Prosecution Insights
Last updated: April 19, 2026
Application No. 17/525,167

DUAL RESISTOR INTEGRATION

Non-Final OA §103
Filed
Nov 12, 2021
Examiner
ZHU, SHENG-BAI
Art Unit
2897
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Texas Instruments Incorporated
OA Round
5 (Non-Final)
63%
Grant Probability
Moderate
5-6
OA Rounds
2y 11m
To Grant
67%
With Interview

Examiner Intelligence

Grants 63% of resolved cases
63%
Career Allow Rate
441 granted / 705 resolved
-5.4% vs TC avg
Minimal +5% lift
Without
With
+4.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 11m
Avg Prosecution
59 currently pending
Career history
764
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
66.2%
+26.2% vs TC avg
§102
21.5%
-18.5% vs TC avg
§112
10.7%
-29.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 705 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Detailed Action Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 9/2/2025 has been entered. Claim Rejections – 35 U.S.C. 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claims 1, 3, 4, 6, 8-14 and 22-24 rejected under 35 U.S.C. 103 as being unpatentable over Saito (U.S. Patent Pub. No. 2016/0276425) of record, in view of Leng (U.S. Patent Pub. No. 2019/0392967), in view of Beach (U.S. Patent Pub. No. 2004/0245575) of record for documentary evidence. Regarding Claim 1 FIG. 5 of Saito discloses an electronic device, comprising: a semiconductor [0074] layer (100); a dielectric [0079] layer (250) above the semiconductor layer, the dielectric layer having a surface extending in a first plane (interface of 260 and 250); a first resistor (right 220) having opposite first (lower) and second (upper) sides, the first side of the first resistor directly on the surface of the dielectric layer, the second side of the first resistor extending in a second plane spaced apart from the first plane, wherein the first resistor includes: a first portion (left), a second portion (middle), and a third portion (right), wherein the first, second, and third portion have a same material; and a second resistor (left 220) having opposite first (lower) and second (upper), the second resistor spaced apart from the first resistor, the first side of the second resistor on the surface of the dielectric layer, the second side of the second resistor extending in the second plane, wherein the first and second resistors include a same material; and a contact (260) connected to the second side of the first portion, wherein the first portion encloses a lateral dimension of the contact. Saito is silent with respect to “the second portion having a recess with respect to the second plane” and “the recess is entirely filled with an insulating material”. FIG. 13 of Leng discloses a similar electronic device, comprising a first resistor (122), wherein the first resistor includes: a first portion (124B), a second portion (120), and a third portion (left 124B), wherein the first side of the first resistor directly on the surface of the dielectric layer (102), the second side of the first resistor extending in a second plane spaced apart from the first plane; wherein the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (116) and the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Leng. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of improving integrated resistor performance ([0005] of Leng). Regarding Claim 3 FIG. 13B of Leng discloses the first and third portions of the first resistor have a first thickness; and the second portion has a second thickness less than the first thickness. Regarding Claim 4 FIG. 5 of Saito discloses a second dielectric layer (260) above the dielectric layer (250), the first resistor (right 220), and the second resistor (left 220); a first contact (260b) extending in the second dielectric layer and contacting the first portion of the first resistor; a second contact (260d) extending in the second dielectric layer and contacting the third portion of the first resistor, the second contact spaced apart from the first contact along the first direction; a third contact (260b) extending in the second dielectric layer and contacting a portion of the second resistor; and a fourth contact (left 260d) extending in the second dielectric layer and contacting another portion of the second resistor, the fourth contact spaced apart from the third contact, wherein the contact is a first contact. Regarding Claim 6 FIG. 5 of Saito discloses a second dielectric layer (260) above the dielectric layer (250), the first resistor (right 220), and the second resistor (left 220); a second contact (260d) extending through the second dielectric layer and contacting the third portion of the first resistor, the second contact spaced apart from the first contact along the first direction; a third contact (260b) extending through the second dielectric layer and contacting a portion of the second resistor; and a fourth contact (left 260d) extending through the second dielectric layer and contacting another portion of the second resistor, the fourth contact spaced apart from the third contact, wherein the contact is a first contact. Regarding Claim 8 With respect to “the second thickness is 50 A or less”, said thickness is related to the desired resistance and the material used for TFR (for example, Para. 34 of Beach states “35 .ANG. for a 1 Kohm silicon chromium resistor”). Therefore, said thickness is considered to be a result effective variable. The claim to a specific thickness therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05). Regarding Claim 9 Leng discloses the first resistor and the second resistor include silicon-chromium [0022]. Regarding Claim 10 FIG. 5 of Saito discloses a resistor (220), comprising: a patterned film having a first side facing a semiconductor substrate (100) and a second side opposite the first side, the first side extending in a first plane and the second side extending in a second plane spaced apart from the first plane, wherein: the patterned film includes a first portion, a second portion, and a third portion, the second portion extending between the first and third portion; and a first conductive contact (260b) connected to the second side of the first portion; and a second conductive contact (260d) connected to the second side of the third portion, wherein the first, second, and third portion have a same material, the first portion encloses a first lateral dimension of the first conductive contact and the third portion encloses a second lateral dimension of the second conductive contact. Saito is silent with respect to “the second portion is recessed with respect to the second plane” and “a surface of the second portion is entirely in direct contact with an insulating material, the surface facing the second plane”. FIG. 13 of Leng discloses a similar electronic device, comprising a first resistor (122), wherein the first resistor includes: a first portion (124B), a second portion (120), and a third portion (left 124B), wherein the first side of the first resistor directly on the surface of the dielectric layer (102), the second side of the first resistor extending in a second plane spaced apart from the first plane; wherein the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (116) and the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Leng. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of improving integrated resistor performance ([0005] of Leng). Regarding Claim 11 FIG. 10B of Leng discloses the first and third portions have a first thicknesses; the second portion has a second thickness less than the first thicknesses. Regarding Claim 12 With respect to “the second thickness is 50 A or less”, said thickness is related to the desired resistance and the material used for TFR (for example, Para. 2 of Mahalingam states “for silicon chromium (SiCr) thin film resistors having a sheet resistance of 1000 Ohms/square a film thickness of about 3.4 nm is required”). Therefore, said thickness is considered to be a result effective variable. The claim to a specific thickness therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05). Regarding Claim 13 Saito as modified by Leng discloses a dielectric layer disposed on the patterned film; the first conductive contact extends through the dielectric layer; and the second conductive contact extends through the dielectric layer. Regarding Claim 14 FIG. 5 of Saito discloses a dielectric layer (260) above the first portion, the second portion, and the third portion; a first conductive contact (260b) extending through the dielectric layer along the third direction and contacting the first portion; a second conductive contact (260d) extending through the dielectric layer along the third direction and contacting the third portion. Regarding Claim 22 Leng discloses the first, second, and third portions include silicon-chromium (SiCr) [0022]. Regarding Claim 23 Leng discloses the material of the first and second resistors includes silicon-chromium (SiCr) [0022]. Regarding Claim 24 Leng discloses the first, second, and third portions include silicon-chromium (SiCr) [0022]. Claims 5, 7 and 21 rejected under 35 U.S.C. 103 as being unpatentable over Saito and Leng, in view of Leng954 (U.S. Patent Pub. No. 2022/0208954), in view of Beach (U.S. Patent Pub. No. 2004/0245575) of record for documentary evidence. Regarding Claim 5 Saito as modified by Leng discloses Claim 3. With respect to “the first thickness is 200 A or more, and the second thickness is 100 A or less”, said thickness is related to the desired resistance and the material used for TFR (for example, Para. 34 of Beach states “35 .ANG. for a 1 Kohm silicon chromium resistor”). Therefore, said thickness is considered to be a result effective variable. The claim to a specific thickness therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05). Furthermore, FIG. 10B of Leng954 discloses the first thickness is 200 A or more [0066], and the second thickness is 100 A or less [0065]. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Leng954. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of improving integrated resistor performance ([0005] of Leng954). Regarding Claim 7 FIG. 10B of Leng954 discloses the second resistor has a first thickness of 200 A or more [0066], and a recessed portion of the first resistor has a second thickness of 100 A or less [0065]. Furthermore, the recitation “the second resistor has a first thickness of 200 A or more, and a recessed portion of the first resistor has a second thickness of 100 A or less” is related to the desired resistance and the material used for TFR (for example, Para. 34 of Beach states “35 .ANG. for a 1 Kohm silicon chromium resistor”). Therefore, said thickness is considered to be a result effective variable. The claim to a specific thickness therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05). Regarding Claim 21 FIG. 10B of Leng discloses the second thickness is 100 A or less [0065]. Furthermore, the recitation “the second thickness is 100 A or less” is related to the desired resistance and the material used for TFR (for example, Para. 34 of Beach states “35 .ANG. for a 1 Kohm silicon chromium resistor”). Therefore, said thickness is considered to be a result effective variable. The claim to a specific thickness therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05). Claims 1 and 10 rejected under 35 U.S.C. 103 as being unpatentable over Saito, in view of Zuo (U.S. Patent Pub. No. 2014/0217550). Regarding Claim 1 FIG. 5 of Saito discloses an electronic device, comprising: a semiconductor [0074] layer (100); a dielectric [0079] layer (250) above the semiconductor layer, the dielectric layer having a surface extending in a first plane (interface of 260 and 250); a first resistor (right 220) having opposite first (lower) and second (upper) sides, the first side of the first resistor directly on the surface of the dielectric layer, the second side of the first resistor extending in a second plane spaced apart from the first plane, wherein the first resistor includes: a first portion (left), a second portion (middle), and a third portion (right), wherein the first, second, and third portion have a same material; and a second resistor (left 220) having opposite first (lower) and second (upper), the second resistor spaced apart from the first resistor, the first side of the second resistor on the surface of the dielectric layer, the second side of the second resistor extending in the second plane, wherein the first and second resistors include a same material; and a contact (260) connected to the second side of the first portion, wherein the first portion encloses a lateral dimension of the contact. Saito is silent with respect to “the second portion having a recess with respect to the second plane” and “the recess is entirely filled with an insulating material”. FIG. 3 of Zuo discloses a similar electronic device, comprising a first resistor (340), wherein the first resistor includes: a first portion, a second portion, and a third portion, wherein the first side of the first resistor directly on the surface of the dielectric layer (300), the second side of the first resistor extending in a second plane spaced apart from the first plane; wherein the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (350) and the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Zuo. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of improving the accuracy and reliability of resistors ([0003] of Zuo). Regarding Claim 10 FIG. 5 of Saito discloses a resistor (220), comprising: a patterned film having a first side facing a semiconductor substrate (100) and a second side opposite the first side, the first side extending in a first plane and the second side extending in a second plane spaced apart from the first plane, wherein: the patterned film includes a first portion, a second portion, and a third portion, the second portion extending between the first and third portion; and a first conductive contact (260b) connected to the second side of the first portion; and a second conductive contact (260d) connected to the second side of the third portion, wherein the first, second, and third portion have a same material, the first portion encloses a first lateral dimension of the first conductive contact and the third portion encloses a second lateral dimension of the second conductive contact. Saito is silent with respect to “the second portion is recessed with respect to the second plane” and “a surface of the second portion is entirely in direct contact with an insulating material, the surface facing the second plane”. FIG. 3 of Zuo discloses a similar electronic device, comprising a first resistor (340), wherein the first resistor includes: a first portion, a second portion, and a third portion, wherein the first side of the first resistor directly on the surface of the dielectric layer (300), the second side of the first resistor extending in a second plane spaced apart from the first plane; wherein the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (350) and the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Zuo. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of improving the accuracy and reliability of resistors ([0003] of Zuo). Claims 1 and 10 rejected under 35 U.S.C. 103 as being unpatentable over Saito, in view of Kim (KR 20060075342) of record. Regarding Claim 1 FIG. 5 of Saito discloses an electronic device, comprising: a semiconductor [0074] layer (100); a dielectric [0079] layer (250) above the semiconductor layer, the dielectric layer having a surface extending in a first plane (interface of 260 and 250); a first resistor (right 220) having opposite first (lower) and second (upper) sides, the first side of the first resistor directly on the surface of the dielectric layer, the second side of the first resistor extending in a second plane spaced apart from the first plane, wherein the first resistor includes: a first portion (left), a second portion (middle), and a third portion (right), wherein the first, second, and third portion have a same material; and a second resistor (left 220) having opposite first (lower) and second (upper), the second resistor spaced apart from the first resistor, the first side of the second resistor on the surface of the dielectric layer, the second side of the second resistor extending in the second plane, wherein the first and second resistors include a same material; and a contact (260) connected to the second side of the first portion, wherein the first portion encloses a lateral dimension of the contact. Saito is silent with respect to “the second portion having a recess with respect to the second plane” and “the recess is entirely filled with an insulating material”. FIG. 2 of Kim discloses a similar electronic device, comprising a first resistor (140), wherein the first resistor includes: a first portion, a second portion, and a third portion, wherein the first side of the first resistor directly on the surface of the dielectric layer (120), the second side of the first resistor extending in a second plane spaced apart from the first plane; the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (150), wherein the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Kim. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of adjusting the resistance. Regarding Claim 10 FIG. 5 of Saito discloses a resistor (220), comprising: a patterned film having a first side facing a semiconductor substrate (100) and a second side opposite the first side, the first side extending in a first plane and the second side extending in a second plane spaced apart from the first plane, wherein: the patterned film includes a first portion, a second portion, and a third portion, the second portion extending between the first and third portion; and a first conductive contact (260b) connected to the second side of the first portion; and a second conductive contact (260d) connected to the second side of the third portion, wherein the first, second, and third portion have a same material, the first portion encloses a first lateral dimension of the first conductive contact and the third portion encloses a second lateral dimension of the second conductive contact. Saito is silent with respect to “the second portion is recessed with respect to the second plane” and “a surface of the second portion is entirely in direct contact with an insulating material, the surface facing the second plane”. FIG. 2 of Kim discloses a similar electronic device, comprising a first resistor (140), wherein the first resistor includes: a first portion, a second portion, and a third portion, wherein the first side of the first resistor directly on the surface of the dielectric layer (120), the second side of the first resistor extending in a second plane spaced apart from the first plane; the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material (150), wherein the first, second, and third portion have a same material. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Saito, as taught by Kim. The ordinary artisan would have been motivated to modify Saito in the above manner for purpose of adjusting the resistance. Pertinent Art US 6441447 discloses an electronic device, comprising: a semiconductor layer; a dielectric layer above the semiconductor layer, the dielectric layer having a surface extending in a first plane; a first resistor having opposite first and second sides, the first side of the first resistor directly on the surface of the dielectric layer, the second side of the first resistor extending in a second plane spaced apart from the first plane, wherein the first resistor includes a recess extending into the second side of the first resistor, the recess being entirely filled with an insulating material; and a second resistor having opposite first and second sides, the second resistor spaced apart from the first resistor, the first side of the second resistor on the surface of the dielectric layer, the second side of the second resistor extending in the second plane. US 20130093055, 20150162396, U.S. Patent No. 8,679,932 and U.S. Patent Pub. No. 2019/0348494 each discloses a resistor comprising a first portion, a second portion, and a third portion. The resistor includes a recess extending into the second side of the resistor, the recess being entirely filled with an insulating material, wherein the first, second, and third portion have a same material. Response to Arguments Applicant’s arguments with respect to Claims 1 and 10 have been considered but are moot because the arguments do not apply to any of the references being used in the current rejection. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHENG-BAI ZHU whose telephone number is (571)270-3904. The examiner can normally be reached on 11am – 7pm EST. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Chad Dicke can be reached on (571)270-7996. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SHENG-BAI ZHU/Primary Examiner, Art Unit 2897
Read full office action

Prosecution Timeline

Nov 12, 2021
Application Filed
Jul 28, 2023
Non-Final Rejection — §103
Jan 03, 2024
Response Filed
Jan 12, 2024
Final Rejection — §103
Jun 18, 2024
Request for Continued Examination
Jun 21, 2024
Response after Non-Final Action
Nov 09, 2024
Non-Final Rejection — §103
Apr 11, 2025
Response Filed
Apr 26, 2025
Final Rejection — §103
Sep 02, 2025
Request for Continued Examination
Sep 03, 2025
Response after Non-Final Action
Dec 28, 2025
Non-Final Rejection — §103 (current)

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Prosecution Projections

5-6
Expected OA Rounds
63%
Grant Probability
67%
With Interview (+4.8%)
2y 11m
Median Time to Grant
High
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