Prosecution Insights
Last updated: August 15, 2026
Application No. 19/169,860

Chip-Based RFID-Enabled Liner Free Labels and Rolls of Liner Free Labels

Final Rejection §103
Filed
Apr 03, 2025
Priority
Apr 11, 2024 — provisional 63/632,876
Examiner
KIM, SHIN H
Art Unit
3636
Tech Center
3600 — Transportation & Electronic Commerce
Assignee
Iconex LLC
OA Round
4 (Final)
64%
Grant Probability
Moderate
5-6
OA Rounds
10m
Est. Remaining
76%
With Interview

Examiner Intelligence

Grants 64% of resolved cases
64%
Career Allowance Rate
750 granted / 1165 resolved
+12.4% vs TC avg
Moderate +11% lift
Without
With
+11.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 2m
Avg Prosecution
30 currently pending
Career history
1189
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
56.8%
+16.8% vs TC avg
§102
26.4%
-13.6% vs TC avg
§112
9.6%
-30.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1165 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1 3-6, 9, 11, 12, 14, and 16-20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Haruhiko Nitta U.S. Patent Publication 2024/0378410 A1 (Nitta) in view of Christophe Halope U.S. Patent Publication 2007/0029391 A1 (Halope). Regarding claim 1, Nitta discloses a liner free label (0076]), comprising: a substrate having a first side and a second side (Figure 2 Element 4 top and bottom); and an adhesive applied to a portion of the first side or the second side ([0073], Element 2b); wherein the label comprises RFID chip and antenna elements formed ([0029-0033]). Nitta does not directly disclose a radio frequency identification (RFID) inlay on the substrate, wherein the RFID inlay comprises a chip and an antenna; and an adhesive applied to a portion of the first side or the second side. Halope discloses a label comprising a radio frequency identification (RFID) inlay on the substrate, wherein the RFID inlay comprises a chip (Element 24) and an antenna (Element 10) wherein the antenna is printed with conductive ink on the first or second side of the substrate to form the RFID antenna, and wherein the RFID inlay is obtained from an OEM (method discloses the printing to be completed by such any source ([0001]). Therefore it would have an obvious modification well known in the art before the effective filing date of the claimed invention to modify Nitta as taught by Halope to include Halope’s RFID with chip and antenna on a label printed by conductive ink. Such a modification would provide a means to keep track of the labeled contents with digital tools and printed with conductive inks. Nitta in view of Halope discloses a system comprising an RFID chip operable to store varying amounts of data ranging from basic identification numbers to complex product information, manufacturing data, or tracking history, enabling advanced inventory management and product authentication ([0002]). Regarding claims 3 and 14, Nitta in view of Halope discloses the liner free label wherein the adhesive is applied as a full coverage layer on the first side or the second side of the substrate (Figure 3 Element 17, Nitta). Regarding claims 4 and 15, Nitta in view of Halope discloses the liner free label further comprises one of: a sense mark on the first side or the second side of the substrate; or no sense mark on either the first side or the second side of the substrate ([0028-0031], Nitta). Regarding claim 5, Nitta in view of Halope discloses the liner free label wherein the RFID inlay is configured to be the sense mark ([0028-0031], Nitta in view of Halope printing ink). Regarding claim 6, Nitta in view of Halope discloses the liner free label wherein the RFID inlay is embedded under flood coated adhesive or patched adhesive on the first side or the second side of the substrate (Figure 3 Element 14, Nitta). Regarding claim 9, Nitta in view of Halope discloses the liner free label wherein the antenna comprises a combination of a printed antenna and a foil antenna ([0030, 0069, 0104], Nitta). Regarding claim 11, Nitta in view of Halope discloses the liner free label comprising the label with an RFID inlay having a chip and antenna (0060-0069, Nitta). Ri Nitta in view of Halope does not directly disclose an OEM wherein the RFID inlay is applied to the OEM label, however, discloses the application of the RFID inlay onto the form of the base label ([0017-0021], Nitta). It would be obvious to perform the application of the RFID inlay to an OEM label as taught in Nitta. Such a modification would provide a means to enhance features of the label to bear information readable by RFID readers. Regarding claims 12 and 19, Nitta discloses a liner free label, comprising: a substrate having a first side and a second side (Figure 3 Element 1; [0076]); and an adhesive (Element 17) applied to a portion of the first side or the second side ([Figure 3); wherein the RFID antenna is formed by transferring a conductive foil on the first side of or the second side of the substrate roll; and wherein the RFID inlay is obtained from an OEM and inserted on the liner free label ([0100-0106]). Nitta does not directly disclose a radio frequency identification (RFID) inlay on the substrate, wherein the RFID inlay comprises a chip and an antenna; and an adhesive applied to a portion of the first side or the second side. Halope discloses a label comprising a radio frequency identification (RFID) inlay on the substrate, wherein the RFID inlay comprises a chip (Element 24) and an antenna (Element 10) wherein the antenna is printed with conductive ink on the first or second side of the substrate to form the RFID antenna, and wherein the RFID inlay is obtained from an OEM (method discloses the printing to be completed by such any source ([0001]). Therefore it would have an obvious modification well known in the art before the effective filing date of the claimed invention to modify Nitta as taught by Halope to include Halope’s RFID with chip and antenna on a label printed by conductive ink. Such a modification would provide a means to keep track of the labeled contents with digital tools and printed with conductive inks. Nitta in view of Halope discloses a system comprising an RFID chip operable to store varying amounts of data ranging from basic identification numbers to complex product information, manufacturing data, or tracking history, enabling advanced inventory management and product authentication ([0002], Nitta). Nitta in view of Halope disclose the labels to be in the form of a roll (Figure 6, Nitta). Regarding claim 17, Nitta in view of Halope discloses the roll of liner free labels wherein adjacent liner free labels in the roll are separated by perforations (Figure 6 [0067], Nitta). Regarding claims 18 and 20, Nitta in view of Halope discloses the roll of liner free labels wherein the RFID inlay of each liner free label is embedded within the adhesive of the first or second side of the substrate (Figure 3, Nitta). Claim(s) 2, 13, and 15 is/are rejected under 35 U.S.C. 103 as being unpatentable over Haruhiko Nitta U.S. Patent Publication 2024/0378410 A1 (Nitta) in view of Christophe Halope U.S. Patent Publication 2007/0029391 A1 (Halope) in view of Tommi Forslund et al. U.S. Patent Publication 2016/0125286 A1 (Forslund). Regarding claims 2, 13, and 15, Nitta in view of Halope discloses the liner free label comprising adhesive (Figure 6 [0076], Nitta). Nitta in view of Halope does not directly disclose the adhesive to be patterned. Forslund discloses a label wherein the adhesive is applied in a pattern on the first side of the substrate (Element 2 [0042]). Therefore it would have been an obvious modification well known in the art before the effective filing date of the claimed invention to modify Nitta in view of Halope as taught by Forslund to include Forslund’s patterned adhesive. Such a modification would provide a means to selective adhere areas on the label the subject that is labeled. Response to Arguments Applicant’s arguments with respect to claim(s) 1-20 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Haruhiko Nitta U.S. Patent Publication 2024/0378410 A1 (Nitta) discloses a liner less version of the label that bears antenna and chip on a label that is also in a roll form. Nitta discloses the RFID elements to be provided with foil and printing. Christophe Halope U.S. Patent Publication 2007/0029391 A1 (Halope) discloses in detail printing the antenna and chip with conductive material. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHIN H KIM whose telephone number is (571)272-7788. The examiner can normally be reached Monday-Friday 9AM-6PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, David Dunn can be reached at 571-272-6670. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SHIN H KIM/Primary Examiner, Art Unit 3636
Read full office action

Prosecution Timeline

Show 4 earlier events
Nov 24, 2025
Response after Non-Final Action
Dec 29, 2025
Request for Continued Examination
Feb 04, 2026
Response after Non-Final Action
Feb 09, 2026
Non-Final Rejection mailed — §103
May 08, 2026
Response Filed
Jun 19, 2026
Examiner Interview (Telephonic)
Jun 22, 2026
Examiner Interview Summary
Jun 30, 2026
Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

5-6
Expected OA Rounds
64%
Grant Probability
76%
With Interview (+11.3%)
2y 2m (~10m remaining)
Median Time to Grant
High
PTA Risk
Based on 1165 resolved cases by this examiner. Grant probability derived from career allowance rate.

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