Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
Information Disclosure Statements (IDS)s submitted on 01/22/2026 and 03/03/2026 have been entered and fully considered by the examiner.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 and 6 are rejected Under U.S.C. 102(a)(1) as being anticipated by Wakabayashi (U.S. Publication No. 2018/0035977) hereinafter “Wakabayashi”.
Regarding claim 1, Wakabayashi discloses a method of manufacturing an ultrasound transducer [see abstract of Wakabayashi] for use in an intravascular ultrasound catheter [this is an intended use limitation and does not hold patentable weight. Further, the transducer of Wakabayashi is capable of being used in an IVUS catheter], the method comprising:
forming a composite PZT structure; [see [0059] disclosing a generating a composite PZT out of three components]
applying a backing layer to the composite PZT structure; [backing material 75 is formed on the back of the piezo material; see [0056] and [0062]]
applying a metallic layered coating to the backing layer; [metallic layer 781,782; see FIG. 12 and [0080]]
dicing the composite PZT structure and the backing layer to form an array of transducer elements, wherein two or more transducer elements remain mechanically connected at the backing layer after dicing; [see FIG. 15 and [0087]]
applying a matching layer [matching layer 73/720] to the diced composite PZT structure; and creating a connection point through the matching layer. [see FIG. 12 and [0064] disclosing that the second electrode 77 is formed in the first acoustic matching layer 72 and is electrically connected to a ground electrode 72a grounded to the ground potential]
Regarding claim 6, Wakabayashi further discloses singulating the transducer elements. [see FIG. 16 and [0087]; each transducer element is separated into a singular transducer]
Claims 11-20 are rejected Under U.S.C. 102(a)(1) as being anticipated by Kobayashi (JP 2006339748) hereinafter “Kobayashi”.
Regarding claim 11, Kobayashi discloses an ultrasound transducer [see abstract of Kobayashi] for an intravascular ultrasound catheter, [this is an intended use limitation and does not hold patentable weight. Further, the transducer of Wakabayashi is capable of being used in an IVUS catheter], comprising:
a backing layer having a lower portion and an upper portion; [backing layer 83 is make up of two parts, 73A/83A and 73B/83B; see FIG. 7 and [0052] of Kobayashi]
a piezoelectric layer disposed on the upper portion of the backing layer; [Piezo layer 54; see FIG. 4 and [0039]]
a matching layer disposed on the piezoelectric layer; and [see Fig. 4 and [0039]; matching layer 56]
a connection point formed through the matching layer; [see [0043]; grooves 66]
wherein the lower portion of the backing layer has a first length greater than a second length of the upper portion of the backing layer. [see FIG. 7 of Kobayashi; the depth of the second layer 83B is greater than the first depth]
Regarding claim 12, Kobayashi further discloses that the lower portion of the backing layer extends beyond the upper portion to form a ledge. [see FIG. 15 and [0064] of Kobayashi]
Regarding claim 13, Kobayashi further discloses that the ledge extends around an entire perimeter of the backing layer. [see FIG. 15 and [0064] of Kobayashi]
Regarding claim 14, Kobayashi discloses a pre-tin solder disposed on the piezoelectric layer at the connection point. [see [0023] of Kobayashi]
Regarding claim 15, Kobayashi discloses a metallic layered coating on a bottom surface of the backing layer. [see [0023] of Kobayashi]
Regarding claim 16 Kobayashi discloses an ultrasound transducer [see abstract of Kobayashi] for an intravascular ultrasound catheter, [this is an intended use limitation and does not hold patentable weight. Further, the transducer of Wakabayashi is capable of being used in an IVUS catheter], comprising:
a backing layer having a lower portion, an intermediate portion, and an upper portion; [see FIG. 14; the bottom portion is 150B; the top portion is 150A and the intermediate portion is the 156A and 156B edges]
a piezoelectric layer disposed on the upper portion of the backing layer; [see FIG. 14; PZT later 138 is on the backing layer ]
matching layer disposed on the piezoelectric layer; and [see Fig. 4 and [0039]; matching layer 56]
a connection point formed through the matching layer; [see [0043]; grooves 66]
wherein the lower portion of the backing layer has a first length, the intermediate portion has a second length less than the first length, and the upper portion has a third length less than the second length. [see FIG. 14; the bottom portion has a largest length, the second portion includes a length for the edges which is more than the top length]
Regarding claim 17, Kobayashi discloses the intermediate portion of the backing layer extends proximally beyond a proximal end of the upper portion to form a first ledge. [see FIG. 14; the first ledge is 156A]
Regarding claim 18, Kobayashi discloses the first ledge extends proximally to a proximal end of the piezoelectric layer. [see FIG. 14]
Regarding claim 19, Kobayashi discloses the lower portion of the backing layer extends proximally beyond a proximal end of the intermediate portion to form a second ledge. [see FIG. 14; the first ledge is 156B]
Regarding claim 20, Kobayashi discloses the lower portion of the backing layer extends distally beyond a distal end of the intermediate portion to form a third ledge.[see FIG. 14]
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claims 2, 3, and 10 are rejected Under U.S.C. 103 as being unpatentable over Wakabayashi (U.S. Publication No. 2018/0035977) hereinafter “Wakabayashi” in view of Baumgartner et al. (U.S. Publication No. 2004/0100163) hereinafter “Baumgartner”.
Regarding claim 2, Wakabayashi discloses all the limitations of claim 1 [see rejection of claim 1]
Wakizashi does not expressly disclose dicing the composite PZT structure and the backing layer comprises: performing a first dicing operation to separate the array of transducer elements into columns; and performing a second dicing operation to partially separate the array of transducer elements into rows while maintaining electrical connectivity between transducer elements through the backing layer.
Baumgartner, directed towards a method of manufacturing transducer arrays [see abstract of Baumgartner] further discloses that dicing the composite PZT structure and the backing layer comprises: performing a first dicing operation to separate the array of transducer elements into columns; [see [0033]; a first dicing to create parallel kerfs 32] and performing a second dicing operation to partially separate the array of transducer elements into rows while maintaining electrical connectivity between transducer elements through the backing layer.[see [0034]; a second dicing is done to form kerfs 36 which stops short of the ground metallization, which keeps the electrical connectivity between transducers]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing of the invention to modify the method of Wakabayashi further such that dicing the composite PZT structure and the backing layer comprises: performing a first dicing operation to separate the array of transducer elements into columns; and performing a second dicing operation to partially separate the array of transducer elements into rows while maintaining electrical connectivity between transducer elements through the backing layer according to the teachings of Baumgartner in order to substitute the electrical connection of piezo elements through etched conductive traces [see [0007] Baumgartner]
Regarding claim 3, Wakabayashi as modified by Baumgartner discloses all the limitations of claim 1 [see rejection of claim 1]
Baumgartner further discloses that applying the backing layer comprises: casting a conductive epoxy onto the composite PZT structure curing the conductive epoxy; and grinding the cured conductive epoxy to a specified thickness. [see [0042] disclosing applying a conductive material on the back of the composite structure and [0051] disclosing that it could be an epoxy]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing of the invention to modify the method of Wakabayashi as modified by Baumgartner further such that applying the backing layer comprises: casting a conductive epoxy onto the composite PZT structure curing the conductive epoxy; and grinding the cured conductive epoxy to a specified thickness according to the teachings of Baumgartner in order to substitute the electrical connection of piezo elements through etched conductive traces [see [0007] Baumgartner]
Regarding claim 10, Wakabayashi discloses all the limitations of claim 1 [see rejection of claim 1]
Wakizashi does not expressly disclose applying a matching layer to the diced composite PZT structure comprises: depositing a conductive deposit on the diced composite PZT structure; and applying the matching layer over the conductive deposit and the diced composite PZT structure; and wherein creating a connection point through the matching layer comprises: removing a portion of the matching layer to expose the conductive deposit.
Baumgartner further discloses that applying a matching layer to the diced composite PZT structure comprises: depositing a conductive deposit on the diced composite PZT structure; [see [0042] disclosing applying a conductive material on the back of the composite structure and applying the matching layer over the conductive deposit and the diced composite PZT structure; [see [0048] disclosing applying the matching layer over the metalized layer providing the ground] and wherein creating a connection point through the matching layer comprises: removing a portion of the matching layer to expose the conductive deposit.[see [0048]-[0049] of Baumgartner disclosing removing kerfs]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing of the invention to modify the method of Wakabayashi as modified by Baumgartner further such that applying a matching layer to the diced composite PZT structure comprises: depositing a conductive deposit on the diced composite PZT structure; and applying the matching layer over the conductive deposit and the diced composite PZT structure; and wherein creating a connection point through the matching layer comprises: removing a portion of the matching layer to expose the conductive deposit according to the teachings of Baumgartner in order to substitute the electrical connection of piezo elements through etched conductive traces [see [0007] Baumgartner]
Claims 4 and 5 are rejected Under U.S.C. 103 as being unpatentable over Wakabayashi (U.S. Publication No. 2018/0035977) hereinafter “Wakabayashi” in view of Griffith et al. (U.S. Patent No. 4841977) hereinafter “Griffith”.
Regarding claim 4, Wakabayashi discloses all the limitations of claim 1 [see rejection of claim 1]
Wakabayashi does not disclose testing the transducer elements while they remain connected in the array of transducer elements.
Griffin, directed towards manufacture and testing of ultrasound arrays [see abstract of Griffin] further discloses that testing the transducer elements while they remain connected in the array of transducer elements. [see column 19, lines 10-20 of Griffin]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing of the invention to modify the method of Wakabayashi further such that it includes testing the transducer elements while they remain connected in the array of transducer elements according to the teachings of Griffin in order to correct any issues before final assembly of the catheter [see column 19, lines 15-20]
Regarding claim 5, Wakabayashi in view of Griffin discloses all the limitations of claim 1 [see rejection of claim 1]
Griffin further discloses that testing the transducer elements comprises: coupling a negative lead to a backing layer of a first transducer element in a column of the array of transducer elements; [see column 19, lines 10-20 of Griffin]coupling a positive lead to a connection point on the first transducer element; measuring an electrical property of the first transducer element; maintaining the coupling of the negative lead to the backing layer; and sequentially coupling the positive lead to connection points on subsequent transducer elements in the column to measure the electrical property of each transducer element in the column. [see column 20, lines 4-20 of Griffin]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing of the invention to modify the method of Wakabayashi as modified by Griffin such that it testing the transducer elements comprises: coupling a negative lead to a backing layer of a first transducer element in a column of the array of transducer elements; coupling a positive lead to a connection point on the first transducer element; measuring an electrical property of the first transducer element; maintaining the coupling of the negative lead to the backing layer; and sequentially coupling the positive lead to connection points on subsequent transducer elements in the column to measure the electrical property of each transducer element in the column according to the teachings of Griffin in order to correct any issues before final assembly of the catheter [see column 19, lines 15-20]
Claims 7-9 are rejected Under U.S.C. 103 as being unpatentable over Wakabayashi (U.S. Publication No. 2018/0035977) hereinafter “Wakabayashi” in view of Jiang et al. (U.S. Publication No. 2009/0108708) hereinafter “Jiang”.
Regarding claim 7, Wakabayashi discloses all the limitations of claim 1 [see rejection of claim 1]
Wakabayashi does not disclose forming the composite PZT structure comprises: dicing a first PZT wafer and a second PZT wafer; applying a thin layer of a polymer coating to the diced surfaces of the PZT wafers; and pressing the first and the second diced PZT wafers together to form the composite PZT structure.
Jiang, directed towards forming a composite transducer array with improved acoustic properties [see abstract of Jiang] further discloses that forming the composite PZT structure comprises: dicing a first PZT wafer and a second PZT wafer; applying a thin layer of a polymer coating to the diced surfaces of the PZT wafers; and pressing the first and the second diced PZT wafers together to form the composite PZT structure. [see [0042], [0046] and FIG. 2A of Jiang disclosing making a composite PZT structure by adding a polymer in between two layers of PZT]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing ofc the invention to modify the design of Wakabayashi further such that forming the composite PZT structure comprises: dicing a first PZT wafer and a second PZT wafer; applying a thin layer of a polymer coating to the diced surfaces of the PZT wafers; and pressing the first and the second diced PZT wafers together to form the composite PZT structure according to the teachings of Jiang in order to reduce fabrication time and minimize lateral modes existing in piezo composites. [see [0001] of Jiang]
Regarding claim 8, Wakabayashi as modified by Jiang discloses all the limitations of claim 7 [see rejection of claim 7]
Jiang further disclose that after dicing the first PZT wafer and the second PZT wafer each of the first and second PZT wafers include a plurality of pillars. [see FIG. 2B of Jiang]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing ofc the invention to modify the design of Wakabayashi further such that after dicing the first PZT wafer and the second PZT wafer each of the first and second PZT wafers include a plurality of pillars according to the teachings of Jiang in order to reduce fabrication time and minimize lateral modes existing in piezo composites. [see [0001] of Jiang]
Regarding claim 9, Wakabayashi as modified by Jiang discloses all the limitations of claim 8 [see rejection of claim 8]
Jiang further discloses that each pillar of the plurality of pillars has a width to height ratio in the range of 0.15 to about 0.35. [see [0054]; the width of the kerf is 3-30 micron and pick is 10-80 micron which makes the ratio in the range of 0.03-0.375 which overlaps the specified range]
It would have been obvious to a person of ordinary skill level in the art at the time of the filing ofc the invention to modify the design of Wakabayashi further such that each pillar of the plurality of pillars has a width to height ratio in the range of 0.15 to about 0.35 according to the teachings of Jiang in order to reduce fabrication time and minimize lateral modes existing in piezo composites. [see [0001] of Jiang] Further it has been held that one the general teachings of a claim is disclosed by the prior art, finding optimum or workable ranges is within the level of skill of an ordinarily skilled in the art. In re Aller, 105 USPQ 233.
Conclusion
No claim is allowed.
any inquiry concerning this communication or earlier communications from the examiner should be directed to MARJAN - SABOKTAKIN whose telephone number is (303)297-4278. The examiner can normally be reached M-F 9 am-5pm CT.
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/MARJAN SABOKTAKIN/Examiner, Art Unit 3797
/MICHAEL J CAREY/Supervisory Patent Examiner, Art Unit 3795
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