Listed by the USPTO as LANE, DANIEL E
Tech Center 3700 • Art Units: 3715
This examiner grants 4% of resolved cases
Daniel E Lane manages a docket in Art Unit 3715 with 310 resolved cases and an allowance rate of 3.9 percent. The median days to allowance is 1160. Major applicants include Koninklijke Philips N.V., NEC Corporation, and Genesis Intelligence LLC. The 3.9 percent rate indicates a very high threshold for allowance in Tech Center 3700. The 1160-day median pendency provides a clear expectation for prosecution duration.
The interview lift is 8.3 percent, which provides a measurable benefit despite the low probability of success. Firms such as Ahmann Kloke LLP, Alley IP, and Brooks Kushman P.C. represent many of the applicants here. With a 3.9 percent allowance rate and a 1160-day median pendency, practitioners should be prepared for a rigorous examination. The 8.3 percent lift suggests that direct engagement may help resolve issues for the 310 cases resolved by this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19332191 | INFORMATION PROVIDING APPARATUS, INFORMATION PROVIDING METHOD, AND NON-TRANSITORY STORAGE MEDIUM | Non-Final OA | NEC Corporation |
| 18414651 | SYSTEM AND METHOD FOR EVALUATING AND COACHING SOCIAL COMPETENCIES IN IMMERSIVE VIRTUAL ENVIRONMENTS | Final Rejection | Board of Regents, The University of Texas System |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy3.9% of resolved applications examined by Daniel E Lane were allowed (310 resolved cases), compared with 56.8% across Art Unit 3715 over the last five years.
This examiner's interview lift is +8.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Daniel E Lane took 1,160 days on average from filing to allowance.
Daniel E Lane examines applications in Art Unit 3715 in Tech Center 3700 (Medical Devices & Mechanical Engineering).