Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Double Patenting
The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
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Claims 1-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-16 of U.S. Patent No. 12,315,987 B2. Although the claims at issue are not identical, they are not patentably distinct from each other because the claim recitations are merely reworded to recite the same limitation in different language and some of the limitations have been grouped in a slightly different manner but still overall set forth the same claim limitations.
The applicant omitted the limitations, “antenna-on-package system”, “launch structure”, and “antenna-on-package (AoP) device”, which would make the scope of the instant application to be broader than that of Patent No. 12,315,987 B2.
Therefore, the claims of the instant application would be anticipated by the claims of the aforementioned patent.
19/196,827 (Instant Application)
Patent No.: US 12,315,987 B2
1. An apparatus, comprising: a multi-layer antenna structure, the multi-layer antenna structure comprising: a first conductive layer comprising an antenna and a transmission line, the transmission line extending from a first edge of the antenna to a first terminal; and a second conductive layer spaced apart from the first conductive layer by a layer of dielectric material; an integrated circuit (IC) die having a signal terminal on a surface of the IC die; a conductive signal interconnect extending through the layer of dielectric material and coupled between the signal terminal and the first terminal; a guard structure formed of the first conductive layer that is coplanar with the antenna, the guard structure being spaced apart from and around the antenna; a first ground interconnect extending through the layer of dielectric material and coupled between a first ground terminal of the IC die and a first guard structure end portion; and a second ground interconnect extending through the layer of dielectric material and coupled between a second ground terminal of the IC die and a second guard structure end portion.
2. The apparatus of claim 1, wherein the second conductive layer comprises a ground reflector.
4. The apparatus of claim 1, wherein the antenna comprises a patch antenna.
1. An antenna-on-package system comprising: a multi-layer antenna structure, the multi-layer antenna structure comprising: a first conductive layer comprising a patch antenna and a transmission line, the transmission line extending from a feed-side edge of the patch antenna to terminate in a launch structure; and a second conductive layer comprising a ground reflector spaced apart from the first conductive layer by a layer of dielectric material; an integrated circuit (IC) die having a signal terminal on a surface of the IC die; a conductive signal interconnect extending through the layer of dielectric material and coupled between the signal terminal and the launch structure; a guard ring formed of the first conductive layer that is coplanar with the patch antenna, the guard ring being spaced apart from and surrounding the patch antenna; a first ground interconnect extending through the layer of dielectric material and coupled between a first ground terminal of the IC die and a first guard ring end portion; and a second ground interconnect extending through the layer of dielectric material and coupled between a second ground terminal of the IC die and a second guard ring end portion.
3. The apparatus of claim 2, further comprising a plurality of conductive vias coupled between the guard structure and the ground reflector.
2. The antenna-on-package system of claim 1, further comprising a plurality of conductive vias coupled between the guard ring and the ground reflector.
5. The apparatus of claim 4, wherein the patch antenna comprises an E-shaped patch antenna having a pair of notches in the first edge.
3. The antenna-on-package system of claim 1, wherein the patch antenna comprises an E-shaped patch antenna having a pair of notches in the feed-side edge of the patch antenna.
6. The apparatus of claim 1, wherein the transmission line extends at least partially through an opening between the first guard structure end portion and the second guard structure end portion.
4. The antenna-on-package system of claim 1, wherein the transmission line extends at least partially through an opening between the first guard ring end portion and the second guard ring end portion.
7. The apparatus of claim 6, wherein the first terminal is circular-shaped, and the first and second guard structure end portions include opposing curved recessed edges along opposite sides of the circular-shaped first terminal.
5. The antenna-on-package system of claim 4, wherein the launch structure is circular-shaped, and the first and second guard ring end portions include opposing curved recessed edges along opposite sides of the circular-shaped launch structure.
8. The apparatus of claim 1, wherein the multi-layer antenna structure is configured to communicate signals having a frequency in a range from about 140 GHz to about 220 GHz.
6. The antenna-on-package system of claim 1, wherein the multi-layer antenna structure is configured to communicate signals having a frequency in a range from about 140 GHz to about 220 GHz.
9. The apparatus of claim 1, wherein the IC die is embedded within an insulating material, the IC die comprising at least a transmitter and/or a receiver, and the first conductive layer comprises a redistribution layer on a surface of the multi-layer antenna structure spaced apart from the surface of the IC die.
7. The antenna-on-package system of claim 1, wherein the IC die is embedded within an insulating material, the IC die comprising at least a transmitter and/or a receiver, and the first conductive layer comprises a redistribution layer on a surface of the multi-layer antenna structure spaced apart from the surface of the IC die.
10. The apparatus of claim 1, wherein the IC die comprises interconnects on another surface of the IC die opposite of the surface having the signal terminal, the apparatus further comprising a printed circuit board coupled to the IC die by the interconnects.
8. The antenna-on-package system of claim 1, wherein the IC die comprises interconnects on another surface of the IC die opposite of the surface having the signal terminal, the antenna-on-package system further comprising a printed circuit board coupled to the IC die by the interconnects.
11. The apparatus of claim 1, wherein the antenna has a periphery positioned directly over and within a virtual projection extending orthogonally of the IC die.
9. The antenna-on-package system of claim 1, wherein the patch antenna has a periphery positioned directly over and within a virtual projection extending orthogonally of the IC die.
12. A method, comprising: forming a first conductive layer over a respective surface of an embedded die; forming a layer of dielectric material over the first conductive layer; forming an antenna and a transmission line in a second conductive layer over the layer of dielectric material, the transmission line extending from a first edge of the antenna to a first terminal; forming an interconnect between the first terminal and a terminal of the embedded die; forming a guard structure in the second conductive layer, the guard structure having an inner periphery spaced outwardly from an outer periphery of the antenna; forming a first ground interconnect extending through the layer of dielectric material to couple a first ground terminal of the embedded die and a first guard structure end portion; and forming a second ground interconnect extending through the layer of dielectric material to couple a second ground terminal of the embedded die and a second guard structure end portion.
13. The method of claim 12, wherein the first conductive layer comprises a ground reflector.
17. The method of claim 12, wherein the antenna comprises a patch antenna.
10. A method of forming an antenna-on-package device comprising: forming a ground reflector patterned of a first conductive layer over a respective surface of an embedded die; forming a layer of dielectric material over the first conductive layer; forming a patch antenna and a transmission line of a second conductive layer over the layer of dielectric material, the transmission line extending from a feed-side edge of the patch antenna to terminate in a launch structure; forming an interconnect between the launch structure of the transmission line and a terminal of the embedded die; forming a guard ring of the second conductive layer, the guard ring having an inner periphery spaced outwardly from an outer periphery of the patch antenna; forming a first ground interconnect extending through the layer of dielectric material to couple a first ground terminal of the embedded die and a first guard ring end portion; and forming a second ground interconnect extending through the layer of dielectric material to couple a second ground terminal of the embedded die and a second guard ring end portion.
14. The method of claim 13, further comprising forming a plurality of conductive vias between the guard structure and the ground reflector.
11. The method of claim 10, further comprising forming a plurality of conductive vias between the guard ring and the ground reflector.
15. The method of claim 12, wherein the transmission line extends at least partially through an opening between the first guard structure end portion and the second guard structure end portion.
12. The method of claim 10, wherein the transmission line extends at least partially through an opening between the first guard ring end portion and the second guard ring end portion.
16. The method of claim 15, wherein the first terminal is circular-shaped, and the first and second guard structure end portions include opposing curved recessed edges formed along opposite sides of the circular-shaped first terminal.
13. The method of claim 12, wherein the launch structure is circular-shaped, and the first and second guard ring end portions include opposing curved recessed edges formed along opposite sides of the circular-shaped launch structure.
18. The method of claim 17, wherein the patch antenna comprises an E-shaped patch antenna having a pair of notches in the first edge.
14. The method of claim 10, wherein the patch antenna is formed as an E-shaped patch antenna having a pair of notches in the feed-side edge of the patch antenna.
19. The method of claim 12, wherein the first and second conductive layers comprise redistribution layers.
15. The method of claim 10, wherein the first and second conductive layers comprise respective redistribution layers.
20. A communication system, comprising: a printed circuit board including an arrangement of mounting terminals; and a device comprising: a first conductive layer comprising an antenna and a transmission line, the transmission line extending from a first edge of the antenna to a first terminal; a second conductive layer spaced apart from the first conductive layer by a layer of dielectric material; an integrated circuit (IC) die including a signal terminal on a first surface and an arrangement of connecting terminals on a second surface opposite the first surface; a conductive signal interconnect extending through the layer of dielectric material and coupled between the signal terminal and the first terminal; a guard structure formed of the first conductive layer around the antenna and at least a portion of the transmission line; a first ground interconnect extending through the layer of dielectric material and coupled between a first ground terminal of the IC die and a first guard structure end portion; and a second ground interconnect extending through the layer of dielectric material and coupled between a second ground terminal of the IC die and a second guard structure end portion.
16. A communication system, comprising: a printed circuit board including an arrangement of mounting terminals; and an antenna-on-package (AoP) device comprising: a first conductive layer comprising a patch antenna and a transmission line, the transmission line extending from a feed-side edge of the patch antenna to terminate in a launch structure; a second conductive layer comprising a ground reflector spaced apart from the first conductive layer by a layer of dielectric material; an integrated circuit (IC) die including a signal terminal on a first surface and an arrangement of connecting terminals on a second surface opposite the first surface; a conductive signal interconnect extending through the layer of dielectric material and coupled between the signal terminal and the launch structure; a guard ring formed of the first conductive layer surrounding the patch antenna and at least a portion of the transmission line; a first ground interconnect extending through the layer of dielectric material and coupled between a first ground terminal of the IC die and a first guard ring end portion; and a second ground interconnect extending through the layer of dielectric material and coupled between a second ground terminal of the IC die and a second guard ring end portion.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Yen (US 2014/0184460 A1) discloses antenna structures. Kim et al. (US 2019/0273320 A1) discloses antenna apparatus and antenna module.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to DANIEL D CHANG whose telephone number is (571)272-1801. The examiner can normally be reached M-F 8-5 EST.
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/DANIEL D CHANG/Primary Examiner, Art Unit 2845
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