Tech Center 2800 • Art Units: 2835 2891
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18442638 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18623538 | Thermal-Control System Of A Mesh Network Device and Associated Mesh Network Devices | Non-Final OA | Google LLC |
| 18701043 | CONVERTER | Non-Final OA | LG INNOTEK CO., LTD. |
| 18510602 | HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18682799 | HIGH VOLTAGE GAS INSULATED SWITCHGEAR, HV GIS, FOR SINGLE OR THREE PHASE OPERATION | Final Rejection | Hitachi Energy Ltd |
| 18276237 | POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE | Non-Final OA | Hitachi Energy Ltd |
| 18029446 | COATED CONDUCTOR IN A HIGH-VOLTAGE DEVICE AND METHOD FOR INCREASING THE DIELECTRIC STRENGTH | Non-Final OA | Siemens Energy Global GmbH & Co. KG |
| 18322001 | Heat Dissipation Apparatus and Vehicle | Final Rejection | Yinwang Intelligent Technologies Co., Ltd. |
| 18616360 | Shield For Fan-Cooled Units | Non-Final OA | Aptiv Technologies AG |
| 18616960 | MODULES, SYSTEMS, AND METHODS FOR COOLING OPTICS AND COPPER PACKAGES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18435102 | ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | Final Rejection | THINKWARE CORPORATION |
| 17413688 | EVAPORATIVE MICROCHIP COOLING | Final Rejection | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| 18635326 | COMMON BUS SWITCHGEAR FOR MOBILE HYBRID MICRO-GRIDS | Non-Final OA | VOLTAGRID LLC |
| 18631182 | Enclosure and Optimizations | Non-Final OA | Schneider Electric USA, Inc. |
| 18582225 | LIQUID COOLED POWER AMPLIFIER WITH INTERNAL FLUID CHANNELIZATION | Non-Final OA | BAE Systems Information and Electronic Systems Integration Inc. |
| 18486186 | PARALLEL LOAD SERVICE FOR MULTI-FAMILY METERING DEVICES | Non-Final OA | Siemens Industry, Inc. |
| 18685361 | ELECTRONICS HOUSING ASSEMBLY | Non-Final OA | Redarc Technologies Pty Ltd |
| 18630420 | ELECTRICAL MODULES WITH REVERSIBLE CONNECTION ARRANGEMENT | Non-Final OA | Group Dekko, Inc. |
| 18693268 | THERMAL MANAGEMENT SYSTEM FOR ELECTRIC POWERTRAINS | Non-Final OA | PUNCH TORINO S.P.A. |
| 18606753 | HOUSING AND HOUSING GRASPING FEATURES USABLE WITH A HEAT DISSIPATING DEVICE | Non-Final OA | Power Integrations, Inc. |
| 18520411 | POWER DISTRIBUTION MODULE FOR SWITCHGEAR AND SWITCHGEAR | Final Rejection | Schneider Electric (China) Co., Ltd. |
| 18235345 | POWER MODULE AND MANUFACTURING METHOD AND MOLD THEREOF | Non-Final OA | SENTEC E&E CO., LTD. |
| 18552416 | GAS INSULATED ELECTRICAL SWITCHGEAR FOR MEDIUM AND HIGH VOLTAGE ELECTRICAL DISTRIBUTION NETWORKS | Non-Final OA | ORMAZABAL Y CIA., S.L.U. |
| 18357889 | MODULAR POWER BOX | Final Rejection | Digital Porpoise, LLC |
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