Prosecution Insights
Last updated: July 17, 2026
Application No. 19/439,118

RELAXED WURTZITE INGAN LAYERS

Non-Final OA §102§112
Filed
Jan 02, 2026
Priority
Jun 28, 2024 — provisional 63/665,945 +2 more
Examiner
SOWARD, IDA M
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Opnovix Corp.
OA Round
3 (Non-Final)
93%
Grant Probability
Favorable
3-4
OA Rounds
1y 7m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 93% — above average
93%
Career Allowance Rate
1260 granted / 1351 resolved
+25.3% vs TC avg
Moderate +6% lift
Without
With
+5.5%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 1m
Avg Prosecution
53 currently pending
Career history
1383
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
48.0%
+8.0% vs TC avg
§102
29.0%
-11.0% vs TC avg
§112
22.0%
-18.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1351 resolved cases

Office Action

§102 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . This Office Action is in response to the Applicant’s amendment filed June 15, 2026. Response to Amendment Applicant's request for reconsideration of the finality of the rejection of the last Office action is persuasive and, therefore, the finality of that action is withdrawn. Drawings The objection to the drawings has been withdrawn due to the amendment filed. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claim 9 recites the limitations "the relaxed In-containing III-nitride surface" in lines 2 and 4; and "the fully relaxed In-containing III-nitride alloy" in lines 5-6. There is insufficient antecedent basis for this limitation in the claim. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-4, 6-9, 13 and 15-33 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yoshikawa et al. (JP 2016111317 A). In regard to claim 1, Yoshikawa et al. teach a semiconductor structure 400 comprising: (a) a III-nitride layer 401 comprising a III-nitride surface; (b) a relaxed In-containing III-nitride layer 402 overlying the III-nitride surface; and (c) a slip layer 403 overlying the III-nitride layer 401 and underlying the relaxed In-containing III-nitride layer 402 (Figure 17, pages 29-37). In regard to claim 2, Yoshikawa et al. teach the slip layer 403 disposed on the III-nitride surface (Figure 17, pages 29-37). In regard to claim 3, Yoshikawa et al. teach the slip layer 403 comprising a metal oxide, a non-metal oxide, a metal nitride, a non-metal nitride, or a combination of any of the foregoing (Figure 17, pages 29-37). In regard to claims 4 and 19-21, where patentability is said to be based upon particular chosen dimensions or upon another variable recited in a claim, burden is on Applicant to show that the chosen dimensions are critical. In re Woodruff, 919 F.2d 1575, 1578, 16 USPQ2d 1934, 1936 (Fed. Cir. 1990). Discovering the desired thickness, distance or pit density is within the level of ordinary skill and requires only routine experimentation. In regard to claim 6, Yoshikawa et al. teach the slip layer 403 comprising nanoscale islands or discontinuous patches 404 defining low-adhesion boundaries (Figure 17, pages 29-37). In regard to claim 7, Yoshikawa et al. teach the nanoscale islands or discontinuous patches 404 covering between 10% and 90% of the III-nitride surface (Figure 17, pages 29-37). In regard to claim 8, Yoshikawa et al. teach the relaxed In-containing III-nitride layer 402 comprising a relaxed In-containing III-nitride surface characterized by an in-plane a-lattice parameter that differs from an in-plane a-lattice parameter of the III-nitride layer 401 by at least 0.1% (Figure 17, pages 29-37). In regard to claim 9, Yoshikawa et al. teach the relaxed In-containing III-nitride surface (of 402) comprising an In-containing III-nitride alloy; and the relaxed In-containing III-nitride surface (of 402) is characterized by an in-plane a-lattice parameter within ±0.1% of an in-plane a-lattice parameter the fully relaxed In-containing III-nitride alloy (of 402) (Figure 17, pages 29-37). In regard to claim 13, Yoshikawa et al. teach the III-nitride layer 401 comprising GaN, InxGa1-xN,or InxAlyGa1-x-yN, wherein 0 < x < 1 and 0 < y < 1 (Figure 17, pages 29-37). In regard to claim 15, Yoshikawa et al. teach the III- nitride surface (of 401) being a planar Wurtzite (0001) surface (Figure 17, pages 29-37). In regard to claim 16, Yoshikawa et al. teach the III-nitride surface (of 401) having a roughness of less than 1 nm RMS over a 1 µm x 1 µm area (Figure 17, pages 29-37). In regard to claim 17, Yoshikawa et al. teach the relaxed In-containing III-nitride layer 402 comprising InxAlyGa1-x-yN, wherein 0 < x < 1 and 0 < y < 1 (Figure 17, pages 29-37). In regard to claim 18, Yoshikawa et al. teach the relaxed In-containing III-nitride layer 402 having an InN mole fraction greater than 1% (Figure 17, pages 29-37). In regard to claim 22, Yoshikawa et al. teach the relaxed In-containing III-nitride layer 402 having a surface characterized by an in-plane a-lattice parameter within ±0.1% of a fully relaxed in-plane a-lattice parameter of the In-containing III-nitride alloy (Figure 17, pages 29-37). In regard to claim 23, Yoshikawa et al. teach one or more epitaxial layers (See Figure 18) overlying the relaxed In-containing III-nitride layer 402 (Figures 17-18, pages 29-37). In regard to claim 24, Yoshikawa et al. teach the one or more epitaxial layers (See Figure 18) comprising an In-containing III-nitride layer (Figure 17, pages 29-37). In regard to claim 25, Yoshikawa et al. teach an engineered substrate 501 underlying the III-nitride layer 502 (Figures 17-18, pages 29-37). In regard to claim 26, Yoshikawa et al. teach a semiconductor device 400 comprising the semiconductor structure of claim 1 (Figure 17, pages 29-37). In regard to claim 27, Yoshikawa et al. teach an active region 403 overlying the relaxed In-containing III-nitride layer 401 (Figure 17, pages 29-37). In regard to claim 28, Yoshikawa et al. teach the active region 403 is configured to emit electromagnetic radiation between 440 nm and 650 nm (Figure 17, pages 29-37). In regard to claim 29, Yoshikawa et al. teach a wafer comprising the semiconductor structure (of 400) of claim 1 (Figure 17, pages 29-37). In regard to claim 30, Yoshikawa et al. teach a wafer comprising the semiconductor device 400 of claim 26 (Figure 17, pages 29-37). In regard to claim 31, Yoshikawa et al. teach the slip layer 403 being non-continuous (Figure 17, pages 29-37). In regard to claim 32, Yoshikawa et al. teach the slip layer 403 disposed between the planar Wurtzite (0001) surface and the relaxed In-containing III-nitride layer 402 (Figure 17, pages 29-37). In regard to claim 33, Yoshikawa et al. teach the slip layer 403 being non-continuous and comprises nanoscale islands, non-continuous nanoscale platelets, or irregularly-shaped areas (Figure 17, pages 29-37). Allowable Subject Matter Claim 10 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claim 11 is objected to as being dependent upon rejected claim 10. Response to Arguments Applicant’s arguments with respect to claim(s) 1-4, 6-11, 13 and 15-33 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. The following patents are cited to further show the state of the art with respect to semiconductor structures: Arena (US 2010/0109126 A1) Arena (US 2013/0285015 A1) Chua et al. (US 2011/0150017 A1) M. Letertre (TW I414021 B) Pernel (CN 113013018 A) Werkhoven (US 2012/0161289 A1). Any inquiry concerning this communication or earlier communications from the examiner should be directed to IDA M SOWARD whose telephone number is (571)272-1845. The examiner can normally be reached Monday through Thursday, 7am to 5:30pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Leonard Chang can be reached at 571-270-3691. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. IMS June 17, 2026 /IDA M SOWARD/Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Jan 02, 2026
Application Filed
Apr 03, 2026
Non-Final Rejection mailed — §102, §112
Apr 15, 2026
Response Filed
Apr 30, 2026
Final Rejection mailed — §102, §112
Jun 10, 2026
Applicant Interview (Telephonic)
Jun 10, 2026
Examiner Interview Summary
Jun 15, 2026
Response after Non-Final Action
Jun 23, 2026
Non-Final Rejection mailed — §102, §112 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
93%
Grant Probability
99%
With Interview (+5.5%)
2y 1m (~1y 7m remaining)
Median Time to Grant
High
PTA Risk
Based on 1351 resolved cases by this examiner. Grant probability derived from career allowance rate.

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