DETAILED ACTION
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-15 are rejected under 35 U.S.C. 102a1 as being anticipated by Hshieh et al (TW 779795 B1 in which US Publication 20230062178 is being used as the direct translation).
As to claim 1 and 8, Hshieh discloses in comparative example 9, 80 parts by weight of SA9000, a vinyl-containing polyphenylene ether resin which has 2 or more unsaturated double bonds (thermosetting resin B), 20 parts by weight of a Ricon 100 a polyolefin resin, 30 parts by weight of a bismaleimide formed by formula III (reaction product A), 150 parts by weight of an inorganic filler (pages 10 and 11 Table 5). The preparation of formula III is by mixing 15 parts by weight of DOPO (a2) and 65 parts by weight of BMI-H (a1) (paragraph 107). Since formula III has a Bismaleimide compound it will have two or more maleimide groups in the molecule and it’s reacted with DOPO which is the phosphorus containing compound a2 as claimed.
As to claim 2, the compound a1 to a2 is in a ratio of 65 to 15 in terms of mass ratio which would fall within the claimed range of 50:50 to 95:5 (table 5).
As to claim 3, the compound A to compound B is in a ratio of 30 to 80 parts by mass which would fall within the claimed range of 70:30 to 10:90 (table 5).
As to claims 4-6, the preliminary reaction product A is a reaction between BMI-H and DOPO and would meet chemical formula 1, and the reaction was 15 parts of DOPO to 65 parts of BMI (chemical formula III paragraph 89, 107-111 and Table 5).
As to claim 7, Hshieh discloses in comparative example 9, 80 parts by weight of SA9000, a vinyl-containing polyphenylene ether resin which has 2 or more unsaturated double bonds (thermosetting resin B) (table 5).
As to claims 9-15, Hsheih discloses that the examples and comparative examples where mixed to form a varnish and impregnated into a fiberglass fabric to form a prepreg, the laminate was then formed to a copper-containing layer and insulating layers were formed by laminating multiple prepreg layers for use as a printed circuit board (paragraphs 114-127).
Conclusion
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/CHRISTOPHER M POLLEY/Primary Examiner, Art Unit 1785