Tech Center 3600 • Art Units: 1732 1764 1765 1796 3613
This examiner grants 36% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18664259 | BINDER AND PREPARATION METHOD THEREOF, SEPARATOR, ELECTRODE PLATE, ELECTRODE ASSEMBLY, BATTERY CELL, BATTERY, AND ELECTRIC APPARATUS | Non-Final OA | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 18028852 | SHOE MIDSOLE | Non-Final OA | COOPER-STANDARD AUTOMOTIVE, INC. |
| 17984595 | RUBBER COMPOSITION AND TIRE | Non-Final OA | Toyo Tire Corporation |
| 17815232 | RUBBER COMPOSITION AND A TIRE | Final Rejection | The Goodyear Tire & Rubber Company |
| 18044078 | LIQUID COMPOSITION SET, POROUS RESIN MANUFACTURING APPARATUS, AND POROUS RESIN MANUFACTURING METHOD | Final Rejection | RICOH COMPANY, LTD. |
| 17792209 | Non-Blocking Multilayer Elastic Composition | Final Rejection | Kimberly-Clark Worldwide, Inc. |
| 18183420 | FOAMABLE RESIN COMPOSITION, MOLDED RESIN FOAM, AND PRODUCTION METHOD THEREFOR | Final Rejection | TOYODA GOSEI CO., LTD. |
| 18268012 | COMPOSITE RESIN COMPOSITION FOR GEOCELL OR CORALCELL | Non-Final OA | HANWHA SOLUTIONS CORPORATION |
| 18449845 | COPOLYMER, MOLDED ARTICLE, INJECTION MOLDED ARTICLE AND COVERED WIRE | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18447502 | MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 18191461 | COPOLYMER, INJECTION MOLDED BODY, MEMBER TO BE COMPRESSED, AND COATED WIRE | Final Rejection | DAIKIN INDUSTRIES, LTD. |
| 18209737 | CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, ADHESIVE, ADHESIVE FILM, PREPREG, INTERLAYER INSULATING MATERIAL, AND PRINTED-WIRING BOARD | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 17796809 | THERMALLY EXPANDABLE COMPOSITIONS COMPRISING EXPANDABLE GRAPHITE | Final Rejection | SIKA TECHNOLOGY AG |
| 17738348 | THERMOPLASTIC COMPOSITE FOR AN ANTENNA COMPONENT | Non-Final OA | ROGERS CORPORATION |
| 17414726 | PRODUCTION OF RIGID POLYURETHANE FOAM | Final Rejection | Evonik Operations GmbH |
| 18023014 | Compositions and Foam Compositions Including Silicone Components, Foam Gaskets, Articles, and Methods | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 17595091 | (CO)POLYMER MATRIX COMPOSITES COMPRISING THERMALLY-CONDUCTIVE PARTICLES AND INTUMESCENT PARTICLES AND METHODS OF MAKING THE SAME | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 18262622 | HYDROCARBYL-MODIFIED METHYLALUMINOXANE COCATALYSTS FOR BISPHENYLPHENOXY METAL-LIGAND COMPLEXES | Non-Final OA | Dow Global Technologies LLC |
| 18004124 | PREPARATION OF LOW ODOR POLYURETHANE FOAMS | Final Rejection | Dow Global Technologies LLC |
| 17799302 | EXPANDED POLYPROPYLENE BEADS, A PROCESS FOR PRODUCING EXPANDING POLYPROPYLENE BEADS, MOLDED ARTICLES FORMED FROM EXPANDED POLYPROPYLENE BEADS, AND A PROCESS FOR FORMING SUCH MOLDED ARTICLES | Non-Final OA | Borealis AG |
| 17450858 | PUMPABLE, THERMALLY CURABLE AND EXPANDABLE PREPARATIONS | Non-Final OA | Henkel AG & Co. KGaA |
| 17450861 | PUMPABLE, THERMALLY EXPANDABLE PREPARATION | Non-Final OA | Henkel AG & Co. KGaA |
| 18194091 | PVDF FOR METAL/METAL ION BATTERIES | Non-Final OA | SYENSQO SPECIALTY POLYMERS ITALY S.P.A. |
| 16720138 | ADHESIVE COMPOSITION AND METHODS OF FORMING THE SAME | Final Rejection | SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION |
| 18151212 | MANUFACTURING METHOD FOR HOLLOW FINE PARTICLES, AND HOLLOW FINE PARTICLES | Final Rejection | NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY |
| 17439107 | METHOD FOR PRODUCING A COPOLYMER FOAM WITH POLYAMIDE BLOCKS AND POLYETHER BLOCKS | Final Rejection | Arkema France |
| 17049681 | THERMOPLASTIC COMPOSITION COMPRISING A MICROWAVE-DEPOLYMERISATION SENSITISING COMPOUND | Non-Final OA | Arkema France |
| 18273849 | Low Odor Heat-Expandable Materials | Non-Final OA | Zephyros, Inc. |
| 18256667 | RUBBER MATERIAL, RUBBER COMPOSITION, VULCANIZED OBJECT, FOAMED OBJECT, AND WET SUIT | Final Rejection | Denka Company Limited |
| 18631712 | N-Doped Semiconducting Material Comprising Phosphine Oxide Matrix and Metal Dopant | Non-Final OA | Novaled GmbH |
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