Prosecution Insights
Last updated: October 02, 2026

Examiner: CAI, JIAJIA JANIE

Tech Center 1700 • Art Units: 1717 1751 1761

This examiner grants 29% of resolved cases

Analysis

Jiajia Janie Cai works in Tech Center 1700 and Art Unit 1717. She has 55 resolved cases. Her allowance rate is 29.1 percent. This 29.1 percent rate indicates the frequency of patent grants for applications assigned to her docket in Art Unit 1717.

The interview lift for this examiner is 20.7 percent. This 20.7 percent lift suggests that an interview can provide a significant boost to the chances of success. Practitioners may find that a direct conversation is useful to clarify technical points for the 55 resolved cases. The 20.7 percent lift is a factor to consider when planning a prosecution strategy to overcome rejections.

The median days to allowance is 1366. This 1366 day figure represents the typical time required for an application to reach allowance. The 1366 day median provides a benchmark for pendency in Tech Center 1700. Applicants should factor the 29.1 percent allowance rate and the 1366 day median into their long-term intellectual property planning.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

29.1%
Allow Rate
-35.9% vs TC avg
101
Total Applications
+20.7%
Interview Lift
1366
Avg Prosecution Days
Based on 55 resolved cases, 2023–2026

Rejection Statute Breakdown

1.8%
§101 Eligibility
10.0%
§102 Novelty
62.5%
§103 Obviousness
18.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
16943137 ANALYSIS METHOD, LIQUID CHEMICAL, AND METHOD FOR PRODUCING LIQUID CHEMICAL Non-Final OA FUJIFILM Corporation
18481810 THERMAL INTERFACE COMPOSITION AND THERMAL INTERFACE MATERIAL Final Rejection Panasonic Intellectual Property Management Co., Ltd.
18548316 THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE RESIN MATERIAL Final Rejection Panasonic Intellectual Property Management Co., Ltd.
19222642 COLD STORAGE MATERIAL COMPOSITION Final Rejection Panasonic Corporation
17177936 THERMOPLASTIC BASED ARC RESISTANT MATERIAL FOR ELECTRICAL APPLICATION Final Rejection EATON INTELLIGENT POWER LIMITED
17559097 COMPOSITION INCLUDING REFRIGERANT, USE THEREOF, REFRIGERATOR HAVING SAME, AND METHOD FOR OPERATING SAID REFRIGERATOR Final Rejection DAIKIN INDUSTRIES, LTD.
17502354 COMPOSITION INCLUDING REFRIGERANT, USE THEREOF, REFRIGERATOR HAVING SAME, AND METHOD FOR OPERATING SAID REFRIGERATOR Non-Final OA DAIKIN INDUSTRIES, LTD.
18379954 FLUORINE SUBSTITUTED ETHERS AND COMPOSITIONS, METHODS AND USES INCLUDING SAME Non-Final OA Honeywell International Inc.
17971353 LOW GWP HEAT TRANSFER COMPOSITIONS Final Rejection HONEYWELL INTERNATIONAL INC.
17609214 HEAT-REMOVING SHEET Non-Final OA 3M INNOVATIVE PROPERTIES COMPANY
18462641 AEROSOL RAW MATERIAL COMPOSITION, AEROSOL COMPOSITION, AND AEROSOL PRODUCT Final Rejection AGC INC.
18623482 COMPOSITIONS BASED ON 1,1,2-TRIFLUOROETHYLENE AND CARBON DIOXIDE Final Rejection ARKEMA FRANCE
17958894 THERMAL CONDUCTIVE SILICONE COMPOSITION Final Rejection SHIN-ETSU CHEMICAL CO., LTD.
17425508 HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME Final Rejection SHIN-ETSU CHEMICAL CO., LTD.
19057051 CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME Non-Final OA AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

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