compliant sensor comprising: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with substantially continuous conducting material integrated within and confined to a location that aligns with the location of the at least one sensor region in the signal electrode layer, and a portion of electrically conducting material configured in an open shielding pattern, wherein the portion of electrically conducting material configured in an open shielding pattern is in the same plane as the substantially continuous conducting material integrated within and confined to a location that aligns with the location of the at least one sensor region in the signal electrode layer and is in a location that aligns with the at least one trace, and wherein the top electrode layer is in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. 2. The compliant sensor of claim 1 wherein the top electrode layer further comprises a Printed Circuit Board (PCB) interface comprising at least one conductive trace pad. 3. The compliant sensor of claim 1 wherein the open shielding pattern comprises a railroad pattern. 4. The compliant sensor of claim 1 wherein the conducting material comprises conductive particulate material. 5. A compliant three-electrode stack sensor comprising: a first cover dielectric layer comprising an elastomeric material and configured to substantially cover a first side of a top electrode layer; the top electrode layer comprising an elastomeric material with substantially continuous conductive material integrated within and confined to a location that aligns with a location of a sensor region in a signal electrode layer, and is located in the same plane as a portion of electrically conducting material configured in an open shielding pattern; a second dielectric layer comprising an elastomeric material in contact with a second side of the top electrode layer, and configured to allow electrical contact to a perimeter electrode region of a signal electrode layer; the signal electrode layer having a first side in contact with the second dielectric layer and comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and the perimeter electrode region; a third dielectric layer in contact with a second side of the signal electrode layer and comprising an elastomeric material and configured to allow electrical contact to the perimeter electrode region of the signal electrode layer; a bottom electrode layer in contact with a second side of the third dielectric layer and comprising an elastomeric material with substantially continuous conductive material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer, and is located in the same plane as a portion of electrically conducting material configured in an open shielding pattern; and a second cover dielectric layer comprising an elastomeric material and configured to substantially cover a second side of the bottom electrode layer; and wherein the portion of electrically conducting material configured in an open shielding pattern in each of the top electrode layer and the bottom electrode layer are each in a location that align with the at least one trace in the signal electrode layer. 6. The compliant three-electrode stack sensor of claim 5 wherein the top electrode layer further comprises a Printed Circuit Board (PCB) interface comprising at least one conductive trace pad. 7. The compliant three-electrode stack sensor of claim 5 wherein the top electrode layer open shielding pattern comprises a railroad pattern. 8. The compliant three-electrode stack sensor of claim 5 wherein the bottom electrode layer open shielding pattern comprises a railroad pattern. 9. The compliant three-electrode stack sensor of claim 5 wherein the top electrode layer and the bottom electrode layer open shielding patterns both comprise a railroad pattern. 10. The compliant three-electrode stack sensor of claim 5 wherein the conducting material comprises conductive particulate material. 11. A multi-region compliant angular displacement sensor system comprising: a first compliant sensor further comprising: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer, and a portion of electrically conducting material configured in a hatched pattern, wherein the portion of electrically conducting material configured in a hatched pattern is in the same plane as the substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer and is in a location that aligns with the at least one trace and provides electric shielding for any stray capacitance due to the at least one trace, and wherein the top electrode layer is in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region; a second compliant sensor; and an elastomeric connector coupling the first compliant sensor to the second compliant sensor. 12. The multi-region compliant angular displacement sensor system of claim 11 wherein the second compliant sensor further comprises: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. 13. The multi-region compliant angular displacement sensor system of claim 12 wherein the top electrode layer comprises a portion of electrically conducting material configured in an open shielding pattern. 14. The multi-region compliant angular displacement sensor system of claim 13 wherein the open shielding pattern comprises a railroad pattern. 15. The multi-region compliant angular displacement sensor system of claim 11 wherein the conducting material comprises conductive particulate material. 16. The multi-region compliant angular displacement sensor system of claim 11 wherein the first compliant sensor further comprises: a compliant three-electrode stack sensor comprising: a first cover dielectric layer comprising an elastomeric material and configured to substantially cover a first side of a top electrode layer; the top electrode layer comprising an elastomeric material with conductive material integrated within; a second dielectric layer comprising an elastomeric material in contact with a second side of the top electrode layer, and configured to allow electrical contact to a perimeter electrode region of a signal electrode layer; the signal electrode layer having a first side in contact with the second dielectric layer and comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and the perimeter electrode region; a third dielectric layer in contact with a second side of the signal electrode layer and comprising an elastomeric material and configured to allow electrical contact to the perimeter electrode region of the signal electrode layer; a bottom electrode layer in contact with a second side of the third dielectric layer and comprising an elastomeric material with conductive material integrated within; and a second cover dielectric layer comprising an elastomeric material and configured to substantially cover a second side of the bottom electrode layer. 17. The multi-region compliant angular displacement sensor system of claim 16 wherein the top electrode layer comprises a portion of electrically conducting material configured in an open shielding pattern. 18. The multi-region compliant angular displacement sensor system of claim 16 wherein the bottom electrode layer comprises a portion of electrically conducting material configured in an open shielding pattern. 19. The multi-region compliant angular displacement sensor system of claim 16 wherein the top electrode layer and the bottom electrode layer both comprise a portion of electrically conducting material configured in an open shielding pattern. 20. The multi-region compliant angular displacement sensor system of claim 19 wherein the open shielding pattern comprises a railroad pattern. A compliant sensor comprising: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer, and a portion of electrically conducting material configured in a hatched pattern, wherein the portion of electrically conducting material configured in a hatched pattern is in the same plane as the substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer and is in a location that aligns with the at least one trace and provides electric shielding for any stray capacitance due to the at least one trace, and wherein the top electrode layer is in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. 2. The compliant sensor of claim 1 wherein the top electrode layer further comprises a Printed Circuit Board (PCB) interface comprising at least one conductive trace pad. 3. The compliant sensor of claim 1 wherein the conducting material comprises conductive particulate material. 4. A compliant three-electrode stack sensor comprising: a first cover dielectric layer comprising an elastomeric material and configured to substantially cover a first side of a top electrode layer; the top electrode layer comprising an elastomeric material with substantially continuous conductive material integrated within and confined to a location that aligns with a location of a sensor region in a signal electrode layer, and is located in the same plane as a portion of electrically conducting material configured in a hatched pattern; a second dielectric layer comprising an elastomeric material in contact with a second side of the top electrode layer, and configured to allow electrical contact to a perimeter electrode region of the signal electrode layer; the signal electrode layer having a first side in contact with the second dielectric layer and comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and the perimeter electrode region; a third dielectric layer in contact with a second side of the signal electrode layer and comprising an elastomeric material and configured to allow electrical contact to the perimeter electrode region of the signal electrode layer; a bottom electrode layer in contact with a second side of the third dielectric layer and comprising an elastomeric material with substantially continuous conductive material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer, and is located in the same plane as a portion of electrically conducting material configured in a hatched pattern; and a second cover dielectric layer comprising an elastomeric material and configured to substantially cover a second side of the bottom electrode layer; and wherein the portion of electrically conducting material configured in a hatched pattern in each of the top electrode layer and the bottom electrode layer are each in a location that align with the at least one trace in the signal electrode layer and provide electric shielding for any stray capacitance due to the at least one trace. 5. The compliant three-electrode stack sensor of claim 4 wherein the top electrode layer further comprises a Printed Circuit Board (PCB) interface comprising at least one conductive trace pad. 6. The compliant three-electrode stack sensor of claim 4 wherein the conducting material comprises conductive particulate material. 7. A multi-region compliant angular displacement sensor system comprising: a first compliant sensor further comprising: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer, and a portion of electrically conducting material configured in a hatched pattern, wherein the portion of electrically conducting material configured in a hatched pattern is in the same plane as the substantially continuous conducting material integrated within and confined to a location that aligns with the location of the sensor region in the signal electrode layer and is in a location that aligns with the at least one trace and provides electric shielding for any stray capacitance due to the at least one trace, and wherein the top electrode layer is in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region; a second compliant sensor; and an elastomeric connector coupling the first compliant sensor to the second compliant sensor. 8. The multi-region compliant angular displacement sensor system of claim 7 wherein the second compliant sensor further comprises: a signal electrode layer comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor region, and a perimeter electrode region; a dielectric layer comprising an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region; and a top electrode layer comprising an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. 9. The multi-region compliant angular displacement sensor system of claim 8 wherein the top electrode layer of the second compliant sensor comprises a portion of electrically conducting material configured in a hatched pattern. 10. The multi-region compliant angular displacement sensor system of claim 7 wherein the conducting material comprises conductive particulate material. 11. The multi-region compliant angular displacement sensor system of claim 7 wherein the second compliant sensor further comprises: a compliant three-electrode stack sensor comprising: a first cover dielectric layer comprising an elastomeric material and configured to substantially cover a first side of a top electrode layer; the top electrode layer comprising an elastomeric material with conductive material integrated within; a second dielectric layer comprising an elastomeric material in contact with a second side of the top electrode layer, and configured to allow electrical contact to a perimeter electrode region of a signal electrode layer; the signal electrode layer having a first side in contact with the second dielectric layer and comprising an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and the perimeter electrode region; a third dielectric layer in contact with a second side of the signal electrode layer and comprising an elastomeric material and configured to allow electrical contact to the perimeter electrode region of the signal electrode layer; a bottom electrode layer in contact with a second side of the third dielectric layer and comprising an elastomeric material with conductive material integrated within; and a second cover dielectric layer comprising an elastomeric material and configured to substantially cover a second side of the bottom electrode layer. 12. The multi-region compliant angular displacement sensor system of claim 11 wherein the top electrode layer of the second compliant sensor comprises a portion of electrically conducting material configured in a hatched pattern. 13. The multi-region compliant angular displacement sensor system of claim 11 wherein the bottom electrode layer of the second compliant sensor comprises a portion of electrically conducting material configured in a hatched pattern. 14. The multi-region compliant angular displacement sensor system of claim 11, wherein the top electrode layer and the bottom electrode layer of the second compliant sensor comprise a portion of electrically conducting material configured in a hatched pattern. A rejection based on double patenting of the “same invention” type finds its support in the language of 35 U.S.C. 101 which states that “whoever invents or discovers any new and useful process... may obtain a patent therefor...” (Emphasis added). Thus, the term “same invention,” in this context, means an invention drawn to identical subject matter. See Miller v. Eagle Mfg. Co., 151 U.S. 186 (1894); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Ockert, 245 F.2d 467, 114 USPQ 330 (CCPA 1957). A statutory type (35 U.S.C. 101) double patenting rejection can be overcome by canceling or amending the claims that are directed to the same invention so they are no longer coextensive in scope. The filing of a terminal disclaimer cannot overcome a double patenting rejection based upon 35 U.S.C. 101. Claims 11-12 and 16 is/are rejected under 35 U.S.C. 101 as claiming the same invention as that of claims 7-8 and 11 of prior U.S. Patent No.12/247,847 (Patent ‘847). This is a statutory double patenting rejection. The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b). The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13. The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer. PNG media_image1.png 268 139 media_image1.png Greyscale Claims 1-10, 12-15, and 17-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-6 and 9-14 of U.S. Patent No. 12,247,847 (Patent ‘847). Although the claims at issue are not identical, they are not patentably distinct from each other because claims 1-6 and 9-14 of Patent ‘847 anticipate claims 1-10, 12-15 and 17-20. Furthermore, the limitations “open shielding pattern” and “railroad pattern” are derivatives of a hatch pattern, since the hatch pattern is form of an open shielding pattern and portion of the hatch pattern has a railroad shape (see illustration). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MINH Q PHAN whose telephone number is (571)270-3898. The examiner can normally be reached Mon-Fri 9am-5pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Stephanie Bloss can be reached at 571-272-3555. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. MINH Q. PHAN Primary Examiner Art Unit 2852 /MINH Q PHAN/Primary Examiner, Art Unit 2852
Read full office action

Prosecution Timeline

Mar 10, 2025
Application Filed
Sep 25, 2026
Non-Final Rejection mailed — §101, §DP (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
76%
Grant Probability
71%
With Interview (-4.7%)
2y 2m (~8m remaining)
Median Time to Grant
Low
PTA Risk
Based on 852 resolved cases by this examiner. Grant probability derived from career allowance rate.

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