Prosecution Insights
Prosecution Insights
1,337 pending office actions • 97 art units • 565 examiners • 0 of 1,337 (0%) have an AI response strategy ready • 3,275 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 262 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 262 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 7 (1%) |
| §101 + other | 11 (1%) |
| §103 only | 468 (35%) |
| §102 only | 103 (8%) |
| §112 only | 60 (4%) |
| Double-patenting only | 74 (6%) |
| Double-patenting + other | 28 (2%) |
| Multi-statute (no §101) | 564 (42%) |
| No statute on record | 22 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| WILCZEWSKI, MARY A | 16 | 84.9% | +10.1% |
| KOO, LAMONT B | 14 | 80.5% | +5.2% |
| VALENZUELA, PATRICIA D | 12 | 90.2% | +2.1% |
| RAHMAN, MOHAMMAD A | 10 | 86.9% | +10.9% |
| WARD, DAVID WILLIAM | 9 | 61.4% | +41.9% |
| TRAN, TRANG Q | 9 | 81.1% | +7.0% |
| ANGEBRANNDT, MARTIN J | 9 | 55.4% | +34.2% |
| BOWEN, ADAM S | 9 | 96.4% | +2.4% |
| HOANG, TUAN A | 9 | 74.1% | +11.4% |
| CHO, SUNG IL | 8 | 91.3% | +8.6% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 56d overdue |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 50d overdue |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 46d overdue |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | VALENZUELA, PATRICIA D | 42d overdue |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | VALENZUELA, PATRICIA D | 42d overdue |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 42d overdue |
| 18771863 | MEMORY CELL ARRAY AND METHOD OF OPERATING SAME | CHO, SUNG IL | 35d overdue |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 15d overdue |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17819381 | Semiconductor Device and Method of Manufacture | ISAAC, STANETTA D | 295d overdue |
| 17575578 | DEVICE LEVEL THERMAL DISSIPATION | CHEN, YU | 162d overdue |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 146d overdue |
| 18596404 | 3D IC POWER GRID | REAMES, MATTHEW L | 119d overdue |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 100d overdue |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SCHODDE, CHRISTOPHER A | 79d overdue |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 66d overdue |
| 18317003 | METHOD AND SYSTEM FOR PERFORMING CHEMICAL MECHANICAL POLISHING | ZAWORSKI, JONATHAN R | 52d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 31d overdue |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 15d overdue |
| 17816208 | LIGHT-EMITTING PACKAGE AND FORMING METHOD THEREOF | WARD, DAVID WILLIAM | 10d overdue |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 10d overdue |
| 17833830 | EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF | ANGEBRANNDT, MARTIN J | 9d overdue |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 8d overdue |
| 18316146 | P-DIPOLE MATERIAL FOR STACKED TRANSISTORS | HOANG, TUAN A | 2d overdue |
| 17885870 | STRUCTURE AND METHOD OF SIGNAL ENHANCEMENT FOR ALIGNMENT PATTERNS | ANGEBRANNDT, MARTIN J | 1d overdue |
| Art Unit | Apps |
|---|---|
| 2898 | 102 |
| 2893 | 82 |
| 2818 | 78 |
| 2812 | 75 |
| 2899 | 68 |
| 2817 | 68 |
| 2897 | 51 |
| 2813 | 43 |
| 2874 | 41 |
| 2811 | 37 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19287081 | MULTI-PORT SRAM CELL WITH ENLARGED CONTACT VIAS | KUSUMAKAR, KAREN M | 2897 | §102§112Other | Non-Final OA | — | Pending | Jul 31, 2025 |
| 19282255 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Non-Final OA | — | Pending | Jul 28, 2025 |
| 19269841 | THICK REDISTRIBUTION LAYER FEATURES | BAIG, ANEESA RIAZ | 2814 | §103§112 | Non-Final OA | — | Pending | Jul 15, 2025 |
| 19265546 | INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Jul 10, 2025 |
| 19254164 | IMPEDANCE MATCHING CIRCUIT AND METHOD | CHEN, PATRICK C | 2836 | §102DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19252931 | CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME | KHAN, IBRAHIM A | 2628 | §103 | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19252413 | GATED TRI-STATE INVERTER, AND METHOD OF OPERATING SAME | JAGER, RYAN C | 2842 | DP | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19250906 | Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation | CHEN, PATRICK C | 2842 | §103DP | Non-Final OA | — | Pending | Jun 26, 2025 |
| 19251693 | TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS | O NEILL, PATRICK | 2842 | DP | Non-Final OA | — | Pending | Jun 26, 2025 |
| 19243052 | LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING | MANHEIM, MARC ETIENNE | 2874 | §103§112 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19240009 | LEAKAGE-FREE DUMMY CELL FOR SEMICONDUCTOR DEVICES | O NEILL, PATRICK | — | §112DP | Non-Final OA | — | Pending | Jun 17, 2025 |
| 19237286 | FUSE STRUCTURE | RETEBO, METASEBIA T | — | §103 | Non-Final OA | — | Pending | Jun 13, 2025 |
| 19235541 | METHOD OF FORMING PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER | GOLDEN, ANDREW J | 1726 | §102§103 | Non-Final OA | — | Pending | Jun 11, 2025 |
| 19232010 | EFEM ROBOT AUTO TEACHING METHODOLOGY | SAMPLE, JONATHAN L | — | §102§103§112 | Non-Final OA | — | Pending | Jun 09, 2025 |
| 19227501 | SLEW RATE CONTROLLED OUTPUT BUFFER CIRCUIT AND SEMICONDUCTOR DEVICE | RETEBO, METASEBIA T | — | DP | Non-Final OA | — | Pending | Jun 04, 2025 |
| 19211402 | Input Hysteresis Buffer in Overdrive Design | JOHNSON, RYAN | 2849 | Other | Non-Final OA | — | Pending | May 19, 2025 |
| 19211749 | CHEMICAL DISPENSING SYSTEM | GARDNER, NICOLE | — | §102§112Other | Non-Final OA | — | Pending | May 19, 2025 |
| 19200973 | SYSTEM AND SEMICONDUCTOR DEVICE THEREIN | JAGER, RYAN C | 2842 | DP | Non-Final OA | — | Pending | May 07, 2025 |
| 19197279 | Level Shifter With Inside Self-Protection High Bias Generator | RETEBO, METASEBIA T | — | §103 | Non-Final OA | — | Pending | May 02, 2025 |
| 19177360 | APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER | BARR, MICHAEL E | 1711 | §102§103§112 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19176354 | Overdrive I/O ESD Protection Network | WELLS, KENNETH B | 2842 | §103§112DP | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19170909 | SCAN CHAINS WITH MULTI-BIT CELLS AND METHODS FOR TESTING THE SAME | AHMED, ENAM | 2112 | §103 | Non-Final OA | — | Pending | Apr 04, 2025 |
| 19069350 | Programmable Regulator Voltage Controlled Ring Oscillator | GANNON, LEVI | 2849 | §102Other | Non-Final OA | 14d | Pending | Mar 04, 2025 |
| 19061051 | SEMICONDUCTOR DEVICE AND OPERATING METHOD THEREOF | MCMAHON, DANIEL F | — | DP | Non-Final OA | — | Pending | Feb 24, 2025 |
| 19059384 | MEMORY DEVICE WITH ADDITIONAL WRITE BIT LINES | CHO, SUNG IL | — | §103 | Non-Final OA | — | Pending | Feb 21, 2025 |
| 19058345 | DATA RETENTION CIRCUIT AND METHOD | CHEN, SIBIN | 2896 | §112 | Non-Final OA | — | Pending | Feb 20, 2025 |
| 19056022 | CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH | GAMBETTA, KELLY M | 1718 | §102§103§112 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19056350 | INTEGRATED CIRCUIT AND METHOD OF OPERATING SAME | ALHWAMDEH, KAREEM FUAD | — | §103 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19053479 | VERTICALLY STACKED LIGHT SENSORS | KO, TONY | — | §102 | Non-Final OA | — | Pending | Feb 14, 2025 |
| 19050140 | CAPACITOR-LESS LOW-DROPOUT REGULATOR WITH DYNAMIC FREQUENCY COMPENSATION | PEREZ, BRYAN REYNALDO | 2838 | §102 | Non-Final OA | — | Pending | Feb 11, 2025 |
| 19049935 | Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit | JEAN PIERRE, PEGUY | — | DP | Non-Final OA | — | Pending | Feb 10, 2025 |
| 19045904 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | CHOI, WOO H | 3992 | §102 | Non-Final OA | — | Pending | Feb 05, 2025 |
| 19043856 | ANTI-FUSE DEVICE AND METHOD | CHO, SUNG IL | — | §103Other | Non-Final OA | — | Pending | Feb 03, 2025 |
| 19043906 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | HIDALGO, FERNANDO N | — | DP | Non-Final OA | — | Pending | Feb 03, 2025 |
| 19041131 | MEMORY ERROR DETECTION AND CORRECTION | YANG, JEFFREY ANDREW | 2112 | §101Other | Non-Final OA | — | Pending | Jan 30, 2025 |
| 19033172 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | NGUYEN, VIET Q | — | DP | Non-Final OA | — | Pending | Jan 21, 2025 |
| 19032137 | METHOD OF CLEANING SENSOR USED IN SEMICONDUCTOR MANUFACTURING TOOL | CARRILLO, BIBI SHARIDAN | 1711 | §103 | Non-Final OA | — | Pending | Jan 20, 2025 |
| 19026754 | SEMICONDUCTOR DEVELOPER TOOL AND METHODS OF OPERATION | PERSAUD, DEORAM | — | §103Other | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19027299 | MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE | KLIMOWICZ, WILLIAM JOSEPH | 2688 | §103Other | Final Rejection | 21d | Pending | Jan 17, 2025 |
| 19020305 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME | HUANG, MIN | — | §103 | Non-Final OA | — | Pending | Jan 14, 2025 |
| 19011147 | SRAM POWER-UP RANDOM NUMBER GENERATOR | REECE, CHRISTOPHER LANE | — | §103Other | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19011055 | MEMORY DEVICE WITH A BIAS CIRCUIT | CHO, SUNG IL | — | DP | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19007022 | CHARGE PUMP SYSTEM WITH LOW RIPPLE OUTPUT VOLTAGE | LEBOEUF, JEROME LARRY | 2824 | DP | Non-Final OA | — | Pending | Dec 31, 2024 |
| 19002035 | FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT | KIM, PETER B | — | §112DP | Non-Final OA | — | Pending | Dec 26, 2024 |
| 19000605 | COMPUTING DEVICE, MEMORY CONTROLLER, AND METHOD FOR PERFORMING AN IN-MEMORY COMPUTATION | HOANG, HUAN | — | §102§103DP | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18990122 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | TRAN, MICHAEL THANH | 2827 | §102§112Other | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18990138 | CIRCUIT AND METHOD FOR HIGH VOLTAGE TOLERANT ESD PROTECTION | PATEL, DHARTI HARIDAS | — | §102§112Other | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18986753 | THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | HIDALGO, FERNANDO N | 2827 | DP | Non-Final OA | — | Pending | Dec 19, 2024 |
| 18981800 | MEMORY CELL WITH UNIPOLAR SELECTORS | LAPPAS, JASON | — | §103 | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18982288 | CORRECTING DISRUPTION OF A NETWORK DURING A VIRTUAL MEETING | CELANI, NICHOLAS P | — | §103Other | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18978369 | RETICLE CLEANING DEVICE AND METHOD OF USE | PERSAUD, DEORAM | — | §103Other | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18975894 | SRAM WITH TRACKING CIRCUITRY FOR REDUCING ACTIVE POWER | SIDDIQUE, MUSHFIQUE | — | §102DP | Non-Final OA | — | Pending | Dec 10, 2024 |
| 18972272 | METHODS TO HIDE OTP CONTENT | SONG, HEE K | — | §103 | Non-Final OA | — | Pending | Dec 06, 2024 |
| 18969428 | IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT | SOHN, SEUNG C | — | §112 | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18969094 | MEMORY DRIVER, MEMORY SYSTEM, AND OPERATING METHOD | TRAN, MICHAEL THANH | — | DP | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18967733 | Computing-In-Memory Architecture | TECHANE, MUNA A | — | §102§103§112 | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18967206 | MEMORY DEVICE WITH SIGNAL EDGE SHARPENER CIRCUITRY | CHO, SUNG IL | — | §102§103Other | Non-Final OA | — | Pending | Dec 03, 2024 |
| 18961468 | MEMORY CIRCUIT AND METHOD FOR READING MEMORY CIRCUIT | TECHANE, MUNA A | — | §112 | Non-Final OA | — | Pending | Nov 27, 2024 |
| 18959723 | WET PROCESS SYSTEM AND PROCESS FOR USING THE SAME | AYALEW, TINSAE B | 1711 | §102§103§112 | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18959976 | EUV MASK INSPECTING METHODS AND SYSTEMS | BOOSALIS, FANI POLYZOS | 2884 | §102§103 | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18960648 | MEMORY CIRCUITS AND METHODS FOR LATCHING READOUT IN MULTI-BANK SRAM MEMORY | PHAM, LY D | 2827 | §102 | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18956017 | CONTACTLESS ELECTRICAL INSPECTION PROCESS | HAWKINS, DOMINIC E | 2858 | §103 | Non-Final OA | — | Pending | Nov 22, 2024 |
| 18954783 | DUO-LEVEL WORD LINE DRIVER | PHAM, LY D | — | §112Other | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18950227 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | ALBRECHT, PETER M | — | §102§103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18947475 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | WELLS, JAMES STEVEN | 2825 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18946996 | PROBE HEAD ASSEMBLY AND PROBE CARD ASSEMBLY | HOLLINGTON, JERMELE M | 2858 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18948432 | PROBE NEEDLE, PROBE CARD STRUCTURE AND METHOD OF TESTING A DEVICE UNDER TEST | MILLER, DANIEL R | 2858 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18947810 | A METHOD TO TEST LDO DRIVING/SINKING IN SOC | BRASWELL, DONALD H.B. | 2825 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18943969 | METHOD FOR MANAGING TEMPERATURE IN SEMICONDUCTOR FABRICATION FACILITY | SHAIKH, MERAJ A | 3763 | §102§103 | Non-Final OA | — | Pending | Nov 12, 2024 |
| 18942759 | RESISTOR ARRAY CIRCUIT, DIGITAL-TO-ANALOG CONVERTER CIRCUIT AND LAYOUT METHOD OF THE SAME | JEAN PIERRE, PEGUY | 2845 | §103 | Non-Final OA | — | Pending | Nov 10, 2024 |
| 18940092 | ADJUSTABLE WAFER CHUCK | COMBER, KEVIN J | 2838 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18938961 | MEMORY DEVICE WITH WRITE PULSE TRIMMING | ALROBAIE, KHAMDAN N | 2824 | §103 | Non-Final OA | — | Pending | Nov 06, 2024 |
| 18939077 | REFERENCE VOLTAGE GENERATION | NGUYEN, HAI L | 2842 | §112Other | Non-Final OA | — | Pending | Nov 06, 2024 |
| 18937811 | NANOIMPRINT LITHOGRAPHY MASK AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | KIM, PETER B | 2882 | §103§112 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937037 | SENSE AMPLIFIER, MEMORY DEVICE AND OPERATION METHOD THEREOF | TRAN, ANTHAN | 2825 | §102Other | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937047 | TESTING APPARATUS OF PACKAGED MODULES AND ITS MANUFACTURING METHOD | BRAUNLICH, MARTIN WALTER | — | §103§112 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937191 | Circuitry for Power Management Assertion | CHO, SUNG IL | — | §102§103Other | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18935102 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS | GAMBETTA, KELLY M | 1718 | §103 | Non-Final OA | — | Pending | Nov 01, 2024 |
| 18926341 | WAFER CLEANING SYSTEM, WAFER DETECTING MODULE AND WAFER CLEANING METHOD | BARR, MICHAEL E | 1711 | §102§103 | Non-Final OA | — | Pending | Oct 25, 2024 |
| 18923719 | WIRING SUBSTRATE | BURNS, TREMESHA WILLIS | — | §102 | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18921340 | VOLTAGE PROVISION CIRCUITS WITH VOLTAGE DETECTOR AND METHODS FOR OPERATING THE SAME | SIDDIQUE, MUSHFIQUE | 2825 | §102§112 | Non-Final OA | — | Pending | Oct 21, 2024 |
| 18919594 | LDO/Band Gap Reference Circuit | FINCH III, FRED E | — | §102§103Other | Non-Final OA | — | Pending | Oct 18, 2024 |
| 18913104 | COOLANT CONDUIT AND WAFER-COOLING APPARATUS INCLUDING THE SAME | RUBY, TRAVIS C | 3763 | §102§103 | Non-Final OA | — | Pending | Oct 11, 2024 |
| 18910043 | DUTY CYCLE CORRECTION CIRCUIT AND METHOD FOR OPERATING THE SAME | NGUYEN, LONG T | 2836 | §102§112 | Non-Final OA | — | Pending | Oct 09, 2024 |
| 18891129 | CLEANING APPARATUS AND METHOD FOR CLEANING ITEMS USED IN SEMICONDUCTOR FABRICATION | BARR, MICHAEL E | 1711 | §103§112 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18886279 | MEMORY DEVICE AND METHOD OF OPERATING THE SAME | LAPPAS, JASON | 2827 | §102§103 | Non-Final OA | — | Pending | Sep 16, 2024 |
| 18802241 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | JORDAN, ANDREW | — | §103 | Non-Final OA | — | Pending | Aug 13, 2024 |
| 18796870 | IMAGE SENSOR | TRUONG, NGUYEN T | 2486 | §102§103 | Non-Final OA | — | Pending | Aug 07, 2024 |
| 18795058 | MEMORY CIRCUITS WITH WORD LINE OVERDRIVE | TRAN, ANTHAN | 2825 | §102 | Non-Final OA | — | Pending | Aug 05, 2024 |
| 18795067 | INSPECTION APPARATUS AND METHODS OF USING THE SAME | WONG, ALLEN C | 2488 | §103 | Non-Final OA | 9d | Pending | Aug 05, 2024 |
| 18794560 | MEMORY DEVICES WITH REDUCED TIMING VARIATION AND METHODS FOR OPERATING THE SAME | HILTUNEN, THOMAS J | 2849 | §102 | Non-Final OA | 8d | Pending | Aug 05, 2024 |
| 18790373 | MEMORY DEVICE INCLUDING BOOSTER CIRCUIT FOR TRACKING WORD LINE | KING, DOUGLAS | 2824 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790547 | MEMORY CIRCUITS WITH REGISTER CIRCUTIS AND METHODS FOR OPERATING THE SAME | REECE, CHRISTOPHER LANE | 2824 | §103 | Final Rejection | 27d | Pending | Jul 31, 2024 |
| 18789686 | METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL | BOOKER, KELVIN | — | §112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790025 | Integrated Reference Electrode And Fluid Dispenser | FISHER, BRITTANY I | 1796 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789862 | METHOD AND APPARATUS FOR REDUCING SOLVENT CONSUMPTION | WILLIAMS, PATRICK C | 3753 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791421 | IN-CHIP THERMOELECTRIC DEVICE | MOWLA, GOLAM | 1721 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791080 | DECOUPLING CAPACITOR CIRCUITS | TRA, ANH QUAN | 2843 | DP | Final Rejection | 9d overdue | Pending | Jul 31, 2024 |
| 18788823 | SEMICONDUCTOR DEVICE HAVING WIDE TUNING RANGE VARACTOR AND METHOD OF MANUFACTURING THE SAME | SLUTSKER, JULIA | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788533 | POWER AMPLIFIERS | AKINYEMI, AJIBOLA A | — | — | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789140 | MEMORY DEVICE HAVING A COMPARATOR CIRCUIT | ALROBAIE, KHAMDAN N | 2824 | Other | Non-Final OA | 9d overdue | Pending | Jul 30, 2024 |
| 18788142 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | BLEVINS, JERRY M | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788483 | COMPUTE IN MEMORY | KING, DOUGLAS | 2824 | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788448 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | NGUYEN, HUNG | 2882 | §103 | Non-Final OA | 10d overdue | Pending | Jul 30, 2024 |
| 18788787 | METHOD OF MEASURING ELECTRO-OPTIC CHARACTERISTIC OF A TRAVELING WAVE MACH-ZEHNDER MODULATOR AND DEVICE FOR SAME | ENDRESEN, KIRSTEN DANIELA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789569 | SEMICONDUCTOR DEVICES HAVING PARASITIC CHANNEL STRUCTURES | WARD, DAVID WILLIAM | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788701 | WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS | JOERGER, KAITLIN S | 3655 | §102§103§112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789668 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789212 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | BERRY, PAUL ANTHONY | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788979 | LOW-RESISTANCE COPPER INTERCONNECTS | LUKE, DANIEL M | 2896 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789307 | METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS | AN, IG TAI | 3662 | §101§103 | Non-Final OA | 72d | Pending | Jul 30, 2024 |
| 18789147 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | CHOU, SHIH TSUN A | 2811 | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788108 | METHOD AND SYSTEM FOR REDUCING WORK-IN-PROCESS | WORKU, KIDEST | — | §112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786573 | SEMICONDUCTOR PACKAGES | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786619 | MEMORY DEVICES | SENGDARA, VONGSAVANH | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786928 | SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR | NUCKOLS, TIFFANY Z | 1716 | §102 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787161 | GATE STRUCTURES FOR SEMICONDUCTOR DEVICES | CHOU, SHIH TSUN A | 2811 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786952 | SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE | MYERS, GLENN F | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787119 | MASK CHARACTERIZATION METHODS AND APPARATUSES | LAPAGE, MICHAEL P | 2877 | §103 | Final Rejection | — | Pending | Jul 29, 2024 |
| 18786475 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | NELSON, JACOB THEODORE | — | §103 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786120 | ANALOG TO DIGITAL CONVERTER WITH VCO-BASED AND PIPELINED QUANTIZERS | MAI, LAM T | 2845 | Other | Non-Final OA | 9d overdue | Pending | Jul 26, 2024 |
| 18785151 | DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION | CHAN, WEI | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786057 | SYSTEM AND METHOD FOR AUTOMATED MATERIAL HANDLING MANAGEMENT | LOGAN, KYLE O | — | §112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785998 | INTEGRATED CIRCUIT | BEGUM, SULTANA | 2824 | §103Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18784838 | METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING | SHUM, KENT N | 3723 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784667 | GUARD RING STRUCTURE | KHALIFA, MOATAZ | — | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784534 | SEMICONDUCTOR MEMORY DEVICES WITH WRAPPED WORD LINES | BLACKWELL, ASHLEY NICOLE | 2897 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784888 | METHOD FOR CLEANING OHT VEHICLE | JENNINGS, MICHAEL DEANGILO | — | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784645 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GEYER, SCOTT B | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783967 | METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE | CHIN, EDWARD | — | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784089 | Ferroelectric Memory Device and Method of Manufacturing the Same | IMTIAZ, S M SOHEL | — | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783610 | DATA BACKUP UNIT FOR STATIC RANDOM-ACCESS MEMORY DEVICE | BEGUM, SULTANA | 2824 | §103§112Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782783 | SEMICONDUCTOR SUBSTRATE STAGE FOR CARRING SUBSTRATE | NGUYEN, HUNG | 2882 | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782753 | ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS | WYCHE, MYRON | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783018 | NON-VOLATILE MEMORY BASED COMPUTE-IN-MEMORY CELL | BERMUDEZ LOZADA, ALFREDO | 2825 | §103§112Other | Final Rejection | 16d overdue | Pending | Jul 24, 2024 |
| 18782319 | A METHOD TO IMPROVE DATA RETENTION OF NON-VOLATILE MEMORY IN LOGIC PROCESSES | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782351 | SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782050 | STORAGE ENVIRONMENT MONITORING SYSTEM AND METHODS OF OPERATION | PAN, YUHUI R | 2116 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782565 | RESIN, PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | §103 | Final Rejection | 12d | Pending | Jul 24, 2024 |
| 18782345 | TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE | HOSSAIN, MOAZZAM | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18781599 | Ion Beam Etching Apparatus And Method | MCCORMACK, JASON L | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781959 | SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF | KOLAHDOUZAN, HAJAR | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781293 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | VU, VU A | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779252 | STILTED PAD STRUCTURE | VU, DAVID | 2818 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780029 | REDUCING RC DELAY IN SEMICONDUCTOR DEVICES | VALENZUELA, PATRICIA D | — | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780440 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | DEO, DUY VU NGUYEN | — | §102DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779390 | METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION | WIEGAND, TYLER J | 2812 | §102§112 | Final Rejection | — | Pending | Jul 22, 2024 |
| 18779097 | SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | SMITH, BRADLEY | — | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779425 | METHOD FOR ELIMINATING DIVOT FORMATION AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME | AHMED, SHAHED | 2813 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779523 | Semiconductor Device with Backside Power Rail and Method for Forming the Same | SEDOROOK, DAVID PAUL | 2812 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778993 | EXTERNAL MAGNETIC FIELD DETECTION FOR MRAM DEVICE | KERVEROS, DEMETRIOS C | 2111 | §102§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778988 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18777573 | OPTICAL MODULATOR AND PACKAGE | STAHL, MICHAEL J | — | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777692 | ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM | GOLIGHTLY, ERIC WAYNE | 1714 | §112 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | GEBREMARIAM, SAMUEL A | — | §112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776346 | SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFERENT THICKNESSES | CRAWFORD EASON, LATANYA N | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776361 | INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777485 | TRANSISTOR, SEMICONDUCTOR STRUCTURE, AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | 2898 | DP | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776833 | METHOD AND APPARATUS FOR MITIGATING CONTAMINATION | CHANG, HANWAY | — | — | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776666 | ARRAY OF UNIT CELLS HAVING PAD STRUCTURES | NASIR, TAQI R | 2858 | §102§103§112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18775793 | SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES | JORDAN, ANDREW | — | §102 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775457 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DANG, PHUC T | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18776182 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME | CROSS, XIA L | — | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | CROSS, XIA L | — | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775431 | WAFER CLEANING SYSTEM | JENNINGS, MICHAEL DEANGILO | 3723 | Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | REYES, JOSHUA NATHANIEL PI | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18773631 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | TRICE III, WILLIAM CLARENCE | — | §102§103 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774012 | STRAP-CELL ARCHITECTURE FOR EMBEDDED MEMORY | MEHTA, RATISHA | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773202 | PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT | LEBENTRITT, MICHAEL | — | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772677 | INTEGRATED CIRCUIT DEVICE AND METHOD | YEAMAN, JAMES G | 2842 | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773250 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | FOX, BRANDON C | — | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773342 | MEMORY DEVICE | RADKE, JAY W | — | §103§112Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772608 | SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | NELSON, JACOB THEODORE | 2815 | §102§103§112 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773354 | MEMORY DEVICE | HUANG, MIN | 2827 | §103§112Other | Non-Final OA | 30d overdue | Pending | Jul 15, 2024 |
| 18772307 | SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF | WRIGHT, TUCKER J | 2891 | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772202 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MENZ, LAURA MARY | 2813 | Other | Final Rejection | 12d | Pending | Jul 14, 2024 |
| 18772224 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | LEE, EUGENE | 2815 | §102 | Non-Final OA | — | Pending | Jul 14, 2024 |
| 18771757 | IMAGING DEVICE | WILLIAMS, DON J | 2878 | DP | Final Rejection | — | Pending | Jul 12, 2024 |
| 18771863 | MEMORY CELL ARRAY AND METHOD OF OPERATING SAME | CHO, SUNG IL | 2825 | DP | Final Rejection | 35d overdue | Pending | Jul 12, 2024 |
| 18771599 | Multi-Gate Field-Effect Transistors and Methods of Forming the Same | YI, CHANGHYUN | 2812 | §102§103Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771548 | INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS | DYKES, LAURA M | 2892 | §102§103Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771578 | CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES | TAYLOR, EARL N | — | §102 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771450 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | VALENZUELA, PATRICIA D | — | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770408 | INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY | YI, CHANGHYUN | 2812 | Other | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769417 | SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES | MAZUMDER, DIDARUL A | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770166 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769246 | AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL | GOODLING, DEVIN KIRK | — | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768468 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | SANDVIK, BENJAMIN P | 2812 | §102 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769261 | THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE | SLUTSKER, JULIA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767571 | Work Function Layers For Transistor Gate Electrodes | SLUTSKER, JULIA | — | §103 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767396 | LITHOGRAPHY APPARATUS AND METHOD FOR OPERATING THE SAME | RIDDLE, CHRISTINA A | 2882 | §102§103 | Final Rejection | — | Pending | Jul 09, 2024 |
| 18767970 | METHOD OF FABRICATING PACKAGE STRUCTURE | MAZUMDER, DIDARUL A | — | §102§103 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767188 | SEMICONDUCTOR STRUCTURE | REIDA, MOLLY KAY | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767168 | SEMICONDUCTOR DEVICE WITH FIN STRUCTURES | KIM, TONG-HO | — | §103 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766358 | PELLICLE STRUCTURE FOR EUV LITHOGRAPHY AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103§112Other | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765696 | TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING | TOBERGTE, NICHOLAS J | — | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765021 | METHOD FOR FORMING SEMICONDUCTOR DIE PACKAGE WITH THERMAL MANAGEMENT FEATURES | PHAM, THANHHA S | — | DP | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764951 | GATE-ALL-AROUND DEVICES | PHAM, LONG | — | §102 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18761335 | SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF | NGUYEN, SOPHIA T | — | §103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18760660 | MEMORY DEVICES WITH DUAL-SIDE DISCHARGE AND METHODS FOR OPERATING THE SAME | BERMUDEZ LOZADA, ALFREDO | 2825 | §102§103 | Final Rejection | 38d overdue | Pending | Jul 01, 2024 |
| 18761077 | SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME | CRAWFORD EASON, LATANYA N | — | §112 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18757630 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS | QUINTO, KEVIN V | — | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | HO, TU TU V | — | §103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757882 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | VU, HUNG K | — | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758948 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | KIM, TONG-HO | — | §103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757949 | PHOTORESIST FOR SEMICONDUCTOR FABRICATION | CHU, JOHN S Y | 1737 | §112 | Non-Final OA | 29d | Pending | Jun 28, 2024 |
| 18755752 | LEVEL SHIFTER WITH INDEPENDENT DRIVER | KIM, JUNG H | 2842 | §102 | Final Rejection | 19d | Pending | Jun 27, 2024 |
| 18755895 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | SABUR, ALIA | — | §103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18755014 | SYSTEM AND METHOD FOR LIQUID LEAK DETECTION | FLETCHER III, WILLIAM P | 1717 | §103§112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753371 | Integrated Impedance Measurement Device and Impedance Measurement Method Thereof | RODAK, LEE E | 2858 | §101 | Final Rejection | 23d | Pending | Jun 25, 2024 |
| 18753024 | SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING THE SAME | LEE, CHEUNG | — | DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753091 | CHIP PACKAGE HAVING MULTIPLE CHIPS | JUNG, MICHAEL YOO LIM | — | §102§103DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753293 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HARRISON, MONICA D | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753738 | CIRCUIT AND METHOD FOR RECEIVER WITH TRACK PATH | PUENTES, DANIEL CALRISSIAN | 2849 | §102 | Final Rejection | 35d | Pending | Jun 25, 2024 |
| 18751382 | SEMICONDUCTOR STRUCTURE | MALEK, MALIHEH | 2813 | §112DP | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18750097 | ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME | MUSE, ISMAIL A | — | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18748250 | CONTACT AND VIA STRUCTURES | LEBENTRITT, MICHAEL | — | §102§103§112 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18749516 | PACKAGE STRUCTURE | SYLVIA, CHRISTINA A | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18748206 | GATE ELECTRODE EXTENDING INTO A SHALLOW TRENCH ISOLATION STRUCTURE IN HIGH VOLTAGE DEVICES | CHOI, CALVIN Y | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18746930 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18745121 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND METHOD OF OPERATING | SMET, UYEN TRAN | 2824 | §102§103 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18743957 | MULTIZONE THERMAL DEVICE FOR SEMICONDUCTOR STRUCTURES | LEBENTRITT, MICHAEL | — | §103§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18743574 | Air-Replaced Spacer for Self-Aligned Contact Scheme | STEVENSON, ANDRE C | 2899 | — | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18744306 | STATIC RANDOM ACCESS MEMORY DEVICE | NELSON, JACOB THEODORE | — | §103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18742298 | PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS | PYO, KEVIN K | 2878 | §102§103§112 | Final Rejection | — | Pending | Jun 13, 2024 |
| 18741837 | SEMICONDUCTOR PHOTONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | PENG, CHARLIE YU | 2874 | §103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18739538 | Device and Method for Reading a Memory Cell | CHO, SUNG IL | 2825 | §103 | Final Rejection | — | Pending | Jun 11, 2024 |
| 18736602 | CONSTANT DELAY DUTY-CYCLE CORRECTOR CIRCUIT AND METHOD FOR OPERATING THE SAME | YEAMAN, JAMES G | 2842 | §103§112 | Final Rejection | — | Pending | Jun 07, 2024 |
| 18736659 | METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE SAME | FAYETTE, NATHALIE RENEE | — | §102§103§112 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18736947 | ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING | BARZYKIN, VICTOR V | — | §103Other | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102 | Final Rejection | 30d overdue | Pending | Jun 05, 2024 |
| 18734638 | GATE STACK TREATMENT FOR FERROELECTRIC TRANSISTORS | NICELY, JOSEPH C | 2813 | §102§103Other | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18733536 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | JONES, ERIC W | — | §102§103 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | WINTERS, SEAN AYERS | 2898 | §103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731821 | BONDED STRUCTURE WITH HALF-OVAL BONDING PAD PAIR DESIGN AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | — | §102 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731593 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18680621 | SEMICONDUCTOR STRUCTURE, AND METHOD FOR FABRICATING A STACKED DIE | TRAPANESE, WILLIAM C | — | §102 | Non-Final OA | — | Pending | May 31, 2024 |
| 18678783 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | — | §102§103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18679331 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | ERDEM, FAZLI | — | §103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18677746 | METHOD OF FABRICATING SEMICONDUCTOR SUBSTRATE | MULERO FLORES, ERIC MANUEL | — | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676595 | SYSTEMS AND METHODS FOR FABRICATING FINFETS WITH DIFFERENT THRESHOLD VOLTAGES | HSIEH, HSIN YI | — | §102 | Non-Final OA | — | Pending | May 29, 2024 |
| 18674956 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | RAMOS FELICIANO, ELISEO | — | §103 | Non-Final OA | — | Pending | May 27, 2024 |
| 18673432 | SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | GUMEDZOE, PENIEL M | — | §103§112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18673488 | METHOD OF OPERATING A PROCESSING APPARATUS | FITZGERALD, JOHN P | 2855 | §102§103DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18674743 | STRUCTURE FOR SELF-ALIGNED VIA AND METHOD FOR FORMING THE SAME | CHOU, SHIH TSUN A | — | §103§112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18672551 | PIXEL SENSOR ARRAY AND METHODS OF FORMATION | KNUDSON, BRAD ALLAN | — | §102§103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18672044 | PHOTODETECTOR DEVICE HAVING LIGHTLY DOPED LAYER | WINTERS, SEAN AYERS | — | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18672076 | SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE | NGUYEN, DUY T V | — | DP | Non-Final OA | — | Pending | May 23, 2024 |
| 18672481 | METHOD AND SYSTEM FOR THERMAL-AWARE ELECTROMIGRATION EVALUATION AND CIRCUIT DESIGN | FORTICH, ALVARO E | 2858 | §101 | Final Rejection | — | Pending | May 23, 2024 |
| 18671330 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | GUMEDZOE, PENIEL M | — | §102§103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18670756 | METHOD FOR DELIVERING WAFER SUBSTRATE | TRAN, VINCENT HUY | — | §103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18670199 | SEMICONDUCTOR DEVICE WITH AIR-GAP SPACERS | RAHMAN, MOHAMMAD A | — | §102§112 | Non-Final OA | — | Pending | May 21, 2024 |
| 18669560 | SEMICONDUCTOR DEVICE AND FORMING METHO OF THE SAME | HOLLWEG, THOMAS A | 2874 | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18668631 | CO-PACKAGED OPTICAL FIBER MOUNTING UNIT AND METHOD OF FABRICATION | PAK, SUNG H | 2874 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18666982 | SEMICONDUCTOR STRUCTURE HAVING VERTICAL CHANNELS AND METHOD FOR MANUFACTURING THE SAME | BOEGEL, CHEVY JACOB | — | §102§103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18663124 | BONDING STRUCTURE AND METHOD THEREOF | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18662168 | HIGHLY PHYSICAL ION RESISTIVE SPACER TO DEFINE CHEMICAL DAMAGE FREE SUB 60NM MRAM DEVICES | CRITE, ANTONIO B | — | §103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662451 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | LINDSAY JR, WALTER LEE | — | §103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662308 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | JORDAN, ANDREW | 2874 | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18660264 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | ERDEM, FAZLI | — | §102 | Non-Final OA | — | Pending | May 10, 2024 |
| 18661000 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE | BERNSTEIN, ALLISON | 2824 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18659745 | SEMICONDUCTOR PACKAGE WITH HEAT SPREADING LID | VU, VU A | — | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18658962 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | SMITH, CHAD | — | §103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18656884 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CRAWFORD EASON, LATANYA N | — | §102§103Other | Non-Final OA | — | Pending | May 07, 2024 |
| 18656969 | INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME | PARK, SAMUEL | — | §103§112 | Non-Final OA | — | Pending | May 07, 2024 |
| 18656782 | GATE-ALL-AROUND TRANSISTOR HAVING MULTIPLE GATE LENGTHS | SEDOROOK, DAVID PAUL | — | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18654020 | SEMICONDUCTOR APPARATUS FOR GAS MIXING AND METHOD OF FILM DEPOSITION | HARRISON, MONICA D | — | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18654400 | CONDITIONING PAD WITH DEPOSITED DIAMOND COATING | DEO, DUY VU NGUYEN | 1713 | §102§103Other | Non-Final OA | — | Pending | May 03, 2024 |
| 18654441 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION | ANYA, IGWE U | — | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18652963 | VOLTAGE CONTROL CIRCUITS AND METHODS FOR OPERATING THE SAME | RADKE, JAY W | 2827 | §112 | Non-Final OA | — | Pending | May 02, 2024 |
| 18652336 | PHASE-CHANGE DEVICE | KEBEDE, BROOK | — | §102 | Non-Final OA | — | Pending | May 01, 2024 |
| 18652772 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | RODELA, EDUARDO A | — | §103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18651321 | INTEGRATED CIRCUIT PACKAGES | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18650905 | Gate Structures For Semiconductor Devices | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18649541 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP | PARKER, JOHN M | 2899 | §102§103Other | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18648527 | METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT STRUCTURE | REMAVEGE, CHRISTOPHER | 1713 | §103§112 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18647151 | SYSTEMS AND METHODS FOR TESTING SEMICONDUCTOR DEVICE | NGUYEN, TRUNG Q | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18647521 | CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE | RAHMAN, MOHAMMAD A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18645481 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | BOWEN, ADAM S | 2897 | §102 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646170 | DIELECTRIC MATERIALS FOR STACKED TRANSISTOR STRUCTURES AND RELATED METHODS | QUINTO, KEVIN V | — | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644377 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | VO, TUYEN KIM | — | §103§112 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644231 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KIELIN, ERIK J | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | GEYER, SCOTT B | — | §102 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644159 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WARREN, MATTHEW E | 2817 | §102§103 | Final Rejection | — | Pending | Apr 24, 2024 |
| 18642992 | Content Addressable Memory Cells | ABDELAZIEZ, YASSER A | — | §103§112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643789 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | REAMES, MATTHEW L | — | §112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18641458 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KEBEDE, BROOK | — | §102 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18642658 | MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE | BELOUSOV, ALEXANDER | 2818 | DP | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18642273 | COMPLEMENTARY FET STRUCTURES WITH REDUCED AREA | SEDOROOK, DAVID PAUL | — | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18638982 | RADIATION SOURCE APPARATUS AND METHOD FOR OPERATING THE SAME | WHITESELL, STEVEN H | 1759 | §102§103§112 | Final Rejection | — | Pending | Apr 18, 2024 |
| 18639739 | GATE SPACERS AND METHODS OF FORMING THE SAME IN SEMICONDUCTOR DEVICES | KOO, LAMONT B | 2813 | §102§103§112 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18636372 | INTEGRATED CIRCUIT INTER-DIE COMMUNICATION USING OPTICAL TRANSMISSION STRUCTURES | PENG, CHARLIE YU | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18635911 | MEMORY DEVICE AND OPERATING METHOD THEREOF | LUONG, DUY HAN | 2825 | §102§103 | Final Rejection | — | Pending | Apr 15, 2024 |
| 18635892 | SIGNAL DISTRIBUTION BOOSTER CIRCUIT AND METHOD | SUN, PINPING | 2849 | §102 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18633920 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | — | §102§103§112 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18633485 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | NIX, NORA TAYLOR | 2891 | §102 | Non-Final OA | — | Pending | Apr 11, 2024 |
| 18632678 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | FOX, BRANDON C | — | §102§103 | Non-Final OA | — | Pending | Apr 11, 2024 |
| 18631692 | SUBSTRATE CARRYING UNIT AND SUBSTRATE PROCESSING DEVICE HAVING THE SAME | KREILING, AMANDA J | 3726 | §102 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18631274 | SEMICONDUCTOR STRUCTURE | DINKE, BITEW A | — | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630241 | HYBRID SELF-TRACKING REFERENCE CIRCUIT FOR RRAM CELLS | SMET, UYEN TRAN | 2824 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629966 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | FARMER, EMILY NICOLE | — | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630365 | MEMORY CIRCUITS WITH TRACKING CELLS AND METHODS FOR OPERATING THE SAME | CHO, SUNG IL | 2825 | §102 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629474 | FRONTSIDE AND BACKSIDE BIT LINES IN A MEMORY ARRAY | MINNEY, GABRIEL SEBASTIAN | — | §103§112 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18629044 | SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME | NGUYEN, KHIEM D | — | §103 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18627561 | PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION | MUSE, ISMAIL A | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628513 | STRAP CELLS IN SEMICONDUCTOR MEMORY DEVICES | INOUSSA, MOULOUCOULAY | — | §102 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628494 | HEAT DISSIPATION FOR HOT SPOTS | NGUYEN, DAO H | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627507 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | WOODARD, AUSTIN TAYLOR | — | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18626948 | SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMATION | PENG, CHARLIE YU | 2874 | §102 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626386 | SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME | DEO, DUY VU NGUYEN | 1713 | §102§103§112 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626638 | METHOD FOR TREATING TWO SUBSTRATES AND SEMICONDUCTOR APPARATUS FOR PERFORMING THE TREATMENT | CHOUDHRY, MOHAMMAD M | — | §103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626116 | Input-Aware Data Inversion Scheme for Low Power Memory Circuit Design | SIMONETTI, NICHOLAS J | 2137 | §103 | Final Rejection | 26d | Pending | Apr 03, 2024 |
| 18625485 | MRAM DEVICE HAVING TWO-TERMINAL SELECTORS | BLACKWELL, ASHLEY NICOLE | — | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18625788 | SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18624484 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | TYNES JR., LAWRENCE C | — | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18624151 | SEMICONDUCTOR DEVICE | REAMES, MATTHEW L | — | §103§112 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18624145 | PACKAGE STRUCTURE HAVING RING RESONANT STRUCTURE AND METHOD OF FORMING THE SAME | PENG, CHARLIE YU | 2874 | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18621138 | PACKAGE STRUCTURE | HA, NATHAN W | 2814 | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621673 | CONDUCTIVE POST WITH FOOTING PROFILE | LEE, CHEUNG | — | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621250 | SPACER FRAME FOR GRAPHITE THERMAL INTERFACE MATERIALS | WHALEN, DANIEL B | — | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18620991 | METHOD FOR INSPECTING SEMICONDUCTOR BONDED STRUCTURE | RODELA, EDUARDO A | — | §103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18620250 | OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR | MOHAMED-ALY, KAREEM M | 2898 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | DINKE, BITEW A | — | §102§103Other | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18617963 | METHOD FOR FORMING CAULKING LAYER, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE THEREOF | NGUYEN, KHIEM D | — | §103 | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18616386 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | KIM, TONG-HO | — | §103§112 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18616674 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | RAHMAN, MOHAMMAD A | — | §112 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18617303 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING COMPLEMENTARY FIELD-EFFECT TRANSISTOR STRUCTURE | FOX, BRANDON C | — | §102§103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18612420 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | KIM, TONG-HO | — | §102§103§112 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18612815 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | NGUYEN, DUY T V | — | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18611042 | DRIVING CIRCUIT, PRECHARGING CIRCUITRY FOR DRIVING CIRCUIT, AND METHOD OF OPERATING DRIVING CIRCUIT | PERENY, TYLER J | — | §102§103Other | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18609682 | SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD OF MANUFACTURING THEREOF | KUSUMAKAR, KAREN M | 2897 | §103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18609456 | INTERCONNECT STRUCTURE AND METHODS THEREOF | RAHMAN, MOHAMMAD A | — | §102§112 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18607714 | Semiconductor Device Including a Voltage Regulator and an Integrated Circuit Module | HILTUNEN, THOMAS J | 2849 | §102§103 | Non-Final OA | 8d overdue | Pending | Mar 18, 2024 |
| 18606335 | INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF | STEVENSON, ANDRE C | 2899 | DP | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 2817 | §102§103 | Final Rejection | 9d overdue | Pending | Mar 14, 2024 |
| 18603779 | INTEGRATED CIRCUIT PACKAGES | CRITE, ANTONIO B | — | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18602163 | THERMAL CONDUCTIVE BONDING STRUCTURE | DULKA, JOHN P | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18602247 | TEMPERATURE COEFFICIENT CALIBRATION OF RESISTOR THERMAL SENSORS | CASTELLON JR, MANUEL SALVADOR | 2855 | §102§103 | Non-Final OA | 4d overdue | Pending | Mar 12, 2024 |
| 18602041 | METHOD FOR FABRICATING MEMORY DEVICE | LI, MEIYA | 2811 | §112 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18602854 | STACKED TRANSISTORS AND METHOD OF FORMING THE SAME | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18603136 | OPTICAL WAVEGUIDE COUPLER | PETKOVSEK, DANIEL | 2874 | §102§103Other | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18601191 | SLOW WAVE INDUCTIVE STRUCTURE | HINSON, RONALD | 2837 | §103 | Final Rejection | 36d overdue | Pending | Mar 11, 2024 |
| 18600981 | METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE | OH, JAEHWAN | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18601535 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | TYNES JR., LAWRENCE C | 2899 | §102§103§112 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18599702 | CHANNEL EXTENSION STRUCTURES FOR SEMICONDUCTOR DEVICES | BELL, LAUREN R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18600394 | BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE | CHOU, SHIH TSUN A | 2811 | §102 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597966 | SEMICONDUCTOR DEVICES HAVING A PATTERNED CONTACT | RAMALLO, GUSTAVO G | 2812 | §112 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18597846 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | AHMED, SHAHED | 2813 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596662 | GRATING COUPLER AND METHOD OF MANUFACTURING THE SAME | BLEVINS, JERRY M | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597871 | CAPACITOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF INTEGRATED CIRCUIT | INOUSSA, MOULOUCOULAY | 2818 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596641 | SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHODS OF MANUFACTURING THE SAME | PARK, SAMUEL | 2818 | §103§112 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596667 | IMAGE SENSOR DEVICE AND SEMICONDUCTOR STRUCTURE | LIU, XIAOMING | 2812 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596600 | PACKAGE STRUCTURE | PETKOVSEK, DANIEL | 2874 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18596404 | 3D IC POWER GRID | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | 119d overdue | Pending | Mar 05, 2024 |
| 18594009 | OPTICAL INSPECTION SYSTEM, METHOD OF OPTICAL INSPECTION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | LAPAGE, MICHAEL P | 2877 | §103 | Final Rejection | 76d | Pending | Mar 04, 2024 |
| 18593444 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | TRAN, TRANG Q | 2811 | §102§103§112 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18592741 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE | HARRISTON, WILLIAM A | 2899 | §102§103 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18591992 | SEMICONDUCTOR DEVICE | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591873 | TRANSISTOR AND SEMICONDUCTOR DEVICE USING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §102§103§112 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18590911 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18588942 | SEMICONDUCTOR DEVICE HAVING NANOSHEETS | HOANG, TUAN A | 2898 | §102§103Other | Non-Final OA | — | Pending | Feb 27, 2024 |
| 18586942 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | TRAN, TIEN | 2812 | §103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18584062 | BOND PAD FOR REDUCED CONTACT RESISTANCE | TYNES JR., LAWRENCE C | 2899 | §102§103Other | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18584092 | SEMICONDUCTOR DEVICE | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §102§103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18582702 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18583194 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | LUKE, DANIEL M | 2896 | §103 | Final Rejection | 11d overdue | Pending | Feb 21, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | PARKER, JOHN M | 2899 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18581750 | AUTOMATED SEMICONDUCTOR WAFER TRANSFER MONITORING | WORKU, KIDEST | 2119 | §101§102§103 | Final Rejection | — | Pending | Feb 20, 2024 |
| 18444268 | IC Structure with Stress-Release Pattern to Enhance Package Yield | GONDARENKO, NATALIA A | 2891 | §103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443329 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING AND TESTING THE SAME | PARTHASARATHY, ROHIT | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443917 | SEMICONDUCTOR DEVICE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443323 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | ALAM, MOHAMMED R | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443158 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHODS | ALBRECHT, PETER M | 2811 | §112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18440483 | SACRIFICIAL TEST PAD | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18440671 | DELAMINATION DETECTION STRUCTURE | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18438875 | Threshold Voltage Tuning Using Aluminum Layer as Dipole Material | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18435093 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | CHIN, EDWARD | 2893 | §103 | Final Rejection | — | Pending | Feb 07, 2024 |
| 18433487 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434215 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | SQUIRES, BRETT STEPHEN | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433641 | BIT LINE WITH NON-UNIFORM WIDTH IN A MEMORY ARRAY | HOANG, HUAN | 2893 | §102§103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433120 | DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING | ERDEM, FAZLI | 2812 | DP | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432386 | CHIP PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME | YUSHINA, GALINA G | 2811 | §103§112 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432199 | Single Phase Clock Controlled Master Latch in Flip Flops | NGUYEN, LONG T | 2842 | §102 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18433275 | METHOD AND SYSTEM FOR RETRIEVING DIFFRACTION PARAMETER OF PHOTOMASK | ZHAI, KYLE | 2611 | §112 | Final Rejection | 14d | Pending | Feb 05, 2024 |
| 18432111 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME | HUNTER III, CARNELL | 2893 | §103§112 | Final Rejection | — | Pending | Feb 05, 2024 |
| 18433033 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MANDALA, VICTOR A | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432058 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | FAN, SU JYA | 2818 | §103§112 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SENGDARA, VONGSAVANH | 2893 | §102 | Non-Final OA | — | Pending | Feb 04, 2024 |
| 18431950 | SEMICONDUCTOR DEVICES WITH LOWERED EPITAXIAL SOURCE/DRAIN REGIONS AND METHODS OF FABRICATION THEREOF | DYKES, LAURA M | 2892 | §102§103§112Other | Non-Final OA | — | Pending | Feb 03, 2024 |
| 18430868 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | GARCES, NELSON Y | 2814 | §102§112 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18431140 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §102 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18431043 | LINER FOR PMOSFET SOURCE DRAIN | WRIGHT, TUCKER J | 2891 | §102§103 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430017 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | PARKER, JOHN M | 2899 | Other | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18430507 | SEMICONDUCTOR DEVICE | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18428230 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | DINKE, BITEW A | 2812 | §102§103Other | Non-Final OA | 76d | Pending | Jan 31, 2024 |
| 18428603 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | JAHAN, BILKIS | 2817 | DP | Non-Final OA | — | Pending | Jan 31, 2024 |
| 18428967 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | LUONG, DUY HAN | 2825 | §102§103§112 | Final Rejection | 2d overdue | Pending | Jan 31, 2024 |
| 18427248 | MEMORY DEVICES HAVING MIDDLE STRAP AREAS FOR ROUTING POWER SIGNALS | STORMES, JOSEPH FIDELIS | 2825 | §103 | Final Rejection | — | Pending | Jan 30, 2024 |
| 18426796 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | SUN, YU-HSI DAVID | 2817 | §103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18425333 | OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE | AHMED, SHAHED | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18426140 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CHOI, CALVIN Y | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425352 | SEMICONDUCTOR STRUCTURE | PETERSON, ERIK T | 2898 | §102 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425306 | TRENCH CAPACITOR STRUCTURE AND METHOD OF FORMING THE SAME | SEVEN, EVREN | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425264 | THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE | NGUYEN, CUONG B | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425224 | INTEGRATED CIRCUIT DEVICE INCLUDING A BOND-BASED CAPACITOR | SEDOROOK, DAVID PAUL | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18424246 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | PARKER, JOHN M | 2899 | Other | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | SANDVIK, BENJAMIN P | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423734 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, NIKI HOANG | 2818 | §103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423888 | OPTICAL SIGNAL REDIRECTION STRUCTURE FOR PHOTONICS DEVICE | ALANKO, ANITA KAREN | 2874 | §112 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423215 | SEMICONDUCTOR STRUCTURE | PARK, SAMUEL | 2818 | §103 | Non-Final OA | — | Pending | Jan 25, 2024 |
| 18421096 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTO-SENSING STRUCTURE | PHAN, STEVE QUOC | 2817 | §103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421176 | FILTER FINS IN A GATE CONNECTOR REGION BETWEEN TRANSISTORS FOR SIGNAL FILTERING | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421312 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421546 | INSTRUMENTAL ERROR TRACKING AND IDENTIFICATION METHOD, INSTRUMENTAL ERROR TRACKING AND IDENTIFICATION SYSTEM AND OPTICAL METROLOGY TOOL | CHARIOUI, MOHAMED | 2857 | §101§103 | Non-Final OA | 84d | Pending | Jan 24, 2024 |
| 18421111 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTOSENSING STRUCTURE | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18419290 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | WELLS, JAMES STEVEN | 2825 | §103 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18418035 | IMAGE SENSOR STRUCTURE | WARD, DAVID WILLIAM | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18415668 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18416715 | FERROELECTRIC NON-VOLATILE MEMORY AND METHODS OF FORMATION | ALAM, MOHAMMED R | 2897 | §112 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415529 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME | WARD, ERIC A | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415487 | SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD THEREOF | REIDA, MOLLY KAY | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415192 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415592 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | PETKOVSEK, DANIEL | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18413062 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | GREEN, TELLY D | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18413073 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | MOHAMED-ALY, KAREEM M | 2898 | §103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18412576 | SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Jan 14, 2024 |
| 18411595 | Contact Structures in Semiconductor Devices | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411041 | SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME | BOOTH, RICHARD A | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411422 | MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM | MOHAMED-ALY, KAREEM M | 2898 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18412129 | MEMORY DEVICES WITH DIFFERENTLY SIZED ACTIVE REGIONS IN PERIPHERY CIRCUITS | DYKES, LAURA M | 2892 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18409950 | WAFER HOLDER APPARATUS, SYSTEM AND METHOD OF FORMING SAME | DODDS, SCOTT | — | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409839 | SEMICONDUCTOR STRUCTURE INCLUDING MEMORY UNIT AND MANUFACTURING METHOD THEREOF | SHAMSUZZAMAN, MOHAMMED | 2897 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409915 | METHODS FOR SELECTIVE METAL CAP FORMATION | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410852 | DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETWEEN MG AND SD | SENGDARA, VONGSAVANH | 2893 | §102 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18410195 | One-Time Programming Memory Device with Backside Isolation Structure | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409806 | SEMICONDUCTOR STRUCTURE INCLUDING PHOTODETECTOR AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410302 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | MENZ, LAURA MARY | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409620 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §102 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18409126 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) STRUCTURES AND METHODS OF FORMING SAME | CHANG, JAY C | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18407524 | SEMICONDUCTOR DEVICE WITH HYBRID SUBSTRATE AND MANUFACTURING METHODS THEREOF | CHAMBLISS, ALONZO | 2897 | §112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407436 | SEMICONDUCTOR DEVICE AND SYSTEM FOR OPTICAL SIGNAL PROCESSING | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | TUTTLE, ETHAN ALEXANDER | 2897 | §103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407342 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ARORA, AJAY | 2892 | §102 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18406246 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | REAMES, MATTHEW L | 2896 | §102§103§112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18405146 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404915 | METHOD FOR DETECTING ENVIRONMENTAL PARAMETER IN SEMICONDUCTOR FABRICATION FACILITY | BUTLER, KEVIN C | 2852 | §102 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405311 | Semiconductor Structures with Backside Buried Contact | CHOI, CALVIN Y | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405919 | IMAGE SENSOR | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405967 | DIFFUSION BARRIER STRUCTURES IN SOURCE/DRAIN STRUCTURES OF NANOSTRUCTURE TRANSISTORS | DANG, PHUC T | 2897 | §103 | Final Rejection | 9d | Pending | Jan 05, 2024 |
| 18404932 | TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME | THROCKMORTON, ROBERT EMIL | 2818 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405951 | ONE-TIME-PROGRAMMABLE MEMORY DEVICES WITH HIGH SECURITY AND METHODS OF MANUFACTURING THEREOF | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405450 | THIN FILM RESISTORS AND METHODS OF FORMING THE SAME | DAS, PINAKI | 2898 | §102§103 | Final Rejection | — | Pending | Jan 05, 2024 |
| 18405318 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BELL, LAUREN R | 2896 | §103§112 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18403785 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | ROST, ANDREW J | 3753 | §103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18403747 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404233 | EPITAXIAL STRUCTURES IN SEMICONDUCTOR DEVICES | CIESLEWICZ, ANETA B | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404211 | RESISTIVE MEMORY DEVICE, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAME | RODELA, EDUARDO A | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404737 | METHOD OF INCREASING CROSSLINKING DENSITY OF PHOTORESIST | CHACKO DAVIS, DABORAH | — | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403746 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | PEACE, RHONDA S | 2874 | §103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18404831 | Gate Patterning for Stacked Device Structure | HRNJIC, ADIN | 2817 | §112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404187 | SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL GATE VIA AND METHOD FOR MANUFACTURING THE SAME | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403774 | SEMICONDUCTOR STRUCTURE INCLUDING IMAGE SENSOR AND MRAM DEVICE | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404226 | HYBRID NANOSTRUCTURE SCHEME AND METHODS FOR FORMING THE SAME | SANDVIK, BENJAMIN P | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403723 | SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404290 | SEMICONDUCTOR STRUCTURE INCLUDING MICRO WELLS WITH DIFFERENT HEIGHTS | MIHALIOV, DMITRI | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | ADHIKARI DAWADI, BIPANA | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403754 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | LINDSEY, COLE LEON | 2812 | §102 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403643 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403692 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403280 | MULTI-LAYER THIN FILM RESISTOR | ANDERSON, ERIK ARTHUR | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402984 | METHOD AND CHEMICAL VAPOR DEPOSITION APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE | MCCOY, THOMAS WILSON | 2814 | §102§103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403587 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | 2898 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402935 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LEBENTRITT, MICHAEL | 2893 | §102 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403455 | INSPECTION SYSTEM AND METHOD FOR OPERATING THEREOF | YAZBACK, MAHER | — | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401853 | PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE STRUCTURE | YEMELYANOV, DMITRIY | 2891 | §103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | 4d overdue | Pending | Jan 02, 2024 |
| 18402178 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | SPRENGER, JAIME LYNN | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401752 | INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANUFACTURE | KARIMY, TIMOR | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | CHIU, TSZ K | 2898 | §103 | Final Rejection | 26d | Pending | Jan 02, 2024 |
| 18401747 | MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE | CIESLEWICZ, ANETA B | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401749 | METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING | TRAN, TAN N | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402404 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18401751 | IMAGE SENSOR DEVICE WITH LIGHT RETENTION STRUCTURE | HA, NATHAN W | 2814 | §102§103 | Non-Final OA | 70d | Pending | Jan 02, 2024 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18400440 | SEMICONDUCTOR DIE AND METHODS OF FORMATION | PHAM, THOMAS T | 1713 | §103§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18398856 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL | JEAN BAPTISTE, WILNER | 2899 | §103 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398882 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL | YUSHINA, GALINA G | 2811 | §103§112Other | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398437 | CIRCUIT CELLS HAVING CONDUCTION PATH BETWEEN FRONTSIDE POWER RAIL AND BACKSIDE POWER RAIL | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398951 | METHODS AND DEVICES THAT INCLUDE A GATE CONTACT THAT ABUTS A DIELECTRIC REGION THAT HAS A LOW-K DIELECTRIC | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398203 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | YUSHINA, GALINA G | 2811 | §103 | Final Rejection | — | Pending | Dec 28, 2023 |
| 18397398 | REDUCTION OF METAL LOSS DURING GATE PATTERNING | TRAN, TONY | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18396186 | MEMORY REFRESH | KING, DOUGLAS | 2824 | §112Other | Final Rejection | 6d | Pending | Dec 26, 2023 |
| 18393711 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | SHEKER, RHYS PONIENTE | 2813 | §103 | Non-Final OA | — | Pending | Dec 22, 2023 |
| 18393283 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | CUNNINGHAM, KIERAN MURRAY | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 21, 2023 |
| 18392242 | INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING | GREEN, TELLY D | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 21, 2023 |
| 18543110 | CHIP STRUCTURE | PIZARRO CRESPO, MARCOS D | 2814 | §103§112 | Non-Final OA | — | Pending | Dec 18, 2023 |
| 18538036 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HO, ANTHONY | 2817 | §102 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18535546 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | DOAN, NGHIA M | — | §103 | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18533136 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | DANG, PHUC T | 2897 | §102§103 | Non-Final OA | 77d | Pending | Dec 07, 2023 |
| 18533054 | OPTICAL WAVEGUIDE, SEMICONDUCTOR DEVICE WITH OPTICAL WAVEGUIDE, AND METHODS OF MANUFACTURING THE SAME | CONNELLY, MICHELLE R | 2874 | §102§103 | Non-Final OA | — | Pending | Dec 07, 2023 |
| 18531189 | HEAT DISSIPATION THROUGH SEAL RINGS | NGUYEN, SOPHIA T | 2893 | §112 | Final Rejection | — | Pending | Dec 06, 2023 |
| 18530248 | LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND METHOD FOR FORMING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §102§103§112 | Final Rejection | — | Pending | Dec 06, 2023 |
| 18528812 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | GONDARENKO, NATALIA A | 2891 | §102§103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18530098 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE | ASFAW, MESFIN T | — | §101 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18527714 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18526473 | CONTACT GATE ISOLATION | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Final Rejection | 22d | Pending | Dec 01, 2023 |
| 18526083 | CHIP TESTING STRUCTURE | PATEL, PARESH H | 2858 | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18525573 | POLISHING APPARATUS AND METHOD FOR POLISHING SUBSTRATE | FLORES, JUAN G | 3745 | §103§112 | Non-Final OA | — | Pending | Nov 30, 2023 |
| 18522224 | CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE | PENG, CHARLIE YU | 2874 | §103 | Final Rejection | 16d overdue | Pending | Nov 29, 2023 |
| 18522583 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STRUCTURE | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18523286 | INTERCONNECTION STRUCTURE HAVING AIR GAP | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18519271 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GREEN, TELLY D | 2898 | §102§112 | Non-Final OA | 83d | Pending | Nov 27, 2023 |
| 18519633 | SRAM HAVING CFET STACKS AND METHOD OF MANUFACTURING SAME | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18519805 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | TURNER, BRIAN | 2894 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18517892 | SEMICONDUCTOR PACKAGE | NELSON, JACOB THEODORE | 2815 | §103§112 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18518151 | SRAM ARCHITECTURE FOR CONVOLUTIONAL NEURAL NETWORK APPLICATION | SIDDIQUE, MUSHFIQUE | — | §102§112 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18513679 | SEMICONDUCTOR STRUCTURE | CHEEK, EDWARD RHETT | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18513968 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | SEVEN, EVREN | 2812 | §102§103 | Final Rejection | 2d overdue | Pending | Nov 20, 2023 |
| 18513562 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | TURNER, BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Nov 19, 2023 |
| 18512686 | PHOTONIC DEVICE FORMED USING SELF-ALIGNED PROCESSES | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18512371 | VERTICALLY STACKED COMPLEMENTARY FIELD EFFECT TRANSISTORS AND METHODS OF FABRICATION THEREOF | KIM, SU C | 2899 | §103 | Final Rejection | — | Pending | Nov 17, 2023 |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | FARMER, EMILY NICOLE | 2812 | §102§103 | Final Rejection | 9d | Pending | Nov 17, 2023 |
| 18512935 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18512452 | POWER GATING USING NANOELECTROMECHANICAL SYSTEMS (NEMS) IN BACK END OF LINE (BEOL) | GREWAL, HEIM KIRIN | 2812 | §103§112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18512411 | CONDUCTOR SCHEME SELECTION AND TRACK PLANNING FOR MIXED-DIAGONAL-MANHATTAN ROUTING | AISAKA, BRYCE M | — | §112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18511016 | THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18511279 | SEMICONDUCTOR STRUCTURE INCLUDING TRANSISTOR WITH DIFFERENT CHANNEL LENGTHS AND METHOD FOR MANUFACTURING THE SAME | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18511652 | MEMORY DEVICES WITH FLYING DECORDER LINES AND METHODS FOR OPERATING THE SAME | TRAN, ANTHAN | 2825 | §103 | Non-Final OA | 84d | Pending | Nov 16, 2023 |
| 18510011 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | OH, JIYOUNG | 2818 | §103§112 | Non-Final OA | — | Pending | Nov 15, 2023 |
| 18509235 | SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18508423 | PHOTORESIST COMPOSITION | ANGEBRANNDT, MARTIN J | — | §103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18389267 | PHOTORESIST MATERIAL AND METHOD FOR LITHOGRAPHY | COSGROVE, JAYSON D | — | §102§103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18507230 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | AHMED, SHAHED | 2813 | §103 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18507100 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18506154 | PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME | TRAN, HOANG Q | 2874 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18505631 | Semiconductor Device and Method of Fabricating Thereof | YEMELYANOV, DMITRIY | 2891 | §102§103§112 | Non-Final OA | — | Pending | Nov 09, 2023 |
| 18504158 | BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | 83d | Pending | Nov 08, 2023 |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | GREEN, TELLY D | 2898 | §102§103Other | Non-Final OA | — | Pending | Nov 07, 2023 |
| 18502640 | INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURING THE SAME | NICELY, JOSEPH C | 2813 | §103 | Non-Final OA | 76d | Pending | Nov 06, 2023 |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 2813 | §103 | Final Rejection | 50d overdue | Pending | Nov 06, 2023 |
| 18502792 | INTERCONNECTION STRUCTURE | WARD, ERIC A | 2891 | §102§112 | Non-Final OA | — | Pending | Nov 06, 2023 |
| 18501172 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 03, 2023 |
| 18500896 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18500878 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | CHEN, YU | 2896 | §103 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18499816 | SEMICONDUCTOR STRUCTURE WITH DEVICES HAVING DIFFERENT EFFECTIVE CHANNELS AND REDUCED EFFECTIVE CAPACITANCES, AND METHOD FOR MANUFACTURING THE SAME | FAN, SU JYA | 2818 | §102§112 | Non-Final OA | — | Pending | Nov 01, 2023 |
| 18499235 | CHIP STACKING STRUCTURE | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | — | Pending | Nov 01, 2023 |
| 18498293 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SYLVIA, CHRISTINA A | 2817 | §112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18498900 | Semiconductor Device Having Dielectric Material Treated with Microwave Plasma and Method of Fabricating Thereof | LAOBAK, ANDREW KEELAN | 1713 | §103§112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18385563 | ADDITIVES FOR METALLIC PHOTORESIST | EOFF, ANCA | — | §103 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | 30d | Pending | Oct 31, 2023 |
| 18496509 | INTEGRATED CIRCUIT LAYOUT SHAPES | DOAN, NGHIA M | — | §102§103§112 | Non-Final OA | — | Pending | Oct 27, 2023 |
| 18384253 | SEMICONDUCTOR PROCESS APPARATUS AND METHOD | GASSEN, CHRISTOPHER J | 2881 | §103 | Final Rejection | — | Pending | Oct 26, 2023 |
| 18494253 | BACKSIDE ISOLATION OF SEMICONDUCTOR STRUCTURES | INOUSSA, MOULOUCOULAY | 2818 | §102 | Non-Final OA | — | Pending | Oct 25, 2023 |
| 18493981 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | NGUYEN, SOPHIA T | 2893 | §102§103§112 | Non-Final OA | — | Pending | Oct 25, 2023 |
| 18493949 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCTIVE CONTACT | SABUR, ALIA | 2812 | §103 | Final Rejection | 16d overdue | Pending | Oct 25, 2023 |
| 18492855 | SEMICONDUCTOR STRUCTURE WITH AIR SPACER AND METHOD FOR FORMING THE SAME | YEUNG LOPEZ, FEIFEI | 2899 | §112 | Final Rejection | — | Pending | Oct 24, 2023 |
| 18492382 | Contact Formation Method and Related Structure | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103§112 | Final Rejection | 45d overdue | Pending | Oct 23, 2023 |
| 18492359 | SEMICONDUCTOR STRUCTURES AND METHODS WITH REDUCED PLASMA INDUCED DAMAGE | WEGNER, AARON MICHAEL | 2897 | §103 | Non-Final OA | — | Pending | Oct 23, 2023 |
| 18492258 | EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | MCCOY, THOMAS WILSON | 2814 | §102§103§112 | Non-Final OA | 83d | Pending | Oct 23, 2023 |
| 18491207 | DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS | AHMADI, MOHSEN | 2896 | §102§103 | Non-Final OA | — | Pending | Oct 20, 2023 |
| 18490922 | SEMICONDUCTOR MEMORY DEVICES WITH FLYING BIT LINES AND METHODS OF MANUFACTURING THEREOF | ALROBAIE, KHAMDAN N | 2824 | §103§112 | Final Rejection | 9d overdue | Pending | Oct 20, 2023 |
| 18490919 | SEMICONDUCTOR DEVICES WITH GATE EXTENSIONS AND METHODS OF FABRICATING THE SAME | HO, ANTHONY | 2817 | §102 | Final Rejection | 12d | Pending | Oct 20, 2023 |
| 18491486 | VARACTORS HAVING INCREASED TUNING RATIO | BEARDSLEY, JONAS TYLER | 2811 | §103 | Final Rejection | — | Pending | Oct 20, 2023 |
| 18381706 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BOOTH, RICHARD A | 2812 | §103 | Non-Final OA | 84d | Pending | Oct 19, 2023 |
| 18489872 | SEMICONDUCTOR DEVICE AND ELECTROSTATIC DISCHARGE CLAMP CIRCUIT | AL-TAWEEL, MUAAMAR QAHTAN | 2897 | §103 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18489853 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | LOPEZ, JORGE ANDRES | 2897 | §103 | Non-Final OA | 56d | Pending | Oct 19, 2023 |
| 18489365 | MULTI-PORT SRAM CELL WITH DUAL SIDE POWER RAILS | MARIN, JACOB RAUL | 2818 | §103 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18488659 | SEMICONDUCTOR DEVICE WITH METAL GATE STRUCTURE AND FABRICATION METHOD THEREOF | CHEN, YU | 2896 | §102§103 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18486561 | STRUCTURE AND METHOD FOR HIGH-VOLTAGE DEVICE | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18379870 | PHOTORESIST MATERIAL AND METHOD FOR LITHOGRAPHY | WALKE, AMANDA C | — | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18485602 | GATE FORMATION PROCESS | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 23d overdue | Pending | Oct 12, 2023 |
| 18485001 | SYSTEMS AND METHODS FOR DUTY CYCLE CHARACTERIZATION | HOLLINGTON, JERMELE M | 2858 | §103 | Non-Final OA | — | Pending | Oct 11, 2023 |
| 18484403 | PACKAGE COMPONENT AND FORMING METHOD THEREOF | AHMED, MEHEK | 2812 | §103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18483739 | MEMORY DEVICES WITH SWITCHABLE POWER DELIVERY PATHS | MCDONALD, JASON ANDREW | 2898 | §103§112 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18481124 | LITHOGRAPHY PROCESS | LEE, ALEXANDER N | 1737 | §103§112 | Non-Final OA | — | Pending | Oct 04, 2023 |
| 18479269 | SEMICONDUCTOR DIE AND METHODS OF FORMATION | AHMAD, KHAJA | 2813 | §103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478086 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BARZYKIN, VICTOR V | 2893 | §102§103§112 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18477940 | SEMICONDUCTOR STRUCTURE WITH DOPED REGION AND METHOD FOR MANUFACTURING THE SAME | NADAV, ORI | 2811 | §103§112 | Final Rejection | 14d | Pending | Sep 29, 2023 |
| 18477399 | POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME | AHMED, SHAMIM | 1713 | §103 | Final Rejection | — | Pending | Sep 28, 2023 |
| 18476922 | STANDARD CELL SPACING QUALITY CHECKING | SOUNDRANAYAGAM, RAYAPPU NMN | — | — | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | DINKE, BITEW A | 2812 | §103 | Final Rejection | 28d overdue | Pending | Sep 27, 2023 |
| 18474613 | SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | TUTTLE, ETHAN ALEXANDER | 2897 | §103 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18474259 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | LEE, ALVIN LYNGHI | 2813 | §103§112 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18472725 | SYSTEMS AND METHODS FOR IMPLEMENTING INTEGRATED CIRCUIT DESIGN | MEMULA, SURESH | — | §101 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18472695 | Corner Reinforcement Structure for Package Interconnect | AHMADI, MOHSEN | 2896 | §102§103 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | TAN, DAVE | 2897 | §103 | Final Rejection | 11d overdue | Pending | Sep 22, 2023 |
| 18471316 | SEMICONDUCTOR CHIP | CHUNG, ANDREW | 2898 | §103 | Final Rejection | 50d overdue | Pending | Sep 21, 2023 |
| 18470614 | Semiconductor Device Having FIN Structure and Method of Forming Thereof | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | 79d | Pending | Sep 20, 2023 |
| 18368014 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | GONZALES, VICENTE ROLANDO | 2899 | §102§103§112 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103§112 | Non-Final OA | 33d | Pending | Sep 14, 2023 |
| 18467200 | Semiconductor Device Package with Thermal Module | BOATMAN, CASEY PAUL | 2893 | §102§103 | Non-Final OA | 57d | Pending | Sep 14, 2023 |
| 18467389 | METHOD FOR FORMING SEMICONDUCTOR DIE | CHEEK, EDWARD RHETT | 2813 | §102§103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18466004 | MAGNETIC TUNNEL JUNCTION (MTJ) STRUCTURE AND MEMORY CELL | SPRENGER, JAIME LYNN | 2893 | §102§103 | Final Rejection | 13d | Pending | Sep 13, 2023 |
| 18367605 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | — | Pending | Sep 13, 2023 |
| 18465815 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | BOULGHASSOUL, YOUNES | 2814 | §102§112 | Non-Final OA | — | Pending | Sep 12, 2023 |
| 18465748 | SEMICONDUCTOR DEVICE WITH BOTTOM DIELECTRIC ISOLATOR AND MANUFACTURING METHOD THEREOF | SRINIVASAN, SESHA SAIRAMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 12, 2023 |
| 18465949 | RECEIVER CIRCUIT AND SEMICONDUCTOR DEVICE | LUGO, DAVID B | 2631 | §102§103 | Non-Final OA | 34d | Pending | Sep 12, 2023 |
| 18464815 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | TRAN, THANH Y | 2817 | §102 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18464508 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | CHA, GRACE YEH-EUN SAET | 2897 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18464243 | DIRECT WRITING SYSTEM USED FOR ELECTRON BEAM LITHOGRAPHY | CHOI, JAMES J | 2878 | §102§103§112 | Final Rejection | 21d | Pending | Sep 10, 2023 |
| 18463405 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF WITH CAP LAYERS | SRINIVASAN, SESHA SAIRAMAN | 2812 | §102§103 | Non-Final OA | — | Pending | Sep 08, 2023 |
| 18463463 | HIGH VOLTAGE MOSFET USING SHALLOW-SHALLOW TRENCH ISOLATION STRUCTURE | CHOU, SHIH TSUN A | 2811 | §102§103§112 | Non-Final OA | — | Pending | Sep 08, 2023 |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | NGUYEN, DAO H | 2818 | §102§103§112 | Non-Final OA | — | Pending | Sep 07, 2023 |
| 18462151 | INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTACT RESISTIVITY | ARORA, AJAY | 2892 | §102§103 | Non-Final OA | — | Pending | Sep 06, 2023 |
| 18461328 | INTERCONNECTION STRUCTURE | KUSUMAKAR, KAREN M | 2897 | §102§103 | Non-Final OA | — | Pending | Sep 05, 2023 |
| 18459089 | STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND DIE LEVEL BONDING PACKAGES | KIELIN, ERIK J | 2814 | §103§112 | Non-Final OA | — | Pending | Aug 31, 2023 |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | PHAM, THANHHA S | 2812 | §102§103 | Final Rejection | — | Pending | Aug 25, 2023 |
| 18238247 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | NADAV, ORI | 2811 | §103§112 | Final Rejection | 22d | Pending | Aug 25, 2023 |
| 18455654 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §103 | Final Rejection | — | Pending | Aug 25, 2023 |
| 18454607 | PIEZOELECTRIC DEVICE AND METHODS OF FORMATION | CUEVAS, PEDRO J | — | §112 | Non-Final OA | — | Pending | Aug 23, 2023 |
| 18454084 | INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE | PARVEZ, AZM A | 2892 | §102§103§112 | Non-Final OA | — | Pending | Aug 23, 2023 |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | CHANG, JAY C | 2817 | §102 | Final Rejection | 22d | Pending | Aug 22, 2023 |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 23d | Pending | Aug 21, 2023 |
| 18452947 | NON-RECTANGULAR CELL LAYOUT METHOD AND SYSTEM | AISAKA, BRYCE M | — | §112 | Non-Final OA | — | Pending | Aug 21, 2023 |
| 18452004 | SEMICONDUCTOR FIN CUT PROCESS AND STRUCTURES FORMED THEREBY | CHOWDHARY, NIMARTA KAUR | 2898 | §101§103 | Non-Final OA | — | Pending | Aug 18, 2023 |
| 18235391 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | VU, HUNG K | 2897 | §102§103§112 | Non-Final OA | 38d overdue | Pending | Aug 18, 2023 |
| 18451263 | SEMICONDUCTOR STRUCTURE | ZARNEKE, DAVID A | 2891 | §103 | Final Rejection | 22d | Pending | Aug 17, 2023 |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | CHAN, CANDICE | 2813 | §102§103§112 | Non-Final OA | 42d overdue | Pending | Aug 15, 2023 |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | VU, HUNG K | 2897 | §102 | Final Rejection | 37d overdue | Pending | Aug 14, 2023 |
| 18448187 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | CHI, SUBERR L | 2893 | §102§103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18447964 | METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447826 | ONE-TIME PROGRAMMABLE MEMORY BIT CELL COMPRISING TWO OR MORE ANTIFUSE MEMORY CELLS | NGUYEN, VAN THU T | 2824 | §103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447750 | SEMICONDUCTOR DEVICE HAVING NANOSHEETS | HOANG, TUAN A | 2898 | §103 | Final Rejection | — | Pending | Aug 10, 2023 |
| 18447321 | SEMICONDUCTOR DEVICE | PARTHASARATHY, ROHIT | 2899 | §103 | Final Rejection | 30d overdue | Pending | Aug 10, 2023 |
| 18448093 | METHOD OF MANUFACTURING SEMICONDUCTOR IMAGE SENSOR | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447580 | MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME | PARIHAR, SUCHIN | — | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18232717 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 70d overdue | Pending | Aug 10, 2023 |
| 18447810 | METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL | KENDALL, BENJAMIN R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18446484 | MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS | DARNELL, BAILEIGH K | 1743 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18446563 | STRUCTURE AND METHOD FOR MRAM DEVICES | HRNJIC, ADIN | 2817 | §103§112 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18232306 | SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT | DINKE, BITEW A | 2812 | §103 | Final Rejection | 75d | Pending | Aug 09, 2023 |
| 18447125 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KOO, LAMONT B | 2813 | §102§103§112 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18446549 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | HALL, VICTORIA KATHLEEN | 2897 | §102§103§112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18447134 | ETCH METHOD FOR INTERCONNECT STRUCTURE | SENGDARA, VONGSAVANH | 2893 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | TURNER, BRIAN | 2818 | §102§103§112 | Final Rejection | 15d | Pending | Aug 08, 2023 |
| 18366074 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | KENDALL, BENJAMIN R | 2896 | §103§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366620 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | ISAAC, STANETTA D | 2898 | §102§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18231201 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18365241 | ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME | WILCZEWSKI, MARY A | 2898 | §103§112 | Non-Final OA | — | Pending | Aug 04, 2023 |
| 18365234 | SEMICONDUCTOR PACKAGE | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 04, 2023 |
| 18365667 | METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME | MINNEY, GABRIEL SEBASTIAN | 2897 | §103§112 | Final Rejection | 42d overdue | Pending | Aug 04, 2023 |
| 18365252 | SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18230325 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | LI, MEIYA | 2811 | §112 | Non-Final OA | — | Pending | Aug 04, 2023 |
| 18365250 | METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR GENERATING LAYOUT BASED ON PATH LABELED WITH MARKER | TAT, BINH C | — | §102 | Non-Final OA | — | Pending | Aug 04, 2023 |
| 18364736 | LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE SENSORS | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Aug 03, 2023 |
| 18364734 | DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | HRNJIC, ADIN | 2817 | §112 | Final Rejection | 35d overdue | Pending | Aug 03, 2023 |
| 18364667 | EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Aug 03, 2023 |
| 18363756 | MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | WARREN, MATTHEW E | 2815 | §102 | Non-Final OA | — | Pending | Aug 02, 2023 |
| 18364291 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | SNOW, COLLEEN ERIN | 2899 | §103 | Final Rejection | 14d | Pending | Aug 02, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18362213 | MASK-FREE PROCESS FOR IMPROVING DRAIN TO GATE BREAKDOWN VOLTAGE IN SEMICONDUCTOR DEVICES | GUPTA, RAJ R | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18228250 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362842 | PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18361949 | Circuits and Methods for a Noise Shaping Analog To Digital Converter | MAI, LAM T | 2845 | §102§103 | Final Rejection | 4d overdue | Pending | Jul 31, 2023 |
| 18362892 | ATOMIC LAYER DEPOSITION (ALD) WITH IMPROVED PARTICLE PREVENTION MECHANISM | LUND, JEFFRIE ROBERT | 1716 | §102§103 | Final Rejection | — | Pending | Jul 31, 2023 |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | §103§112 | Final Rejection | 34d | Pending | Jul 28, 2023 |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | ENAD, CHRISTINE A | 2811 | Other | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18360486 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | SIPLING, KENNETH MARK | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 27, 2023 |
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | WALL, VINCENT | 2898 | §103 | Non-Final OA | 35d overdue | Pending | Jul 27, 2023 |
| 18360666 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Final Rejection | 26d | Pending | Jul 27, 2023 |
| 18227097 | SEMICONDUCTOR MANUFACTURING CHAMBER WITH PLASMA/GAS FLOW CONTROL DEVICE | CROWELL, ANNA M | 1716 | §103 | Non-Final OA | — | Pending | Jul 27, 2023 |
| 18360038 | SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER | GREWAL, HEIM KIRIN | 2812 | §103 | Non-Final OA | — | Pending | Jul 27, 2023 |
| 18226508 | COATER PHOTORESIST ARM SMART CENTERING JIG | KURPLE, KARL | 1717 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18358966 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | MARUF, SHEIKH | 2897 | — | Non-Final OA | 14d | Pending | Jul 26, 2023 |
| 18358267 | COMPOSITE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR | NARAGHI, ALI | 2817 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2023 |
| 18358255 | ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | — | Pending | Jul 25, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | LUKE, DANIEL M | 2896 | §103 | Non-Final OA | 5d | Pending | Jul 25, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 46d overdue | Pending | Jul 25, 2023 |
| 18357264 | IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE | MARUF, SHEIKH | 2897 | §103 | Final Rejection | — | Pending | Jul 24, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18357517 | OPTOELECTRONIC DEVICE INCLUDING A VERTICAL-CAVITY SURFACE EMITTING LASER DIODE | CAMACHO ALANIS, FERNANDA ADRIANA | 2828 | §103 | Non-Final OA | — | Pending | Jul 24, 2023 |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 21, 2023 |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | SIPLING, KENNETH MARK | 2818 | §103 | Final Rejection | 2d overdue | Pending | Jul 20, 2023 |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 42d overdue | Pending | Jul 18, 2023 |
| 18353691 | GATE HEIGHT OPTIMIZATION | HOANG, TUAN A | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 17, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | BERRY, PAUL ANTHONY | 2898 | §102§103 | Final Rejection | 37d overdue | Pending | Jul 14, 2023 |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | WILCZEWSKI, MARY A | 2898 | §102§112 | Final Rejection | 8d | Pending | Jul 14, 2023 |
| 18221985 | TRANSISTORS WITH IMPROVED THERMAL STABILITY | SIPLING, KENNETH MARK | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 14, 2023 |
| 18351784 | QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 9d | Pending | Jul 13, 2023 |
| 18352071 | GATE HARD MASK DESIGN FOR IMPROVED SOURCE/DRAIN FORMATION | KOO, LAMONT B | 2813 | §102§103 | Final Rejection | — | Pending | Jul 13, 2023 |
| 18350512 | DESIGN-FOR-TEST CIRCUITS AND METHODS OF OPERATING THE SAME | GARBOWSKI, LEIGH M | 2851 | §102 | Non-Final OA | — | Pending | Jul 11, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 10, 2023 |
| 18348741 | ELECTROSTATIC DISCHARGE IN GALLIUM NITRIDE DEVICES | PARK, SAMUEL | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 07, 2023 |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Jul 06, 2023 |
| 18218927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIM, JAY C | 2815 | §102 | Final Rejection | 26d | Pending | Jul 06, 2023 |
| 18347542 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | BOOTH, RICHARD A | 2812 | §103 | Final Rejection | — | Pending | Jul 05, 2023 |
| 18346568 | ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18346506 | HIGH EFFICIENCY OPTICAL COUPLER | PETKOVSEK, DANIEL | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18346772 | SEMICONDUCTOR DEVICE HAVING LOW-RESISTANCE GATE CONNECTOR | NARAGHI, ALI | 2817 | §103§112 | Final Rejection | 3d overdue | Pending | Jul 03, 2023 |
| 18346267 | METHOD AND SYSTEM OF ARRANGING PATTERNS OF SEMICONDUCTOR DEVICE | REAMES, MATTHEW L | 1737 | §102§112Other | Non-Final OA | — | Pending | Jul 02, 2023 |
| 18346219 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | RAHMAN, MOIN M | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 01, 2023 |
| 18345552 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | 71d | Pending | Jun 30, 2023 |
| 18344860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CHUNG, ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18341205 | METALENS FOR NEAR INFRARED PHOTODETECTOR | LAU, EDMOND C | 2871 | §103§112 | Final Rejection | — | Pending | Jun 26, 2023 |
| 18340897 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Final Rejection | 22d overdue | Pending | Jun 26, 2023 |
| 18340843 | ACTIVE REGION TRIMMING AFTER FORMATION OF SOURCE/DRAIN COMPONENTS | KEAGY, ROSE ALYSSA | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 24, 2023 |
| 18339596 | METAL GATES FOR SEMICONDUCTOR DEVICES AND METHOD THEREOF | OZDEN, ILKER NMN | 2812 | §102§103 | Final Rejection | — | Pending | Jun 22, 2023 |
| 18338414 | FEFET DEVICE | WALL, VINCENT | 2898 | §103 | Final Rejection | — | Pending | Jun 21, 2023 |
| 18338984 | MEMORY DEVICE | AHMAD, KHAJA | 2813 | §103 | Final Rejection | 11d overdue | Pending | Jun 21, 2023 |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | 4d overdue | Pending | Jun 21, 2023 |
| 18338381 | DIELECTRIC WAVEGUIDE FOR TRANSMITTING ELECTRICAL SIGNAL AND METHOD OF FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18337963 | Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Copper Redistribution Layer Scheme | AU, BAC H | 2898 | §103 | Non-Final OA | — | Pending | Jun 20, 2023 |
| 18337262 | METHODS OF SELECTING DEVICES IN CIRCUIT DESIGN | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Jun 19, 2023 |
| 18336435 | PACKAGE STRUCTURE WITH DUMMY DIE | TRAN, TRANG Q | 2811 | §102§103§112 | Non-Final OA | 63d | Pending | Jun 16, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | 15d | Pending | Jun 15, 2023 |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | §103 | Final Rejection | 32d overdue | Pending | Jun 14, 2023 |
| 18334630 | NOISE TRANSISTOR | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Final Rejection | — | Pending | Jun 14, 2023 |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | FERNANDES, ERROL V | 2893 | §102 | Final Rejection | 26d | Pending | Jun 12, 2023 |
| 18332837 | HIGH VOLTAGE RESISTOR WITH HIGH VOLTAGE JUNCTION TERMINATION | LIN, JOHN | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2023 |
| 18332054 | THRESHOLD VOLTAGE TUNING USING A MULTIPLE DIPOLE LOOP PROCESS FOR CFET DEVICES | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Jun 09, 2023 |
| 18331897 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | KUSUMAKAR, KAREN M | 2897 | §102§103 | Non-Final OA | 26d | Pending | Jun 08, 2023 |
| 18331745 | SEMICONDUCTOR STRUCTURE WITH REDUCED LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME | CHUNG, ANDREW | 2898 | §102§103§112 | Non-Final OA | 84d | Pending | Jun 08, 2023 |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | KIM, JAY C | 2815 | §103§112 | Final Rejection | 27d | Pending | Jun 06, 2023 |
| 18329356 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | SHEKER, RHYS PONIENTE | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jun 05, 2023 |
| 18327179 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | JEAN BAPTISTE, WILNER | 2899 | §102§103 | Final Rejection | — | Pending | Jun 01, 2023 |
| 18326494 | SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION | LU, JIONG-PING | 1713 | §103 | Final Rejection | 20d | Pending | May 31, 2023 |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §102§103§112 | Final Rejection | 15d overdue | Pending | May 29, 2023 |
| 18324729 | WRAP-AROUND SILICIDE LAYER | FAYETTE, NATHALIE RENEE | 2812 | §102§103 | Final Rejection | — | Pending | May 26, 2023 |
| 18324580 | OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT MATERIAL | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | May 26, 2023 |
| 18323732 | STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | Pending | May 25, 2023 |
| 18323465 | STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE | NARAGHI, ALI | 2817 | §103Other | Non-Final OA | — | Pending | May 25, 2023 |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §103 | Non-Final OA | 53d overdue | Pending | May 24, 2023 |
| 18322882 | SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF MAKING | MUNOZ, ANDRES F | 2818 | §102§112DP | Non-Final OA | — | Pending | May 24, 2023 |
| 18321844 | METHOD FOR PERFORMING TRENCH ISOLATION PROCESS | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | — | Pending | May 23, 2023 |
| 18200886 | METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY | DEGRASSE, IAN ISAAC | 2818 | §102§103§112 | Non-Final OA | — | Pending | May 23, 2023 |
| 18321281 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | PROSTOR, ANDREW VICTOR | 2812 | §103 | Final Rejection | — | Pending | May 22, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18320724 | MOS-BASED DESIGN SOLUTIONS FOR SOLVING WELL-PID | RAHIM, NILUFA | 2893 | §103 | Final Rejection | — | Pending | May 19, 2023 |
| 18320398 | PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | May 19, 2023 |
| 18320020 | DEEP TRENCH CAPACITORS | WILLS-BURNS, CHINEYERE D | 2673 | §102§103 | Non-Final OA | — | Pending | May 18, 2023 |
| 18318865 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | May 17, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | CHEN, JACK S J | 2893 | §103 | Non-Final OA | — | Pending | May 12, 2023 |
| 18315868 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION | LU, JIONG-PING | 1713 | §102§103 | Non-Final OA | — | Pending | May 11, 2023 |
| 18316146 | P-DIPOLE MATERIAL FOR STACKED TRANSISTORS | HOANG, TUAN A | 2898 | §112 | Final Rejection | 2d overdue | Pending | May 11, 2023 |
| 18313459 | FLAT OPTICS CAMERA MODULE FOR HIGH QUALITY IMAGING | TABA, MONICA TERESA | 2872 | §103 | Non-Final OA | — | Pending | May 08, 2023 |
| 18312766 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | LI, MEIYA | 2811 | §112 | Non-Final OA | — | Pending | May 05, 2023 |
| 18312012 | WAFER BONDING APPARATUS AND METHOD | GHYKA, ALEXANDER G | 2812 | §103 | Final Rejection | — | Pending | May 04, 2023 |
| 18312199 | COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | §102§103 | Final Rejection | 49d overdue | Pending | May 04, 2023 |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | — | Pending | May 03, 2023 |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | 2818 | §102§103 | Non-Final OA | 34d | Pending | Apr 28, 2023 |
| 18308026 | DIELECTRIC GAS SPACER FORMATION FOR REDUCING PARASITIC CAPACITANCE IN A TRANSISTOR INCLUDING NANOSHEET STRUCTURES | LEE, DA WEI | 2817 | §102 | Final Rejection | 8d overdue | Pending | Apr 27, 2023 |
| 18307793 | SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME | CHANG, JAY C | 2817 | §102§103§112 | Final Rejection | — | Pending | Apr 26, 2023 |
| 18139266 | PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §102§103DP | Non-Final OA | — | Pending | Apr 25, 2023 |
| 18305698 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | LAOBAK, ANDREW KEELAN | 1713 | §101§103 | Non-Final OA | 83d | Pending | Apr 24, 2023 |
| 18305514 | SEMICONDUCTOR DEVICE STRUCTURE WITH EXPANSION FILM AND METHOD FOR FORMING THE SAME | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Apr 24, 2023 |
| 18138597 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Apr 24, 2023 |
| 18304913 | BACKSIDE VIA AND METAL GATE SEPARATION | DAS, PINAKI | 2898 | §103 | Final Rejection | — | Pending | Apr 21, 2023 |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | OH, JIYOUNG | 2818 | §103 | Final Rejection | — | Pending | Apr 21, 2023 |
| 18137288 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | CHACKO DAVIS, DABORAH | 1737 | §103 | Final Rejection | 4d overdue | Pending | Apr 20, 2023 |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | MUNOZ, ANDRES F | 2818 | §103 | Final Rejection | — | Pending | Apr 20, 2023 |
| 18302987 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | KIM, JAY C | 2815 | §102 | Final Rejection | — | Pending | Apr 19, 2023 |
| 18303137 | SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18303551 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18302010 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Apr 18, 2023 |
| 18302775 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Final Rejection | — | Pending | Apr 18, 2023 |
| 18301524 | GUARD RING STRUCTURE AND METHOD FORMING SAME | HOANG, TUAN A | 2898 | §102 | Non-Final OA | — | Pending | Apr 17, 2023 |
| 18299691 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | WALL, VINCENT | 2898 | §103 | Non-Final OA | 34d | Pending | Apr 12, 2023 |
| 18299427 | SEMICONDUCTOR STRUCTURE AND METHOD FOR CORE-ONLY DESIGN | LIN, ARIC | 2851 | §101§103 | Non-Final OA | — | Pending | Apr 12, 2023 |
| 18298503 | WAFER CARRIER HAVING INSPECTION WINDOW AND OPERATING METHOD THEREOF | NGUYEN, LEON VIET Q | 2663 | §103 | Non-Final OA | — | Pending | Apr 11, 2023 |
| 18298031 | METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING | GOURLIE, LAURA ELOISE | 2881 | §103 | Final Rejection | 66d overdue | Pending | Apr 10, 2023 |
| 18297872 | STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR | MOTT, ADAM JOSEPH | 2817 | §102§103§112 | Non-Final OA | — | Pending | Apr 10, 2023 |
| 18298277 | Isolation Structures in Semiconductor Devices | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Apr 10, 2023 |
| 18296010 | SEMICONDUCTOR MEMORY DEVICES WITH IMPROVED PERFORMANCE | QUINTO, KEVIN V | 2893 | §102§103 | Final Rejection | — | Pending | Apr 05, 2023 |
| 18194709 | SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD | SYLVIA, CHRISTINA A | 2817 | §102 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18192704 | MICRO-RING WAVEGUIDE HEATER | BLEVINS, JERRY M | 2874 | §103 | Final Rejection | 43d overdue | Pending | Mar 30, 2023 |
| 18128601 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | GREWAL, HEIM KIRIN | 2812 | §103§112 | Non-Final OA | 17d overdue | Pending | Mar 30, 2023 |
| 18123749 | EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF | COSGROVE, JAYSON D | 1737 | §103 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18186778 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | FAYETTE, NATHALIE RENEE | 2812 | §102§103 | Final Rejection | 8d overdue | Pending | Mar 20, 2023 |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | GREEN, TELLY D | 2898 | §102Other | Non-Final OA | 29d | Pending | Mar 20, 2023 |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 20d | Pending | Mar 17, 2023 |
| 18185059 | CHARGE PUMP CIRCUIT AND METHOD | TRA, ANH QUAN | 2843 | §103Other | Final Rejection | 70d overdue | Pending | Mar 16, 2023 |
| 18181430 | Multi-Gate Devices And Method Of Forming The Same | CHUNG, ANDREW | 2898 | §103 | Final Rejection | 50d overdue | Pending | Mar 09, 2023 |
| 18179519 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | HUNTER III, CARNELL | 2893 | §103 | Final Rejection | — | Pending | Mar 07, 2023 |
| 18118498 | PELLICLE AND METHOD OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103 | Non-Final OA | — | Pending | Mar 07, 2023 |
| 18178522 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 05, 2023 |
| 18177909 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC SPACER AND METHOD FOR MANUFACTURING THE SAME | MARIN, JACOB RAUL | 2818 | §103 | Non-Final OA | 29d | Pending | Mar 03, 2023 |
| 18173086 | PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | 2899 | §103 | Non-Final OA | 5d | Pending | Feb 23, 2023 |
| 18171384 | SIMULATION MODEL AUTHENTICATION | GAN, CHUEN-MEEI | 4100 | §101§103 | Non-Final OA | — | Pending | Feb 20, 2023 |
| 18170845 | Interconnect Structure for Improving Memory Performance and/or Logic Performance | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | — | Pending | Feb 17, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 8d | Pending | Feb 16, 2023 |
| 18169594 | VOLTAGE SUPPLY SELECTION CIRCUIT AND METHODS FOR OPERATING THE SAME | ALMO, KHAREEM E | 2849 | §103 | Final Rejection | — | Pending | Feb 15, 2023 |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | PATEL, REEMA | 2812 | §112 | Final Rejection | 21d | Pending | Feb 15, 2023 |
| 18169579 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Feb 15, 2023 |
| 18168884 | SEMICONDUCTOR STRUCTURE WITH DEVICES HAVING DIFFERENT EFFECTIVE CHANNELS AND METHOD FOR MANUFACTURING THE SAME | DAS, PINAKI | 2898 | §102§103 | Final Rejection | — | Pending | Feb 14, 2023 |
| 18169177 | PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §102§103 | Non-Final OA | 42d overdue | Pending | Feb 14, 2023 |
| 18167081 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Final Rejection | — | Pending | Feb 10, 2023 |
| 18107658 | MULTICHANNEL TRANSISTORS WITH SOURCE/DRAIN REGIONS HAVING WAVY INNER PROFILES AND METHODS FOR MANUFACTURING THEREOF | DUREN, TIMOTHY EDWARD | 2817 | §103 | Non-Final OA | — | Pending | Feb 09, 2023 |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | DAS, PINAKI | 2898 | §103 | Non-Final OA | — | Pending | Feb 08, 2023 |
| 18165669 | ETCHING PROCESS WITH PROTECTED REGION | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§103 | Non-Final OA | — | Pending | Feb 07, 2023 |
| 18165292 | METHOD OF EXECUTING DESIGN FLOW WITH MACHINE LEARNING TECHNIQUES | NGUYEN, NHA T | 2851 | §103 | Final Rejection | 2d overdue | Pending | Feb 06, 2023 |
| 18163878 | COMPUTING CIRCUIT, COMPUTING METHOD, AND DECODER | DE LA GARZA, CARLOS HEBERTO | — | §112 | Non-Final OA | — | Pending | Feb 03, 2023 |
| 18164204 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | LEE, DA WEI | 2817 | §102§103 | Non-Final OA | — | Pending | Feb 03, 2023 |
| 18103676 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | NGUYEN, THANH T | 2893 | §102§103 | Final Rejection | — | Pending | Jan 31, 2023 |
| 18162318 | SEMICONDUCTOR DIE PACKAGE WITH SEAL RING DISCHARGE PATHS | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | — | Pending | Jan 31, 2023 |
| 18103664 | MEMORY DEVICES AND METHODS OF MANUFACTURING AND OPERATING THEREOF | STORMES, JOSEPH FIDELIS | 2825 | §102§103 | Final Rejection | — | Pending | Jan 31, 2023 |
| 18160697 | MULTI-BIT FLIP-FLOP REGION WITH SERPENTINE DATA FLOW PATH, SEMICONDUCTOR DEVICE INCLUDING SAME, METHOD OF OPERATING SAME AND METHOD OF MANUFACTURING SAME | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Jan 27, 2023 |
| 18100714 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | §103 | Final Rejection | 26d overdue | Pending | Jan 24, 2023 |
| 18158159 | METHOD AND SYSTEM TO GENERATE PERFORMANCE-DATA-LIBRARY ASSOCIATED WITH STANDARD-CELL-LIBRARY | KHAN, IFTEKHAR A | 2187 | §112 | Non-Final OA | — | Pending | Jan 23, 2023 |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 31d overdue | Pending | Jan 20, 2023 |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Non-Final OA | 3d overdue | Pending | Jan 20, 2023 |
| 18099482 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING OXIDE FILM AND METHOD FOR SUPPRESSING GENERATION OF LEAKAGE CURRENT | RAHMAN, MOIN M | 2898 | §103 | Non-Final OA | 46d | Pending | Jan 20, 2023 |
| 18099106 | DIE BONDING DEVICE, DIE BONDING METHOD AND VACUUM CONTROL METHOD FOR PICK-AND-PLACER THEREOF | BRAHJA, BRIAN | 3654 | §102§103§112 | Non-Final OA | — | Pending | Jan 19, 2023 |
| 18156369 | ACCELERATOR CIRCUIT, SEMICONDUCTOR DEVICE, AND METHOD FOR ACCELERATING CONVOLUTION CALCULATION IN CONVOLUTIONAL NEURAL NETWORK | KOWALIK, SKIELER ALEXANDER | 2142 | §103§112 | Final Rejection | — | Pending | Jan 18, 2023 |
| 18097970 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | MOJADDEDI, OMAR F | 2898 | §103 | Final Rejection | 20d | Pending | Jan 17, 2023 |
| 18155491 | IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME | MUNOZ, ANDRES F | 2818 | §103 | Non-Final OA | — | Pending | Jan 17, 2023 |
| 18096389 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18154017 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18153890 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | PATERSON, BRIGITTE A | 2896 | §102 | Non-Final OA | 27d | Pending | Jan 12, 2023 |
| 18153700 | GATE PROFILE TUNING FOR MULTIGATE DEVICE | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18152938 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Final Rejection | — | Pending | Jan 11, 2023 |
| 18152726 | INDUCTOR AND METHOD OF FORMING THE SAME | WEST, AISLIN MARIE | 2837 | §102§103 | Final Rejection | 5d overdue | Pending | Jan 10, 2023 |
| 18152715 | TRIMMING METHOD | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | 19d overdue | Pending | Jan 10, 2023 |
| 18152651 | SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STACK AND METHOD FOR FORMING THE SAME | OZDEN, ILKER NMN | 2812 | §103 | Non-Final OA | — | Pending | Jan 10, 2023 |
| 18152157 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 10, 2023 |
| 18150810 | COMPUTATION METHOD AND COMPUTATION APPARATUS WITH INPUT SWAPPING | WAJE, CARLO C | — | §101 | Non-Final OA | — | Pending | Jan 06, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | 2897 | §103 | Final Rejection | — | Pending | Jan 06, 2023 |
| 18150362 | PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Non-Final OA | 76d | Pending | Jan 05, 2023 |
| 18150539 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | 9d | Pending | Jan 05, 2023 |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | BELL, LAUREN R | 2896 | §103§112 | Final Rejection | 27d | Pending | Jan 04, 2023 |
| 18149393 | SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE AND METHOD FOR FORMING THE SAME | LASASSO, VICTOR JOSEPH | 2898 | §102 | Non-Final OA | — | Pending | Jan 03, 2023 |
| 18149215 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | 45d overdue | Pending | Jan 03, 2023 |
| 17994750 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURES | YEMELYANOV, DMITRIY | 2891 | §102§103 | Non-Final OA | — | Pending | Nov 28, 2022 |
| 17982587 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 08, 2022 |
| 17823508 | EMBEDDED SOI STRUCTURE FOR LOW LEAKAGE MOS CAPACITOR | MAI, ANH D | 2893 | §103 | Final Rejection | 7d | Pending | Aug 30, 2022 |
| 17898163 | POLISHING METROLOGY | ZAWORSKI, JONATHAN R | 3723 | §102§103§112 | Non-Final OA | — | Pending | Aug 29, 2022 |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 23d overdue | Pending | Aug 27, 2022 |
| 17896745 | WORD LINE STRUCTURES IN SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | Pending | Aug 26, 2022 |
| 17896081 | MEMORY DEVICE AND METHOD OF MAKING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 42d overdue | Pending | Aug 26, 2022 |
| 17896093 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Non-Final OA | 35d overdue | Pending | Aug 26, 2022 |
| 17822123 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Aug 24, 2022 |
| 17894169 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Aug 24, 2022 |
| 17894095 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | PRASAD, NEIL R | 2897 | §103 | Final Rejection | 70d | Pending | Aug 23, 2022 |
| 17891439 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | — | Pending | Aug 19, 2022 |
| 17890571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | BOULGHASSOUL, YOUNES | 2814 | §102§103§112 | Non-Final OA | — | Pending | Aug 18, 2022 |
| 17890199 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | MELLINGER, CORBYN DAVID | 2899 | §103 | Final Rejection | — | Pending | Aug 17, 2022 |
| 17889868 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Non-Final OA | — | Pending | Aug 17, 2022 |
| 17819987 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF FORMING SEMICONDUCTOR DEVICE | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | 8d | Pending | Aug 16, 2022 |
| 17887499 | A Semiconductor Package Comprising An Underfill Material That Extends to, And is Coplanar With, A Bottom Surface Of An Electrical Device | MIHALIOV, DMITRI | 2812 | §103 | Final Rejection | — | Pending | Aug 14, 2022 |
| 17819482 | POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17887122 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | KIELIN, ERIK J | 2814 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17886466 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | §102§103 | Final Rejection | 22d | Pending | Aug 11, 2022 |
| 17886053 | INSPECTION METHOD FOR PELLICLE MEMBRANE OF LITHOGRAPHY SYSTEM | FABIAN JR, ROBERTO | 2877 | §103 | Non-Final OA | 63d | Pending | Aug 11, 2022 |
| 17885870 | STRUCTURE AND METHOD OF SIGNAL ENHANCEMENT FOR ALIGNMENT PATTERNS | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | 1d overdue | Pending | Aug 11, 2022 |
| 17818369 | PHOTOMASK AND METHOD OF MANUFACTURING THE SAME | CLEVELAND, MICHAEL B | 1737 | §103 | Final Rejection | — | Pending | Aug 09, 2022 |
| 17881621 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SON, ERIKA HEERA | 2893 | §102§103§112 | Non-Final OA | 25d overdue | Pending | Aug 05, 2022 |
| 17880676 | TARGET MATERIAL IDENTIFICATION METHOD | FRITCHMAN, REBECCA M | 1758 | §103 | Final Rejection | 4d overdue | Pending | Aug 04, 2022 |
| 17880019 | EXTREME ULTRAVIOLET MASK WITH DIFFUSION BARRIER LAYER | CLEVELAND, MICHAEL B | 1700 | §102 | Final Rejection | — | Pending | Aug 03, 2022 |
| 17817023 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | NARAGHI, ALI | 2817 | §103 | Final Rejection | 15d overdue | Pending | Aug 03, 2022 |
| 17816208 | LIGHT-EMITTING PACKAGE AND FORMING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 10d overdue | Pending | Jul 29, 2022 |
| 17875975 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME | TRICE III, WILLIAM CLARENCE | 2893 | §102 | Non-Final OA | — | Pending | Jul 28, 2022 |
| 17815318 | PLASMA ETCHER EDGE RING WITH A CHAMFER GEOMETRY AND IMPEDANCE DESIGN | CHEN, KEATH T | 1716 | §103§112 | Non-Final OA | 30d overdue | Pending | Jul 27, 2022 |
| 17874192 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | GREEN, TELLY D | 2898 | §103 | Final Rejection | — | Pending | Jul 26, 2022 |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2022 |
| 17874057 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH HARD MASK LAYER OVER FIN STRUCTURE | WEGNER, AARON MICHAEL | 2897 | §103§112 | Final Rejection | 44d overdue | Pending | Jul 26, 2022 |
| 17814317 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LEE, ALVIN LYNGHI | 2813 | §103 | Final Rejection | — | Pending | Jul 22, 2022 |
| 17870341 | CO-OPTIMIZATION OF MEMORY AND LOGIC DEVICES BY SOURCE/DRAIN MODULATION AND STRUCTURES THEREOF | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | — | Pending | Jul 21, 2022 |
| 17869205 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WEGNER, AARON MICHAEL | 2897 | §103 | Final Rejection | 34d | Pending | Jul 20, 2022 |
| 17813637 | SEMICONDUCTOR ASSEMBLY | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Jul 20, 2022 |
| 17865399 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, THANH Y | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 15, 2022 |
| 17812700 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 14, 2022 |
| 17863175 | TIE OFF DEVICE | ADROVEL, WILLIAM | 2800 | §103 | Final Rejection | — | Pending | Jul 12, 2022 |
| 17811876 | THIN FILM DEPOSITION WITH IMPROVED CONTROL OF PRECURSOR | MOORE, KARLA A | 1716 | §103§112 | Final Rejection | — | Pending | Jul 11, 2022 |
| 17810626 | PACKAGE STRUCTURE WITH FAN-OUT STRUCTURE | BELL, LAUREN R | 2896 | §103§112 | Final Rejection | 6d | Pending | Jul 04, 2022 |
| 17857049 | SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CAPACITOR OR MEMEORY CELL | ALAM, MOHAMMED R | 2800 | §102§103§112 | Final Rejection | — | Pending | Jul 04, 2022 |
| 17855550 | EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY | LOGIE, MICHAEL J | 2881 | §103 | Final Rejection | 27d | Pending | Jun 30, 2022 |
| 17852768 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | HUNTER III, CARNELL | 2893 | §103§112 | Non-Final OA | — | Pending | Jun 29, 2022 |
| 17853543 | SEMICONDUCTOR STRUCTURE HAVING CONTACT PLUG | ZHU, SHENG-BAI | 2897 | §102§103 | Final Rejection | 22d overdue | Pending | Jun 29, 2022 |
| 17809432 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | — | Pending | Jun 28, 2022 |
| 17850734 | STACKED IMAGE SENSORS AND METHODS OF MANUFACTURING THEREOF | FLECK, LINDA JOAN | 2812 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17849720 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING 2D MATERIAL LAYER | MCCUTCHEON, COLIN RUSSELL | 2892 | §103§112 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17808175 | ANISOTROPIC WET ETCHING IN PATTERNING | MELLINGER, CORBYN DAVID | 2899 | §103 | Non-Final OA | — | Pending | Jun 22, 2022 |
| 17847075 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KOLAHDOUZAN, HAJAR | 2898 | §103 | Final Rejection | — | Pending | Jun 22, 2022 |
| 17841314 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK SURROUNDED BY STRAINED DIELECTRIC LAYER | WATTS, JEREMY DANIEL | 2800 | §103 | Non-Final OA | — | Pending | Jun 15, 2022 |
| 17838303 | FIN FIELD EFFECT TRANSSITOR (FinFET) STRUCTURE HAVING ISOLATION STRUCTURE INTERUPTING CONTINUITY OF SEMICONDUCTO FINS INTO SEGMENTED PORTIONS | MAI, ANH D | 2893 | §103 | Final Rejection | — | Pending | Jun 13, 2022 |
| 17838253 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2812 | §102§103 | Non-Final OA | 72d | Pending | Jun 12, 2022 |
| 17836781 | SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | SALAZ, SAMMANTHA KATELYN | 2892 | §102§103 | Final Rejection | 31d overdue | Pending | Jun 09, 2022 |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | REIDA, MOLLY KAY | 2899 | §103 | Final Rejection | 8d overdue | Pending | Jun 06, 2022 |
| 17833830 | EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | 9d overdue | Pending | Jun 06, 2022 |
| 17832380 | IMAGE SENSOR INTEGRATED CIRCUIT WITH ISOLATION STRUCTURE AND METHOD | XU, ZHIJUN | 2818 | §103 | Final Rejection | — | Pending | Jun 03, 2022 |
| 17805109 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | KHALIFA, MOATAZ | 2815 | §103 | Non-Final OA | — | Pending | Jun 02, 2022 |
| 17827223 | COMPUTE-IN-MEMORY DEVICES AND METHODS OF OPERATING THE SAME | RIVERA, MARIA DE JESUS | 2151 | §103 | Final Rejection | — | Pending | May 27, 2022 |
| 17824915 | EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION | VERDES, RICKY | 2898 | §103 | Non-Final OA | 2d overdue | Pending | May 26, 2022 |
| 17752580 | MEMORY DEVICES AND METHODS FOR OPERATING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §102§103 | Final Rejection | — | Pending | May 24, 2022 |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 5d | Pending | May 23, 2022 |
| 17747058 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTORS AND BACK-SIDE INTERCONNECT STRUCTURE COMPRISING POWER LINE | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Non-Final OA | — | Pending | May 18, 2022 |
| 17663108 | PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | 78d overdue | Pending | May 12, 2022 |
| 17736076 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | GUPTA, RAJ R | 2893 | §102§103 | Final Rejection | — | Pending | May 03, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | 8d overdue | Pending | Apr 22, 2022 |
| 17726036 | PHOTORESIST COMPOSITION WITH NOVEL SOLVENT | CHU, JOHN S Y | 1737 | §103§112 | Final Rejection | — | Pending | Apr 21, 2022 |
| 17726494 | FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Apr 21, 2022 |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | FORD, NATHAN K | 1716 | §103 | Final Rejection | 10d overdue | Pending | Apr 18, 2022 |
| 17722302 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §102§103 | Final Rejection | 8d | Pending | Apr 16, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | FOX, BRANDON C | 2818 | §102 | Final Rejection | 28d | Pending | Apr 15, 2022 |
| 17721814 | NEUROMORPHIC FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICE WITH ANTI-FERROELECTRIC BUFFER LAYER | SMITH, BRADLEY | 2817 | §102§103§112 | Non-Final OA | — | Pending | Apr 15, 2022 |
| 17721345 | ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF | LANDAU, MATTHEW C | 2800 | §103 | Final Rejection | — | Pending | Apr 14, 2022 |
| 17710545 | PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103 | Non-Final OA | — | Pending | Mar 31, 2022 |
| 17710218 | METHOD FOR LITHOGRAPHY USING MIDDLE LAYER WITH POROUS TOP SURFACE | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Mar 31, 2022 |
| 17703889 | PROGRAMMING CIRCUIT, INTEGRATED CIRCUIT, AND METHOD | KING, DOUGLAS | 2824 | §103 | Non-Final OA | — | Pending | Mar 24, 2022 |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 39d | Pending | Mar 23, 2022 |
| 17695839 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Mar 16, 2022 |
| 17674847 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | ASHBAHIAN, ERIC K | 2891 | §103§112 | Non-Final OA | — | Pending | Feb 18, 2022 |
| 17673728 | SEMICONDUCTOR PACKAGE STRUCTURE WITH MULTIPLE WAVEGUIDES | PURVIS, SUE A | 2800 | §102 | Final Rejection | — | Pending | Feb 16, 2022 |
| 17671813 | LOW RANDOM TELEGRAPH NOISE DEVICE | LOKE, STEVEN HO YIN | 2818 | §103 | Non-Final OA | — | Pending | Feb 15, 2022 |
| 17669378 | INTEGRATED CHIP, FERROELECTRIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | LI, MEIYA | 2811 | §103§112 | Final Rejection | — | Pending | Feb 11, 2022 |
| 17586664 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Jan 27, 2022 |
| 17585252 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | CRAMER, HALEE PAIGE | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 26, 2022 |
| 17577014 | TRAINING METHOD, OPERATING METHOD AND MEMORY SYSTEM | KAPOOR, DEVAN | 2126 | §101§103 | Non-Final OA | — | Pending | Jan 17, 2022 |
| 17577010 | SUBSTRATE PROCESS SYSTEM INCLUDING A COOLING STATION | SHIRSAT, VIVEK K | 3762 | §102§103 | Non-Final OA | 4d overdue | Pending | Jan 16, 2022 |
| 17575578 | DEVICE LEVEL THERMAL DISSIPATION | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | 162d overdue | Pending | Jan 13, 2022 |
| 17570710 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | Pending | Jan 07, 2022 |
| 17568654 | METAL GATE WITH PRETREATMENT LAYER | BOATMAN, CASEY PAUL | 2893 | §102§103 | Non-Final OA | 46d overdue | Pending | Jan 04, 2022 |
| 17558092 | MASK AND METHOD FOR FABRICATING THE SAME | ANGEBRANNDT, MARTIN J | 1737 | §103§112DPOther | Non-Final OA | 62d | Pending | Dec 21, 2021 |
| 17453105 | Gas Control in Semiconductor Processing | TADAYYON ESLAMI, TABASSOM | 1718 | §102§103 | Final Rejection | — | Pending | Nov 01, 2021 |
| 17486223 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §103 | Final Rejection | 11d overdue | Pending | Sep 27, 2021 |
| 17464460 | SEMICONDUCTOR MEMORY STRUCTURES HAVING A GREATER SOURCE AREA | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | — | Pending | Sep 01, 2021 |
| 17460909 | SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | 12d | Pending | Aug 30, 2021 |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | 79d overdue | Pending | Aug 30, 2021 |
| 17461398 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | WEILAND, ADAM DAVID | 2813 | §103§112 | Non-Final OA | — | Pending | Aug 30, 2021 |
| 17393381 | High Density 3 Dimensional Gate All Around Memory | HRNJIC, ADIN | 2817 | §103§112 | Final Rejection | — | Pending | Aug 03, 2021 |
| 17377772 | METHOD OF FORMING OXIDIZED REGION OF ANTI-FUSE MEMORY CELL | BAUMAN, SCOTT E | 2815 | §112 | Final Rejection | — | Pending | Jul 16, 2021 |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | §103 | Final Rejection | 9d | Pending | Jun 07, 2021 |
| 17322769 | Bonding Pad on a Back Side Illuminated Image Sensor | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | — | Pending | May 17, 2021 |
| 17246496 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §103 | Non-Final OA | — | Pending | Apr 30, 2021 |
| 17302054 | DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | HRNJIC, ADIN | 2817 | §103 | Non-Final OA | — | Pending | Apr 22, 2021 |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 10d overdue | Pending | Nov 25, 2020 |
| 16549153 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103 | Non-Final OA | — | Pending | Aug 23, 2019 |
| 19274981 | Package with Improved Heat Dissipation Efficiency and Method for Forming the Same | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | — | Pending | Jul 21, 2025 |
| 19170096 | ARTIFICIAL INTELLIGENCE ACCELERATOR DEVICE | SUN, MICHAEL | — | §103Other | Non-Final OA | — | Pending | Apr 04, 2025 |
| 18983284 | METHOD AND APPARATUS FOR DEFECT-TOLERANT MEMORY-BASED ARTIFICIAL NEURAL NETWORK | PHAM, LY D | — | DP | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18946633 | STORAGE FOR EXTREME ULTRAVIOLET LIGHT LITHOGRAPHY | WHITESELL, STEVEN H | 1759 | §101DP | Non-Final OA | — | Pending | Nov 13, 2024 |
| 18797233 | AIRFLOW ADJUST SYSTEM FOR WORKPIECE TOOL AND METHOD OF OPERATING THE SAME | KIM, PETER B | 2882 | §103§112 | Non-Final OA | — | Pending | Aug 07, 2024 |
| 18790426 | STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE | BUI, THA-O H | 2825 | §103 | Final Rejection | 2d overdue | Pending | Jul 31, 2024 |
| 18790674 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790908 | CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE | MACARTHUR, SYLVIA | 1716 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791017 | 3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS | TRINH, MINH N | 3729 | DP | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18788717 | DEPOSITION APPARATUS AND METHOD WITH EM RADIATION | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | 2d overdue | Pending | Jul 30, 2024 |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ISAAC, STANETTA D | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789598 | SYSTEMS AND METHODS FOR WAFER BOND MONITORING | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789042 | FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING | GONDARENKO, NATALIA A | 2891 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788633 | SELECTIVE DUAL SILICIDE FORMATION USING A MASKLESS FABRICATION PROCESS FLOW | YEUNG LOPEZ, FEIFEI | 2899 | §112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789253 | DEPOSITION SYSTEM AND METHOD | OTT, PATRICK S | 1794 | §101§103§112 | Non-Final OA | 77d | Pending | Jul 30, 2024 |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | SPALLA, DAVID C | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787755 | AUTOMATED MATERIAL HANDLING SYSTEMS | YANCHUS III, PAUL B | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786724 | Conductive Features with Air Spacer and Method of Forming Same | CRAWFORD EASON, LATANYA N | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787978 | SEMICONDUCTOR DEVICE, METHOD AND TOOL OF MANUFACTURE | TRINH, MINH N | 3729 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786821 | FLUORINE PASSIVATION IN A PIXEL SENSOR | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786529 | SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND METHODS OF MANUFACTURE | LOHAKARE, PRATIKSHA JAYANT | — | DP | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18785381 | SEMICONDUCTOR DEVICES WITH IMPROVED CAPACITORS | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785053 | Semiconductor Devices and Methods of Manufacture | VU, VU A | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786382 | CLAMP RING AND METHOD OF USING CLAMP RING | HALL JR, TYRONE VINCENT | — | §102§103Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785596 | SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES | RAHMAN, MOHAMMAD A | — | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786321 | MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION SYSTEMS | NEIBAUR, ROBERT F | — | §112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785156 | Chip Package Structure with Bump | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785442 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | — | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785172 | RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME | HOQUE, MOHAMMAD M | — | §103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18783688 | IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING | CHAMBLISS, ALONZO | — | §102§112DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783765 | EUV METALLIC RESIST PERFORMANCE ENHANCEMENT VIA ADDITIVES | CHU, JOHN S Y | 1737 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783807 | 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME | GEYER, SCOTT B | — | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784541 | EDGE COUPLERS AND METHODS OF MAKING THE SAME | WONG, TINA MEI SENG | 2874 | Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784675 | APPARATUS AND METHODS FOR THREE DIMENSIONAL RETICLE DEFECT SMART REPAIR | SHARIFF, MICHAEL ADAM | — | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783614 | FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782959 | Transducer Device and Method of Manufacture | ARMSTRONG, JONATHAN D | 3645 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783352 | SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE | WILCZEWSKI, MARY A | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 2882 | §101§112Other | Final Rejection | 8d overdue | Pending | Jul 24, 2024 |
| 18783277 | SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION | MARKMAN, MAKENA | — | §102§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782667 | SYSTEM AND METHOD FOR DYNAMICALLY ADJUSTING THIN-FILM DEPOSITION PARAMETERS | KHUU, HIEN DIEU THI | 2116 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782900 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING DEPOSITION | RAHIM, NILUFA | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782473 | PARTIAL DIRECTIONAL ETCH METHOD AND RESULTING STRUCTURES | SPALLA, DAVID C | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782460 | INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME | SEDOROOK, DAVID PAUL | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783347 | INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING | MUNOZ, ANDRES F | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782214 | EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS | WILCZEWSKI, MARY A | — | §102§103§112DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780927 | GATE-ALL-AROUND DEVICES HAVING SELF-ALIGNED CAPPING BETWEEN CHANNEL AND BACKSIDE POWER RAIL | YI, CHANGHYUN | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780824 | Semiconductor Device and Manufacturing Method of Semiconductor Device | CRAWFORD EASON, LATANYA N | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780838 | Fully Self-Aligned Interconnect Structure | MATTABONI, TIMOTHY JAMES | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780748 | CUT METAL GATE IN MEMORY MACRO EDGE AND MIDDLE STRAP | MEHTA, RATISHA | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781721 | SYSTEM AND METHOD FOR DETECTING DEBRIS IN A PHOTOLITHOGRAPHY SYSTEM | RIDDLE, CHRISTINA A | 2882 | §112 | Final Rejection | 8d overdue | Pending | Jul 23, 2024 |
| 18781059 | SEMICONDUCTOR DEVICE AND METHOD | TRAN, TAN N | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780081 | MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS | NGUYEN, CUONG B | 2872 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778258 | SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FORMING THE SAME | CHAMBLISS, ALONZO | — | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778763 | Integrated Circuit Package and Method | DANG, PHUC T | — | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777250 | METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR DEVICES | FAN, SU JYA | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777198 | SEMICONDUCTOR DEVICES | GHYKA, ALEXANDER G | — | §102DP | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18775995 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | OH, JIYOUNG | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775808 | Nanostructure Field-Effect Transistor Device and Method of Forming | YI, CHANGHYUN | — | Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774289 | BOTTOM-UP FORMATION OF CONTACT PLUGS | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774296 | Backside Vias in Semiconductor Device | SPALLA, DAVID C | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774512 | DUMMY FIN PROFILE CONTROL TO ENLARGE GATE PROCESS WINDOW | STEVENSON, ANDRE C | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773292 | SELF-HEALING POLISHING PAD | DEO, DUY VU NGUYEN | 1713 | §103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18771311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | NIX, NORA TAYLOR | 2891 | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771551 | INTERFACE PROFILE CONTROL IN EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES | YI, CHANGHYUN | 2812 | Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771674 | SEMICONDUCTOR DEVICE GATE STRUCTURES | YI, CHANGHYUN | 2812 | §102§103Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770919 | METHODS OF FORMING EPITAXIAL STRUCTURES IN FIN-LIKE FIELD EFFECT TRANSISTORS | TRAN, THANH Y | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18769781 | PARASITIC CAPACITANCE REDUCTION | LI, MEIYA | — | §112 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770022 | Reinforcing Package Using Reinforcing Patches | TOBERGTE, NICHOLAS J | — | §112Other | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768702 | EPITAXY REGIONS EXTENDING BELOW STI REGIONS AND PROFILES THEREOF | VALENZUELA, PATRICIA D | — | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767858 | CIRCUITS AND METHODS FOR COMPENSATING A MISMATCH IN A SENSE AMPLIFIER | BEGUM, SULTANA | 2824 | DP | Final Rejection | 59d overdue | Pending | Jul 09, 2024 |
| 18767848 | STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES | SCHOENHOLTZ, JOSEPH | 2893 | §112Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766881 | FIN FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING THE SAME | SLUTSKER, JULIA | — | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766246 | COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS | KIELIN, ERIK J | — | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766336 | BSI CHIP WITH BACKSIDE ALIGNMENT MARK | TAYLOR, EARL N | — | §102§112 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766300 | SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES | JONES, ERIC W | 2892 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18762702 | PROCESSES FOR REDUCING LINE-END SPACING | LU, JIONG-PING | — | DP | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18762706 | DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR | DIALLO, MAMADOU L | 2897 | DP | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18753130 | Metal Gates and Methods of Forming Thereby | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753240 | DIELECTRIC SPACER TO PREVENT CONTACTING SHORTING | RAMALLO, GUSTAVO G | 2812 | DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18750737 | Source/Drain Feature to Contact Interfaces | MUNOZ, ANDRES F | — | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18748008 | NOVEL THIN FILM RESISTOR | JONES, ERIC W | 2892 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18747623 | NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME | KOO, LAMONT B | — | §102 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18743529 | HIGH-DENSITY MEMORY CELLS AND LAYOUTS THEREOF | SMET, UYEN TRAN | 2824 | §102 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18741756 | ANTENNA DEVICE | MUSE, ISMAIL A | — | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18733107 | FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME | STEVENSON, ANDRE C | 2899 | DP | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18731752 | OPTICAL FIBER COUPLING STRUCTURE FOR PHOTONIC PACKAGE | LE, UYEN CHAU N | — | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18679788 | SEMICONDUCTOR PACKAGE AND METHOD | IQBAL, HAMNA FATHIMA | — | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18680053 | SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES | MARIN, JACOB RAUL | — | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18677641 | CMP METHOD AND SYSTEM WITH NANOBUBBLE CLEANING | HAWKINS, JASON KHALIL | — | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18674634 | LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF | RODELA, EDUARDO A | — | DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18672485 | LOW-STRESS PASSIVATION LAYER | OH, JAEHWAN | — | §102 | Non-Final OA | — | Pending | May 23, 2024 |
| 18672546 | CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER | PARKER, JOHN M | — | DP | Non-Final OA | — | Pending | May 23, 2024 |
| 18671497 | GATE PATTERNING PROCESS FOR MULTI-GATE DEVICES | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18671732 | Contact Structures With Deposited Silicide Layers | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18668911 | GATE ISOLATION FOR MULTIGATE DEVICE | JUNG, MICHAEL YOO LIM | 2898 | §102 | Non-Final OA | — | Pending | May 20, 2024 |
| 18661969 | AIR SPACER FOR A GATE STRUCTURE OF A TRANSISTOR | RAHMAN, MOHAMMAD A | — | §102§103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662374 | DUAL SILICIDE STRUCTURE AND METHODS THEREOF | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 13, 2024 |
| 18663038 | DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF | GUMEDZOE, PENIEL M | — | §102 | Non-Final OA | — | Pending | May 13, 2024 |
| 18657170 | DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME | OZDEN, ILKER NMN | — | §102§103§112DP | Non-Final OA | — | Pending | May 07, 2024 |
| 18655568 | MEMORY DEVICES WITH GATE ALL AROUND TRANSISTORS | TRAN, ANTHAN | 2825 | §102§103 | Final Rejection | 36d overdue | Pending | May 06, 2024 |
| 18654298 | NANOSHEET FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18655086 | INTEGRATED CIRCUIT WITH NANOSTRUCTURE TRANSISTORS AND FLEXIBLE BOTTOM SOURCE/DRAIN EPITAXY FOR DEVICE PERFORMANCE | LEE, CHEUNG | — | §102§103§112 | Non-Final OA | — | Pending | May 03, 2024 |
| 18648917 | Die Stacking Structure and Method Forming Same | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18647260 | SEMICONDUCTOR DEVICES | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646870 | Interconnect Structure of Semiconductor Device | QUINTO, KEVIN V | 2893 | §103DP | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646326 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | WONG, ERIC K | 2874 | §102§112 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646469 | CMOS IMAGE SENSOR STRUCTURE | CHAN, CANDICE | 2813 | §103§112 | Non-Final OA | 25d overdue | Pending | Apr 25, 2024 |
| 18646459 | PLANARIZATION PROCESS AND METHOD | PHAM, THOMAS T | 1713 | §103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644770 | Semiconductor Device and Method of Manufacture | AHMAD, KHAJA | 2813 | §103 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18644657 | GAPFILL STRUCTURE AND MANUFACTURING METHODS THEREOF | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18643212 | Depositing and Oxidizing Silicon Liner for Forming Isolation Regions | BOULGHASSOUL, YOUNES | 2814 | §102§112DP | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643324 | ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING | NGUYEN, KHIEM D | — | §102§103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643083 | SEMICONDUCTOR DEVICE HAVING ISOLATION LINER AND METHOD OF MANUFACTURING THEREOF | CHOWDHURY, AFROZA Y | — | §102§103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18641904 | Gate-All-Around Field-Effect Transistors In Integrated Circuits | KIM, TONG-HO | 2811 | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18641927 | Apparatus and Bonding Process for Wafer Bonding | JEAN BAPTISTE, WILNER | — | — | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18635641 | ASYMMETRIC EPITAXY REGIONS FOR LANDING CONTACT PLUG | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635834 | MERGED SOURCE/DRAIN FEATURES | OZDEN, ILKER NMN | 2897 | §103DP | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635461 | NEGATIVE CAPACITANCE TRANSISTOR WITH EXTERNAL FERROELECTRIC STRUCTURE | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18627789 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628112 | AIR SPACERS FOR SEMICONDUCTOR DEVICES | BOULGHASSOUL, YOUNES | — | §102§103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628173 | SEMICONDUCTOR PACKAGE AND METHOD | JUNG, MICHAEL YOO LIM | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18625651 | REDUCE WELL DOPANT LOSS IN FINFETS THROUGH CO-IMPLANTATION | JEAN BAPTISTE, WILNER | 2897 | — | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18619605 | BEVEL SEALING SYSTEM AND METHOD OF USING THE SAME | SCHOENHOLTZ, JOSEPH | — | DP | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619983 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MOONEY, MICHAEL P | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18618815 | SELF-ALIGNED BARRIER FOR METAL VIAS | BOULGHASSOUL, YOUNES | — | §102§103Other | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18616604 | CONNECTOR FOR OPTICAL FIBER ALIGNMENT | PEACE, RHONDA S | 2874 | §102§103 | Final Rejection | 6d | Pending | Mar 26, 2024 |
| 18610375 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD | MCFARLAND, TYLER JAMES | 3723 | §103 | Final Rejection | — | Pending | Mar 20, 2024 |
| 18602392 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF | KIELIN, ERIK J | 2814 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18600931 | THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE | TRAPANESE, WILLIAM C | 2812 | §103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18600172 | INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS OF FORMING THE SAME | HARBOTTLE, CHARLOTTE ELIZABETH | 4100 | §103 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597219 | SEMICONDUCTOR DEVICE AND METHOD | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18594463 | EPITAXIAL BLOCKING LAYER FOR MULTI-GATE DEVICES AND FABRICATION METHODS THEREOF | RAHMAN, MOHAMMAD A | 2898 | §102 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18594694 | WAVEGUIDES AND METHODS OF FORMING THE SAME | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18593364 | Treating the Dielectric Films Under the Bottoms of Source/Drain Regions | SMITH, SAMUEL JONATHAN | 2817 | §103 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18593661 | SEMICONDUCTOR DEVICE | KIM, SU C | 2899 | §103 | Final Rejection | — | Pending | Mar 01, 2024 |
| 18591923 | GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE | KIM, SU C | 2899 | DPOther | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18584165 | VERTICAL RESISTIVE MEMORY DEVICE AND RELATED METHOD | BODNAR, JOHN A | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18582326 | Forming Multiple TSVs with Different Formation Schemes | FOX, BRANDON C | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18581604 | Methods, Structures and Devices for Intra-Connection Structures | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18582240 | SELF-ALIGNED METHOD FOR FORMING AN OPTICAL MODULATOR | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103 | Final Rejection | 15d | Pending | Feb 20, 2024 |
| 18581153 | TRANSISTORS HAVING NANOSTRUCTURES | TAYLOR, EARL N | 2896 | §102§103§112 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18442747 | SELECTIVE FORMATION OF ETCH STOP LAYERS AND THE STRUCTURES THEREOF | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18437139 | SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Feb 08, 2024 |
| 18434553 | DEVICE OF DIELECTRIC LAYER | DINKE, BITEW A | 2812 | §102§103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18431117 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | MOONEY, MICHAEL P | 2874 | §103 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18420595 | Multiple Polymer Layers as the Encapsulant of Conductive Vias | BOEGEL, CHEVY JACOB | 2812 | §102 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18415784 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | RADKOWSKI, PETER | 2874 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §102§103§112 | Final Rejection | 21d | Pending | Jan 18, 2024 |
| 18416410 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | MOHAMED-ALY, KAREEM M | 2898 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415426 | PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME | RAHIM, NILUFA | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18412779 | SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME | LI, MEIYA | 2811 | §103§112 | Non-Final OA | — | Pending | Jan 15, 2024 |
| 18410301 | Semiconductor Packages and Methods of Forming | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18405526 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHOD | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405973 | INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405844 | STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE | HOQUE, MOHAMMAD M | 2817 | §112 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404762 | INSPECTION SYSTEM WITH MULTIWAVELENGTH LIGHT SOURCE AND METHOD | NGUYEN, KEMAYA DEANN HUU | 2877 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404639 | DIFFRACTION-BASED OVERLAY MARK DESIGN | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404785 | FIELD EFFECT TRANSISTOR WITH RECRYSTALLIZED SOURCE/DRAINS AND METHOD | SEVEN, EVREN | 2812 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403531 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | RAHLL, JERRY T | 2874 | §102§103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403326 | SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401851 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, TINA MEI SENG | 2874 | §103 | Non-Final OA | 34d | Pending | Jan 02, 2024 |
| 18401789 | Power Switches in Interconnect Structures and the Method Forming the Same | KARIMY, TIMOR | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402039 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | LEBENTRITT, MICHAEL | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402166 | CFETS AND THE METHODS OF FORMING THE SAME | RAHMAN, MOHAMMAD A | 2898 | §102 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18400949 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | JEAN BAPTISTE, WILNER | 2899 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18529948 | CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18526445 | SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME | TURNER, BRIAN | — | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 24d overdue | Pending | Dec 01, 2023 |
| 18525988 | HIGH PERFORMANCE MOSFETS HAVING VARYING CHANNEL STRUCTURES | SARKER-NAG, AKHEE | 2893 | §103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526920 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | CHIEM, DINH D | 2874 | §103 | Final Rejection | — | Pending | Dec 01, 2023 |
| 18520414 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | CHA, GRACE YEH-EUN SAET | 2897 | §102§103 | Non-Final OA | 70d | Pending | Nov 27, 2023 |
| 18517577 | Gradually Changed Dummy Pattern Distribution Around TSVs | BLACKWELL, ASHLEY NICOLE | 2897 | §103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18515842 | Semiconductor Device, Method and Machine of Manufacture | BERMAN, JASON | 1794 | §103 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18516147 | SELECTIVE DEPOSITION OF MASK FOR REDUCING NANO SHEET LOSS | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18513957 | Packages with Implantation | CLINTON, EVAN GARRETT | 2899 | §103 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18514356 | BASE LAYOUT CELL | DOAN, NGHIA M | — | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | 71d | Pending | Nov 20, 2023 |
| 18512146 | WAFER CHUCK ASSEMBLY | KACKAR, RAM N | 1716 | §103§112 | Final Rejection | — | Pending | Nov 17, 2023 |
| 18510523 | SEAL RING STRUCTURE AND METHOD OF FORMING SAME | PARTHASARATHY, ROHIT | 2899 | §102§103§112 | Non-Final OA | — | Pending | Nov 15, 2023 |
| 18506747 | DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FORMING SAME | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506641 | DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES | OH, JIYOUNG | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18504874 | ENABLING MULTI-VT IN CFETS WITH COMMON GATES AND A COMMON DIPOLE DOPANT | SQUIRES, BRETT STEPHEN | 2899 | §102§103 | Non-Final OA | — | Pending | Nov 08, 2023 |
| 18503892 | CFETs and the Methods of Forming the Same | RAHMAN, MOHAMMAD A | 2898 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2023 |
| 18502485 | ANTI-PLASMA COATING | GRUSBY, REBECCA LYNN | 1785 | §102§103§112 | Final Rejection | 5d | Pending | Nov 06, 2023 |
| 18501653 | PATTERNING METHOD AND STRUCTURES RESULTING THEREFROM | WILCZEWSKI, MARY A | — | §102§103Other | Non-Final OA | — | Pending | Nov 03, 2023 |
| 18500593 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | CHU, JOHN S Y | 1737 | §103§112 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | ANDERSON, WILLIAM H | 2817 | §102§103§112 | Final Rejection | 23d | Pending | Nov 01, 2023 |
| 18498697 | CFET WITH VIA FUSE STRUCTURE AND METHOD | MALEK, MALIHEH | 2813 | §102§103§112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18495495 | Packages with Power Switches and Power User Circuits Separated in Different Dies | NGUYEN, CUONG B | 2818 | §102§103 | Non-Final OA | — | Pending | Oct 26, 2023 |
| 18493187 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | — | Pending | Oct 24, 2023 |
| 18491237 | MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Final Rejection | — | Pending | Oct 20, 2023 |
| 18490014 | PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING | ZHU, SHENG-BAI | 2897 | §102§103§112 | Final Rejection | 27d | Pending | Oct 19, 2023 |
| 18483657 | FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS | MCDONALD, JASON ANDREW | 2898 | §103§112 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18482122 | DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY ENHANCEMENT | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18482632 | INTEGRATED CIRCUIT PACKAGES AND METHODS | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18375593 | MIXED COMPLEMENTARY FIELD EFFECT AND UNIPOLAR TRANSISTORS AND METHODS OF FORMING THE SAME | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478592 | INTEGRATED CIRCUIT PACKAGE AND METHOD | SYLVIA, CHRISTINA A | 2817 | §103 | Final Rejection | — | Pending | Sep 29, 2023 |
| 18467020 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MANHEIM, MARC ETIENNE | 2874 | §103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18463596 | BACKSIDE GATE CONTACT, BACKSIDE GATE ETCH STOP LAYER, AND METHODS OF FORMING SAME | GREAVING, JASON JAMES | 2893 | §103 | Final Rejection | 5d overdue | Pending | Sep 08, 2023 |
| 18462499 | FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | — | Pending | Sep 07, 2023 |
| 18459171 | INTEGRATED CIRCUIT PACKAGE AND METHOD | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §103§112 | Non-Final OA | 45d overdue | Pending | Aug 31, 2023 |
| 18240065 | SEMICONDUCTOR PACKAGE AND METHOD | PARENDO, KEVIN A | 2896 | §102§103 | Final Rejection | 31d overdue | Pending | Aug 30, 2023 |
| 18451982 | BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | Aug 18, 2023 |
| 18451984 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | WONG, ERIC K | 2874 | §102§103 | Final Rejection | 43d overdue | Pending | Aug 18, 2023 |
| 18450475 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Aug 16, 2023 |
| 18232986 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18448337 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | ROLAND, CHRISTOPHER M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18447890 | IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103§112 | Non-Final OA | 146d overdue | Pending | Aug 10, 2023 |
| 18447913 | SOURCE/DRAIN REGIONS IN COMPLEMENTARY FIELD EFFECT TRANSISTORS AND METHODS OF FORMING THE SAME | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447149 | SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18232181 | Profile Control Of Gate Structures In Semiconductor Devices | HOANG, TUAN A | 2898 | §103 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18446858 | WAFER DRYING SYSTEM | YUEN, JESSICA JIPING | 3762 | §103§112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18366848 | GATE STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | PIZARRO CRESPO, MARCOS D | 2814 | §102§103 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18366370 | STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE | KOO, LAMONT B | 2813 | §102§103 | Final Rejection | — | Pending | Aug 07, 2023 |
| 18230793 | MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 2813 | §102§103 | Final Rejection | 66d overdue | Pending | Aug 07, 2023 |
| 18364332 | PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | THOMASON, DARBY MARGARET | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 02, 2023 |
| 18363444 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Aug 01, 2023 |
| 18362755 | SEMICONDUCTOR DEVICE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362649 | System Formed Through Package-In-Package Formation | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112Other | Final Rejection | 8d overdue | Pending | Jul 31, 2023 |
| 18228288 | Biological Device And Biosensing Method Thereof | EOM, ROBERT J | 1797 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18361152 | STACKED TRANSISTOR CHANNEL REGIONS AND METHODS OF FORMING THE SAME | CHOI, CALVIN Y | 2812 | §103 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18359396 | Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen | ZAWORSKI, JONATHAN R | 3723 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18359180 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18355889 | PREVENTING GATE-TO-CONTACT BRIDGING BY REDUCING CONTACT DIMENSIONS IN FINFET SRAM | AISAKA, BRYCE M | — | §112 | Non-Final OA | — | Pending | Jul 20, 2023 |
| 18355884 | SLURRY ENHANCEMENT FOR POLISHING SYSTEM | SOTO, CHRISTOPHER ASHLEY | 3723 | §103§112Other | Non-Final OA | — | Pending | Jul 20, 2023 |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | ENAD, CHRISTINE A | 2811 | §102§103 | Final Rejection | 18d overdue | Pending | Jul 19, 2023 |
| 18351099 | Volume-Less Dipole Incorporation into CFET Having Common Gate | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 56d overdue | Pending | Jul 07, 2023 |
| 18347188 | Optical Transceiver and Manufacturing Method Thereof | STAHL, MICHAEL J | 2874 | §112 | Final Rejection | — | Pending | Jul 05, 2023 |
| 18346113 | METHOD OF PRODUCING MASK DATA FOR SEMICONDUCTOR DEVICE MANUFACTURING | AISAKA, BRYCE M | 2851 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18345303 | Barrier Free Tungsten Liner in Contact Plugs and The Method Forming the Same | HOANG, TUAN A | 2898 | §103§112 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18344615 | SEMICONDUCTOR DEVICE | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Final Rejection | 84d | Pending | Jun 29, 2023 |
| 18343680 | DEVICE HAVING HYBRID NANOSHEET STRUCTURE AND METHOD | DAS, PINAKI | 2898 | §102§103 | Non-Final OA | 30d | Pending | Jun 28, 2023 |
| 18338107 | Multi-Level Stacking of Wafers and Chips | GOODWIN, DAVID J | 2817 | §103DP | Final Rejection | — | Pending | Jun 20, 2023 |
| 18334650 | Redistribution Lines and The Method Forming the Same Through Stitching | ABRAHAM, JOSE K | 3729 | §112 | Non-Final OA | — | Pending | Jun 14, 2023 |
| 18333197 | SRAM CELL WITH BALANCED WRITE PORT | JUNGE, BRYAN R. | 2897 | §102 | Non-Final OA | 40d | Pending | Jun 12, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 13d | Pending | Jun 05, 2023 |
| 18328207 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | OZDEN, ILKER NMN | 2812 | §103 | Non-Final OA | 34d | Pending | Jun 02, 2023 |
| 18328502 | CRYSTALLIZATION TEMPERATURE REDUCTION OF HIGH-K DIELECTRIC LAYER | SARKER-NAG, AKHEE | 2893 | §103 | Non-Final OA | 38d overdue | Pending | Jun 02, 2023 |
| 18327557 | LEAKAGE ANALYSIS ON SEMICONDUCTOR DEVICE | TAT, BINH C | 2851 | §102Other | Non-Final OA | — | Pending | Jun 01, 2023 |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | KIELIN, ERIK J | 2814 | §102§103§112 | Final Rejection | 17d overdue | Pending | Jun 01, 2023 |
| 18324894 | SYSTEM AND METHOD FOR HEATING SEMICONDUCTOR WAFERS | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | May 26, 2023 |
| 18324544 | Optical Device and Method of Manufacture | MANHEIM, MARC ETIENNE | 2874 | §103 | Non-Final OA | — | Pending | May 26, 2023 |
| 18320566 | LITHOGRAPHY SYSTEM AND METHODS | ANGEBRANNDT, MARTIN J | 1737 | §103§112 | Final Rejection | — | Pending | May 19, 2023 |
| 18172240 | DEVICE WITH THROUGH VIA AND RELATED METHODS | SEHAR, FAKEHA | 2893 | §102§103§112 | Final Rejection | — | Pending | May 17, 2023 |
| 18317003 | METHOD AND SYSTEM FOR PERFORMING CHEMICAL MECHANICAL POLISHING | ZAWORSKI, JONATHAN R | 3723 | §103§112 | Final Rejection | 52d overdue | Pending | May 12, 2023 |
| 18313705 | METHOD OF MODELING A MASK BY TAKING INTO ACCOUNT OF MASK PATTERN EDGE INTERACTION | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Final Rejection | 30d | Pending | May 08, 2023 |
| 18194748 | Blocking Structures on Isolation Structures | BERRY, PAUL ANTHONY | 2898 | §102§103 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18193405 | Multi-Blade Trimming and Dressing Tool | MARKMAN, MAKENA | 3723 | §102§103§112 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18188929 | PRE-TREATMENT APPARATUS | TUROCY, DAVID P | 1718 | §103 | Final Rejection | 46d | Pending | Mar 23, 2023 |
| 18188314 | Crystallization of High-K Dielectric Layer | HOANG, TUAN A | 2898 | §102 | Final Rejection | 15d | Pending | Mar 22, 2023 |
| 18186413 | Optical Device and Method of Manufacture | ST CYR, DANIEL | 2876 | §102 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18181085 | SEMICONDUCTOR DEVICES WITH ASYMMETRIC SOURCE/DRAIN DESIGN | OZDEN, ILKER NMN | 2812 | §102§103§112 | Final Rejection | — | Pending | Mar 09, 2023 |
| 18175266 | SWITCHABLE POWER SUPPLY | TRAN, NGUYEN | 2838 | §102§103 | Non-Final OA | 14d | Pending | Feb 27, 2023 |
| 18167755 | WORKPIECE PLATING AND RINSE APPARATUS AND METHOD | RUFO, LOUIS J | 1795 | §102§103§112 | Final Rejection | — | Pending | Feb 10, 2023 |
| 18156978 | INTEGRATED CIRCUIT INCLUDING EFUSE CELL | RAHIM, NILUFA | 2893 | §102§103§112Other | Final Rejection | 15d overdue | Pending | Jan 19, 2023 |
| 18152409 | Defect Inspection System and Method | REVERMAN, CHAD ANDREW | 2877 | §103 | Non-Final OA | 54d | Pending | Jan 10, 2023 |
| 18152454 | Etch Stop Region for Semiconductor Device Substrate Thinning | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 9d overdue | Pending | Jan 10, 2023 |
| 18151843 | DUAL BAND FAN OUT DEVICE AND METHOD | MILLER, ALEXANDER MICHAEL | 2898 | §103§112 | Final Rejection | — | Pending | Jan 09, 2023 |
| 18151856 | Die Structures and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §103 | Final Rejection | 13d | Pending | Jan 09, 2023 |
| 18150912 | SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING | PATERSON, BRIGITTE A | 2896 | §102 | Non-Final OA | 22d | Pending | Jan 06, 2023 |
| 18151413 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Jan 06, 2023 |
| 18150256 | INTEGRATED CIRCUIT PACKAGES AND METHODS | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 17892344 | SEMICONDUCTOR PACKAGE AND METHOD | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | 132d overdue | Pending | Aug 22, 2022 |
| 17819381 | Semiconductor Device and Method of Manufacture | ISAAC, STANETTA D | 2898 | §102§103 | Non-Final OA | 295d overdue | Pending | Aug 12, 2022 |
| 17882817 | HIGH VOLTAGE DEVICE | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | 23d | Pending | Aug 08, 2022 |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 8d overdue | Pending | Aug 02, 2022 |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | 100d overdue | Pending | Jul 27, 2022 |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17815078 | Semiconductor Device and Method of Manufacturing the Same | KEAGY, ROSE ALYSSA | 2818 | §103 | Non-Final OA | — | Pending | Jul 26, 2022 |
| 17813839 | Processes for Removing Spikes from Gates | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Jul 20, 2022 |
| 17868635 | Methods Of Forming Metal Gate Spacer | CULBERT, CHRISTOPHER A | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2022 |
| 17860228 | USING REDUCED READ ENERGY BASED ON THE PARTIAL-SUM | GUDAS, JAKOB OSCAR | 2151 | §101 | Non-Final OA | 70d | Pending | Jul 08, 2022 |
| 17858985 | Inner Spacers for Gate-All-Around Semiconductor Devices | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17855529 | METAL ETCHING WITH IN SITU PLASMA ASHING | NUCKOLS, TIFFANY Z | 1716 | §103 | Non-Final OA | — | Pending | Jun 30, 2022 |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 10d overdue | Pending | Jun 14, 2022 |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | KIELIN, ERIK J | 2814 | §102§103 | Non-Final OA | 71d | Pending | Jun 10, 2022 |
| 17837312 | HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | GUPTA, RAJ R | 2893 | §103 | Non-Final OA | — | Pending | Jun 10, 2022 |
| 17833419 | MEMORY STRUCTURE WITH DOPING-INDUCED LEAKAGE PATHS | SON, ERIKA HEERA | 2893 | §103 | Non-Final OA | — | Pending | Jun 06, 2022 |
| 17833208 | Semiconductor Device and Method Forming Same | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | — | Pending | Jun 06, 2022 |
| 17805034 | Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same | HRNJIC, ADIN | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jun 02, 2022 |
| 17825748 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Non-Final OA | — | Pending | May 26, 2022 |
| 17752730 | ON-LINE ANALYSIS SYSTEM AND METHOD FOR SPECIALTY GASSES | GZYBOWSKI, MICHAEL STANLEY | 1798 | §103 | Non-Final OA | 30d | Pending | May 24, 2022 |
| 17752558 | TRANSDUCER DEVICE AND METHOD OF MANUFACTURE | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | — | Pending | May 24, 2022 |
| 17750145 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | — | Pending | May 20, 2022 |
| 17750148 | SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT | TALBOT, BRIAN K | 1712 | §103 | Final Rejection | — | Pending | May 20, 2022 |
| 17663683 | Semiconductor Package and Method | SCHODDE, CHRISTOPHER A | 2898 | §103 | Non-Final OA | — | Pending | May 17, 2022 |
| 17663692 | SEMICONDUCTOR PACKAGE AND METHOD | FOX, BRANDON C | 2818 | §112 | Non-Final OA | — | Pending | May 17, 2022 |
| 17745562 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | DEGRASSE, IAN ISAAC | 2818 | §103 | Final Rejection | — | Pending | May 16, 2022 |
| 17737810 | PHOTORESIST COMPOSITION AND METHODS OF USE | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | — | Pending | May 05, 2022 |
| 17717731 | METHOD OF FORMING A SEMICONDUCTOR DEVICE HAVING A LOWER CONDUCTIVE LAYER OF A MULTI-LAYERED STRUCTURE BEING PLASMA TREATED BEFORE FORMING A SECOND CONDUCTIVE LAYER | MAI, ANH D | 2893 | §103 | Final Rejection | — | Pending | Apr 11, 2022 |
| 17711885 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A GATE MASK COMPOSING OF A SEMICONDUCTOR LAYER OVER A DIELECTRIC LAYER FORMED ON GATE ELECTRODE | MAI, ANH D | 2893 | §102§103 | Non-Final OA | — | Pending | Apr 01, 2022 |
| 17699314 | PLASMA-ASSISTED ETCHING OF METAL OXIDES | CHAN, LAUREEN | 1716 | §103§112 | Non-Final OA | — | Pending | Mar 21, 2022 |
| 17681346 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | — | Pending | Feb 25, 2022 |
| 17675558 | Methods of Manufacturing Semiconductor Devices | NGUYEN, DUY T V | 2818 | §103§112 | Final Rejection | 29d | Pending | Feb 18, 2022 |
| 17651335 | Packages With Deep Bond Pads and Method Forming Same | DEGRASSE, IAN ISAAC | 2818 | §103 | Non-Final OA | — | Pending | Feb 16, 2022 |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 15d overdue | Pending | Feb 15, 2022 |
| 17669953 | High Voltage ESD Protection Apparatus | BELL, LAUREN R | 2896 | §112DP | Final Rejection | — | Pending | Feb 11, 2022 |
| 17582563 | SEMICONDUCTOR DEVICE AND METHOD | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §103§112 | Non-Final OA | — | Pending | Jan 24, 2022 |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | STEVENSON, ANDRE C | 2899 | §103 | Final Rejection | — | Pending | Jan 20, 2022 |
| 17562794 | SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | Dec 27, 2021 |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 31d overdue | Pending | Jul 22, 2021 |
| 17352133 | DEPOSITION SYSTEM AND METHOD | KURPLE, KARL | 1717 | §103Other | Non-Final OA | 26d | Pending | Jun 18, 2021 |
| 17318810 | GATE BASED RESISTANCE CONTROL UNITS | MCINTOSH, ANDREW T | 2144 | §103 | Final Rejection | — | Pending | May 12, 2021 |
| 17316155 | Recessed STI as the Gate Dielectric of HV Device | TRAN, DZUNG | 2893 | §103 | Non-Final OA | — | Pending | May 10, 2021 |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | SWEELY, KURT D | 1718 | §103§112 | Non-Final OA | 50d | Pending | Apr 16, 2021 |
| 17150044 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §103 | Non-Final OA | 79d | Pending | Jan 15, 2021 |
| 17107420 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103§112 | Non-Final OA | 30d | Pending | Nov 30, 2020 |
| 17068375 | System and Method of Chemical Mechanical Polishing | POON, DANA LEE | 3723 | §103 | Non-Final OA | — | Pending | Oct 12, 2020 |
| 16927638 | Pre-Clean for Contacts | ALEJANDRO MULERO, LUZ L | 1716 | §103 | Final Rejection | — | Pending | Jul 13, 2020 |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 35d | Pending | May 08, 2020 |
| 16395895 | PCRAM STRUCTURE | CHEN, YU | 2896 | §103§112 | Non-Final OA | — | Pending | Apr 26, 2019 |
| 19047179 | LOW NOISE RING OSCILLATOR DEVICES AND METHODS | SHIN, JEFFREY M | 2849 | Other | Non-Final OA | 30d overdue | Pending | Feb 06, 2025 |
| 18093472 | LOW RESISTANCE BOTTOM ELECTRODE VIA | TRAN, TONY | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 19004372 | ADHESIVE TAPE APPLICATION SYSTEM TO MODIFY THE ADHESIVE STRENGTH OF THE ADHESIVE TAPE AND METHOD OF APPLYING THE ADHESIVE TAPE | RAIMUND, CHRISTOPHER W | 1746 | §102§103 | Non-Final OA | — | Pending | Dec 29, 2024 |
| 18991656 | METHOD FOR ERROR CORRECTION CODING WITH MULTIPLE HASH GROUPINGS AND DEVICE FOR PERFORMING THE SAME | BRITT, CYNTHIA H | 2111 | §112DP | Non-Final OA | — | Pending | Dec 22, 2024 |
| 18984182 | Multi-Fuse Memory Cell Circuit and Method | NGUYEN, VIET Q | — | §102 | Non-Final OA | — | Pending | Dec 17, 2024 |
| 18959802 | Turbo Mode SRAM for High Performance | SMET, UYEN TRAN | — | §103DP | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18894342 | TEST SYSTEM WITH IMPROVED CONTACT BLADE DESIGN AND METHODS OF USING THE SAME | ASTACIO-OQUENDO, GIOVANNI | 2858 | DP | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18808430 | POLISHING MATERIAL SUPPLY SYSTEM AND RELATED METHODS | HUANG, STEVEN | 3723 | §102§103 | Non-Final OA | — | Pending | Aug 19, 2024 |
| 18789786 | SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF | MANDALA, MICHELLE | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789626 | MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME | GAMINO, CARLOS J | 1735 | §103§112 | Final Rejection | 38d overdue | Pending | Jul 30, 2024 |
| 18788082 | ORGANIC GATE TFT-TYPE STRESS SENSORS AND METHOD OF MAKING AND USING THE SAME | FOX, BRANDON C | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787593 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | WINTERS, SEAN AYERS | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18783713 | PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET | MURATA, AUSTIN | 1718 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18779017 | TRANSISTOR INCLUDING AN ACTIVE REGION AND METHODS FOR FORMING THE SAME | LEE, EUGENE | 2815 | §103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18771856 | Semiconductor Structure | KIM, SU C | 2899 | §112DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18768106 | PLATING SYSTEM AND METHOD OF PLATING WAFER | CHUNG, HOSUNG CHARLES | 1794 | Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767239 | Zero Mask High Density Capacitor | TYNES JR., LAWRENCE C | — | DP | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18745271 | LIQUID DETECTION APPARATUS AND METHOD OF DETECTING LIQUID IN WAFER PROCESSING DEVICE | MAINI, RAHUL | 2858 | §103Other | Final Rejection | — | Pending | Jun 17, 2024 |
| 18743329 | INSPECTION TOOL FOR FIBER ARRAY UNIT (FAU) QUALITY MONITORING IN THE CO-PACKAGED OPTICS APPLICATION AND METHODS FOR INSPECTING USNG THE SAME | NGUYEN, SANG H | 2877 | — | Final Rejection | 30d | Pending | Jun 14, 2024 |
| 18731672 | EMERGENCY RESPONSE SYSTEM | CHUNG, MONG-SHUNE | 2118 | §103Other | Final Rejection | 43d overdue | Pending | Jun 03, 2024 |
| 18661935 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE INCLUDING A PRECISION PROOF MASS ELEMENT AND METHODS FOR FORMING THE SAME | ABDELAZIEZ, YASSER A | 2898 | §102 | Non-Final OA | — | Pending | May 13, 2024 |
| 18661907 | SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS | LIU, MIKKA H | 2817 | §102§103Other | Non-Final OA | — | Pending | May 13, 2024 |
| 18647104 | HYBRID-BONDING STACK INCLUDING A PROCESSOR DIE AND MULTI-CACHE-LEVEL MEMORY DIES AND METHODS OF FORMING THE SAME | KIM, JAY C | — | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18641473 | BONDING SCHEME TO PROVIDE IMPROVED COPLANARITY AND HIGH JOINT YIELDS WITH REDUCED COSTS AND METHODS FOR FORMING THE SAME | LEE, EUGENE | — | §103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18636401 | Method of Forming Transistor | TRICE III, WILLIAM CLARENCE | 2811 | §102§103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18631092 | OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORMING THE SAME | KIM, TONG-HO | — | §102§103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18607702 | Auto Calibration Dead-Time Control Circuit | GBLENDE, JEFFREY A | 2838 | §103§112 | Non-Final OA | — | Pending | Mar 18, 2024 |
| 18601062 | CARRIER MODIFICATION DEVICES FOR AVOIDING CHANNEL LENGTH REDUCTION AND METHODS FOR FABRICATING THE SAME | CHOI, CALVIN Y | 2812 | §102§103Other | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18600838 | SEMICONDUCTOR DEVICE INCLUDING A TEST LINE PORTION AND METHOD OF MAKING AND TESTING THE SAME | TRAPANESE, WILLIAM C | 2812 | §102 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18596501 | VERTICAL HETEROSTRUCTURE SEMICONDUCTOR MEMORY CELL AND METHODS FOR MAKING THE SAME | LEE, CHEUNG | 2812 | DP | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18591150 | PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC PACKAGES AND METHODS OF FORMING THE SAME | KIANNI, KAVEH C | 2874 | §103Other | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18434886 | ELECTROPLATING PROCESS USING A PROXIMITY MASK WITH AN OVERHANG AND AN APPARATUS FOR PERFORMING THE SAME | VAN, LUAN V | — | §112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18422479 | MEMORY DEVICE WITH FLAT-TOP BOTTOM ELECTRODES AND METHODS FOR FORMING THE SAME | MILLER, JAMI VALENTINE | 2818 | §112 | Final Rejection | 35d overdue | Pending | Jan 25, 2024 |
| 18421102 | TUNABLE PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC SYSTEMS AND METHODS OF FORMING THE SAME | LEPISTO, RYAN A | 2874 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18416783 | FERROELECTRIC TUNNEL JUNCTION DEVICES WITH METAL-FE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | MARUF, SHEIKH | 2897 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18402773 | POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMING THE SAME | PHAM, LONG | 2897 | §102 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402778 | SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME | GHYKA, ALEXANDER G | 2812 | §112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402016 | PHOTONIC ASSEMBLY INCLUDING AN EMBEDDED OPTICAL CONNECTOR DIE AND METHODS FOR FORMING THE SAME | LEPISTO, RYAN A | 2874 | §102 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402059 | PACKAGE SHUTTLE FOR ENHANCED PACKAGE HANDLING RELIABILITY AND METHODS FOR FORMING THE SAME | CORNELY, JOHN PATRICK | 2812 | §103§112 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18526331 | SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUMPS AND METHOD OF MAKING THE SAME | HSIEH, HSIN YI | 2899 | §112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18511976 | MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRUCTURE | TUGBANG, ANTHONY D | — | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18501062 | PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE WITH A RECESSED PORTION AND METHODS OF FORMING THE SAME | RODELA, EDUARDO A | 2893 | §103 | Final Rejection | — | Pending | Nov 03, 2023 |
| 18496969 | PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMING THE SAME | SLUTSKER, JULIA | 2891 | §102§103§112 | Non-Final OA | — | Pending | Oct 30, 2023 |
| 18484541 | SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS FOR FORMING THE SAME | TAN, DAVE | 2897 | §103 | Non-Final OA | — | Pending | Oct 11, 2023 |
| 18475292 | SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHODS FOR FORMING THE SAME | RAHIM, NILUFA | 2893 | §102§103 | Non-Final OA | — | Pending | Sep 27, 2023 |
| 18457523 | REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | PARTHASARATHY, ROHIT | 2899 | §103 | Final Rejection | — | Pending | Aug 29, 2023 |
| 18456567 | ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USING THE SAME | HUNTER III, CARNELL | 2893 | §102§103 | Non-Final OA | — | Pending | Aug 28, 2023 |
| 18452601 | SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSIONS AND METHODS FOR FORMING THE SAME | TYNES JR., LAWRENCE C | 2899 | §103§112 | Final Rejection | — | Pending | Aug 21, 2023 |
| 18366725 | RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME | KIM, JAY C | 2815 | §112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18230864 | TRANSISTOR INCLUDING HYDROGEN DIFFUSION BARRIER FILM AND METHODS OF FORMING SAME | NICELY, JOSEPH C | 2813 | §103 | Final Rejection | — | Pending | Aug 07, 2023 |
| 18362251 | SYSTEMS FOR IMPROVED EFFICIENCY OF BALL MOUNT CLEANING AND METHODS FOR USING THE SAME | ORTA, LAUREN GRACE | 1711 | §103§112 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18359009 | POST-TREATMENT PROCESSES FOR ION BEAM ETCHING OF MAGNETIC TUNNEL JUNCTION AND STRUCTURES FORMED BY THE SAME | LEGASPI, EUGENE REY DEVERA | 3729 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18357797 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | BOULGHASSOUL, YOUNES | 2814 | §103 | Final Rejection | 36d overdue | Pending | Jul 24, 2023 |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | FAN, SU JYA | 2818 | §102§103 | Final Rejection | 22d overdue | Pending | Jul 10, 2023 |
| 18323481 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 34d | Pending | May 25, 2023 |
| 18317118 | PHASE CHANGE MATERIAL SWITCH INCLUDING AN IONIC RESISTANCE CHANGE MATERIAL HEATING ELEMENT AND METHODS FOR FORMING THE SAME | CHAN, CANDICE | 2813 | §103§112 | Non-Final OA | — | Pending | May 15, 2023 |
| 18310556 | PHASE CHANGE MATERIAL SWITCH FOR LOW POWER CONSUMPTION AND METHODS FOR FORMING THE SAME | TRAN, THANH Y | 2817 | §102§112 | Non-Final OA | — | Pending | May 02, 2023 |
| 18307036 | PACKAGE PICK-UP APPARATUS AND METHODS FOR USING THE SAME | CHIN, PAUL T | 3632 | §103 | Non-Final OA | — | Pending | Apr 26, 2023 |
| 18304638 | PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Apr 21, 2023 |
| 18126630 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | KIM, JAY C | 2815 | §102§112 | Final Rejection | — | Pending | Mar 27, 2023 |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | CHANG, JAY C | 2817 | §102§103 | Final Rejection | 10d overdue | Pending | Mar 01, 2023 |
| 18110134 | BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFORMING THE SAME | PATEL, DEVANG R | 1735 | §103 | Non-Final OA | — | Pending | Feb 15, 2023 |
| 17882655 | SEMICONDUCTOR PACKAGE WITH A STACKED FILM STRUCTURE TO REDUCE CRACKING AND DELAMINATION AND METHODS OF MAKING THE SAME | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Non-Final OA | — | Pending | Aug 08, 2022 |
| 17874366 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17842672 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 28d | Pending | Jun 16, 2022 |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | §103 | Non-Final OA | 3d overdue | Pending | Jun 02, 2022 |
| 17828064 | PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME | RAHMAN, MOIN M | 2898 | §103§112 | Non-Final OA | — | Pending | May 31, 2022 |
| 17828066 | SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | §112 | Final Rejection | 34d | Pending | May 31, 2022 |
| 17750426 | CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXER-DISPENSER AND METHODS FOR OPERATING THE SAME | SOTO, CHRISTOPHER ASHLEY | 3723 | §103§112 | Non-Final OA | — | Pending | May 23, 2022 |
| 17749204 | BOOTH MULTIPLIER FOR COMPUTE-IN-MEMORY | LE, PHAT NGOC | 2182 | §102§103 | Non-Final OA | — | Pending | May 20, 2022 |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | NGUYEN, CUONG B | 2818 | §102§103§112 | Final Rejection | 4d overdue | Pending | May 03, 2022 |
| 17716010 | PROCESSING APPARATUS AND METHOD OF MANUFACTURE | LOGIE, MICHAEL J | 2800 | §102§103DP | Non-Final OA | — | Pending | Apr 08, 2022 |
| 17708348 | SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS OF FORMING THE SAME | DINKE, BITEW A | 2812 | §103 | Non-Final OA | 14d | Pending | Mar 30, 2022 |
| 17654927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | BELL, LAUREN R | 2896 | §102§103 | Final Rejection | 1d overdue | Pending | Mar 15, 2022 |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | — | Pending | Mar 10, 2022 |
| 17647263 | SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Non-Final OA | — | Pending | Jan 06, 2022 |
| 17565220 | WORK FUNCTION MATERIAL AND MANUFACTURING PROCESS THEREOF | ASHBAHIAN, ERIC K | 2891 | §103 | Final Rejection | — | Pending | Dec 29, 2021 |
| 17367698 | SEMICONDUCTOR ARRANGEMENT INCLUDING A SPACER ADJACENT A CONDUCTIVE LAYER AND METHOD OF MAKING | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2021 |
| 17306414 | THIN-FILM TRANSISTORS HAVING HYBRID CRYSTALLINE SEMICONDUCTOR CHANNEL LAYER AND METHODS OF FORMING THE SAME | CHEN, JACK S J | 2893 | §112 | Final Rejection | — | Pending | May 03, 2021 |
| 16880038 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | May 21, 2020 |
| 18790469 | COUPLING MONITORING SYSTEM | SMITH, MAURICE C | 2877 | §102§103§112 | Final Rejection | — | Pending | Jul 31, 2024 |
| 18748954 | OSCILLATOR CIRCUIT, LAYOUT, AND METHOD | SHIN, JEFFREY M | — | §102 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18598580 | METHOD OF FABRICATING TRANSISTOR HAVING EXPANDED GATE STRUCTURE, AND TRANSISTOR FABRICATED THEREBY | DINKE, BITEW A | 2812 | §102§103Other | Non-Final OA | — | Pending | Mar 07, 2024 |
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