797 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 19227765 | SPACER FILM SCHEME FORM POLARIZATION IMPROVEMENT | SASINOWSKI, ANDREW | 2625 | Non-Final OA | Jun 04, 2025 |
| 19177677 | CHEMICAL MECHANICAL POLISHING METHOD | ALANKO, ANITA KAREN | 1713 | Non-Final OA | Apr 14, 2025 |
| 19069350 | Programmable Regulator Voltage Controlled Ring Oscillator | GANNON, LEVI | 2849 | Non-Final OA | Mar 04, 2025 |
| 19027299 | MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE | KLIMOWICZ, WILLIAM JOSEPH | 2688 | Non-Final OA | Jan 17, 2025 |
| 19010611 | SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL | MCDONALD, RODNEY GLENN | 1794 | Non-Final OA | Jan 06, 2025 |
| 19005512 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PATTERN FORMATION METHOD | WEDDLE, ALEXANDER MARION | 1712 | Non-Final OA | Dec 30, 2024 |
| 18970786 | MULTIPLEXING CIRCUIT, OUTPUT STAGE, AND SEMICONDUCTOR DEVICE | RETEBO, METASEBIA T | 2842 | Non-Final OA | Dec 05, 2024 |
| 18968522 | SENSE AMPLIFIER FOR COUPLING EFFECT REDUCTION | O NEILL, PATRICK | 2842 | Non-Final OA | Dec 04, 2024 |
| 18936254 | MEMORY ADDRESS PROTECTION CIRCUIT AND METHOD OF OPERATING SAME | KNAPP, JUSTIN R | 2112 | Non-Final OA | Nov 04, 2024 |
| 18919584 | System and Method for Data Communication | TIEU, JANICE N | 2633 | Non-Final OA | Oct 18, 2024 |
| 18795067 | INSPECTION APPARATUS AND METHODS OF USING THE SAME | WONG, ALLEN C | 2488 | Non-Final OA | Aug 05, 2024 |
| 18794560 | MEMORY DEVICES WITH REDUCED TIMING VARIATION AND METHODS FOR OPERATING THE SAME | HILTUNEN, THOMAS J | 2849 | Final Rejection | Aug 05, 2024 |
| 18789694 | WET CLEANING METHOD | ZHANG, RICHARD Z | 1714 | Non-Final OA | Jul 31, 2024 |
| 18790793 | METHOD OF FAST SURFACE PARTICLE AND SCRATCH DETECTION FOR EUV MASK BACKSIDE | AHMED, JAMIL | 2877 | Non-Final OA | Jul 31, 2024 |
| 18790776 | WAFER WET CLEANING SYSTEM | PARIHAR, PRADHUMAN | 1714 | Non-Final OA | Jul 31, 2024 |
| 18789837 | RECONFIGURABLE IN-MEMORY PHYSICALLY UNCLONABLE FUNCTION DEVICE AND METHOD OF OPERATING THE SAME | BUI, THA-O H | 2825 | Non-Final OA | Jul 31, 2024 |
| 18790547 | MEMORY CIRCUITS WITH REGISTER CIRCUTIS AND METHODS FOR OPERATING THE SAME | REECE, CHRISTOPHER LANE | 2824 | Non-Final OA | Jul 31, 2024 |
| 18789745 | APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING | PARIHAR, PRADHUMAN | 1714 | Non-Final OA | Jul 31, 2024 |
| 18790477 | POWER LOSS REGULATION CIRCUIT | TRAN, ANH Q | 2844 | Final Rejection | Jul 31, 2024 |
| 18790595 | FLOATING DATA LINE CIRCUIT AND METHOD | HOANG, HUAN | 2827 | Non-Final OA | Jul 31, 2024 |
| 18791080 | DECOUPLING CAPACITOR CIRCUITS | TRA, ANH QUAN | 2843 | Non-Final OA | Jul 31, 2024 |
| 18789140 | MEMORY DEVICE HAVING A COMPARATOR CIRCUIT | ALROBAIE, KHAMDAN N | 2824 | Non-Final OA | Jul 30, 2024 |
| 18789063 | TWO-LEVEL ERROR CORRECTING CODE WITH SHARING OF CHECK-BITS | NGUYEN, STEVE N | 2111 | Final Rejection | Jul 30, 2024 |
| 18789393 | DEVICE SIGNATURE BASED ON TRIM AND REDUNDANCY INFORMATION | WILLIAMS, JEFFERY L | 2495 | Non-Final OA | Jul 30, 2024 |
| 18788179 | CLEANING METHOD, METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SYSTEM THEREOF | NGUYEN, HUNG | 2882 | Non-Final OA | Jul 30, 2024 |
| 18789652 | MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT | HOANG, HUAN | 2154 | Non-Final OA | Jul 30, 2024 |
| 18788448 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | NGUYEN, HUNG | 2882 | Non-Final OA | Jul 30, 2024 |
| 18788007 | ENHANCING LITHOGRAPHY OPERATION FOR MANUFACTURING SEMICONDUCTOR DEVICES | KIM, PETER B | 2882 | Non-Final OA | Jul 29, 2024 |
| 18786718 | Bit Selection for Power Reduction in Stacking Structure During Memory Programming | HOANG, HUAN | 2827 | Non-Final OA | Jul 29, 2024 |
| 18787706 | HIGH-DENSITY & HIGH-VOLTAGE-TOLERABLE PURE CORE MEMORY CELL | TECHANE, MUNA A | 2827 | Non-Final OA | Jul 29, 2024 |
| 18786686 | Pipelined Hybrid Noise-Shaping Analog-To-Digital Converter | NGUYEN, KHAI M | 2845 | Non-Final OA | Jul 29, 2024 |
| 18787119 | MASK CHARACTERIZATION METHODS AND APPARATUSES | LAPAGE, MICHAEL P | 2877 | Non-Final OA | Jul 29, 2024 |
| 18786120 | ANALOG TO DIGITAL CONVERTER WITH VCO-BASED AND PIPELINED QUANTIZERS | MAI, LAM T | 2845 | Non-Final OA | Jul 26, 2024 |
| 18784936 | CAPACITOR STRUCTURE | SINCLAIR, DAVID M | 2848 | Non-Final OA | Jul 26, 2024 |
| 18786316 | SYSTEMS AND METHODS TO MITIGATE CYCLE TIME DEGRADATION BY NBTI EFFECT ON PDP SRAM | HUANG, MIN | 2827 | Non-Final OA | Jul 26, 2024 |
| 18785636 | MEMORY DEVICE WITH CONTENT ADDRESSABLE MEMORY UNITS | YANG, HAN | 2824 | Non-Final OA | Jul 26, 2024 |
| 18786289 | Multiple Stack High Voltage Circuit for Memory | HO, HOAI V | 2827 | Non-Final OA | Jul 26, 2024 |
| 18785519 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | CAMPBELL, NATASHA N. | 1714 | Non-Final OA | Jul 26, 2024 |
| 18784854 | MEMORY POWER CONTROL BY ENABLE CIRCUIT | BEGUM, SULTANA | 2824 | Non-Final OA | Jul 25, 2024 |
| 18783924 | HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL | HOANG, HUAN | 2827 | Non-Final OA | Jul 25, 2024 |
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | PHAM, THOMAS T | 1713 | Final Rejection | Jul 24, 2024 |
| 18782565 | RESIN, PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | Non-Final OA | Jul 24, 2024 |
| 18782714 | METHOD FOR FORMING A MAMR STRUCTURE BASED ON A TMR - SPIN TORQUE OSCILLATOR (STO) HAVING SEED LAYER AND CAPPING LAYER OF METAL OXIDE | MAI, ANH D | 2893 | Non-Final OA | Jul 24, 2024 |
| 18782815 | THREE-PORT SRAM CELL AND LAYOUT METHOD | SIDDIQUE, MUSHFIQUE | 2825 | Non-Final OA | Jul 24, 2024 |
| 18783018 | NON-VOLATILE MEMORY BASED COMPUTE-IN-MEMORY CELL | BERMUDEZ LOZADA, ALFREDO | 2825 | Non-Final OA | Jul 24, 2024 |
| 18781286 | COMPUTE IN MEMORY SYSTEM | HUANG, MIN | 2827 | Non-Final OA | Jul 23, 2024 |
| 18780873 | TOP NOTCH SLIT PROFILE FOR MEMS DEVICE | JOSHI, SUNITA | 2691 | Non-Final OA | Jul 23, 2024 |
| 18779402 | SEMICONDUCTOR DEVICE | HUANG, MIN | 2827 | Non-Final OA | Jul 22, 2024 |
| 18779977 | PELLICLE FOR AN EUV LITHOGRAPHY MASK AND A METHOD OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jul 22, 2024 |
| 18778993 | EXTERNAL MAGNETIC FIELD DETECTION FOR MRAM DEVICE | KERVEROS, DEMETRIOS C | 2111 | Final Rejection | Jul 21, 2024 |
| 18776286 | SYSTEM AND METHOD FOR DETECTING BIOMOLECULES | NOGUEROLA, ALEXANDER STEPHAN | 1795 | Non-Final OA | Jul 18, 2024 |
| 18777114 | SYSTEMS FOR INSPECTION OF SEMICONDUCTOR SUBSTRATES | KIM, PETER B | 2882 | Non-Final OA | Jul 18, 2024 |
| 18776559 | RETICLE ENCLOSURE FOR LITHOGRAPHY SYSTEMS | ASFAW, MESFIN T | 2882 | Non-Final OA | Jul 18, 2024 |
| 18776675 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | Final Rejection | Jul 18, 2024 |
| 18777324 | CLOCK GATING CIRCUIT AND METHOD OF OPERATING THE SAME | CRAWFORD, JASON | 2844 | Non-Final OA | Jul 18, 2024 |
| 18775753 | LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME | HERNANDEZ, WILLIAM | 2849 | Non-Final OA | Jul 17, 2024 |
| 18773354 | MEMORY DEVICE | HUANG, MIN | 2827 | Non-Final OA | Jul 15, 2024 |
| 18773269 | Memory Device | HOANG, HUAN | 2827 | Non-Final OA | Jul 15, 2024 |
| 18772911 | LEVEL SHIFTER | NGUYEN, LONG T | 2842 | Final Rejection | Jul 15, 2024 |
| 18772677 | INTEGRATED CIRCUIT DEVICE AND METHOD | YEAMAN, JAMES G | 2842 | Non-Final OA | Jul 15, 2024 |
| 18772202 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MENZ, LAURA MARY | 2813 | Non-Final OA | Jul 14, 2024 |
| 18771863 | MEMORY CELL ARRAY AND METHOD OF OPERATING SAME | CHO, SUNG IL | 2825 | Non-Final OA | Jul 12, 2024 |
| 18771753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | Non-Final OA | Jul 12, 2024 |
| 18770792 | VARIABLE SIZE FIN STRUCTURES | NGUYEN, CUONG B | 2818 | Non-Final OA | Jul 12, 2024 |
| 18769407 | MEMORY DEVICE INCLUDING DUAL CONTROL CIRCUITS | CHO, SUNG IL | 2825 | Non-Final OA | Jul 11, 2024 |
| 18769678 | METHOD, DEVICE, AND CIRCUIT FOR MEMORIES FOR SKIPPING PRE-CHARGING | LUU, PHO M | 2824 | Non-Final OA | Jul 11, 2024 |
| 18767396 | LITHOGRAPHY APPARATUS AND METHOD FOR OPERATING THE SAME | RIDDLE, CHRISTINA A | 2882 | Non-Final OA | Jul 09, 2024 |
| 18767126 | Two-Step Charge-Based Capacitor Measurement | HE, AMY | 2858 | Non-Final OA | Jul 09, 2024 |
| 18766808 | METHOD FOR EFFICIENTLY WAKING UP FERROELECTRIC MEMORY | NGUYEN, VAN THU T | 2824 | Non-Final OA | Jul 09, 2024 |
| 18767216 | Delay Lock Loop Circuits and Methods for Operating Same | HOUSTON, ADAM D | 2842 | Non-Final OA | Jul 09, 2024 |
| 18764379 | POWER MANAGEMENT CIRCUIT, SYSTEM-ON-CHIP DEVICE, AND METHOD OF POWER MANAGEMENT | STOYNOV, STEFAN | 2175 | Non-Final OA | Jul 05, 2024 |
| 18764161 | SEMICONDUCTOR DEVICE, INTERFACE DEVICE AND OPERATION METHOD | TSE, YOUNG TOI | 2632 | Non-Final OA | Jul 04, 2024 |
| 18764167 | PACKAGE STRUCTURE WITH ANTENNA PATTERN AND METHOD OF FORMING THE SAME | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Jul 04, 2024 |
| 18764340 | MEMORY DEVICE, MEMORY ARRAY, AND N-BIT MEMORY UNIT | ALROBAIE, KHAMDAN N | 2824 | Non-Final OA | Jul 04, 2024 |
| 18762685 | PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER AND METHOD OF FABRICATING THE SAME | CROSS, XIA L | 2892 | Non-Final OA | Jul 03, 2024 |
| 18762826 | CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD | LE, THAO P | 2818 | Non-Final OA | Jul 03, 2024 |
| 18763040 | MEMORY DEVICE WITH TUNABLE PROBABILISTIC STATE | TRAN, MICHAEL THANH | 2827 | Non-Final OA | Jul 03, 2024 |
| 18761324 | DIE STACK STRUCTURE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | 2818 | Non-Final OA | Jul 02, 2024 |
| 18761592 | AIR CURTAIN FOR DEFECT REDUCTION | MCCLAIN, GERALD | 3652 | Non-Final OA | Jul 02, 2024 |
| 18761020 | METHOD AND APPARATUS FOR MITIGATING TIN DEBRIS | NGUYEN, KIET TUAN | 2881 | Final Rejection | Jul 01, 2024 |
| 18760589 | END-OF-CYCLE SIGNAL GENERATION CIRCUIT AND METHOD | BEGUM, SULTANA | 2824 | Non-Final OA | Jul 01, 2024 |
| 18760660 | MEMORY DEVICES WITH DUAL-SIDE DISCHARGE AND METHODS FOR OPERATING THE SAME | BERMUDEZ LOZADA, ALFREDO | 2825 | Non-Final OA | Jul 01, 2024 |
| 18758504 | NEW WAS CELL FOR SRAM HIGH-R ISSUE IN ADVANCED TECHNOLOGY NODE | CHO, SUNG IL | 2825 | Non-Final OA | Jun 28, 2024 |
| 18756105 | METHOD OF FABRICATING MAGNETO-RESISTIVE RANDOM ACCESS MEMORY (MRAM) | NGUYEN, CUONG B | 2818 | Non-Final OA | Jun 27, 2024 |
| 18755752 | LEVEL SHIFTER WITH INDEPENDENT DRIVER | KIM, JUNG H | 2842 | Non-Final OA | Jun 27, 2024 |
| 18755747 | POWER CLAMP DEVICE | NGUYEN, DANNY | 2838 | Non-Final OA | Jun 27, 2024 |
| 18756142 | SEMICONDUCTOR DEVICE AND OPERATING METHOD THEREOF | KING, DOUGLAS | 2824 | Non-Final OA | Jun 27, 2024 |
| 18754948 | SEMICONDUCTOR INTEGRATED CIRCUIT | ERDEM, FAZLI | 2812 | Non-Final OA | Jun 26, 2024 |
| 18753371 | Integrated Impedance Measurement Device and Impedance Measurement Method Thereof | FERDOUS, ZANNATUL | 2858 | Non-Final OA | Jun 25, 2024 |
| 18751362 | METHOD OF FORMING SEMICONDUCTOR PACKAGE | BRASFIELD, QUINTON A | 2814 | Final Rejection | Jun 24, 2024 |
| 18751858 | PELLICLE ASSEMBLY AND METHOD OF MAKING SAME | CULBERT, ROBERTS P | 1716 | Non-Final OA | Jun 24, 2024 |
| 18748972 | MEMORY CIRCUITS AND METHODS FOR OPERATING THE SAME | CHO, SUNG IL | 2825 | Non-Final OA | Jun 20, 2024 |
| 18747490 | FLUID SENSOR SYSTEM | POTHEN, FEBA | 2858 | Non-Final OA | Jun 19, 2024 |
| 18742298 | PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS | PYO, KEVIN K | 2878 | Non-Final OA | Jun 13, 2024 |
| 18740889 | METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DESIGN | KHALIFA, MOATAZ | 2815 | Final Rejection | Jun 12, 2024 |
| 18739538 | Device and Method for Reading a Memory Cell | CHO, SUNG IL | 2825 | Non-Final OA | Jun 11, 2024 |
| 18739911 | METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR MEMORY REPAIR | HUANG, MIN | 2827 | Non-Final OA | Jun 11, 2024 |
| 18738225 | Low Hold Multi-Bit Flip-Flop | TRA, ANH QUAN | 2843 | Non-Final OA | Jun 10, 2024 |
| 18734190 | SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING | SALERNO, SARAH KATE | 2814 | Final Rejection | Jun 05, 2024 |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | Non-Final OA | Jun 05, 2024 |
| 18733512 | SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE | AU, BAC H | 2898 | Non-Final OA | Jun 04, 2024 |
| 18733458 | SEMICONDUCTOR INSPECTION TOOL AND METHODS OF OPERATION | PYO, KEVIN K | 2878 | Non-Final OA | Jun 04, 2024 |
| 18679478 | WAFER INSPECTION APPARATUS AND METHOD | TON, TRI T | 2877 | Non-Final OA | May 31, 2024 |
| 18676537 | SEMICONDUCTOR DEVICE INCLUDING STANDARD CELL HAVING SPLIT PORTIONS | BOWERS, BRANDON | 2851 | Non-Final OA | May 29, 2024 |
| 18675661 | SYSTEM AND METHOD FOR CLEANING A WAFER SURFACE | BERGNER, ERIN FLANAGAN | 1713 | Non-Final OA | May 28, 2024 |
| 18674891 | SEMICONDUCTOR PACKAGE | TOBERGTE, NICHOLAS J | 2817 | Final Rejection | May 26, 2024 |
| 18671929 | COMPUTING CIRCUIT, MEMORY CELL, AND COMPUTE-IN-MEMORY DEVICE | HOANG, HUAN | 2827 | Final Rejection | May 22, 2024 |
| 18669564 | MEASURING SYSTEM AND METHOD OF MEASURING STATIC CHARGES | POTHEN, FEBA | 2858 | Non-Final OA | May 21, 2024 |
| 18669800 | PROBE HEAD STRUCTURE | NGUYEN, TUNG X | 2858 | Non-Final OA | May 21, 2024 |
| 18669089 | SEMICONDUCTOR STRUCTURE WITH BARRIER AND METHOD FOR MANUFACTURING THE SAME | SABUR, ALIA | 2812 | Non-Final OA | May 20, 2024 |
| 18669285 | MEMORY DEVICE | HIDALGO, FERNANDO N | 2827 | Non-Final OA | May 20, 2024 |
| 18663776 | POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL | OH, JAEHWAN | 2899 | Non-Final OA | May 14, 2024 |
| 18657842 | APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING | PHAM, THOMAS T | 1713 | Non-Final OA | May 08, 2024 |
| 18655397 | GATE STRUCTURE IN HIGH-K METAL GATE TECHNOLOGY | PHAM, HOAI V | 2892 | Final Rejection | May 06, 2024 |
| 18655591 | SYSTEM AND METHOD APPLIED WITH COMPUTING-IN-MEMORY | CHEN, XIAOCHUN L | 2824 | Non-Final OA | May 06, 2024 |
| 18652963 | VOLTAGE CONTROL CIRCUITS AND METHODS FOR OPERATING THE SAME | RADKE, JAY W | 2827 | Final Rejection | May 02, 2024 |
| 18650139 | COVER ASSEMBLY OF SEMICONDUCTOR MANUFACTURING TOOL | TANENBAUM, TZVI SAMUEL | 3763 | Non-Final OA | Apr 30, 2024 |
| 18645608 | Device and Method for Generating a Temperature-Independent Reference Voltage | NOVAK, PETER MICHAEL | 2838 | Non-Final OA | Apr 25, 2024 |
| 18643208 | SYSTEMS AND METHODS FOR MEMORY CONTROLLER WITH PROGRAMMABLE INTERFACE SIGNAL | TRAN, ANH Q | 2844 | Non-Final OA | Apr 23, 2024 |
| 18643981 | MEMORY DEVICE, SEMICONDUCTOR DIE, AND METHOD OF FABRICATING THE SAME | GONDARENKO, NATALIA A | 2891 | Non-Final OA | Apr 23, 2024 |
| 18642889 | COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE | HOSSAIN, MOAZZAM | 2898 | Non-Final OA | Apr 23, 2024 |
| 18638982 | RADIATION SOURCE APPARATUS AND METHOD FOR OPERATING THE SAME | WHITESELL, STEVEN H | 1759 | Non-Final OA | Apr 18, 2024 |
| 18637490 | SENSOR IN AN INTERNET-OF-THINGS | FRANK, RODNEY T | 2855 | Non-Final OA | Apr 17, 2024 |
| 18629961 | TESTING APPARATUS AND METHOD FOR OPERATING THE SAME | ZAKARIA, AKM | 2858 | Non-Final OA | Apr 09, 2024 |
| 18630160 | ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE | MOORE, DEVON TYLEN | 3763 | Non-Final OA | Apr 09, 2024 |
| 18625877 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | WELLINGTON, ANDREA L | 2800 | Non-Final OA | Apr 03, 2024 |
| 18626116 | Input-Aware Data Inversion Scheme for Low Power Memory Circuit Design | SIMONETTI, NICHOLAS J | 2137 | Non-Final OA | Apr 03, 2024 |
| 18624645 | LITHOGRAPHIC APPARATUS, INSPECTION METHOD, AND METHOD FOR PERFORMING LITHOGRAPHY PROCESS | RIDDLE, CHRISTINA A | 2882 | Final Rejection | Apr 02, 2024 |
| 18623806 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SAME | GONDARENKO, NATALIA A | 2891 | Non-Final OA | Apr 01, 2024 |
| 18617730 | DUAL SUBSTRATE SIDE ESD DIODE FOR HIGH SPEED CIRCUIT | ZHU, SHENG-BAI | 2897 | Final Rejection | Mar 27, 2024 |
| 18615459 | MAGNETIC TUNNEL JUNCTION DEVICES | MILLER, JAMI VALENTINE | 2818 | Non-Final OA | Mar 25, 2024 |
| 18615866 | MEMORY DEVICE AND METHOD | CHEN, XIAOCHUN L | 2824 | Non-Final OA | Mar 25, 2024 |
| 18607714 | Semiconductor Device Including a Voltage Regulator and an Integrated Circuit Module | HILTUNEN, THOMAS J | 2849 | Final Rejection | Mar 18, 2024 |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Mar 14, 2024 |
| 18602247 | TEMPERATURE COEFFICIENT CALIBRATION OF RESISTOR THERMAL SENSORS | CASTELLON JR, MANUEL SALVADOR | 2855 | Non-Final OA | Mar 12, 2024 |
| 18601191 | SLOW WAVE INDUCTIVE STRUCTURE | HINSON, RONALD | 2837 | Non-Final OA | Mar 11, 2024 |
| 18597981 | TWO-DIMENSIONAL (2D) MATERIAL FOR OXIDE SEMICONDUCTOR (OS) FERROELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICE | WALL, VINCENT | 2898 | Final Rejection | Mar 07, 2024 |
| 18595429 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | 2898 | Non-Final OA | Mar 05, 2024 |
| 18596404 | 3D IC POWER GRID | REAMES, MATTHEW L | 2896 | Non-Final OA | Mar 05, 2024 |
| 18589569 | INTEGRATED CIRCUIT WITH DUMMY BOUNDARY CELLS | GARCES, NELSON Y | 2814 | Non-Final OA | Feb 28, 2024 |
| 18587437 | SYSTEM FOR DESIGNING A SEMICONDUCTOR DEVICE, DEVICE MADE, AND METHOD OF USING THE SYSTEM | TAT, BINH C | 2851 | Non-Final OA | Feb 26, 2024 |
| 18583194 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | LUKE, DANIEL M | 2896 | Non-Final OA | Feb 21, 2024 |
| 18439316 | USING BUILT-IN SELF TEST OR TEST RESULTS TO IDENTIFY WEAK MEMORY BITS AND ENABLE ASSIST CIRCUITS WHEN NECESSARY | KERVEROS, DEMETRIOS C | 2111 | Non-Final OA | Feb 12, 2024 |
| 18434326 | FAR-END BIT LINE PRE-CHARGE FOR HIGH-DENSITY SRAMS | COON, BRADLEY SCOTT | 2827 | Non-Final OA | Feb 06, 2024 |
| 18433275 | METHOD AND SYSTEM FOR RETRIEVING DIFFRACTION PARAMETER OF PHOTOMASK | ZHAI, KYLE | 2611 | Non-Final OA | Feb 05, 2024 |
| 18432199 | Single Phase Clock Controlled Master Latch in Flip Flops | NGUYEN, LONG T | 2842 | Final Rejection | Feb 05, 2024 |
| 18429708 | METHOD OF MANUFACTURING AN INTERCONNECT STRUCTURE WITH A METAL CAP | NGUYEN, KHIEM D | 2892 | Non-Final OA | Feb 01, 2024 |
| 18429850 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | PAK, SUNG H | 2874 | Non-Final OA | Feb 01, 2024 |
| 18427846 | SEMICONDUCTOR PHOTONIC PACKAGE | PAK, SUNG H | 2874 | Non-Final OA | Jan 31, 2024 |
| 18428967 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | LUONG, DUY HAN | 2825 | Non-Final OA | Jan 31, 2024 |
| 18425692 | SENSING DEVICE | FITZPATRICK, JULIA GRACE | 2855 | Non-Final OA | Jan 29, 2024 |
| 18424455 | SEALING ARTICLES FOR PLASMA RESISTANCE APPLICATIONS | SANDERS, JAMES M | 1743 | Non-Final OA | Jan 26, 2024 |
| 18422245 | METHOD FOR FORMING A MFMIS MEMORY DEVICE | WARREN, MATTHEW E | 2817 | Non-Final OA | Jan 25, 2024 |
| 18422028 | METHOD OF MANUFACTURING COMPOSITE ARTICLE | LU, JIONG-PING | 1713 | Non-Final OA | Jan 25, 2024 |
| 18421365 | SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMING THE SAME | TAVLYKAEV, ROBERT FUATOVICH | 2896 | Non-Final OA | Jan 24, 2024 |
| 18421373 | ELECTRON MICROSCOPE DETECTOR AND RELATED METHODS | MCCORMACK, JASON L | 2881 | Non-Final OA | Jan 24, 2024 |
| 18419290 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | WELLS, JAMES STEVEN | 2825 | Non-Final OA | Jan 22, 2024 |
| 18417314 | SEMICONDUCTOR DEVICES WITH DOUBLE SILICON LENS | RADKOWSKI, PETER | 2874 | Non-Final OA | Jan 19, 2024 |
| 18410739 | MEMORY DEVICES WITH RC TRACKING AND METHODS FOR OPERATING THE SAME | KING, DOUGLAS | 2824 | Non-Final OA | Jan 11, 2024 |
| 18408584 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | ALBRECHT, PETER M | 2811 | Non-Final OA | Jan 10, 2024 |
| 18407368 | PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR DEVICE USING THE SAME | KENDALL, BENJAMIN R | 2896 | Non-Final OA | Jan 08, 2024 |
| 18406524 | SEMICONDUCTOR DEVICE INCLUDING SPATIAL LIGHT MODULATOR AND METHOD FOR MANUFACTURING THE SAME | HASAN, MOHAMMED A | 2872 | Non-Final OA | Jan 08, 2024 |
| 18406836 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CONDUCTIVE VIAS | RIVAS, CRISTIAN O | 2642 | Non-Final OA | Jan 08, 2024 |
| 18405948 | SYSTEMS AND METHODS FOR SUPER POWER RAIL (SPR) ANALOG CELLS DESIGN | JANG, BO BIN | 2818 | Non-Final OA | Jan 05, 2024 |
| 18405967 | DIFFUSION BARRIER STRUCTURES IN SOURCE/DRAIN STRUCTURES OF NANOSTRUCTURE TRANSISTORS | DANG, PHUC T | 2897 | Non-Final OA | Jan 05, 2024 |
| 18405695 | RETICLE CARRIER AND METHOD FOR MANUFACTURING AUXILIARY STRUCTURE IN RETICLE CARRIER | MAYY, MOHAMMAD | 1718 | Non-Final OA | Jan 05, 2024 |
| 18403727 | MANUFACTURING METHOD OF HEAT DISSIPATION LAYER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | OJEH, NDUKA E | 2892 | Non-Final OA | Jan 04, 2024 |
| 18403735 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | CAPUTO, LISA M | 2874 | Non-Final OA | Jan 04, 2024 |
| 18403746 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | PEACE, RHONDA S | 2874 | Non-Final OA | Jan 04, 2024 |
| 18403785 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | ROST, ANDREW J | 3753 | Non-Final OA | Jan 04, 2024 |
| 18403779 | PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING PHOTOELECTRIC DEVICE | CAPUTO, LISA M | 2874 | Non-Final OA | Jan 04, 2024 |
| 18402918 | INTEGRATED FIBER ARRAY UNIT STRUCTURE INCLUDING EMBEDDED PASSIVE OPTICAL COMPONENTS AND METHOD FOR FORMING THE SAME | STAHL, MICHAEL J | 2874 | Non-Final OA | Jan 03, 2024 |
| 18402794 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MICHAUD, ROBERT J | 2622 | Non-Final OA | Jan 03, 2024 |
| 18402740 | TESTING MODULE AND TESTING METHOD USING THE SAME | NGUYEN, TUNG X | 2858 | Non-Final OA | Jan 03, 2024 |
| 18401771 | HIGH PERFORMANCE STACKING PIXEL | REAMES, MATTHEW L | 2896 | Non-Final OA | Jan 02, 2024 |
| 18401746 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | CHIU, TSZ K | 2898 | Non-Final OA | Jan 02, 2024 |
| 18397217 | INTEGRATED CIRCUIT DEVICE USING OXIDE SEMICONDUCTOR WITH OXYGEN VACANCY STABILIZING MATERIAL | SEVEN, EVREN | 2812 | Non-Final OA | Dec 27, 2023 |
| 18396713 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE | OWENS, DOUGLAS W | 2897 | Non-Final OA | Dec 27, 2023 |
| 18396186 | MEMORY REFRESH | KING, DOUGLAS | 2824 | Final Rejection | Dec 26, 2023 |
| 18396675 | METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PACKAGE | ALBRECHT, PETER M | 2811 | Non-Final OA | Dec 26, 2023 |
| 18396662 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | SENGDARA, VONGSAVANH | 2893 | Non-Final OA | Dec 26, 2023 |
| 18395197 | INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME | MANDALA, VICTOR A | 2899 | Non-Final OA | Dec 22, 2023 |
| 18535477 | METHOD AND APPARATUS FOR MONITORING AN EXTREME ULTRAVIOLET RADIATION SOURCE | NGUYEN, KIET TUAN | 2881 | Non-Final OA | Dec 11, 2023 |
| 18533077 | SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING METHOD THEREOF | MANDALA, VICTOR A | 2899 | Non-Final OA | Dec 07, 2023 |
| 18531706 | SYSTEM ON INTEGRATED CIRCUIT STRUCTURE | ALBRECHT, PETER M | 2811 | Non-Final OA | Dec 07, 2023 |
| 18531089 | BACK-END ACTIVE DEVICE | CHOU, SHIH TSUN A | 2811 | Non-Final OA | Dec 06, 2023 |
| 18531007 | ETCH STOP LAYERS | YI, CHANGHYUN | 2812 | Non-Final OA | Dec 06, 2023 |
| 18529008 | METHODS FOR FORMING THIN FILM RESISTOR | HARRISON, MONICA D | 2815 | Non-Final OA | Dec 05, 2023 |
| 18527632 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | KUSUMAKAR, KAREN M | 2897 | Non-Final OA | Dec 04, 2023 |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Dec 04, 2023 |
| 18526473 | CONTACT GATE ISOLATION | ADHIKARI DAWADI, BIPANA | 2898 | Non-Final OA | Dec 01, 2023 |
| 18526278 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | BERNSTEIN, ALLISON | 2824 | Non-Final OA | Dec 01, 2023 |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Nov 30, 2023 |
| 18524644 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF | OWENS, DOUGLAS W | 2897 | Non-Final OA | Nov 30, 2023 |
| 18524533 | METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY | AU, BAC H | 2898 | Non-Final OA | Nov 30, 2023 |
| 18524661 | SEMICONDUCTOR DEVICES WITH BACKSIDE GATE CONTACTS AND METHODS OF FABRICATION THEREOF | OWENS, DOUGLAS W | 2897 | Non-Final OA | Nov 30, 2023 |
| 18522224 | CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE | PENG, CHARLIE YU | 2874 | Non-Final OA | Nov 29, 2023 |
| 18521569 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | GARCES, NELSON Y | 2814 | Non-Final OA | Nov 28, 2023 |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | LIU, BENJAMIN T | 2893 | Non-Final OA | Nov 28, 2023 |
| 18520105 | SEMICONDUCTOR DEVICE INCLUDING INTERFACIAL LAYER WITH CET SCALING AND METHOD FOR MANUFACTURING THE SAME | OJEH, NDUKA E | 2892 | Non-Final OA | Nov 27, 2023 |
| 18519744 | PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD OF FORMING THE SAME | WONG, TINA MEI SENG | 2874 | Final Rejection | Nov 27, 2023 |
| 18518809 | ONE-TIME-PROGRAMMABLE MEMORY DEVICES | TECHANE, MUNA A | 2827 | Non-Final OA | Nov 24, 2023 |
| 18518585 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NICELY, JOSEPH C | 2813 | Non-Final OA | Nov 23, 2023 |
| 18517945 | ISOLATION STRUCTURES FOR MULTI-GATE DEVICES | KIM, TONG-HO | 2811 | Non-Final OA | Nov 22, 2023 |
| 18518429 | NEAR EYE DISPLAY APPARATUS | BOLOTIN, DMITRIY | 2623 | Final Rejection | Nov 22, 2023 |
| 18518413 | GATE STRUCTURE, FIN FIELD-EFFECT TRANSISTOR, AND METHOD OF MANUFACTURING FIN-FIELD EFFECT TRANSISTOR | SEVEN, EVREN | 2812 | Final Rejection | Nov 22, 2023 |
| 18516999 | WAFER TRANSPORTING METHOD | GITMAN, GABRIEL E | 1772 | Non-Final OA | Nov 22, 2023 |
| 18516877 | TRIMMING METHOD OF STACKED STRUCTURE AND STACKED STRUCTURE FORMED THEREFROM | HENRY, CALEB E | 2818 | Non-Final OA | Nov 21, 2023 |
| 18513873 | SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL) | CAMPBELL, SHAUN M | 2893 | Non-Final OA | Nov 20, 2023 |
| 18515152 | SEMICONDUCTOR STRUCTURE | HO, ANTHONY | 2817 | Non-Final OA | Nov 20, 2023 |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | SEVEN, EVREN | 2812 | Non-Final OA | Nov 20, 2023 |
| 18512371 | VERTICALLY STACKED COMPLEMENTARY FIELD EFFECT TRANSISTORS AND METHODS OF FABRICATION THEREOF | KIM, SU C | 2899 | Non-Final OA | Nov 17, 2023 |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Nov 17, 2023 |
| 18512570 | INNER SPACERS FOR MULTI-GATE TRANSISTORS AND MANUFACTURING METHOD THEREOF | TRAN, TAN N | 2812 | Non-Final OA | Nov 17, 2023 |
| 18512624 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD FOR MANUFACTURING THE SAME | DANG, PHUC T | 2897 | Non-Final OA | Nov 17, 2023 |
| 18512450 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | QUINTO, KEVIN V | 2893 | Non-Final OA | Nov 17, 2023 |
| 18512792 | SYSTEMS AND METHODS TO DETECT CELL-INTERNAL DEFECTS | DOAN, NGHIA M | 2851 | Non-Final OA | Nov 17, 2023 |
| 18513439 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | BOWEN, ADAM S | 2897 | Non-Final OA | Nov 17, 2023 |
| 18511652 | MEMORY DEVICES WITH FLYING DECORDER LINES AND METHODS FOR OPERATING THE SAME | TRAN, ANTHAN | 2825 | Final Rejection | Nov 16, 2023 |
| 18510595 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | LEBENTRITT, MICHAEL | 2893 | Non-Final OA | Nov 15, 2023 |
| 18509545 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BOEGEL, CHEVY JACOB | 2812 | Non-Final OA | Nov 15, 2023 |
| 18507039 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | KIM, TONG-HO | 2811 | Non-Final OA | Nov 11, 2023 |
| 18505632 | GATE ISOLATION FEATURES | KOO, LAMONT B | 2813 | Non-Final OA | Nov 09, 2023 |
| 18505668 | DEVICE PERFORMANCE DIVERSIFICATION | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Nov 09, 2023 |
| 18504398 | SEMICONDUCTOR FABRICATION PROCESSES FOR DEFECT REDUCTION | PATEL, REEMA | 2812 | Non-Final OA | Nov 08, 2023 |
| 18503189 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | JORDAN, ANDREW | 2874 | Non-Final OA | Nov 07, 2023 |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 2813 | Non-Final OA | Nov 06, 2023 |
| 18500133 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | ALBRECHT, PETER M | 2811 | Non-Final OA | Nov 02, 2023 |
| 18499230 | PACKAGE STRUCTURE | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Nov 01, 2023 |
| 18498369 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | WELLS, JAMES STEVEN | 2825 | Non-Final OA | Oct 31, 2023 |
| 18498031 | DUMMY DIES AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | Non-Final OA | Oct 30, 2023 |
| 18384253 | SEMICONDUCTOR PROCESS APPARATUS AND METHOD | GASSEN, CHRISTOPHER J | 2881 | Non-Final OA | Oct 26, 2023 |
| 18495189 | SEMICONDUCTOR DEVICE INCLUDING GATE DIELECTRICS OF DIFFERENT THICKNESSES AND METHOD FOR MANUFACTURING THE SAME | JOHNSON, CHRISTOPHER A | 2899 | Non-Final OA | Oct 26, 2023 |
| 18494073 | SRAM STRUCTURE WITH DUAL SIDE POWER RAILS | INOUSSA, MOULOUCOULAY | 2818 | Non-Final OA | Oct 25, 2023 |
| 18493949 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCTIVE CONTACT | SABUR, ALIA | 2812 | Non-Final OA | Oct 25, 2023 |
| 18493293 | INTERCONNECTION STRUCTURE | YI, CHANGHYUN | 2812 | Non-Final OA | Oct 24, 2023 |
| 18493768 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | LEBENTRITT, MICHAEL | 2893 | Non-Final OA | Oct 24, 2023 |
| 18492382 | Contact Formation Method and Related Structure | PALANISWAMY, KRISHNA JAYANTHI | 2899 | Non-Final OA | Oct 23, 2023 |
| 18491486 | VARACTORS HAVING INCREASED TUNING RATIO | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | Oct 20, 2023 |
| 18490922 | SEMICONDUCTOR MEMORY DEVICES WITH FLYING BIT LINES AND METHODS OF MANUFACTURING THEREOF | ALROBAIE, KHAMDAN N | 2824 | Non-Final OA | Oct 20, 2023 |
| 18490893 | INSERTION LAYER BETWEEN CHANNEL AND PASSIVATION FOR TRANSISTOR | RODELA, EDUARDO A | 2893 | Non-Final OA | Oct 20, 2023 |
| 18490757 | PHOTODETECTION DEVICE AND MANUFACTURING METHOD THEREOF | DINKE, BITEW A | 2812 | Non-Final OA | Oct 20, 2023 |
| 18490919 | SEMICONDUCTOR DEVICES WITH GATE EXTENSIONS AND METHODS OF FABRICATING THE SAME | HO, ANTHONY | 2817 | Non-Final OA | Oct 20, 2023 |
| 18490081 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | Non-Final OA | Oct 19, 2023 |
| 18488448 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Oct 17, 2023 |
| 18488979 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | STEVENSON, ANDRE C | 2899 | Non-Final OA | Oct 17, 2023 |
| 18488805 | COMPACT EFUSE STRUCTURE | DIALLO, MAMADOU L | 2897 | Non-Final OA | Oct 17, 2023 |
| 18488028 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MINNEY, GABRIEL SEBASTIAN | 2897 | Non-Final OA | Oct 16, 2023 |
| 18487063 | NON-VOLATILE MEMORY CELL AND METHOD OF FORMING THE SAME | HEISTERKAMP, JUSTIN BRYCE | 2827 | Non-Final OA | Oct 14, 2023 |
| 18485602 | GATE FORMATION PROCESS | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Oct 12, 2023 |
| 18377513 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | Non-Final OA | Oct 06, 2023 |
| 18481679 | BACKSIDE DIELECTRIC PLUG | TAYLOR, EARL N | 2896 | Non-Final OA | Oct 05, 2023 |
| 18481244 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | HO, ANTHONY | 2817 | Non-Final OA | Oct 05, 2023 |
| 18480551 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | SLUTSKER, JULIA | 2891 | Non-Final OA | Oct 04, 2023 |
| 18480225 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | YUSHINA, GALINA G | 2811 | Non-Final OA | Oct 03, 2023 |
| 18480068 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | YUSHINA, GALINA G | 2811 | Non-Final OA | Oct 03, 2023 |
| 18480473 | SEMICONDUCTOR DEVICE | YUSHINA, GALINA G | 2811 | Non-Final OA | Oct 03, 2023 |
| 18479808 | STRUCTURE HAVING CAPPING LAYER AND MANUFACTURING METHOD THEREOF | JUNG, MICHAEL YOO LIM | 2817 | Non-Final OA | Oct 02, 2023 |
| 18477940 | SEMICONDUCTOR STRUCTURE WITH DOPED REGION AND METHOD FOR MANUFACTURING THE SAME | NADAV, ORI | 2811 | Non-Final OA | Sep 29, 2023 |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | DINKE, BITEW A | 2812 | Non-Final OA | Sep 27, 2023 |
| 18475167 | IN-CHIP THERMOELECTRIC DEVICE | MOWLA, GOLAM | 1721 | Non-Final OA | Sep 26, 2023 |
| 18371577 | RADIO FREQUENCY INDUCTOR | KUPP, BENJAMIN MICHAEL | 2893 | Non-Final OA | Sep 22, 2023 |
| 18472594 | LENSES AND METHODS OF MANUFACTURING THE SAME | GONZALES, VICENTE ROLANDO | 2899 | Non-Final OA | Sep 22, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | TAN, DAVE | 2897 | Non-Final OA | Sep 22, 2023 |
| 18472243 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | LEE, KYOUNG | 2817 | Non-Final OA | Sep 22, 2023 |
| 18472768 | SEMICONDUCTOR DEVICE INCLUDING HIGH CONDUCTIVITY GATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ERDEM, FAZLI | 2812 | Non-Final OA | Sep 22, 2023 |
| 18471316 | SEMICONDUCTOR CHIP | CHUNG, ANDREW | 2898 | Non-Final OA | Sep 21, 2023 |
| 18370459 | LATERAL BIPOLAR JUNCTION TRANSISTOR DEVICE AND METHOD OF FORMING SAME | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Sep 20, 2023 |
| 18468498 | ANTI-DOPED MOS DEVICE AND VOLTAGE REFERENCE CIRCUIT INCLUDING SAME | LEE, WOO KYUNG | 2815 | Non-Final OA | Sep 15, 2023 |
| 18369099 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | WALLER, LATONYA RENEE | 2811 | Non-Final OA | Sep 15, 2023 |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Sep 14, 2023 |
| 18467072 | Molybdenum-Containing Device-Level Interconnects and Methods of Fabrication Thereof | HAIDER, WASIUL | 2812 | Non-Final OA | Sep 14, 2023 |
| 18467650 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | PARK, SAMUEL | 2818 | Non-Final OA | Sep 14, 2023 |
| 18368387 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | GOODLING, DEVIN KIRK | 2898 | Non-Final OA | Sep 14, 2023 |
| 18466004 | MAGNETIC TUNNEL JUNCTION (MTJ) STRUCTURE AND MEMORY CELL | SPRENGER, JAIME LYNN | 2893 | Non-Final OA | Sep 13, 2023 |
| 18466538 | FERROELECTRIC NON-VOLATILE MEMORY AND METHODS OF FORMATION | WATTS, JEREMY DANIEL | 2897 | Non-Final OA | Sep 13, 2023 |
| 18465949 | RECEIVER CIRCUIT AND SEMICONDUCTOR DEVICE | LUGO, DAVID B | 2631 | Final Rejection | Sep 12, 2023 |
| 18367129 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 12, 2023 |
| 18464243 | DIRECT WRITING SYSTEM USED FOR ELECTRON BEAM LITHOGRAPHY | CHOI, JAMES J | 2878 | Non-Final OA | Sep 10, 2023 |
| 18463297 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | STEVENSON, ANDRE C | 2899 | Non-Final OA | Sep 08, 2023 |
| 18244040 | METHODS FOR FORMING GATE OXIDE LAYER FOR HIGH-VOLTAGE TRANSISTOR | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Sep 08, 2023 |
| 18463818 | PHOTODETECTORS AND METHODS OF FORMATION | IMTIAZ, S M SOHEL | 2812 | Non-Final OA | Sep 08, 2023 |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | Non-Final OA | Sep 06, 2023 |
| 18242867 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | AMER, MOUNIR S | 2818 | Non-Final OA | Sep 06, 2023 |
| 18461535 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Sep 06, 2023 |
| 18461043 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | YI, CHANGHYUN | 2812 | Non-Final OA | Sep 05, 2023 |
| 18460600 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MENZ, LAURA MARY | 2813 | Non-Final OA | Sep 04, 2023 |
| 18460594 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | Non-Final OA | Sep 04, 2023 |
| 18460578 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF | ENAD, CHRISTINE A | 2811 | Non-Final OA | Sep 03, 2023 |
| 18459565 | INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING | ANDERSON, ERIK ARTHUR | 2812 | Non-Final OA | Sep 01, 2023 |
| 18459531 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF WITH DIFFUSION CAP LAYERS | RAHMAN, MOHAMMAD A | 2898 | Non-Final OA | Sep 01, 2023 |
| 18459448 | SEMICONDUCTOR DEVICE WITH CONDUCTIVE FEATURE CONNECTING TRANSISTORS | GARCES, NELSON Y | 2814 | Non-Final OA | Sep 01, 2023 |
| 18239999 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | RAMIREZ, ALEXANDRE XAVIER | 2812 | Non-Final OA | Aug 30, 2023 |
| 18240033 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MILLER, ALEXANDER MICHAEL | 2898 | Non-Final OA | Aug 30, 2023 |
| 18457282 | SEMICONDUCTOR DEVICES WITH DUMMY FILL STRUCTURES BETWEEN A THROUGH SILICON VIA AND AN ACTIVE DEVICE AND METHODS OF FORMING THE SAME | SABUR, ALIA | 2812 | Non-Final OA | Aug 28, 2023 |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | PHAM, THANHHA S | 2812 | Non-Final OA | Aug 25, 2023 |
| 18456291 | ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES | JUNG, MICHAEL YOO LIM | 2817 | Non-Final OA | Aug 25, 2023 |
| 18238247 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | NADAV, ORI | 2811 | Non-Final OA | Aug 25, 2023 |
| 18455211 | REDUCED RESIDUE AT ETCHED STRUCTURE SIDEWALLS | MCDONALD, JASON ANDREW | 2898 | Non-Final OA | Aug 24, 2023 |
| 18454107 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Aug 23, 2023 |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | CHANG, JAY C | 2817 | Non-Final OA | Aug 22, 2023 |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Aug 21, 2023 |
| 18452584 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HO, TU TU V | 2818 | Non-Final OA | Aug 21, 2023 |
| 18235391 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | VU, HUNG K | 2897 | Non-Final OA | Aug 18, 2023 |
| 18234988 | FURNACE INNER TUBE FOR PROCESS UNIFORMITY | CHAN, LAUREEN | 1716 | Final Rejection | Aug 17, 2023 |
| 18451263 | SEMICONDUCTOR STRUCTURE | ZARNEKE, DAVID A | 2891 | Non-Final OA | Aug 17, 2023 |
| 18234502 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | LI, MEIYA | 2811 | Non-Final OA | Aug 16, 2023 |
| 18234572 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE | RAMALLO, GUSTAVO G | 2812 | Non-Final OA | Aug 16, 2023 |
| 18450140 | IN-TRENCH CAPACITOR MERGED STRUCTURE | WHALEN, DANIEL B | 2893 | Non-Final OA | Aug 15, 2023 |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | CHAN, CANDICE | 2813 | Non-Final OA | Aug 15, 2023 |
| 18450358 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Aug 15, 2023 |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | VU, HUNG K | 2897 | Non-Final OA | Aug 14, 2023 |
| 18232580 | MEMORY DEVICES WITH PARTIALLY MISALIGNED GAP LOCATIONS AND METHODS OF MANUFACTURING THEREOF | WOLDEGEORGIS, ERMIAS T | 2893 | Non-Final OA | Aug 10, 2023 |
| 18447568 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | Non-Final OA | Aug 10, 2023 |
| 18447979 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND SYSTEM FOR SAME | SEDOROOK, DAVID PAUL | 2812 | Non-Final OA | Aug 10, 2023 |
| 18447926 | BIOSENSOR APPARATUS | EISEMAN, ADAM JARED | 3791 | Non-Final OA | Aug 10, 2023 |
| 18447999 | POWER GATING CELL STRUCTURE | KOO, LAMONT B | 2813 | Non-Final OA | Aug 10, 2023 |
| 18448125 | DIAGONAL VIA STRUCTURE | ZARNEKE, DAVID A | 2891 | Non-Final OA | Aug 10, 2023 |
| 18447482 | INDUCTIVE DEVICE | ADHIKARI DAWADI, BIPANA | 2898 | Non-Final OA | Aug 10, 2023 |
| 18447321 | SEMICONDUCTOR DEVICE | PARTHASARATHY, ROHIT | 2899 | Non-Final OA | Aug 10, 2023 |
| 18447614 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | MICHAUD, NICHOLAS BRIAN | 2818 | Non-Final OA | Aug 10, 2023 |
| 18232774 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | Final Rejection | Aug 10, 2023 |
| 18447239 | HIGH-K DIELECTRIC MATERIALS WITH DIPOLE LAYER | CRAMER, HALEE PAIGE | 2891 | Final Rejection | Aug 09, 2023 |
| 18446917 | METHOD AND STRUCTURE FOR DIODES WITH BACKSIDE CONTACTS | MIYOSHI, JESSE Y | 2898 | Final Rejection | Aug 09, 2023 |
| 18446549 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | HALL, VICTORIA KATHLEEN | 2897 | Final Rejection | Aug 09, 2023 |
| 18232225 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | CHU, JOHN S Y | 1737 | Non-Final OA | Aug 09, 2023 |
| 18232264 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | Final Rejection | Aug 09, 2023 |
| 18446733 | Spacer Structures for Nano-Sheet-Based Devices | WINTERS, SEAN AYERS | 2892 | Non-Final OA | Aug 09, 2023 |
| 18231938 | INTEGRATED CIRCUIT WITH STACKED TRANSISTORS HAVING INDUCTORS AT BOTH SIDES OF SUBSTRATE | YUSHINA, GALINA G | 2811 | Non-Final OA | Aug 09, 2023 |
| 18232306 | SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT | DINKE, BITEW A | 2812 | Non-Final OA | Aug 09, 2023 |
| 18446707 | PIXEL SENSOR INCLUDING A LAYER STACK TO REDUCE AND/OR BLOCK THE EFFECTS OF PLASMA PROCESSING AND ETCHING ON THE PIXEL SENSOR | GARCES, NELSON Y | 2814 | Non-Final OA | Aug 09, 2023 |
| 18366845 | METHODS FOR FORMING IMAGE SENSORS | LI, MEIYA | 2811 | Non-Final OA | Aug 08, 2023 |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | TURNER, BRIAN | 2818 | Non-Final OA | Aug 08, 2023 |
| 18446299 | SEMICONDUCTOR DEVICE INCLUDING AN ALIGNMENT MARK AND METHODS OF FORMATION | BARZYKIN, VICTOR V | 2893 | Non-Final OA | Aug 08, 2023 |
| 18446424 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | Final Rejection | Aug 08, 2023 |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | STEPHENSON, KENNETH STEPHEN | 2898 | Non-Final OA | Aug 08, 2023 |
| 18231196 | APPARATUS FOR ELECTRO-CHEMICAL PLATING | MARKOFF, ALEXANDER | 1711 | Non-Final OA | Aug 07, 2023 |
| 18366175 | PIXEL SENSOR INCLUDING REFRACTION STRUCTURES | NARAGHI, ALI | 2817 | Non-Final OA | Aug 07, 2023 |
| 18366096 | SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT | LUKE, DANIEL M | 2896 | Non-Final OA | Aug 07, 2023 |
| 18366308 | OPTICAL DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | CONNELLY, MICHELLE R | 2874 | Non-Final OA | Aug 07, 2023 |
| 18365483 | SEMICONDUCTOR DIODE STRUCTURE | PHAN, STEVE QUOC | 2817 | Non-Final OA | Aug 04, 2023 |
| 18365667 | METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME | MINNEY, GABRIEL SEBASTIAN | 2897 | Non-Final OA | Aug 04, 2023 |
| 18365252 | SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Aug 04, 2023 |
| 18365470 | CHANNEL WIDTH MODULATION | TANG, ALICE W | 2814 | Non-Final OA | Aug 04, 2023 |
| 18364734 | DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | HRNJIC, ADIN | 2817 | Non-Final OA | Aug 03, 2023 |
| 18364291 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | SNOW, COLLEEN ERIN | 2899 | Non-Final OA | Aug 02, 2023 |
| 18362991 | SEMICONDUCTOR STRUCTURES | GREEN, TELLY D | 2898 | Non-Final OA | Aug 01, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 2815 | Non-Final OA | Aug 01, 2023 |
| 18363627 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MUSE, ISMAIL A | 2812 | Final Rejection | Aug 01, 2023 |
| 18362892 | ATOMIC LAYER DEPOSITION (ALD) WITH IMPROVED PARTICLE PREVENTION MECHANISM | LUND, JEFFRIE ROBERT | 1716 | Non-Final OA | Jul 31, 2023 |
| 18361949 | Circuits and Methods for a Noise Shaping Analog To Digital Converter | MAI, LAM T | 2845 | Non-Final OA | Jul 31, 2023 |
| 18362101 | CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS | RAHIM, NILUFA | 2893 | Non-Final OA | Jul 31, 2023 |
| 18361177 | CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE | JANG, BO BIN | 2818 | Non-Final OA | Jul 28, 2023 |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | Non-Final OA | Jul 28, 2023 |
| 18360853 | EXTREME ULTRAVIOLET LITHOGRAPHY METHOD AND EUV PHOTOMASK | FRASER, STEWART A | 1724 | Non-Final OA | Jul 28, 2023 |
| 18360930 | METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR DEVICE | DEO, DUY VU NGUYEN | 1713 | Final Rejection | Jul 28, 2023 |
| 18360178 | SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 27, 2023 |
| 18360656 | PACKAGE WITH FAN-OUT STRUCTURES | HOANG, TUAN A | 2898 | Non-Final OA | Jul 27, 2023 |
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | WALL, VINCENT | 2898 | Non-Final OA | Jul 27, 2023 |
| 18360666 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | KEAGY, ROSE ALYSSA | 2818 | Non-Final OA | Jul 27, 2023 |
| 18360510 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | ISAAC, STANETTA D | 2898 | Non-Final OA | Jul 27, 2023 |
| 18358966 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | MARUF, SHEIKH | 2897 | Non-Final OA | Jul 26, 2023 |
| 18359747 | REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES | LU, JIONG-PING | 1713 | Final Rejection | Jul 26, 2023 |
| 18358970 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | HA, NATHAN W | 2814 | Non-Final OA | Jul 26, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 25, 2023 |
| 18358199 | OPTICAL ROUTING STRUCTURE ON BACKSIDE OF SUBSTRATE FOR PHOTONIC DEVICES | BEDTELYON, JOHN M | 2874 | Non-Final OA | Jul 25, 2023 |
| 18358522 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | KOO, LAMONT B | 2813 | Final Rejection | Jul 25, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | LUKE, DANIEL M | 2896 | Final Rejection | Jul 25, 2023 |
| 18311773 | Backside Contact and Metal over Diffusion | ESKRIDGE, CORY W | 3624 | Non-Final OA | Jul 25, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 2899 | Non-Final OA | Jul 24, 2023 |
| 18357264 | IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE | MARUF, SHEIKH | 2897 | Non-Final OA | Jul 24, 2023 |
| 18224994 | DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF | BANKLER, AIDAN DENNEHY | 2817 | Non-Final OA | Jul 21, 2023 |
| 18356244 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | WARREN, MATTHEW E | 2815 | Non-Final OA | Jul 21, 2023 |
| 18356912 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 21, 2023 |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 21, 2023 |
| 18356388 | WAFER THINNING METHOD HAVING FEEDBACK CONTROL | AU, BAC H | 2898 | Non-Final OA | Jul 21, 2023 |
| 18355688 | GATE DIELECTRIC LAYERS FOR STACKED MULTI-GATE DEVICE | KIM, TONG-HO | 2811 | Non-Final OA | Jul 20, 2023 |
| 18224065 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | TRAN, TRANG Q | 2811 | Non-Final OA | Jul 20, 2023 |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | SIPLING, KENNETH MARK | 2818 | Non-Final OA | Jul 20, 2023 |
| 18354244 | DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 18, 2023 |
| 18354217 | DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR NARROWED BY EPITAXY GROWTH | NARAGHI, ALI | 2817 | Non-Final OA | Jul 18, 2023 |
| 18353732 | Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The Same | OH, JIYOUNG | 2818 | Non-Final OA | Jul 17, 2023 |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | WILCZEWSKI, MARY A | 2898 | Non-Final OA | Jul 14, 2023 |
| 18352847 | Structure and Method for High-Voltage Device | DOAN, THERESA T | 2814 | Non-Final OA | Jul 14, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | Jul 14, 2023 |
| 18222077 | SEMICONDUCTOR DEVICE WITH IMPROVED SOURCE/DRAIN PROFILE AND METHODS OF FABRICATION THEREOF | SPALLA, DAVID C | 2893 | Non-Final OA | Jul 14, 2023 |
| 18352640 | ETCH PROFILE CONTROL OF VIA OPENING | HOANG, TUAN A | 2898 | Non-Final OA | Jul 14, 2023 |
| 18351877 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | DIAZ, JOSE R | 2815 | Non-Final OA | Jul 13, 2023 |
| 18351761 | HIGH ELECTRON MOBILITY TRANSISTOR WITH HELPING GATE | RAMIREZ, ALEXANDRE XAVIER | 2812 | Non-Final OA | Jul 13, 2023 |
| 18351784 | QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES | WARD, DAVID WILLIAM | 2891 | Non-Final OA | Jul 13, 2023 |
| 18350933 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SPACERS | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Jul 12, 2023 |
| 18350521 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | YUSHINA, GALINA G | 2811 | Non-Final OA | Jul 11, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 10, 2023 |
| 18349298 | INTEGRATION OF MEMORY CELL AND LOGIC CELL | MICHAUD, NICHOLAS BRIAN | 2818 | Final Rejection | Jul 10, 2023 |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | ENAD, CHRISTINE A | 2811 | Final Rejection | Jul 07, 2023 |
| 18348868 | SELECTIVE SIN CAPPING ON METAL GATE FOR METAL OXIDATION PREVENTION | AU, BAC H | 2898 | Non-Final OA | Jul 07, 2023 |
| 18348780 | MULTI-GATE DEVICE AND RELATED METHODS | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 07, 2023 |
| 18219248 | METAL-INSULATOR-METAL CAPACITORS | DIAZ, JOSE R | 2815 | Non-Final OA | Jul 07, 2023 |
| 18218927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIM, JAY C | 2815 | Non-Final OA | Jul 06, 2023 |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 06, 2023 |
| 18348343 | NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY | BRADFORD, PETER | 2897 | Non-Final OA | Jul 06, 2023 |
| 18347254 | VT1 REDUCTION USING VERTICAL NPN | ABDELAZIEZ, YASSER A | 2898 | Non-Final OA | Jul 05, 2023 |
| 18218482 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jul 05, 2023 |
| 18347542 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | BOOTH, RICHARD A | 2812 | Non-Final OA | Jul 05, 2023 |
| 18346841 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MEASURING THE OPTICAL DIE | MOONEY, MICHAEL P | 2874 | Non-Final OA | Jul 04, 2023 |
| 18346530 | IMAGE SENSOR INTEGRATED CHIP STRUCTURE | WRIGHT, TUCKER J | 2891 | Non-Final OA | Jul 03, 2023 |
| 18346495 | CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHODS OF FORMATION | MOJADDEDI, OMAR F | 2898 | Non-Final OA | Jul 03, 2023 |
| 18346772 | SEMICONDUCTOR DEVICE HAVING LOW-RESISTANCE GATE CONNECTOR | NARAGHI, ALI | 2817 | Non-Final OA | Jul 03, 2023 |
| 18346544 | MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE | BELOUSOV, ALEXANDER | 2818 | Non-Final OA | Jul 03, 2023 |
| 18345844 | HIGH VOLTAGE TRANSISTOR STRUCTURE AND METHODS OF FORMATION | RAHIM, NILUFA | 2893 | Non-Final OA | Jun 30, 2023 |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | GOODWIN, DAVID J | 2817 | Non-Final OA | Jun 30, 2023 |
| 18345988 | SEMICONDUCTOR DEVICE HAVING DIELECTRIC GATE ISOLATION SECTION | WELLINGTON, ANDREA L | 2800 | Non-Final OA | Jun 30, 2023 |
| 18344665 | STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHODS FOR FORMING THE SAME | HOQUE, MOHAMMAD M | 2817 | Non-Final OA | Jun 29, 2023 |
| 18343757 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | CLINTON, EVAN GARRETT | 2899 | Non-Final OA | Jun 29, 2023 |
| 18215600 | SEMICONDUCTOR STORAGE CELL STRUCTURE AND MANUFACTURING METHOD THEREOF | CHIN, EDWARD | 2893 | Non-Final OA | Jun 28, 2023 |
| 18343339 | INTEGRATED CIRCUIT DEVICE, SYSTEM AND METHOD | KAO, SOPHIA WEI-CHUN | 2817 | Non-Final OA | Jun 28, 2023 |
| 18342910 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | GONDARENKO, NATALIA A | 2891 | Non-Final OA | Jun 28, 2023 |
| 18343107 | PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURING THE SAME | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Jun 28, 2023 |
| 18342751 | SEMICONDUCTOR STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF | SIPLING, KENNETH MARK | 2818 | Non-Final OA | Jun 28, 2023 |
| 18342052 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | FARMER, EMILY NICOLE | 2812 | Non-Final OA | Jun 27, 2023 |
| 18342709 | SEMICONDUCTOR STRUCTURES WITH COVER LAYERS | HANUMASAGAR, SHAMITA S | 2814 | Non-Final OA | Jun 27, 2023 |
| 18340897 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | HANUMASAGAR, SHAMITA S | 2814 | Non-Final OA | Jun 26, 2023 |
| 18341205 | METALENS FOR NEAR INFRARED PHOTODETECTOR | LAU, EDMOND C | 2871 | Non-Final OA | Jun 26, 2023 |
| 18340519 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | MENZ, LAURA MARY | 2813 | Non-Final OA | Jun 23, 2023 |
| 18338935 | BIAXIAL OXIDE DIRECTION COMPLEMENTARY FIELD EFFECT TRANSISTOR | BOEGEL, CHEVY JACOB | 2812 | Non-Final OA | Jun 21, 2023 |
| 18338381 | DIELECTRIC WAVEGUIDE FOR TRANSMITTING ELECTRICAL SIGNAL AND METHOD OF FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jun 21, 2023 |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | Non-Final OA | Jun 21, 2023 |
| 18338984 | MEMORY DEVICE | AHMAD, KHAJA | 2813 | Non-Final OA | Jun 21, 2023 |
| 18212487 | METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES THEREOF | SALERNO, SARAH KATE | 2814 | Non-Final OA | Jun 21, 2023 |
| 18337963 | Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Copper Redistribution Layer Scheme | AU, BAC H | 2898 | Final Rejection | Jun 20, 2023 |
| 18338161 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jun 20, 2023 |
| 18337267 | STACKED TRANSISTORS IN MEMORY CIRCUIT AND METHOD OF OPERATING SAME | BERMUDEZ LOZADA, ALFREDO | 2825 | Non-Final OA | Jun 19, 2023 |
| 18336791 | BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE | KARIMY, TIMOR | 2818 | Non-Final OA | Jun 16, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | MCCOY, THOMAS WILSON | 2814 | Final Rejection | Jun 15, 2023 |
| 18335525 | FEEDTHROUGH VIA BETWEEN ACTIVE REGIONS | TRICE III, WILLIAM CLARENCE | 2893 | Non-Final OA | Jun 15, 2023 |
| 18335838 | METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME | KARIMY, TIMOR | 2818 | Non-Final OA | Jun 15, 2023 |
| 18334630 | NOISE TRANSISTOR | TRICE III, WILLIAM CLARENCE | 2893 | Non-Final OA | Jun 14, 2023 |
| 18334955 | RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING | RIVERA, CARLOS A | 3723 | Final Rejection | Jun 14, 2023 |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | Non-Final OA | Jun 14, 2023 |
| 18334802 | INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME | PHAM, THANHHA S | 2812 | Non-Final OA | Jun 14, 2023 |
| 18334350 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | 2818 | Non-Final OA | Jun 13, 2023 |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | FERNANDES, ERROL V | 2893 | Non-Final OA | Jun 12, 2023 |
| 18333189 | SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME | HAIDER, WASIUL | 2812 | Non-Final OA | Jun 12, 2023 |
| 18333102 | SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME | PETKOVSEK, DANIEL | 2874 | Non-Final OA | Jun 12, 2023 |
| 18332028 | DIELECTRIC FEATURES FOR PARASITIC CAPACITANCE REDUCTION | DUREN, TIMOTHY EDWARD | 2817 | Final Rejection | Jun 09, 2023 |
| 18331897 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | KUSUMAKAR, KAREN M | 2897 | Final Rejection | Jun 08, 2023 |
| 18329690 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME | STAHL, MICHAEL J | 2874 | Final Rejection | Jun 06, 2023 |
| 18206267 | SEMICONDUCTOR DEVICE STRUCTURE WITH BUTTED-CONTACT AND METHODS OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jun 06, 2023 |
| 18329881 | BUFFER STRUCTURE WITH INTERLAYER BUFFER LAYERS FOR HIGH VOLTAGE DEVICE | KIM, JAY C | 2815 | Non-Final OA | Jun 06, 2023 |
| 18329166 | VIAS and Via Rails for Source/Drain Metal Full Contact | PHAM, THANHHA S | 2812 | Non-Final OA | Jun 05, 2023 |
| 18205678 | HIGH VOLTAGE DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | AHMED, SHAHED | 2813 | Non-Final OA | Jun 05, 2023 |
| 18329271 | PROTECTIVE PACKAGE ASSEMBLY | SPICER, JENINE MARIE | 3736 | Non-Final OA | Jun 05, 2023 |
| 18327628 | OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATING THEREOF | BOULGHASSOUL, YOUNES | 2814 | Non-Final OA | Jun 01, 2023 |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | MCDONALD, RODNEY GLENN | 1794 | Final Rejection | Jun 01, 2023 |
| 18326494 | SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION | LU, JIONG-PING | 1713 | Non-Final OA | May 31, 2023 |
| 18325117 | MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | SHOOK, DANIEL P | 2896 | Non-Final OA | May 30, 2023 |
| 18325739 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | SMITH, CHAD | 2874 | Non-Final OA | May 30, 2023 |
| 18325699 | OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS | BELOUSOV, ALEXANDER | 2818 | Non-Final OA | May 30, 2023 |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | Non-Final OA | May 29, 2023 |
| 18202541 | ANTI-FERROELECTRIC MEMORY DEVICE | MARUF, SHEIKH | 2897 | Non-Final OA | May 26, 2023 |
| 18324201 | ISOLATION STRUCTURE FOR ACTIVE DEVICES | JAHAN, BILKIS | 2817 | Non-Final OA | May 26, 2023 |
| 18324729 | WRAP-AROUND SILICIDE LAYER | FAYETTE, NATHALIE RENEE | 2812 | Non-Final OA | May 26, 2023 |
| 18324415 | PIXEL WITH DUAL-PD LAYOUT | WRIGHT, TUCKER J | 2891 | Non-Final OA | May 26, 2023 |
| 18323688 | LAYOUT OF SCRIBE LINE FEATURES | LEE, DA WEI | 2817 | Non-Final OA | May 25, 2023 |
| 18323465 | STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE | NARAGHI, ALI | 2817 | Non-Final OA | May 25, 2023 |
| 18322863 | INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING | FAN, SU JYA | 2818 | Final Rejection | May 24, 2023 |
| 18322882 | SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF MAKING | MUNOZ, ANDRES F | 2818 | Final Rejection | May 24, 2023 |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | May 24, 2023 |
| 18200939 | SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD | WITTENBERG, STEFANIE S | 1795 | Non-Final OA | May 23, 2023 |
| 18321343 | SEMICONDUCTOR STRUCTURE INCLUDING VERTICAL DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME | GHYKA, ALEXANDER G | 2812 | Non-Final OA | May 22, 2023 |
| 18200495 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION | CHACKO DAVIS, DABORAH | 1737 | Non-Final OA | May 22, 2023 |
| 18321512 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | MUSE, ISMAIL A | 2812 | Final Rejection | May 22, 2023 |
| 18321609 | METHOD OF FORMING CONTACT STRUCTURES | PRIDEMORE, NATHAN ANDREW | 2898 | Non-Final OA | May 22, 2023 |
| 18320464 | SEMICONDUCTOR STRUCTURE WITH MEMORY DEVICES AND METHOD FOR MANUFACTURING THE SAME | BAUMAN, SCOTT E | 2815 | Non-Final OA | May 19, 2023 |
| 18320724 | MOS-BASED DESIGN SOLUTIONS FOR SOLVING WELL-PID | RAHIM, NILUFA | 2893 | Non-Final OA | May 19, 2023 |
| 18320219 | PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME | CHEN, KEATH T | 1716 | Non-Final OA | May 19, 2023 |
| 18319703 | FLASH MEMORY WITH STACKABLE MEMORY CELLS | BOOTH, RICHARD A | 2812 | Non-Final OA | May 18, 2023 |
| 18319673 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | May 18, 2023 |
| 18318726 | METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING CRYSTALLINE SEMICONDUCTOR FILM | LEE, DA WEI | 2817 | Final Rejection | May 17, 2023 |
| 18198318 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HAN, JONATHAN | 2818 | Non-Final OA | May 17, 2023 |
| 18197968 | FINFET DEVICE STRUCTURE AND METHOD | WILCZEWSKI, MARY A | 2898 | Non-Final OA | May 16, 2023 |
| 18318662 | DIRECT-TIME-OF-FLIGHT DEVICE, SYSTEM, AND METHOD | HELLNER, MARK | 3645 | Non-Final OA | May 16, 2023 |
| 18318698 | MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | May 16, 2023 |
| 18317351 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | HAN, JONATHAN | 2818 | Non-Final OA | May 15, 2023 |
| 18317481 | INTEGRATED CIRCUIT DRIVER DEVICE, LAYOUT, AND METHOD | TURNER, BRIAN | 2818 | Non-Final OA | May 15, 2023 |
| 18317462 | SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE | LE, THAO P | 2818 | Non-Final OA | May 15, 2023 |
| 18316146 | P-DIPOLE MATERIAL FOR STACKED TRANSISTORS | HOANG, TUAN A | 2898 | Non-Final OA | May 11, 2023 |
| 18315868 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION | LU, JIONG-PING | 1713 | Final Rejection | May 11, 2023 |
| 18315672 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH THROUGH SEMICONDUCTOR VIA | GHYKA, ALEXANDER G | 2812 | Non-Final OA | May 11, 2023 |
| 18316029 | TRANSISTOR STRUCTURE AND METHODS OF FORMATION | LEE, EUGENE | 2815 | Non-Final OA | May 11, 2023 |
| 18315232 | N-DIPOLE MATERIAL FOR STACKED TRANSISTORS | HOANG, TUAN A | 2898 | Non-Final OA | May 10, 2023 |
| 18314968 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | Non-Final OA | May 10, 2023 |
| 18314811 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME | MARUF, SHEIKH | 2897 | Final Rejection | May 09, 2023 |
| 18314184 | FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | May 09, 2023 |
| 18195351 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | HOANG, TUAN A | 2898 | Non-Final OA | May 09, 2023 |
| 18314555 | LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHEET DEVICE | HAN, JONATHAN | 2818 | Non-Final OA | May 09, 2023 |
| 18312718 | TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES | GHYKA, ALEXANDER G | 2812 | Non-Final OA | May 05, 2023 |
| 18312199 | COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | Non-Final OA | May 04, 2023 |
| 18312012 | WAFER BONDING APPARATUS AND METHOD | GHYKA, ALEXANDER G | 2812 | Non-Final OA | May 04, 2023 |
| 18311890 | SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | PROSTOR, ANDREW VICTOR | 2812 | Non-Final OA | May 03, 2023 |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | 2818 | Non-Final OA | Apr 28, 2023 |
| 18308982 | SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME | HAN, JONATHAN | 2818 | Non-Final OA | Apr 28, 2023 |
| 18308928 | DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION | WARREN, MATTHEW E | 2815 | Non-Final OA | Apr 28, 2023 |
| 18309277 | Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale Package | CHANG, JAY C | 2817 | Non-Final OA | Apr 28, 2023 |
| 18307977 | THIN FILM RESISTOR WITH GRADED RESISTIVE LAYER | LEE, KYUNG S | 2831 | Non-Final OA | Apr 27, 2023 |
| 18308026 | DIELECTRIC GAS SPACER FORMATION FOR REDUCING PARASITIC CAPACITANCE IN A TRANSISTOR INCLUDING NANOSHEET STRUCTURES | LEE, DA WEI | 2817 | Non-Final OA | Apr 27, 2023 |
| 18308003 | SEAL RING STRUCTURE FOR MULTI-GATE DEVICE AND THE METHOD THEREOF | DAS, PINAKI | 2898 | Non-Final OA | Apr 27, 2023 |
| 18307793 | SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME | CHANG, JAY C | 2817 | Non-Final OA | Apr 26, 2023 |
| 18307025 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | Final Rejection | Apr 26, 2023 |
| 18139266 | PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Apr 25, 2023 |
| 18305442 | POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR | HUTSON, NICHOLAS LELAND | 2818 | Final Rejection | Apr 24, 2023 |
| 18306101 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | PATEL, REEMA | 2812 | Non-Final OA | Apr 24, 2023 |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | OH, JIYOUNG | 2818 | Non-Final OA | Apr 21, 2023 |
| 18304527 | THROUGH VIA WITH GUARD RING STRUCTURE | NGUYEN, DAO H | 2818 | Non-Final OA | Apr 21, 2023 |
| 18304393 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | SHAMSUZZAMAN, MOHAMMED | 2897 | Non-Final OA | Apr 21, 2023 |
| 18304913 | BACKSIDE VIA AND METAL GATE SEPARATION | DAS, PINAKI | 2898 | Non-Final OA | Apr 21, 2023 |
| 18137288 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | CHACKO DAVIS, DABORAH | 1737 | Non-Final OA | Apr 20, 2023 |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | MUNOZ, ANDRES F | 2818 | Non-Final OA | Apr 20, 2023 |
| 18303589 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME | HA, NATHAN W | 2814 | Non-Final OA | Apr 20, 2023 |
| 18303131 | SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | SLUTSKER, JULIA | 2891 | Non-Final OA | Apr 19, 2023 |
| 18302466 | SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION | LIU, BENJAMIN T | 2893 | Non-Final OA | Apr 18, 2023 |
| 18302430 | SEMICONDUCTOR DEVICE WITH PHASE-CHANGE MATERIAL AND METHOD FOR MANUFACTURING THEREOF | AMER, MOUNIR S | 2818 | Non-Final OA | Apr 18, 2023 |
| 18302154 | Energy-Efficient Recurrent Neural Network Accelerator | KHAN, SHAHID K | 2146 | Non-Final OA | Apr 18, 2023 |
| 18302775 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Apr 18, 2023 |
| 18301450 | SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD | HAN, JONATHAN | 2818 | Non-Final OA | Apr 17, 2023 |
| 18135598 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MOJADDEDI, OMAR F | 2898 | Non-Final OA | Apr 17, 2023 |
| 18299199 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Apr 12, 2023 |
| 18133945 | PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF | SULLIVAN, CALEEN O | 2899 | Final Rejection | Apr 12, 2023 |
| 18133933 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | CHAMPION, RICHARD DAVID | 1737 | Non-Final OA | Apr 12, 2023 |
| 18298503 | WAFER CARRIER HAVING INSPECTION WINDOW AND OPERATING METHOD THEREOF | NGUYEN, LEON VIET Q | 2663 | Non-Final OA | Apr 11, 2023 |
| 18298629 | SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES | LIU, XIAOMING | 2812 | Non-Final OA | Apr 11, 2023 |
| 18298206 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | NGUYEN, DUY T V | 2818 | Final Rejection | Apr 10, 2023 |
| 18298114 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | TRAN, BINH X | 1713 | Non-Final OA | Apr 10, 2023 |
| 18298031 | METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING | TANDY, LAURA ELOISE | 2881 | Non-Final OA | Apr 10, 2023 |
| 18297182 | EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS | LIU, XIAOMING | 2812 | Non-Final OA | Apr 07, 2023 |
| 18297462 | CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | 2898 | Final Rejection | Apr 07, 2023 |
| 18297162 | ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY | WARREN, MATTHEW E | 2815 | Non-Final OA | Apr 07, 2023 |
| 18131562 | CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING | COMLEY, ALEXANDER BRYANT | 3746 | Non-Final OA | Apr 06, 2023 |
| 18130288 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE | MEMULA, SURESH | 2851 | Non-Final OA | Apr 03, 2023 |
| 18193777 | BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS | GEBREMARIAM, SAMUEL A | 2811 | Non-Final OA | Mar 31, 2023 |
| 18194484 | ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | JUNGE, BRYAN R. | 2897 | Non-Final OA | Mar 31, 2023 |
| 18193052 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | LOHAKARE, PRATIKSHA JAYANT | 2818 | Non-Final OA | Mar 30, 2023 |
| 18128601 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Mar 30, 2023 |
| 18192704 | MICRO-RING WAVEGUIDE HEATER | BLEVINS, JERRY M | 2874 | Non-Final OA | Mar 30, 2023 |
| 18126298 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES | LIU, XIAOMING | 2812 | Non-Final OA | Mar 24, 2023 |
| 18188082 | STRUCTURE AND METHOD FOR DEEP TRENCH CAPACITOR | BODNAR, JOHN A | 2893 | Non-Final OA | Mar 22, 2023 |
| 18188306 | Gate Isolation Wall for Semiconductor Device | RAHMAN, MOIN M | 2898 | Non-Final OA | Mar 22, 2023 |
| 18188234 | INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF | HOANG, TUAN A | 2898 | Non-Final OA | Mar 22, 2023 |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | GREEN, TELLY D | 2898 | Non-Final OA | Mar 20, 2023 |
| 18186778 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | FAYETTE, NATHALIE RENEE | 2812 | Non-Final OA | Mar 20, 2023 |
| 18123095 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | SULLIVAN, CALEEN O | 2899 | Non-Final OA | Mar 17, 2023 |
| 18185611 | SEMICONDUCTOR STRUCTURE | SPALLA, DAVID C | 2893 | Non-Final OA | Mar 17, 2023 |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | 2812 | Final Rejection | Mar 17, 2023 |
| 18184666 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | KOO, LAMONT B | 2813 | Non-Final OA | Mar 16, 2023 |
| 18185059 | CHARGE PUMP CIRCUIT AND METHOD | TRA, ANH QUAN | 2843 | Non-Final OA | Mar 16, 2023 |
| 18183574 | Image Sensor Structures And Methods For Forming The Same | PARENDO, KEVIN A | 2896 | Non-Final OA | Mar 14, 2023 |
| 18181678 | SPACER STRUCTURES AND CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | NGUYEN, CUONG B | 2818 | Non-Final OA | Mar 10, 2023 |
| 18180852 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | CLINTON, EVAN GARRETT | 2899 | Non-Final OA | Mar 09, 2023 |
| 18181430 | Multi-Gate Devices And Method Of Forming The Same | CHUNG, ANDREW | 2898 | Non-Final OA | Mar 09, 2023 |
| 18180589 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SPALLA, DAVID C | 2893 | Non-Final OA | Mar 08, 2023 |
| 18179395 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | CHEN, YU | 2896 | Final Rejection | Mar 07, 2023 |
| 18179519 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | HUNTER III, CARNELL | 2893 | Non-Final OA | Mar 07, 2023 |
| 18178406 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BODNAR, JOHN A | 2893 | Non-Final OA | Mar 03, 2023 |
| 18177909 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC SPACER AND METHOD FOR MANUFACTURING THE SAME | MARIN, JACOB RAUL | 2818 | Final Rejection | Mar 03, 2023 |
| 18174046 | SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACTURING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | Non-Final OA | Feb 24, 2023 |
| 18173086 | PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | 2899 | Final Rejection | Feb 23, 2023 |
| 18173033 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Feb 22, 2023 |
| 18172703 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | LEE, WOO KYUNG | 2815 | Final Rejection | Feb 22, 2023 |
| 18173039 | PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE | PATEL, REEMA | 2812 | Final Rejection | Feb 22, 2023 |
| 18171277 | THIN FILM RESISTOR (TFR) WITH OXIDATION PREVENTION | LEE, KYUNG S | 2831 | Non-Final OA | Feb 17, 2023 |
| 18171282 | DISPLAY DEVICES WITH STRAY LIGHT PREVENTION MECHANISMS | AHMADI, MOHSEN | 2896 | Non-Final OA | Feb 17, 2023 |
| 18171288 | FRAME CASSETTE WITH INTERNAL COVER CASES | MYERS, GLENN F | 3652 | Final Rejection | Feb 17, 2023 |
| 18170416 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | MOVVA, AMAR | 2898 | Final Rejection | Feb 16, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | Feb 16, 2023 |
| 18170111 | INTEGRATED CIRCUIT DESIGN METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT | PARIHAR, SUCHIN | 2851 | Non-Final OA | Feb 16, 2023 |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | PATEL, REEMA | 2812 | Non-Final OA | Feb 15, 2023 |
| 18169594 | VOLTAGE SUPPLY SELECTION CIRCUIT AND METHODS FOR OPERATING THE SAME | ALMO, KHAREEM E | 2849 | Non-Final OA | Feb 15, 2023 |
| 18169177 | PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Final Rejection | Feb 14, 2023 |
| 18167423 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | HOANG, TUAN A | 2898 | Non-Final OA | Feb 10, 2023 |
| 18167081 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Feb 10, 2023 |
| 18107658 | MULTICHANNEL TRANSISTORS WITH SOURCE/DRAIN REGIONS HAVING WAVY INNER PROFILES AND METHODS FOR MANUFACTURING THEREOF | DUREN, TIMOTHY EDWARD | 2817 | Final Rejection | Feb 09, 2023 |
| 18166730 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LEE, DA WEI | 2817 | Final Rejection | Feb 09, 2023 |
| 18166932 | SEMICONDUCTOR DEVICE STRUCTURE WITH ISOLATION LAYER AND METHOD FOR FORMING THE SAME | HOANG, TUAN A | 2898 | Final Rejection | Feb 09, 2023 |
| 18166016 | OPTICAL DEVICE AND METHOD OF FABRICATING THEREOF | SMITH, CHAD | 2874 | Non-Final OA | Feb 08, 2023 |
| 18165759 | SELECTIVE HARDMASK ON HARDMASK | SULLIVAN, CALEEN O | 2899 | Non-Final OA | Feb 07, 2023 |
| 18165772 | Thermal Dissipation Structures and Methods for Forming Same | WEGNER, AARON MICHAEL | 2897 | Final Rejection | Feb 07, 2023 |
| 18165624 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Feb 07, 2023 |
| 18165292 | METHOD OF EXECUTING DESIGN FLOW WITH MACHINE LEARNING TECHNIQUES | NGUYEN, NHA T | 2851 | Non-Final OA | Feb 06, 2023 |
| 18164845 | MAGNETIC TUNNEL JUNCTION (MTJ) HAVING A DIFFUSION BLOCKING SPACER LAYER | LEE, WOO KYUNG | 2815 | Final Rejection | Feb 06, 2023 |
| 18105659 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | NGUYEN, SOPHIA T | 2893 | Final Rejection | Feb 03, 2023 |
| 18163539 | SEMICONDUCTOR STRUCTURE WITH TREATED GATE DIELECTRIC LAYER AND METHOD FOR MANUFACTURING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2812 | Non-Final OA | Feb 02, 2023 |
| 18163400 | CONTACT STRUCTURE WITH ARCHED TOP SURFACE AND FABRICATION METHOD THEREOF | ENAD, CHRISTINE A | 2811 | Non-Final OA | Feb 02, 2023 |
| 18163394 | WAFER-LEVEL DIE-TRANSFER TOOL AND METHOD | PETERSON, ERIK T | 2898 | Non-Final OA | Feb 02, 2023 |
| 18103846 | METHODS FOR CORRECTING WARPAGE WITH STRESS FILMS AND PACKAGE STRUCTURES THEREOF | PATEL, REEMA | 2812 | Non-Final OA | Jan 31, 2023 |
| 18103684 | SYSTEMS AND METHODS FOR SEMICONDUCTOR WAFER TRANSPORT | COLLINS, MICHAEL | 3655 | Non-Final OA | Jan 31, 2023 |
| 18103676 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | NGUYEN, THANH T | 2893 | Non-Final OA | Jan 31, 2023 |
| 18103377 | BACK-END-OF-LINE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | VU, DAVID | 2818 | Non-Final OA | Jan 30, 2023 |
| 18161555 | SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF | HARRISON, MONICA D | 2815 | Non-Final OA | Jan 30, 2023 |
| 18103289 | METHOD OF MANUFACTURING PHOTO MASKS AND SEMICONDUCTOR DEVICES | ANGEBRANNDT, MARTIN J | 1737 | Final Rejection | Jan 30, 2023 |
| 18160593 | INTEGRATED CIRCUIT DESIGN METHOD AND SYSTEM | DINH, PAUL | 2851 | Non-Final OA | Jan 27, 2023 |
| 18159773 | Metal Gate Interconnect for Forksheet and Related Semiconductor Structures | BOEGEL, CHEVY JACOB | 2812 | Final Rejection | Jan 26, 2023 |
| 18159878 | Semiconductor Devices with Frontside and Backside Power Rails | BERNSTEIN, ALLISON | 2824 | Non-Final OA | Jan 26, 2023 |
| 18100714 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | Non-Final OA | Jan 24, 2023 |
| 18099348 | SEMICONDUCTOR DEVICE | LASASSO, VICTOR JOSEPH | 2898 | Non-Final OA | Jan 20, 2023 |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Non-Final OA | Jan 20, 2023 |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | 2898 | Final Rejection | Jan 20, 2023 |
| 18156847 | SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION | MUNOZ, ANDRES F | 2818 | Final Rejection | Jan 19, 2023 |
| 18099245 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jan 19, 2023 |
| 18099146 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | 2898 | Final Rejection | Jan 19, 2023 |
| 18156414 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | PIZARRO CRESPO, MARCOS D | 2814 | Final Rejection | Jan 19, 2023 |
| 18157054 | METHOD OF MODULATING MULTI-GATE DEVICE CHANNELS AND STRUCTURES THEREOF | NIX, NORA TAYLOR | 2891 | Non-Final OA | Jan 19, 2023 |
| 18155912 | SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME | ASSOUMAN, HERVE-LOUIS Y | 2812 | Final Rejection | Jan 18, 2023 |
| 18155980 | SILICON PHOTONICS SYSTEM | NGO, BRIAN | 2851 | Non-Final OA | Jan 18, 2023 |
| 18097970 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | MOJADDEDI, OMAR F | 2898 | Non-Final OA | Jan 17, 2023 |
| 18155296 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | OH, JIYOUNG | 2818 | Final Rejection | Jan 17, 2023 |
| 18155491 | IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME | MUNOZ, ANDRES F | 2818 | Non-Final OA | Jan 17, 2023 |
| 18097343 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | KEAGY, ROSE ALYSSA | 2818 | Final Rejection | Jan 16, 2023 |
| 18154043 | INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | JAHAN, BILKIS | 2817 | Non-Final OA | Jan 13, 2023 |
| 18153358 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | CHI, SUBERR L | 2893 | Non-Final OA | Jan 12, 2023 |
| 18153553 | BARRIER LAYER FOR WEAKENED BOUNDARY EFFECT | ENAD, CHRISTINE A | 2811 | Non-Final OA | Jan 12, 2023 |
| 18153890 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | PATERSON, BRIGITTE A | 2896 | Non-Final OA | Jan 12, 2023 |
| 18152770 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | AMER, MOUNIR S | 2818 | Final Rejection | Jan 11, 2023 |
| 18152778 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF | TANG, ALICE W | 2814 | Non-Final OA | Jan 11, 2023 |
| 18152160 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | WALL, VINCENT | 2898 | Final Rejection | Jan 10, 2023 |
| 18152167 | METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR GENERATING A LAYOUT OF A SEMICONDUCTOR DEVICE | TAT, BINH C | 2851 | Non-Final OA | Jan 10, 2023 |
| 18152726 | INDUCTOR AND METHOD OF FORMING THE SAME | WEST, AISLIN MARIE | 2837 | Non-Final OA | Jan 10, 2023 |
| 18152715 | TRIMMING METHOD | ZABEL, ANDREW JOHN | 2818 | Final Rejection | Jan 10, 2023 |
| 18150806 | IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WRIGHT, TUCKER J | 2891 | Non-Final OA | Jan 06, 2023 |
| 18150809 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | LEE, DA WEI | 2817 | Non-Final OA | Jan 06, 2023 |
| 18150863 | PHASE-CHANGE DEVICE STRUCTURE | AMER, MOUNIR S | 2818 | Non-Final OA | Jan 06, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | 2897 | Non-Final OA | Jan 06, 2023 |
| 18150385 | INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY | SUN, YU-HSI DAVID | 2817 | Non-Final OA | Jan 05, 2023 |
| 18150410 | BACK END FLOATING GATE STRUCTURE IN A SEMICONDUCTOR DEVICE | DINKE, BITEW A | 2812 | Non-Final OA | Jan 05, 2023 |
| 18150539 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS | TRAN, TRANG Q | 2811 | Final Rejection | Jan 05, 2023 |
| 18150617 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELECTRICAL BREAKDOWN PERFORMANCE, AND METHOD FOR MANUFACTURING THE SAME | TRAN, TONY | 2893 | Final Rejection | Jan 05, 2023 |
| 18149783 | ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE | BELL, LAUREN R | 2896 | Final Rejection | Jan 04, 2023 |
| 18149767 | DIELECTRIC STRUCTURE FOR SMALL PIXEL DESIGNS | FAYETTE, NATHALIE RENEE | 2812 | Final Rejection | Jan 04, 2023 |
| 18149789 | CRUCIFORM BONDING STRUCTURE FOR 3D-IC | GOODWIN, DAVID J | 2817 | Final Rejection | Jan 04, 2023 |
| 18150027 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | Jan 04, 2023 |
| 18149712 | 3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES | KARIMY, TIMOR | 2818 | Non-Final OA | Jan 04, 2023 |
| 18149312 | THRESHOLD VOLTAGE MODULATION FOR THIN FILM TRANSISTORS | LEE, EUGENE | 2815 | Final Rejection | Jan 03, 2023 |
| 18149215 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Jan 03, 2023 |
| 18092677 | GATE STACK OF FORKSHEET STRUCTURE | BOEGEL, CHEVY JACOB | 2812 | Final Rejection | Jan 03, 2023 |
| 18083576 | FINFET HAVING A GATE DIELECTRIC COMPRISING A MULTI-LAYER STRUCTURE INCLUDING AN OXIDE LAYER WITH DIFFERENT THICKNESSES ON SIDE AND TOP SURFACES OF THE FINS | PIZARRO CRESPO, MARCOS D | 2814 | Final Rejection | Dec 19, 2022 |
| 17994750 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURES | YEMELYANOV, DMITRIY | 2891 | Final Rejection | Nov 28, 2022 |
| 17986155 | Magnetoresistive Random Access Memory Cell And Fabricating The Same | PIZARRO CRESPO, MARCOS D | 2814 | Final Rejection | Nov 14, 2022 |
| 17967041 | METHOD AND APPARATUS FOR SOLVENT RECYCLING | PHAM, THOMAS T | 1713 | Final Rejection | Oct 17, 2022 |
| 17900001 | SEMICONDUCTOR STRUCTURE WITH REDUCED PARASITIC CAPACITANCE AND METHOD FOR MANUFACTURING THE SAME | DEGRASSE, IAN ISAAC | 2818 | Final Rejection | Aug 31, 2022 |
| 17823508 | EMBEDDED SOI STRUCTURE FOR LOW LEAKAGE MOS CAPACITOR | MAI, ANH D | 2893 | Non-Final OA | Aug 30, 2022 |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | Non-Final OA | Aug 27, 2022 |
| 17896745 | WORD LINE STRUCTURES IN SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | ZHU, SHENG-BAI | 2897 | Non-Final OA | Aug 26, 2022 |
| 17896081 | MEMORY DEVICE AND METHOD OF MAKING THE SAME | CULBERT, CHRISTOPHER A | 2815 | Final Rejection | Aug 26, 2022 |
| 17896093 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Final Rejection | Aug 26, 2022 |
| 17822390 | CAPACITORLESS DYNAMIC RANDOM ACCESS MEMORY AND METHODS OF FORMATION | ANDERSON, WILLIAM H | 2817 | Non-Final OA | Aug 25, 2022 |
| 17822139 | EDGE COUPLER AND METHOD OF FORMING THE SAME | PETKOVSEK, DANIEL | 2874 | Final Rejection | Aug 25, 2022 |
| 17894614 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | ARDEO, EMILIO | 2899 | Final Rejection | Aug 24, 2022 |
| 17891348 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | HATFIELD, MARSHALL MU-NUO | 2897 | Final Rejection | Aug 19, 2022 |
| 17889404 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | PRASAD, NEIL R | 2897 | Non-Final OA | Aug 17, 2022 |
| 17889381 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | CIESLEWICZ, ANETA B | 2893 | Final Rejection | Aug 16, 2022 |
| 17819987 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF FORMING SEMICONDUCTOR DEVICE | WEGNER, AARON MICHAEL | 2897 | Final Rejection | Aug 16, 2022 |
| 17887983 | IMAGE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | Final Rejection | Aug 15, 2022 |
| 17887499 | A Semiconductor Package Comprising An Underfill Material That Extends to, And is Coplanar With, A Bottom Surface Of An Electrical Device | MIHALIOV, DMITRI | 2812 | Non-Final OA | Aug 14, 2022 |
| 17886461 | PACKAGE AND FABRICATION METHOD THEREOF | NGUYEN, CUONG B | 2818 | Final Rejection | Aug 12, 2022 |
| 17886921 | SEMICONDUCTOR STRUCTURE WITH STACKED DIELECTRIC DUMMY FIN AND MANUFACTURING METHOD THEREOF | WINTERS, SEAN AYERS | 2892 | Non-Final OA | Aug 12, 2022 |
| 17887306 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | RAMPERSAUD, PRIYA M | 2897 | Final Rejection | Aug 12, 2022 |
| 17885870 | STRUCTURE AND METHOD OF SIGNAL ENHANCEMENT FOR ALIGNMENT PATTERNS | ANGEBRANNDT, MARTIN J | 1737 | Non-Final OA | Aug 11, 2022 |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | Non-Final OA | Aug 11, 2022 |
| 17885809 | APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING | MARINI, MATTHEW G | 2853 | Non-Final OA | Aug 11, 2022 |
| 17884817 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | NGUYEN, THANH T | 2893 | Non-Final OA | Aug 10, 2022 |
| 17883664 | Match-Slave Latch with Skewed Clock | TRA, ANH QUAN | 2843 | Non-Final OA | Aug 09, 2022 |
| 17818368 | PHOTOMASK STRUCTURE AND METHOD OF MANUFACTURING THE SAME | ANGEBRANNDT, MARTIN J | 1737 | Non-Final OA | Aug 09, 2022 |
| 17818377 | MEMORY DEVICE WITH BACKSIDE INTERCONNECTION FOR POWER RAIL AND BITLINE AND METHOD OF FORMING THE SAME | RAMIREZ, ALEXANDRE XAVIER | 2812 | Final Rejection | Aug 09, 2022 |
| 17883668 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | GRAY, AARON J | 2897 | Final Rejection | Aug 09, 2022 |
| 17882047 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | NELSON, HUNTER JARED | 2828 | Final Rejection | Aug 05, 2022 |
| 17881621 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SON, ERIKA HEERA | 2893 | Final Rejection | Aug 05, 2022 |
| 17817603 | WAFER ALIGNMENT ASSEMBLY OF THE SOLDER REFLOW SYSTEM | BACHNER, ROBERT G | 2898 | Non-Final OA | Aug 04, 2022 |
| 17880676 | TARGET MATERIAL IDENTIFICATION METHOD | FRITCHMAN, REBECCA M | 1758 | Non-Final OA | Aug 04, 2022 |
| 17817023 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | NARAGHI, ALI | 2817 | Non-Final OA | Aug 03, 2022 |
| 17816208 | LIGHT-EMITTING PACKAGE AND FORMING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | Non-Final OA | Jul 29, 2022 |
| 17876966 | Semiconductor Structure With Source/Drain Contact Plugs And Method For Forming The Same | CRAMER, HALEE PAIGE | 2891 | Non-Final OA | Jul 29, 2022 |
| 17876819 | Miniature-Target-Detecting Transistors With Different Gate Structures | KARIMY, TIMOR | 2818 | Non-Final OA | Jul 29, 2022 |
| 17876737 | DEVICE WITH TAPERED INSULATION STRUCTURE AND RELATED METHODS | ASHBAHIAN, ERIC K | 2891 | Non-Final OA | Jul 29, 2022 |
| 17815861 | Memory Device and Method of Forming The Same | GREEN, TELLY D | 2898 | Final Rejection | Jul 28, 2022 |
| 17815884 | WAVY-SHAPED EPITAXIAL SOURCE/DRAIN STRUCTURES | TRAN, TONY | 2893 | Final Rejection | Jul 28, 2022 |
| 17874048 | CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | HRNJIC, ADIN | 2817 | Final Rejection | Jul 26, 2022 |
| 17814905 | Structure and Method for Single Gate Non-Volatile Memory Device | BELL, LAUREN R | 2896 | Non-Final OA | Jul 26, 2022 |
| 17874192 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | GREEN, TELLY D | 2898 | Non-Final OA | Jul 26, 2022 |
| 17874057 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH HARD MASK LAYER OVER FIN STRUCTURE | WEGNER, AARON MICHAEL | 2897 | Non-Final OA | Jul 26, 2022 |
| 17873146 | FLUIDIC CARTRIDGE MODULE, BIOSENSOR DEVICE, METHOD OF DETECTING ANALYTE IN SAMPLE | HERBERT, MADISON TAYLOR | 1758 | Final Rejection | Jul 26, 2022 |
| 17873060 | 3D SEMICONDUCTOR PACKAGE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Jul 25, 2022 |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | ISAAC, STANETTA D | 2898 | Non-Final OA | Jul 24, 2022 |
| 17870770 | FIELD EFFECT TRANSISTOR WITH ISOLATION STRUCTURE AND METHOD | DAS, PINAKI | 2898 | Final Rejection | Jul 21, 2022 |
| 17870341 | CO-OPTIMIZATION OF MEMORY AND LOGIC DEVICES BY SOURCE/DRAIN MODULATION AND STRUCTURES THEREOF | GREWAL, HEIM KIRIN | 2812 | Non-Final OA | Jul 21, 2022 |
| 17866924 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | LIN, JOHN | 2815 | Non-Final OA | Jul 18, 2022 |
| 17867083 | SEMICONDUCTOR STRUCTURE WITH THROUGH VIA STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | NIX, NORA TAYLOR | 2891 | Non-Final OA | Jul 18, 2022 |
| 17866532 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | Non-Final OA | Jul 17, 2022 |
| 17866533 | ACCURATE TEMPERATURE MONITOR | LEE JR, WOODY A | 3761 | Final Rejection | Jul 17, 2022 |
| 17865769 | OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | PYO, KEVIN K | 2878 | Non-Final OA | Jul 15, 2022 |
| 17812700 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | SCHODDE, CHRISTOPHER A | 2898 | Final Rejection | Jul 14, 2022 |
| 17864894 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH POWER RAIL | ENAD, CHRISTINE A | 2811 | Final Rejection | Jul 14, 2022 |
| 17862422 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | Non-Final OA | Jul 12, 2022 |
| 17862372 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | TAN, DAVE | 2897 | Final Rejection | Jul 11, 2022 |
| 17811876 | THIN FILM DEPOSITION WITH IMPROVED CONTROL OF PRECURSOR | MOORE, KARLA A | 1716 | Non-Final OA | Jul 11, 2022 |
| 17861234 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | CRAWFORD EASON, LATANYA N | 2813 | Non-Final OA | Jul 10, 2022 |
| 17859013 | MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY CELL | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | Jul 07, 2022 |
| 17859982 | Strained Channel Field Effect Transistor | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | Jul 07, 2022 |
| 17857382 | IMAGE SENSOR HAVING A LATERAL PHOTODETECTOR STRUCTURE | SRINIVASAN, SESHA SAIRAMAN | 2817 | Non-Final OA | Jul 05, 2022 |
| 17858056 | INTERFACE FOR A SEMICONDUCTOR CHIP WITH ADAPTIVE VIA REGION ARRANGEMENT AND SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS | LEE, DA WEI | 2817 | Non-Final OA | Jul 05, 2022 |
| 17810626 | PACKAGE STRUCTURE WITH FAN-OUT STRUCTURE | BELL, LAUREN R | 2896 | Final Rejection | Jul 04, 2022 |
| 17855550 | EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY | LOGIE, MICHAEL J | 2881 | Non-Final OA | Jun 30, 2022 |
| 17853910 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Jun 29, 2022 |
| 17853543 | SEMICONDUCTOR STRUCTURE HAVING CONTACT PLUG | ZHU, SHENG-BAI | 2897 | Non-Final OA | Jun 29, 2022 |
| 17851026 | PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH AIR GAP | AUTORE JR, MARIO ANDRES | 2897 | Final Rejection | Jun 28, 2022 |
| 17809432 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | ANGUIANO, MICHAEL | 2899 | Non-Final OA | Jun 28, 2022 |
| 17851569 | SEMICONDUCTOR DEVICE INCLUDING ANTI-FUSE CELL STRUCTURE | SENGDARA, VONGSAVANH | 2893 | Non-Final OA | Jun 28, 2022 |
| 17809099 | HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | XU, ZHIJUN | 2818 | Non-Final OA | Jun 27, 2022 |
| 17849739 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | TRAN, TIEN | 2812 | Non-Final OA | Jun 27, 2022 |
| 17850845 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | DAS, PINAKI | 2898 | Non-Final OA | Jun 27, 2022 |
| 17847450 | IMAGE SENSOR GATE STRUCTURE AND DOPING PROFILE | XU, ZHIJUN | 2818 | Non-Final OA | Jun 23, 2022 |
| 17847264 | PERIODICAL CORRELATION DETECTION FOR BACKGROUND LIGHT SUPPRESSION IN DIRECT TIME-OF-FLIGHT SENSOR | HULKA, JAMES R | 3645 | Final Rejection | Jun 23, 2022 |
| 17847208 | WET CLEANING TOOL AND METHOD | ZHANG, RICHARD Z | 1714 | Final Rejection | Jun 23, 2022 |
| 17842972 | EMBEDDED CAPACITORS WITH SHARED ELECTRODES | HOQUE, MOHAMMAD M | 2817 | Final Rejection | Jun 17, 2022 |
| 17807324 | FIN STRUCTURES | BLACKWELL, ASHLEY NICOLE | 2897 | Final Rejection | Jun 16, 2022 |
| 17841685 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Jun 16, 2022 |
| 17838303 | FIN FIELD EFFECT TRANSSITOR (FinFET) STRUCTURE HAVING ISOLATION STRUCTURE INTERUPTING CONTINUITY OF SEMICONDUCTO FINS INTO SEGMENTED PORTIONS | MAI, ANH D | 2893 | Non-Final OA | Jun 13, 2022 |
| 17837664 | GRAPHENE-CLAD METAL INTERCONNECT | CHEN, DAVID Z | 2815 | Non-Final OA | Jun 10, 2022 |
| 17836781 | SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | SALAZ, SAMMANTHA KATELYN | 2892 | Non-Final OA | Jun 09, 2022 |
| 17836359 | SYSTEM, METHOD, CIRCUIT, AND DEVICE FOR MILLIMETER-WAVE MULTI-STAGE AMPLIFIER WITH INDUCTIVE COUPLING | BARTOL, LANCE TORBJORN | 2843 | Final Rejection | Jun 09, 2022 |
| 17834274 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | MULERO FLORES, ERIC MANUEL | 2898 | Final Rejection | Jun 07, 2022 |
| 17833820 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES | SALERNO, SARAH KATE | 2814 | Non-Final OA | Jun 06, 2022 |
| 17833830 | EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF | ANGEBRANNDT, MARTIN J | 1737 | Non-Final OA | Jun 06, 2022 |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | REIDA, MOLLY KAY | 2899 | Non-Final OA | Jun 06, 2022 |
| 17833440 | BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS | MARIN, JACOB RAUL | 2818 | Non-Final OA | Jun 06, 2022 |
| 17832580 | Semiconductor Devices With Reduced Leakage Current And Methods Of Forming The Same | ADHIKARI DAWADI, BIPANA | 2898 | Final Rejection | Jun 04, 2022 |
| 17832522 | Guard Ring Design For Through Via | CIESLEWICZ, ANETA B | 2893 | Final Rejection | Jun 03, 2022 |
| 17826100 | MEMORY CELL ISOLATION | KHALIFA, MOATAZ | 2815 | Final Rejection | May 26, 2022 |
| 17825698 | SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING | XU, ZHIJUN | 2818 | Non-Final OA | May 26, 2022 |
| 17824915 | EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION | VERDES, RICKY | 2898 | Final Rejection | May 26, 2022 |
| 17825411 | SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | Non-Final OA | May 26, 2022 |
| 17752577 | Isolation Features For Semiconductor Devices And Methods Of Fabricating The Same | SMITH, BRADLEY | 2817 | Final Rejection | May 24, 2022 |
| 17751340 | SEMICONDUCTOR STRUCTURE INCLUDING SEMICONDUCTOR DEVICES WITH DIFFERENT THRESHOLD VOLTAGES AND METHOD FOR MANUFACTURING THE SAME | SABUR, ALIA | 2812 | Non-Final OA | May 23, 2022 |
| 17750951 | DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS | NADAV, ORI | 2811 | Final Rejection | May 23, 2022 |
| 17751363 | MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | STEVENSON, ANDRE C | 2899 | Final Rejection | May 23, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | SON, ERIKA HEERA | 2893 | Final Rejection | May 23, 2022 |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | Non-Final OA | May 23, 2022 |
| 17749160 | SEMICONDUCTOR DEVICE COMPRISING CONNECTIONS THROUGH STACKED TRANSISTORS FOR ROUTING FLEXIBILITY | WIEGAND, TYLER J | 2812 | Non-Final OA | May 20, 2022 |
| 17747058 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTORS AND BACK-SIDE INTERCONNECT STRUCTURE COMPRISING POWER LINE | MICHAUD, NICHOLAS BRIAN | 2818 | Final Rejection | May 18, 2022 |
| 17746434 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | BEARDSLEY, JONAS TYLER | 2811 | Non-Final OA | May 17, 2022 |
| 17744740 | TEST STRUCTURE AND METHODS OF FORMING THE SAME | FAN, SU JYA | 2818 | Non-Final OA | May 16, 2022 |
| 17743761 | PIPELINES FOR POWER AND AREA SAVINGS AND FOR HIGHER PARALLELISM | RIVERA, MARIA DE JESUS | 2151 | Final Rejection | May 13, 2022 |
| 17742714 | FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH OXIDE SEMICONDUCTOR CHANNEL | CULBERT, CHRISTOPHER A | 2815 | Non-Final OA | May 12, 2022 |
| 17663106 | PHOTODETECTORS HAVING STACKED CONTACT AND SENSING REGIONS | ANDREWS, FELIX BRYAN | 2812 | Non-Final OA | May 12, 2022 |
| 17736105 | CONCENTRATION DETERMINATION METHOD | QIAN, SHIZHI | 1795 | Final Rejection | May 04, 2022 |
| 17661386 | BACK SIDE POWER SUPPLY INTERCONNECT ROUTING | DIAZ, JOSE R | 2815 | Final Rejection | Apr 29, 2022 |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | GOODWIN, DAVID J | 2817 | Non-Final OA | Apr 26, 2022 |
| 17727841 | PACKAGE ON PACKAGE STRUCUTURE WITH ENCAPSULATED HEAT SINK | DAS, PINAKI | 2898 | Final Rejection | Apr 25, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 2891 | Final Rejection | Apr 22, 2022 |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | FORD, NATHAN K | 1716 | Non-Final OA | Apr 18, 2022 |
| 17722302 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | Non-Final OA | Apr 16, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | FOX, BRANDON C | 2818 | Non-Final OA | Apr 15, 2022 |
| 17707078 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF | CARLEY, JEFFREY T. | 3729 | Final Rejection | Mar 29, 2022 |
| 17703668 | SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES | ROLAND, CHRISTOPHER M | 2893 | Non-Final OA | Mar 24, 2022 |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | ISAAC, STANETTA D | 2898 | Final Rejection | Mar 23, 2022 |
| 17697822 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | Non-Final OA | Mar 17, 2022 |
| 17695438 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | HELBERG, DAVID MICHAEL | 2815 | Non-Final OA | Mar 15, 2022 |
| 17690685 | ANTI-FERROELECTRIC TUNNEL JUNCTION WITH ASYMMETRICAL METAL ELECTRODES | MCCOY, THOMAS WILSON | 2814 | Non-Final OA | Mar 09, 2022 |
| 17688647 | FORMATION METHOD OF CHIP PACKAGE | CHEN, YU | 2896 | Non-Final OA | Mar 07, 2022 |
| 17686074 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | CHUNG, ANDREW | 2898 | Non-Final OA | Mar 03, 2022 |
| 17685584 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | MCCOY, THOMAS WILSON | 2814 | Final Rejection | Mar 03, 2022 |
| 17672355 | FERROELECTRIC MEMORY DEVICE WITH LEAKAGE BARRIER LAYERS | ANGUIANO, MICHAEL | 2899 | Non-Final OA | Feb 15, 2022 |
| 17649381 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE | NGUYEN, DUY T V | 2818 | Non-Final OA | Jan 31, 2022 |
| 17584716 | MEMORY DEVICE WITH DUAL CHANNEL TRANSISTOR | BAUMAN, SCOTT E | 2815 | Non-Final OA | Jan 26, 2022 |
| 17577010 | SUBSTRATE PROCESS SYSTEM INCLUDING A COOLING STATION | SHIRSAT, VIVEK K | 3762 | Final Rejection | Jan 16, 2022 |
| 17575619 | FISHBONE STRUCTURE ENHANCING SPACING WITH ADJACENT CONDUCTIVE LINE IN POWER NETWORK | MIYOSHI, JESSE Y | 2898 | Non-Final OA | Jan 13, 2022 |
| 17575578 | DEVICE LEVEL THERMAL DISSIPATION | CHEN, YU | 2896 | Non-Final OA | Jan 13, 2022 |
| 17572935 | STATIC RANDOM ACCESS MEMORY CELL POWER SUPPLY | BUI, THA-O H | 2825 | Final Rejection | Jan 11, 2022 |
| 17568654 | METAL GATE WITH PRETREATMENT LAYER | BOATMAN, CASEY PAUL | 2893 | Final Rejection | Jan 04, 2022 |
| 17516315 | METHOD OF MANUFACTURING A FIELD EFFECT TRANSISTOR USING CARBON NANOTUBES AND A FIELD EFFECT TRANSISTOR | NGUYEN, SOPHIA T | 2893 | Non-Final OA | Nov 01, 2021 |
| 17491179 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | CHEN, YU | 2896 | Final Rejection | Sep 30, 2021 |
| 17486223 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | Non-Final OA | Sep 27, 2021 |
| 17482094 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | SARKER-NAG, AKHEE | 2893 | Final Rejection | Sep 22, 2021 |
| 17473657 | SEMICONDUCTOR MEMORY DEVICES WITH DIELECTRIC FIN STRUCTURES | NGUYEN, SOPHIA T | 2893 | Final Rejection | Sep 13, 2021 |
| 17460909 | SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Aug 30, 2021 |
| 17446215 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | KIELIN, ERIK J | 2814 | Non-Final OA | Aug 27, 2021 |
| 17397547 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Aug 09, 2021 |
| 17393345 | IN-CHIP THERMOELECTRIC DEVICE | MOWLA, GOLAM | 1721 | Final Rejection | Aug 03, 2021 |
| 17372564 | PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME | SPALLA, DAVID C | 2893 | Non-Final OA | Jul 12, 2021 |
| 17367631 | APPARATUS AND METHOD FOR SUBSTRATE HANDLING | WHITMIRE, ERIC DANIEL | 3722 | Non-Final OA | Jul 06, 2021 |
| 17363298 | SYSTEMS AND METHODS FOR CAPACITANCE EXTRACTION | LIN, ARIC | 2851 | Final Rejection | Jun 30, 2021 |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | Non-Final OA | Jun 07, 2021 |
| 17340069 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | Non-Final OA | Jun 06, 2021 |
| 17335985 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING | LI, MEIYA | 2811 | Non-Final OA | Jun 01, 2021 |
| 17302880 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | Final Rejection | May 14, 2021 |
| 17232563 | VALVE BOX MODULE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KLUNK, MARGARET D | 1716 | Final Rejection | Apr 16, 2021 |
| 17220269 | INTEGRATED CIRCUIT STRUCTURE | LIN, ARIC | 2851 | Final Rejection | Apr 01, 2021 |
| 17111014 | INTEGRATED CIRCUIT LAYOUT DIAGRAM SYSTEM | LIN, ARIC | 2851 | Final Rejection | Dec 03, 2020 |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | GOODWIN, DAVID J | 2817 | Non-Final OA | Nov 25, 2020 |
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