Prosecution Insights
Last updated: April 19, 2026
Application No. 17/577,010

SUBSTRATE PROCESS SYSTEM INCLUDING A COOLING STATION

Final Rejection §102§103
Filed
Jan 16, 2022
Examiner
SHIRSAT, VIVEK K
Art Unit
3762
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Taiwan Semiconductor Manufacturing Company Ltd.
OA Round
2 (Final)
74%
Grant Probability
Favorable
3-4
OA Rounds
3y 0m
To Grant
99%
With Interview

Examiner Intelligence

Grants 74% — above average
74%
Career Allow Rate
781 granted / 1061 resolved
+3.6% vs TC avg
Strong +28% interview lift
Without
With
+28.5%
Interview Lift
resolved cases with interview
Typical timeline
3y 0m
Avg Prosecution
60 currently pending
Career history
1121
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
45.7%
+5.7% vs TC avg
§102
25.2%
-14.8% vs TC avg
§112
23.3%
-16.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1061 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Arguments Applicant’s arguments, see pp. 6-9, filed 10/26/2025, with respect to the rejection(s) of claim(s) 1, 21, and 32 under 35 U.S.C 102 have been fully considered and are persuasive. Therefore, the rejection has been withdrawn. However, a reinterpretation of Grundy can provide for the limitations required by the amended independent claims, see rejection below. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-3, 5, and 8 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Grundy (US 5,944,602). With respect to claim 1 Grundy discloses an apparatus for semiconductor processing comprising: a housing [reference character 40’] comprising a plurality of shelves [reference character 37] configured to receive a plurality of substrates [reference character 21] wherein the housing had an open upper side [at reference character 29, where the housing is open to airflow]; a shelter plate [reference character 47] disposed over the open upper side of the housing and configured to reduce heat loss of an upper substrate of the plurality of substrates, wherein an air gap [reference character 45] extends vertically between an upper side of the housing and the shelter plate; and an airflow structure [reference characters 53, 53’, and 52] in the housing and configured to control an air circulation in the housing. With respect to claim 2 Grundy discloses that the housing comprises a polygonal cross-sectional shape [see Fig. 3]. With respect to claim 3 Grundy discloses that the housing comprises a material having a thermal conductivity equal to or less than 150W/mK. Specifically, Grundy discloses that the outer structure is clear anodized aluminum [column 6 lines 30-47], where a person having ordinary skill in the art would recognize that anodized aluminum has a thermal conductivity of ~6W/mK1. With respect to claim 5 Grundy discloses that the shelter plate comprises aluminum [column 6 lines 30-47]. With respect to claim 8 Grundy discloses that the airflow structure comprises a plurality of openings [reference character 35 and 35’] disposed along an inner peripheral surface of the housing and configured to deliver air from left-to-right or right-to-left along the inner peripheral surface of the housing [see Fig. 3]. Claim(s) 21-25 and 29-30 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Grundy (US 5,944,602). With respect to claim 21 Grundy discloses a cooling station comprising: a housing having an inner wall surface [reference characters 40 and 40’] and an upper side [at reference character 29, where the housing is open to airflow]; a plurality of shelves [reference character 37] attached to the inner wall surface of the housing and configured to receive a plurality of substrates [reference character 31]; a shelter plate [reference character 47] disposed over the open upper side of the housing and configured to reduce heat loss of an upper substrate of the plurality of substrates; wherein an air gap [reference character 45] extends vertically between the open upper side of the housing and the shelter plate, and an airflow structure [reference characters 53, 53’, and 52] in the housing and configured to control an air circulation in the housing. With respect to claim 22 Grundy discloses that a horizontal cross section of the housing is polygonal [see Figs. 4-5]. With respect to claim 23 Grundy discloses that the horizontal cross section of the housing is rectangular [see Figs. 4-5]. With respect to claim 24 Grundy discloses that the housing comprises a material having a thermal conductivity equal to or less than 150W/mK. Specifically, Grundy discloses that the outer structure is clear anodized aluminum [column 6 lines 30-47], where a person having ordinary skill in the art would recognize that anodized aluminum has a thermal conductivity of ~6W/mK2. With respect to claim 25 Grundy discloses that the housing comprises stainless steel [column 6 lines 30-47]. With respect to claim 29 Grundy discloses that the shelter plate comprises aluminum [column 6 lines 30-47]. With respect to claim 30 Grundy discloses that the airflow structure comprises a plurality of openings [reference character 35 and 35’] disposed along an inner peripheral surface of the housing and configured to deliver air from left-to-right or right-to-left along the inner peripheral surface of the housing [see Fig. 3]. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claim(s) 4, 6, 9, 27, 31 is/are rejected under 35 U.S.C. 103 as being unpatentable over Grundy (US 5,944,602) in view of Kestner et. al (US 9,980,322 B1). With respect to claims 4, 6 and 27 Grundy does not disclose that the shelter plate is removably mounted to the upper side of the housing. Kestner discloses a heated holding station that includes a top panel [reference character 20] which is removably attached to a housing using fasteners [see annotated Fig. below] (claims 4 and 27), or that the shelter plate is mounted to the upper side of the housing through a fastening member (claim 6). It would have been obvious to one of ordinary skill in the art at the time of the filing date of the invention to modify the apparatus taught by Grundy by removably attaching the top panel/shelter plate to the housing in order to allow for servicing of the filter [reference character 31 of Grundy]. PNG media_image1.png 467 794 media_image1.png Greyscale With respect to claims 9 and 31 Grundy does not disclose that the plurality of shelves each comprise a heating element configured to heat an associated substrate to a predetermined temperature. Kestner discloses shelves [reference character 52] that include a heating element [reference characters 65 and 67]. It would have been obvious to one of ordinary skill in the art at the time of the filing date of the invention to modify the apparatus taught by Grundy by including heating elements in the shelves, as taught by Kester, in order to allow for better thermal control. Claim(s) 26 is/are rejected under 35 U.S.C. 103 as being unpatentable over Grundy (US 5,944,602). With respect to claim 26 Grundy does not disclose that the housing comprises glass. However, in the same field of cabinet housings it would have been obvious to one skilled in the art at the time of the invention to modify Grundy by including glass in the housing, since it has been held to be within the general skill of a worker in the art to select a known component or material on the basis of suitability for the intended use as a matter of obvious mechanical design expediency. In re Leshin, 125 USPQ 416. Also see MPEP 2144.07. Sinclair & Carroll Co. v. Interchemical Corp. states "Reading a list and selecting a known compound to meet known requirements is no more ingenious than selecting the last piece to put in the last opening in a jig-saw puzzle." 325 U.S. at 335, 65 USPQ at 301.). Since both glass, stainless steel, and aluminum are well known housing construction materials, the designation of a specific material does nothing to enhance the patentability of a design. Claim(s) 32 is/are rejected under 35 U.S.C. 103 as being unpatentable over Zhao et.al (US 2004/0020601 A1) in view of Grundy (US 5,944,602). With respect to claim 32 Zhao discloses a substrate processing system, comprising: two or more process chambers [reference characters 1125] where semiconductor processing is conducted; a curing chamber [reference character 1121] for curing a substrate after the semiconductor processing; and a cooling station [reference character 1115] in a vicinity of the curing chamber. Zhao does not disclose that the cooling station comprises: a housing having an inner wall surface and an open upper side; a plurality of shelves attached to the inner wall surface of the housing and configured to receive a plurality of substrates; a shelter plate disposed over the open upper side of the housing and configured to reduce heat loss of an upper substrate of the plurality of substrates; wherein an air gap extends vertically between the open upper side of the housing and the shelter plate and an airflow structure in the housing and configured to control an air circulation in the housing. Grundy discloses an apparatus for semiconductor processing comprising: a housing [reference character 40’] comprising a plurality of shelves [reference character 37] configured to receive a plurality of substrates [reference character 21] wherein the housing had an open upper side [at reference character 29, where the housing is open to airflow]; a shelter plate [reference character 47] disposed over the open upper side of the housing and configured to reduce heat loss of an upper substrate of the plurality of substrates, wherein an air gap [reference character 45] extends vertically between an upper side of the housing and the shelter plate; and an airflow structure [reference characters 53, 53’, and 52] in the housing and configured to control an air circulation in the housing. It would have been obvious to one of ordinary skill in the art at the time of the filing date of the invention to modify the cooling station taught by Zhao by including the shelves, shelter plate, filter, and airflow structure taught by Grundy in order to ensure uniform cooling and remove particulate matter from the circulating air. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to VIVEK K SHIRSAT whose telephone number is (571)272-3722. The examiner can normally be reached M-F 9:00AM-5:20AM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven B McAllister can be reached at 571-272-6785. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /VIVEK K SHIRSAT/Primary Examiner, Art Unit 3762 1 https://semanoinc.com/hard-anodizing-information-properties-and-performance/#:~:text=Thermal%20Properties:%20Hard%20anodized%20surfaces%20have%20an,as%20in%20heatsinks%20and%20electrical%20battery%20packs. 2 https://semanoinc.com/hard-anodizing-information-properties-and-performance/#:~:text=Thermal%20Properties:%20Hard%20anodized%20surfaces%20have%20an,as%20in%20heatsinks%20and%20electrical%20battery%20packs.
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Prosecution Timeline

Jan 16, 2022
Application Filed
Mar 31, 2022
Response after Non-Final Action
Jul 12, 2025
Non-Final Rejection — §102, §103
Oct 26, 2025
Response Filed
Feb 20, 2026
Final Rejection — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
74%
Grant Probability
99%
With Interview (+28.5%)
3y 0m
Median Time to Grant
Moderate
PTA Risk
Based on 1061 resolved cases by this examiner. Grant probability derived from career allow rate.

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