Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on February 3, 2026 has been entered.
The after final amendment of December 22, 2025 is entered and considered as requested by the RCE submission of February 3, 2026. With the entry of the amendment, claims 1-17, 19 and 23-32 are canceled, and claims 18, 20-22 and 33 are pending for examination.
Election/Restrictions
It is noted that non-elected claims 24-32 have been canceled by the amendment of May 13, 2024. It is also noted that withdrawn claims 1-17 have been canceled in the amendment of December 12, 2023.
Specification
The objection to the amendment filed December 12, 2023 is under 35 U.S.C. 132(a) because it introduces new matter into the disclosure is withdrawn due to the arguments and reasoning provided by applicant in the amendment of May 13, 2024.
Claim Rejections - 35 USC § 101
The rejection of claims 18-23 under 35 U.S.C. 101 because the claimed invention is directed to an abstract idea without significantly more is withdrawn due to the amendment of May 23, 2024 providing claim language that meets the requirements of 35 USC 101.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 18, 20-22 and 33 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 18 has been amended to provide “wherein the remaining sub-set of the plurality of pixels of the camera corresponds to a 0th order reflection of light reflected off the substrate” is confusing and indefinite as to what is intended. As worded, this appears to include (1) the pixels are actually light reflections, or (2) is it intended that the pixels used are those that receive a 0th order reflection of light, or (3) something else? For the purpose of examination, any connection to 0th order reflection of light is understood to meet the requirements of the claim, but applicant should clarify what is intended, without adding new matter.
The other dependent claims do not cure the defects of the claim from which they depend and are therefore also rejected.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claims 18, 20-22 and 33 are rejected under 35 U.S.C. 103 as being unpatentable over Davlin et al (US 2003/0012868) in view of Japan 08-236430 (hereinafter ‘430), Sugie et al (US 4866782), Sano et al (US 2015/0262848), Yashiki et al (US 2006/0185792), Imai et al (US 5473166), Couturier (US 2016/0153917), and Havener et al (US 2020/0271591).
Claims 18, 21, 33: Davlin teaches a method of monitoring a fluid material (such as photoresist) during spin coating (note abstract, figures 1, 2, 0002, 0021-0022). The method includes providing a substrate within the fluid dispense system, the substrate being located under a dispensing nozzle (note 0021, figure 2). A material (fluid, such as photoresist) is spin coated upon the substrate (figures 1, 2, 0002, 0021-0022). A camera is used to obtain image data of the substrate while spin coating the material upon the substrate (figure 2, 0022, 0027—0032, since amount of coverage in an area determined, the substrate would also be imaged showing boundary between substrate and photoresist). This data would be understood to be at least suggested to be over time, because a video camera can be used (note 0022), and also determination of when an amount of coverage occurs, so would be understood that images would occur over time to show when desired amount of coverage reached (note 0029-0030). As to the image data includes data from a plurality of pixels of the camera, this would be indicated by Davlin, which notes how there can be an array (plurality) of pixels of data from the image generator (which can be a camera), and determine when a pre-selected fraction indicate coverage (note 0031). It is noted that the system can be used to help control amount deposited and with less variation in thickness (note 0041). It is further indicated that the substrate is a microelectronic substrate, which can have microelectronic circuits (and which therefore, would have a circuit pattern formed of the circuits on the substrate) and/or vias and conductive lines (which can also be understood to give a circuit pattern as conductive lines can act as circuits) (note 0020).
(A) As to providing the substrate within a processing chamber and the dispensing nozzle having a dispense arm, obtaining reflected intensity data over time from the image data from the plurality of pixels, and determining a thickness of the fluid material over time, with the determining comprising utilizing signal processing techniques on the reflected intensity data to account for movement of the dispense nozzle relative to the substrate, and where in response to determining that the thickness does not equal a desired thickness, adjusting a spin speed of the substrate,
‘430 describes how when providing resist coating, the resist can be applied to a rotating substrate using a dispenser (note 0003, 0011), where it is desired to control thickness of the resist on the substrate in real time, where such correction can occur by providing real time measurement using reflection intensity, where light can be irradiated from a top surface of the resist, where detected intensity change of the reflected light is monitored, and spin rotation speed can be adjusted in real time to adjust the coating thickness (note 0003, 0004), so in other word, thickness would be detected over time (as the process occurs) based on the reflected intensity data, and when thickness does not equal a desired thickness, adjusting the spin speed of the substrate (note 0003, 0005, 00011, 0013, where since the speed is adjusted while measuring the thickness to get desired thickness, the initial measurement would not be of desired thickness)
Additionally, Sugie indicates how the difference between a resist coating and a semiconductor wafer surface can be determined using image analysis where light is scanned to a substrate and reflected back to receiver and converted into a light intensity signal, where the light intensity for an area indicates whether resist covered or not (note column 1, line 65 through column 2, line 20), where a camera can be used to obtain the image data (reflected light) and convert into a light intensity signal (data), which is sent to image analysis (note column 2, lines 40-45, column 4, lines 1-10), indicating that cameras can be used for providing reflected light intensity features for resist examination, and also how different results will occur with resist and other materials.
Additionally, Sano describes how it is known to apply resists or other fluids onto substrates with spin coating, where the substrate would be provided within a processing chamber, and the substrate would be located under a dispensing nozzle on a dispensing arm, and where the nozzle would have movement relative to the substrate during processing (note figures 3, 4, 0087, 0092, 0121, 0099). Sano further uses a camera to monitor the movement of the nozzle into correct position, where it takes images of the substrate surface and nozzle as it moves into the processing position (note 0115, 0116, figures 3, 8, 9), where the camera takes images of region PA when the nozzle starts moving from standby to processing position and determines differences in the images showing when nozzle present and when not (0135-0138), and therefore, indicates how there would be a clear difference in images when a nozzle present vs. when simply the substrate/coating present.
Yashiki notes that when processing semiconductor wafers with processing liquid on a rotating substrate (0003), it is known to want to provide image processing of the substrates (here a rim portion), where an image is taken of the rim portion of the substrate (note 0030), where the images taken would be output as image signals (data) to an image processing part, and this image processing part performs signal processing to produce the contour outline, of the substrate, etc. (note 0033). This is indicated as occurring while the substrate rotating (note figure 3, 0042, 0043), and therefore to produce the contour outline would occur over time. It is further indicated that the wafer substrate can have a pattern (in the form of notch NT), and this has to be taken into account, where the pattern shape of the notch (which would also be moving as the substrate rotated) is registered in advance to the image processing part, and then checked against the image pattern from the image taker (CCD 21, 22), and when a portion of the substrate with this pattern present, it can be deleted from basic information regarding distance measurements (0025, filters out this information, 0044), and thus movement of a pattern (notch) on the substrate (which would occur due to the substrate spinning) is accounted for in the system and the overall signal processing occurs as desired since this pattern can be filtered out of measurements. It is indicated that substrates with photoresist to be applied can have such a notch, noting the indication of providing photoresist on the wafer (0020). It is also indicated that the that light intensity data from the image data can be obtained, which would then be signal processed as discussed before (note 0054).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin to use the camera to obtain image data of the substrate over time while spin coating the material on the substrate, with providing the substrate within a processing chamber and the dispensing nozzle having a dispense arm, obtaining reflected intensity data over time from the image data which is from the plurality of pixels in the camera, and determining a thickness of the fluid material over time, with the determining comprising utilizing signal processing techniques on the reflected data to account for movement of the dispense nozzle relative to the substrate, and when the thickness does not equal a desired thickness adjusting a spin speed of the substrate to get the desired thickness as suggested by ‘430, Sugie, Sano and Yashiki to provide a desirable monitoring system that also allows for determining fluid material thickness over time, and allowing correction of thickness, since Davlin provides a camera that can monitor fluid flow such as resist applied to a spinning substrate over time, and indicates the desire to control coating thickness variation/uniformity, and ‘430 teaches that it is well known to monitor a fluid flow of resist applied to a spinning substrate in real time with using reflected intensity data to determine coating thickness and allow for corrected thickness in real time, by adjusting the spin speed of the substrate when the measured thickness is not as desired, thereby adjusting to provide the desired thickness, when Sugie further indicates how camera monitoring can be used to provide image data used to obtain similar reflected intensity data of resist coating, and distinguish between coating and other materials, suggesting that the camera of Davlin can be used to provide image data of the substrate from the plurality of pixels and obtaining reflected intensity data from this image data that would also allow coating thickness determination and correction over time, and additionally, as to utilizing signal processing techniques on the reflected intensity data to account for movement of the dispense nozzle as part of thickness determination, Sano would further suggest the conventionality of providing the substrate in a processing chamber and the substrate being located under a dispensing nozzle and arm, where the dispense nozzle would move relative to the substrate in processing, and further Sano describes how cameras for monitoring a system with deposition of fluid including resist onto wafers can be provided, and the monitoring can monitor and determine when a moving nozzle is present, and thus distinguish from data from the nozzle and the substrate/coating, where Sugie would further indicate how reflected intensity data can show a difference between coated resist and another material, and Yashiki shows that substrate wafers for such resist application can conventionally have a pattern such as a notch that would move when the substrate spun, and that when performing image analysis would have signal processing techniques used to account for this notch affecting readings by filtering out, and it would further be suggested to similarly filter out the movement of the dispense nozzle obtained by the monitoring camera by signal processing, as it would similarly give different results than that desired for the resist monitoring, as shown by the distinguishable images indicated by Sano.
(B) As to the determining process for determining thickness further accounts for movement of a circuit pattern on the substrate resulting from the substrate spinning, where the signal processing techniques include removing image data/a sub-set of the plurality of pixels of the camera from the data analysis for image analysis, wherein the sub-set of the plurality of pixels of the camera correspond to pixels that are affected by undesired reflections from the circuit pattern, and analyzing image data from a remaining subs-set of the plurality of pixels of the camera, as discussed above, Davlin would indicate that that the substrate can have a circuit pattern, since the substrate can have circuits on the substrate, and would indicate obtaining image data while spin coating. Davlin further notes how there can be an array (plurality) of pixels of data from the image generator (which can be a camera), and the controller can determine when a pre-selected fraction (that is a sub-set of pixels) indicate coverage (note 0031), which would at least suggest to only analyze image from this fraction/sub-set of pixels (note 0022, 0031) (so a sub-set of pixels would be removed of the plurality of pixels of the camera, and image data analyzed from the remaining sub-set). Furthermore, ‘430 notes performing the thickness measurement while the substrate is spinning (note 0005), and as discussed above uses light irradiated on the applied material (resist) and detected intensity change of the reflected light is monitored to determine thickness (note 0003-0004), and Sugie as discussed above, also notes using applied and reflected light for image analysis. Yashiki, for example, also notes taking images while the substrate is rotating (note 0042-0043, figure 2) and taking into account a pattern on the substrate giving a different effect (with the notch), as discussed above.
Additionally, Imai describes that it is known that when applying resist/photoresist to a wafer/substrate reflected light intensity changes due to the changes in thickness, but as well, the wafer material, base material (such a metallic film, insulating film, etc) applied on the wafer, the kind of photoresist applied on the base, etc. all affect the reflectance of the light when changed and change the intensity of the reflected light incident on a detector would also occur (note column 1, line 50 to column 3, line 10). Therefore, it would be understood that as well as the thickness of the photoresist affecting the reflected light intensity, the intensity would also be affected by the underlying substrate material, materials on the substrate to which the liquid/resist applied, and the liquid/resist material used.
Couturier further indicates performing image data processing of a substrate (here a target surface 56), where target image data is generated by a camera of a sensor unit 22, where a comparison is made between reflection intensity image data as generated by the sensor unit 22 and reflection intensity data associated with a reference surface, where the computer 69 is programmed to generated corrected intensity image data, where calculation of correction data involves image pixels corresponding to at least one reflection based characteristic common to both target and reference surfaces, and filtering is performed to remove image pixels corresponding to reflection based characteristics not common to these surface (that is, removing a sub-set of pixels), with for example, for a wood board surface, pixels corresponding to reflection related characteristics of the scanned surface associated with detected knots, mineral streaks, slits and heartwood/or sapwood (depending on the wood type) are removed, while pixels corresponding to a reflection related characteristic associated with sapwood (high luminance, with an appropriate minimum light intensity threshold) or heartwood (low luminance, with an appropriate maximum light intensity threshold) (depending on the wood type) are kept (that is the sub-set of pixels related to the desired reflection related characteristics are kept and analyzed) (note 0061-0063).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin in view of Yang, Sugie, Sano and Yashiki to also account for movement of a circuit pattern on the substrate resulting from the substrate spinning as suggested by Imai to provide a correctly determined thickness of the fluid material on the substrate, and to use signal processing techniques that include removing image data/a sub-set of the plurality of pixels of the camera from data/ image analysis, where the sub-set of the plurality of pixels of the camera correspond to pixels that are affected by undesired reflections from the circuit pattern, and analyzing the image data from a remaining sub-set of the plurality of pixels of the camera, since Davlin in view of Yang, Sugie, Sano and Yashiki would provide for a process using reflected intensity value of the fluid material on the substrate while spin coating, where such reflected intensity is used in determining thickness, and Davlin would indicate that the underlying substrate can have a circuit pattern and that the camera can have a plurality of pixels of with a sub-set of the pixels are used/analyzed to determine coverage, and Imai teaches that reflected intensity values from a material (resist) on a substrate/wafer change with changing thickness, but the reflectance and intensity is also changed with changing of material that would be under the resist, such as metallic film, insulating film, etc. on the substrate and substrate material, and therefore when measuring the thickness of the material upon the substrate that is applied over a circuit pattern on a substrate, one would need to take into account the movement of the circuit pattern on the substrate resulting from the substrate spinning (that is, what material of the circuit pattern is present at different points when spinning and obtaining intensity data, such as when is the underlying material conductive circuit lines, and when is insulating material, etc.) so that one can correlate to intensity data received based on the underlying materials so as to correctly determine the thickness based on the correct intensity data analysis, furthermore, as to the signal processing techniques removing image data/a sub-set of the plurality of pixels of the camera from data/image analysis, where the sub-set of the plurality of pixels of the camera correspond to pixels that are affected by undesired reflections from the circuit patten, and analyzing image data from a remaining subs-set of the plurality of pixels of the camera this would be further suggested by Couturier with an expectation providing desired efficient analyzing, since Davlin would indicate that the underlying substrate can have a circuit pattern and that the camera can have a plurality of pixels of with a sub-set of the pixels are used/analyzed to determine coverage, Imai would indicate how the circuit pattern could affect the resulting intensity data, and Couturier would indicate how a camera with pixels can be used to monitor a surface and how pixels from reflections not desired to be considered and compared to a reference can be removed from consideration(such as reflection intensity from specific surface features such as knots, mineral streaks, etc.) while pixels related to a desired reflection related characteristic (such as heartwood with low luminance) can be kept (using an appropriate light intensity threshold), and thus thickness can be determined with signal process techniques on the reflected intensity data with analyzing image data based on reference of remaining sub-set of the plurality of pixels on a similar reference comparison while removing and not considering a sub-set of pixels that give different (undesired) light intensity based on the reflections from the circuit pattern, since ‘430 is using known reference data (note 0004) to determine the thickness which would be based on the substrate used, etc. For claim 33, Couturier indicates that based on the specific surface used, detection can occur using a minimum or maximum light intensity threshold (note 0062), and based on the specific reflection values of the circuit pattern as opposed to the rest of the substrate, it would have been obvious to determine how the reflection intensity from the circuit board differs from the rest of the substrate to be considered and to provide a variation threshold (such as above a maximum amount or below a minimum amount, which would be a variation threshold) of the reflection intensity under which pixels would not be considered, and thus in the sub-set of pixels to be removed, to provide desirable optimization of what to use since reflection intensity is measured and used in the process and reference data determined by ‘430.
(C) Additionally, as to changing a combination of selected wavelengths examined in the image data from the plurality of pixels of the camera during data analysis, wherein the changing comprises selectively including or excluding one or more color channels from the data analysis, ‘430 notes using reflected light with detection of intensity change (note 0003-0004), where the light irradiated would have at least one or more wavelengths (as light has wavelengths). This would also be the case for Sugie. Furthermore, Couturier describes how when performing image data processing of a substate using reflection intensity image data (note 0038), the system can use a first laser source (which would act as a light source), which provides laser wavelength for use in the red range (selected wavelength range of 620-660 nm, or color channel), where the laser beam/light intensity is reflected to be captured by a camera (note 0038), and it is further indicated that an embodiment that also has a second (dual) laser can be provided that also uses a second laser of a second wavelength range (green, selected wavelength range of 510-540 nm, or color channel) to provide a second reflected light to be captured by the camera as well (note 0039-0043). It is indicated that for the data/image analysis the wavelengths examined in the image data can change (so the combination of the red wavelengths can be examined and as well a changed combination of green wavelengths can be examined, note first red image and second green image) (0060), where the different wavelengths analysis can be compared to each other and help with analysis (note 0081-0082). Additionally, as to the changing of the selective wavelengths examined during data analysis comprising selectively including or excluding one or more channels from the data analysis, this would be indicated by Couturier, where in 0060-0061, 0081-0082, it is indicated (1) to provide first color images from R (red wavelength) and second color images from G (green wavelength) deinterlaced (so only one color) and the deinterlaced images can be analyzed, so red or green color channels can be alternatively included and excluded from the data analysis, or (2) it is further indicated that optionally a third color image (blue wavelength, blude color channel) can be added to obtain a third color image frame, and since this can optionally be used, it would have been obvious to one of ordinary skill in the art that the blue color channel can be included or excluded as desired such that during data analysis the wavelengths examined can be changed so as to sometimes include blue wavelengths/channel in the data analysis, when a full color image desired, and exclude blue wavelengths/channel when a full color image not desired.
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin in view of ‘430, Sugie, Sano, Yashiki, Imai and Couturier to also change the combination of selected wavelengths examined in the image data from the plurality of pixels of the camera during data analysis, where the changing comprises selectively including or excluding one or more color channels from the data analysis with an expectation of providing further help with the analysis as suggested by Couturier, since ‘430 and Sugie for example would be using reflected intensity, and Couturier teaches that reflected intensity can be provided using multiple selected wavelength ranges (such as that of red channel and green channel), such that red wavelengths can be examined in the image data during data analysis and changed to analysis of green wavelengths to help analysis, and further since blue wavelength/channel can optionally be used data analysis, it would have been obvious to one of ordinary skill in the art that the blue color channel can be included or excluded as desired such that during data analysis the wavelengths examined can be changed so as to sometimes include blue wavelengths/channel in the data analysis, when a full color image desired, and exclude blue wavelengths/channel when a full color image not desired. For claim 21, this would also indicate that the selected wavelengths can be used in analyzing the selected wavelengths of the reflected intensity data.
Furthermore, Havener further indicates how a system can be provided for analyzing material where first and second materials can be determined using reflected light with a camera and spectrometer to determine an intensity spectrum of light and capture image data (note 0004-0005), where the camera can be optimized for use at one or more wavelength ranges to determine abnormalities in a film and determine where more or less reflectance (note 0031, 0037), and further notes that an abnormal/different area can be determined by subjectively noting an intensity shift between the shapes or the processing circuitry can determine an average intensity over the measured, abnormal spectrum, and compare that with average intensity (over the same wavelength range) for an average of reference spectra and determine whether that difference is over a predetermined threshold (thus smoothing the data) (note 0091). As to the use of changing of wavelengths examined, Havener notes how for specific substrates/thicknesses/materials for a substrate a specific wavelength range can be indicated to be used (note 0044-0045), which would indicate to change wavelength used for examination from substrate to substrate treatment. It is further indicated that samples can be examined using different selected wavelengths to determine on a trial and error basis which would be the best wavelength range should be used for analysis (note 0053), which would further indicate that for a given substrate analysis the wavelengths used for examining the image data can be changed, at least for determining the best wavelengths to use, and therefore there would be changing of the wavelengths during data analysis, which would include selectively including and excluding different wavelengths (since analysis for one would be stopped and changed to another), and these different wavelengths can be different color channels (noting, for example that Havener describes how spectrum interference minima can be at 430, 480, 540, and 620 nm, for example, note 0047, which would give different colors, note Couturier describing green as 510-540 and red as 620-660 nm, 0038, 0041 of Couturier).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin in view of ‘430, Sugie, Sano, Yashiki, Imai and Couturier to further provide changing a combination of selected wavelengths examined in the image data from the plurality of pixels of the camera during data analysis, where the changing comprises selectively including or excluding one or more color channels from the data analysis as suggested by Havener as conventional for image analysis using reflected light, since as indicated by ‘430, Sugie intensity of reflected light would be used, and the combination of references would provide analysis over time, and Havener would indicate that with reflected light analysis, one can also use optimized wavelength ranges for specific materials, which therefore would change from substrate to substrate, and as well that a same substrate can be examined using changed combinations of wavelengths as part of determining the best wavelengths to use, and therefore there would be changing of the wavelengths during data analysis, which would include selectively including and excluding different wavelengths (since analysis for one would be stopped and changed to another), and these different wavelengths can be different color channels For claim 21, this would also indicate that the selected wavelengths can be used in analyzing the selected wavelengths of the reflected intensity data.
(D) Additionally, as to the remaining sub-set of the plurality of pixels also corresponding to a 0th order reflection of light reflected off the substrate, as discussed for section (B) above it would be suggested to remove image data from a sub-set of pixels corresponding to pixels that are affected by undesirable reflections from the circuit pattern, which would leave a remaining sub-set of pixels. As to further adjusting the sub-set of pixels to leave a remaining sub-set for analyzing that also correspond to aa 0th order reflection of light reflected off the substrate,
Havener further indicates, as discussed above, how a system can be provided for analyzing material where first and second materials can be determined using reflected light with a camera and spectrometer to determine an intensity spectrum of light and capture image data (note 0004-0005), where the camera can be optimized for use at one or more wavelength ranges to determine abnormalities in a film and determine where more or less reflectance (note 0031, 0037). Havener describes how measurements can be taken using specular reflectance data, which can be used for data from thin films, for example (note 0041), where it is noted that specular reflectance refers to reflection of light in a single outgoing direction, where the surface at which the light source’s incident light is aligned with respect to the substrate so that the portion of the surface on which the light is received acts as a mirror and reflects the light at an angle that equals the light’s angle of incidence, such that specular analysis of a film layer based on specular reflectance may revel anomalies that are not apparent to the naked eye which relies on diffuse reflections (note 0050). As shown in figure 1, use of a camera system, where light is emitted to the surface and reflected back can also have a specular reflection, noting how light emitting devices 108 are positioned about a receiving camera so that light propagation to the surface and reflectance back gives specular reflection (note figure 1, 0046-0038).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin in view of ‘430, Sugie, Sano, Yashiki, Imai, Couturier and Havener to further provide that the sub-set of the pixels to have image data analyzed (remaining sub-set) would those pixels of the camera that would receive data in the form of specular reflection as suggested by Havener with an expectation of providing a desirable analyzing of the data, since Davlin provides a camera to monitor fluid flow and that there would be an array of pixels of data for the camera, and as discussed above, a sub-set of pixels is suggested to be remove from analyzing, and Havener indicates that it is desirable to provide that the data analyzed is in a form that the light received is reflected at an angle that equals the incoming light’s angle of incidence, giving specular reflection, thus suggesting to use simply pixels with this desired reflection present. The Examiner further would understand that this use of specular reflection equates to using a 0th order of light reflected off the substrate as such 0th order reflection acts in the same way, and corresponds to secular reflection.
Claim 20: As to smoothing the reflected intensity data over time,
Havener further notes that an abnormal/different area can be determined by subjectively noting an intensity shift between the shapes or the processing circuitry can determine an average intensity over the measured, abnormal spectrum, and compare that with average intensity (over the same wavelength range) for an average of reference spectra and determine whether that difference is over a predetermined threshold (thus smoothing the data) (note 0091). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Davlin in view of ‘430, Sugie, Sano, Yashiki, Imai, Couturier and Havener to further provide smoothing the reflected intensity data over time as suggested by Havener as conventional for image analysis using reflected light, since as indicated by Sugie and ‘430 intensity of reflected light would be used, and the combination of references would provide analysis over time, and Havener would indicate that with reflected light analysis, one can smooth data when determining differences between areas.
Claim 22: As to transforming the reflected intensity data, it would be understood that this would be provided as part of signal processing techniques, since as noted by Sugie there is further image analysis to determine where is substrate and where is resist note column 4, lines 1-10), and also note Yashiki, that pattern information from the notch portion can be deleted (0035), so results would be transformed.
Uemae et al (US 2016/0089688) also notes how it is known to apply resists of other fluids onto substrates with spin coating, where the substrate would be provided within a processing chamber, and the substrate would be located under a dispensing nozzle on a dispensing arm, and where the nozzle would have movement relative to the substrate during processing (note figures 3, 4, 0028, 0039, 0062, 0055). Uemae further uses a camera to monitor the movement of the nozzle into correct position, where it takes images of the substrate surface and discharge as it moves into the processing position (note figures 7, 8, 0065, 0070-0074).
Joseph et al (US 6441375) describes measuring thickness of a coating using reflected intensity, where it is noted that if the substrate composition changes, then the apparent thickness of the coating material may change, since the intensity value also depends on the composition of the substrate material (note column 1, lines 15-60).
Johansson et al (US 2006/0165136) notes a zeroth order reflected ray as specular reflection (note 0043). Rangarajan et al (US 6451621) notes 0th diffracted order (m=0) corresponds to specular reflection, that is, scattered light that has an angle of reflection mirroring the angle of incidence (note column 5, lines 15-25).
Response to Arguments
Applicant's arguments filed December 22, 2025 have been fully considered.
Note the new 35 USC 112 rejection provided due to the amendments to the claims.
It is argued that the cited references are silent as to the new providing of analyzing image data from a remaining sub-set of the plurality of pixels of the camera, where the remaining sub-set of the plurality of pixels corresponds to a 0th order reflection of light reflected off the substrate.
The Examiner has reviewed these arguments, however, the rejections above are maintained. Havener is now a non-optional reference for the rejection and provides the suggestion of using measurements from specular reflection which would also be another term/correspond to using a 0th order reflection of light reflected off the substrate. Note the description of specular reflection in Havener. As a courtesy, the Examiner also notes Johansson and Rangarajan, cited of interest in paragraph 13 above, as further noting the conventional understanding of the equivalence/correspondence of the terms.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KATHERINE A BAREFORD whose telephone number is (571)272-1413. The examiner can normally be reached M-Th 6:00 am -3:30 pm, 2nd F 6:00 am -2:30 pm.
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/KATHERINE A BAREFORD/Primary Examiner, Art Unit 1718