Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
1,589 pending office actions • 98 art units • 611 examiners • 0 of 1,589 (0%) have an AI response strategy ready • 3,090 patents granted in the last 365 days
Taiwan Semiconductor Manufacturing Company, Ltd. manages a portfolio featuring 1494 pending office actions. These actions are situated within the Semiconductors, Circuits & Optics technology area. The portfolio is distributed across 95 distinct art units and involves 593 distinct examiners.
TONG-HO KIM is the busiest examiner for this portfolio, currently handling 20 pending office actions. This workload represents a portion of the 1494 total pending actions, illustrating the decentralization of the company's prosecution efforts. With 593 distinct examiners involved, the company must navigate an array of individual examination styles and art unit cultures.
The 95 distinct art units involved in these 1494 pending office actions indicate that the company's innovations span many sub-specialties within the Semiconductors, Circuits & Optics technology area. Managing the distinct examiners requires a strategy to ensure consistency across the portfolio. TONG-HO KIM's 20 pending actions serve as a focal point within the broader prosecution landscape.
Based on the USPTO statutory response window for each pending office action. 277 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 277 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 1 (0%) |
| §101 + other | 13 (1%) |
| §103 only | 466 (29%) |
| §102 only | 120 (8%) |
| §112 only | 55 (3%) |
| Double-patenting only | 104 (7%) |
| Double-patenting + other | 66 (4%) |
| Multi-statute (no §101) | 748 (47%) |
| No statute on record | 16 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| KIM, TONG-HO | 21 | 95.2% | +0.7% |
| KOO, LAMONT B | 21 | 80.6% | +5.2% |
| VALENZUELA, PATRICIA D | 16 | 90.3% | +2.0% |
| WILCZEWSKI, MARY A | 16 | 84.9% | +10.2% |
| BOWEN, ADAM S | 15 | 96.5% | +2.4% |
| DINKE, BITEW A | 12 | 72.9% | +12.4% |
| PARKER, JOHN M | 11 | 92.1% | +0.9% |
| OH, JIYOUNG | 10 | 77.3% | +21.5% |
| WALL, VINCENT | 10 | 62.5% | +24.4% |
| WARD, DAVID WILLIAM | 10 | 62.3% | +37.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 56d overdue |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 50d overdue |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 46d overdue |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 46d overdue |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | VALENZUELA, PATRICIA D | 42d overdue |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 42d overdue |
| 18505632 | GATE ISOLATION FEATURES | KOO, LAMONT B | 10d overdue |
| 18361569 | BENT FIN DEVICES | KOO, LAMONT B | 10d overdue |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17575578 | DEVICE LEVEL THERMAL DISSIPATION | CHEN, YU | 162d overdue |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 146d overdue |
| 18596404 | 3D IC POWER GRID | REAMES, MATTHEW L | 119d overdue |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 100d overdue |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SCHODDE, CHRISTOPHER A | 79d overdue |
| 18498369 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | WELLS, JAMES STEVEN | 77d overdue |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 66d overdue |
| 17220269 | INTEGRATED CIRCUIT STRUCTURE | LIN, ARIC | 58d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | WALL, VINCENT | 35d overdue |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 31d overdue |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | DINKE, BITEW A | 28d overdue |
| 17816208 | LIGHT-EMITTING PACKAGE AND FORMING METHOD THEREOF | WARD, DAVID WILLIAM | 10d overdue |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 10d overdue |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 8d overdue |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 8d overdue |
| 17815088 | Semiconductor Package and Method | OH, JIYOUNG | 5d overdue |
| Art Unit | Apps |
|---|---|
| 2898 | 101 |
| 2818 | 81 |
| 2893 | 79 |
| 2817 | 68 |
| 2812 | 61 |
| 2899 | 58 |
| 2897 | 47 |
| 2874 | 43 |
| 2813 | 43 |
| 2815 | 32 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19290528 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | SAAD, ERIN BARRY | — | §103§112 | Non-Final OA | — | Pending | Aug 05, 2025 |
| 19286970 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | RAMIREZ, ALEXANDRE XAVIER | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2025 |
| 19283746 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | — | Pending | Jul 29, 2025 |
| 19273162 | SEMICONDUCTOR CIRCUIT AND METHOD FOR OPERATING THE SAME | O TOOLE, COLLEEN J | — | DP | Non-Final OA | — | Pending | Jul 18, 2025 |
| 19265546 | INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Jul 10, 2025 |
| 19259508 | FLIP-FLOP CIRCUIT AND METHOD | O NEILL, PATRICK | — | DP | Non-Final OA | — | Pending | Jul 03, 2025 |
| 19255872 | INTEGRATED CIRCUIT HAVING LATCH WITH TRANSISTORS OF DIFFERENT GATE WIDTHS | O NEILL, PATRICK | 2842 | §102§112DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19254164 | IMPEDANCE MATCHING CIRCUIT AND METHOD | CHEN, PATRICK C | 2836 | §102DP | Non-Final OA | — | Pending | Jun 30, 2025 |
| 19253186 | DATA SEQUENCING CIRCUIT | VERBRUGGE, KEVIN | 2132 | Other | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19252413 | GATED TRI-STATE INVERTER, AND METHOD OF OPERATING SAME | JAGER, RYAN C | 2842 | §112DP | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19252149 | IMAGE SENSOR PIXEL AND METAL SHIELDING OF CHARGE STORAGE DEVICE OF IMAGE SENSOR PIXEL FORMED BY ONE STEP PROCESS | HALIYUR, PADMA | 2637 | §103Other | Non-Final OA | — | Pending | Jun 27, 2025 |
| 19250906 | Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation | CHEN, PATRICK C | 2842 | §103DP | Non-Final OA | — | Pending | Jun 26, 2025 |
| 19251693 | TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS | O NEILL, PATRICK | 2842 | §102DP | Non-Final OA | — | Pending | Jun 26, 2025 |
| 19247229 | SEMICONDUCTOR DEVICE INCLUDING DECOUPLING SYSTEM | RETEBO, METASEBIA T | 2842 | DP | Non-Final OA | — | Pending | Jun 24, 2025 |
| 19245453 | CIRCUIT AND METHOD FOR DUTY CYCLE ADJUSTMENT | COX, CASSANDRA F | 2842 | DP | Non-Final OA | — | Pending | Jun 23, 2025 |
| 19245452 | ELECTRONIC CIRCUIT AND METHOD FOR OPERATING THE SAME | PEREZ, JAMES M | 2631 | §112DP | Non-Final OA | — | Pending | Jun 23, 2025 |
| 19243074 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19243052 | LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING | MANHEIM, MARC ETIENNE | 2874 | §103§112 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19241406 | SHIFT REGISTER HAVING LOW POWER MODE | O NEILL, PATRICK | — | §102§112DP | Non-Final OA | — | Pending | Jun 18, 2025 |
| 19240009 | LEAKAGE-FREE DUMMY CELL FOR SEMICONDUCTOR DEVICES | O NEILL, PATRICK | — | §112DP | Non-Final OA | — | Pending | Jun 17, 2025 |
| 19241088 | SEMICONDUCTOR DEVICE HAVING HYSTERESIS BLOCK | WELLS, KENNETH B | — | §102§103§112DP | Non-Final OA | — | Pending | Jun 17, 2025 |
| 19237327 | METHOD FOR PROCESSING SEMICONDUCTOR WAFER | ROSTAMI, MOHAMMAD S | 2154 | §103Other | Final Rejection | — | Pending | Jun 13, 2025 |
| 19237286 | FUSE STRUCTURE | RETEBO, METASEBIA T | — | §103 | Non-Final OA | — | Pending | Jun 13, 2025 |
| 19211749 | CHEMICAL DISPENSING SYSTEM | GARDNER, NICOLE | — | §102§112Other | Non-Final OA | — | Pending | May 19, 2025 |
| 19200973 | SYSTEM AND SEMICONDUCTOR DEVICE THEREIN | JAGER, RYAN C | 2842 | §102DP | Non-Final OA | — | Pending | May 07, 2025 |
| 19197279 | Level Shifter With Inside Self-Protection High Bias Generator | RETEBO, METASEBIA T | — | §102§103 | Non-Final OA | — | Pending | May 02, 2025 |
| 19176327 | Device and Method for Diagnosis of the Same | BRADEN, GRACE VICTORIA | 2112 | §103 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19177360 | APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER | CORMIER, DAVID G | 1711 | §102§103§112 | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19176354 | Overdrive I/O ESD Protection Network | WELLS, KENNETH B | 2842 | §103§112DP | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19171607 | ION EXPOSURE METHOD AND APPARATUS | ASFAW, MESFIN T | — | §102§103 | Non-Final OA | — | Pending | Apr 07, 2025 |
| 19089163 | Bio-Detector Device for Bio-Targets | BALL, JOHN C | — | DP | Non-Final OA | — | Pending | Mar 25, 2025 |
| 19081528 | MEMORY DEVICE AND METHOD OF OPERATING THE SAME | TECHANE, MUNA A | — | DP | Non-Final OA | — | Pending | Mar 17, 2025 |
| 19075364 | LOW-DROPOUT (LDO) REGULATOR WITH A FEEDBACK CIRCUIT | GBLENDE, JEFFREY A | — | DP | Non-Final OA | — | Pending | Mar 10, 2025 |
| 19070730 | Sub-Word Line Driver Placement For Memory Device | YANG, HAN | — | §102 | Non-Final OA | — | Pending | Mar 05, 2025 |
| 19069350 | Programmable Regulator Voltage Controlled Ring Oscillator | GANNON, LEVI | 2849 | §102Other | Non-Final OA | 14d | Pending | Mar 04, 2025 |
| 19068296 | METHOD OF USING WAFER STAGE | NGUYEN, HUNG | — | §103DP | Non-Final OA | — | Pending | Mar 03, 2025 |
| 19069048 | ONE TIME PROGRAMMABLE MEMORY | CHEN, XIAOCHUN L | — | §103§112DP | Non-Final OA | — | Pending | Mar 03, 2025 |
| 19064599 | LOW DROPOUT REGULATOR CIRCUITS, INPUT/OUTPUT DEVICE, AND METHODS FOR OPERATING A LOW DROPOUT REGULATOR | TIKU, SISAY G | — | §103 | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19064089 | LOW-DROPOUT (LDO) VOLTAGE REGULATOR | QUDDUS, NUSRAT | — | §103Other | Non-Final OA | — | Pending | Feb 26, 2025 |
| 19059384 | MEMORY DEVICE WITH ADDITIONAL WRITE BIT LINES | CHO, SUNG IL | — | §102§103Other | Non-Final OA | — | Pending | Feb 21, 2025 |
| 19058345 | DATA RETENTION CIRCUIT AND METHOD | CHEN, SIBIN | 2896 | §112 | Non-Final OA | — | Pending | Feb 20, 2025 |
| 19055872 | MERGED BIT LINES FOR HIGH DENSITY MEMORY ARRAY | TECHANE, MUNA A | — | §102§103 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19056350 | INTEGRATED CIRCUIT AND METHOD OF OPERATING SAME | ALHWAMDEH, KAREEM FUAD | — | §103 | Non-Final OA | — | Pending | Feb 18, 2025 |
| 19052420 | Device and Method for Measuring a Duty Cycle of a Clock Signal | MAINI, RAHUL | — | §103§112Other | Non-Final OA | — | Pending | Feb 13, 2025 |
| 19050140 | CAPACITOR-LESS LOW-DROPOUT REGULATOR WITH DYNAMIC FREQUENCY COMPENSATION | PEREZ, BRYAN REYNALDO | 2838 | §102 | Non-Final OA | — | Pending | Feb 11, 2025 |
| 19049935 | Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit | JEAN PIERRE, PEGUY | — | DP | Non-Final OA | — | Pending | Feb 10, 2025 |
| 19045904 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | CHOI, WOO H | 3992 | §102§112 | Non-Final OA | — | Pending | Feb 05, 2025 |
| 19044697 | Circuit for Outputting a Stepdown Voltage and Method for Stepping Down a Voltage | JACKSON, LAKAISHA | — | §103Other | Non-Final OA | — | Pending | Feb 04, 2025 |
| 19043906 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | HIDALGO, FERNANDO N | — | DP | Non-Final OA | — | Pending | Feb 03, 2025 |
| 19043856 | ANTI-FUSE DEVICE AND METHOD | CHO, SUNG IL | — | §103Other | Non-Final OA | — | Pending | Feb 03, 2025 |
| 19038298 | Novel Bank Design with Differential Bulk Bias in eFuse Array | BUI, THA-O H | — | §103 | Non-Final OA | — | Pending | Jan 27, 2025 |
| 19038241 | NOVEL DYNAMIC INHIBIT VOLTAGE TO REDUCE WRITE POWER FOR RANDOM-ACCESS MEMORY | ALROBAIE, KHAMDAN N | — | §102 | Non-Final OA | — | Pending | Jan 27, 2025 |
| 19035772 | INTEGRATED CIRCUIT | TANG, ANTHONY THINH | 2827 | §103 | Non-Final OA | — | Pending | Jan 23, 2025 |
| 19033172 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | NGUYEN, VIET Q | — | DP | Non-Final OA | — | Pending | Jan 21, 2025 |
| 19032453 | SENSE AMPLIFIER CIRCUIT, MEMORY CIRCUIT, AND SENSING METHOD THEREOF | NGUYEN, VIET Q | — | Other | Non-Final OA | — | Pending | Jan 21, 2025 |
| 19032136 | METHOD FOR INSPECTING SEMICONDUCTOR DEVICE AND SYSTEM THEREOF | KIDWELL, KAITLYN ELIZABETH | 2877 | §103 | Non-Final OA | — | Pending | Jan 20, 2025 |
| 19030111 | PHYSICAL UNCLONABLE FUNCTION (PUF) SECURITY KEY GENERATION | SAADOUN, HASSAN | — | Other | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19026389 | MEMORY DEVICES AND METHODS OF FORMING THE SAME | LEBOEUF, JEROME LARRY | — | §102§103§112 | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19026754 | SEMICONDUCTOR DEVELOPER TOOL AND METHODS OF OPERATION | PERSAUD, DEORAM | — | §103Other | Non-Final OA | — | Pending | Jan 17, 2025 |
| 19025060 | EUV LIGHT SOURCE CONTAMINATION MONITORING SYSTEM | KIM, PETER B | — | §103Other | Non-Final OA | — | Pending | Jan 16, 2025 |
| 19020305 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME | HUANG, MIN | — | §103Other | Non-Final OA | — | Pending | Jan 14, 2025 |
| 19015027 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | NGUYEN, HUNG | 2882 | §112DP | Non-Final OA | — | Pending | Jan 09, 2025 |
| 19012272 | SEMICONDUCTOR DEVICE INCLUDING I/O SYSTEM, AND METHOD OF OPERATING THE SAME | WELLS, KENNETH B | 2842 | DP | Final Rejection | — | Pending | Jan 07, 2025 |
| 19012199 | MEMORY ARRAY CONNECTIONS | LAPPAS, JASON | — | §103 | Non-Final OA | — | Pending | Jan 07, 2025 |
| 19011147 | SRAM POWER-UP RANDOM NUMBER GENERATOR | REECE, CHRISTOPHER LANE | — | §103Other | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19011055 | MEMORY DEVICE WITH A BIAS CIRCUIT | CHO, SUNG IL | — | DP | Non-Final OA | — | Pending | Jan 06, 2025 |
| 19007022 | CHARGE PUMP SYSTEM WITH LOW RIPPLE OUTPUT VOLTAGE | LEBOEUF, JEROME LARRY | 2824 | DP | Non-Final OA | — | Pending | Dec 31, 2024 |
| 19004992 | IMPRINT APPARATUS AND METHOD THEREOF | KIM, YUNJU | 1742 | §103 | Non-Final OA | — | Pending | Dec 30, 2024 |
| 19002035 | FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT | KIM, PETER B | — | §112DP | Non-Final OA | — | Pending | Dec 26, 2024 |
| 19000605 | COMPUTING DEVICE, MEMORY CONTROLLER, AND METHOD FOR PERFORMING AN IN-MEMORY COMPUTATION | HOANG, HUAN | — | §102§103DP | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18999478 | COMPUTE-IN-MEMORY SYSTEMS AND METHODS FOR OPERATING THE SAME | LUU, PHO M | 2824 | §102 | Non-Final OA | — | Pending | Dec 23, 2024 |
| 18990138 | CIRCUIT AND METHOD FOR HIGH VOLTAGE TOLERANT ESD PROTECTION | PATEL, DHARTI HARIDAS | — | §102§112Other | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18990122 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | TRAN, MICHAEL THANH | 2827 | §102§112Other | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18981800 | MEMORY CELL WITH UNIPOLAR SELECTORS | LAPPAS, JASON | — | §103 | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18978369 | RETICLE CLEANING DEVICE AND METHOD OF USE | PERSAUD, DEORAM | — | §103Other | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18974840 | SEMICONDUCTOR MANUFACTURING METHOD | TRAN, BINH X | — | §112DP | Non-Final OA | — | Pending | Dec 10, 2024 |
| 18973767 | NON-VOLATILE MEMORY CIRCUIT AND METHOD | HOANG, HUAN | — | DP | Non-Final OA | — | Pending | Dec 09, 2024 |
| 18969335 | NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS | GRAY, SUNGHEE Y | 2877 | DP | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18970786 | MULTIPLEXING CIRCUIT, OUTPUT STAGE, AND SEMICONDUCTOR DEVICE | RETEBO, METASEBIA T | 2842 | §103§112 | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18968343 | RETICLE CARRIER AND ASSOCIATED METHODS | KIM, PETER B | — | §103§112Other | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18968729 | MEMORY CELL ARRAY CIRCUIT AND METHOD OF FORMING THE SAME | ALROBAIE, KHAMDAN N | — | DP | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18967733 | Computing-In-Memory Architecture | TECHANE, MUNA A | — | §102§103§112 | Non-Final OA | — | Pending | Dec 04, 2024 |
| 18967206 | MEMORY DEVICE WITH SIGNAL EDGE SHARPENER CIRCUITRY | CHO, SUNG IL | — | §102§103Other | Non-Final OA | — | Pending | Dec 03, 2024 |
| 18962220 | METHOD FOR INSPECTING PATTERN DEFECTS | TON, TRI T | — | DP | Non-Final OA | — | Pending | Nov 27, 2024 |
| 18959976 | EUV MASK INSPECTING METHODS AND SYSTEMS | BOOSALIS, FANI POLYZOS | 2884 | §102§103 | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18959723 | WET PROCESS SYSTEM AND PROCESS FOR USING THE SAME | AYALEW, TINSAE B | 1711 | §102§103§112 | Final Rejection | — | Pending | Nov 26, 2024 |
| 18955387 | MIM EFUSE MEMORY DEVICES AND FABRICATION METHOD THEREOF | HO, HOAI V | — | §102§103 | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18953096 | CHIP PROBING APPARATUS, CHIP PROBING METHOD AND SHIFT DETECTION PATTERN | POTHEN, FEBA | 2858 | §102§103§112 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18952719 | MULTIPLE LAYER DUAL PORT MEMORY CELL MANUFACTURING METHOD | LEBOEUF, JEROME LARRY | 2824 | §102 | Non-Final OA | — | Pending | Nov 19, 2024 |
| 18950227 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | ALBRECHT, PETER M | — | §102§103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18949192 | Systems and Methods for Generating Synthesizable Netlists From Register Transfer Level Designs | LIN, ARIC | — | §103Other | Non-Final OA | — | Pending | Nov 15, 2024 |
| 18947475 | MEMORY CIRCUIT AND METHOD OF OPERATING SAME | WELLS, JAMES STEVEN | 2825 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18946996 | PROBE HEAD ASSEMBLY AND PROBE CARD ASSEMBLY | HOLLINGTON, JERMELE M | 2858 | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18948432 | PROBE NEEDLE, PROBE CARD STRUCTURE AND METHOD OF TESTING A DEVICE UNDER TEST | MILLER, DANIEL R | 2858 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18948078 | ONE TIME PROGRAMMABLE (OTP) MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) | TANG, ANTHONY THINH | — | §103 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18947761 | NEW DESIGN OF EUV VESSEL PERIMETER FLOW AUTO ADJUSTMENT | ASFAW, MESFIN T | 2882 | §103 | Final Rejection | — | Pending | Nov 14, 2024 |
| 18945457 | TESTING APPARATUS AND ITS CONDUCTIVE TERMINAL | NGUYEN, TUNG X | — | §102 | Non-Final OA | — | Pending | Nov 12, 2024 |
| 18943158 | FITTINGS FOR WAFER CLEANING SYSTEMS | DUNWOODY, AARON M | 3679 | DP | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18938961 | MEMORY DEVICE WITH WRITE PULSE TRIMMING | ALROBAIE, KHAMDAN N | 2824 | §102§103Other | Non-Final OA | — | Pending | Nov 06, 2024 |
| 18937811 | NANOIMPRINT LITHOGRAPHY MASK AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | KIM, PETER B | 2882 | §103§112 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937037 | SENSE AMPLIFIER, MEMORY DEVICE AND OPERATION METHOD THEREOF | TRAN, ANTHAN | 2825 | §102Other | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18937208 | Systems and Methods for Controlling Power Management Operations in a Memory Device | HO, HOAI V | — | §102§103 | Non-Final OA | — | Pending | Nov 05, 2024 |
| 18931576 | METHODS AND SYSTEMS FOR REDUCING PARTICULATE DEPOSITION ON PHOTOMASK | NGUYEN, HUNG | 2882 | §103 | Final Rejection | — | Pending | Oct 30, 2024 |
| 18926341 | WAFER CLEANING SYSTEM, WAFER DETECTING MODULE AND WAFER CLEANING METHOD | BARR, MICHAEL E | 1711 | §102§103 | Non-Final OA | — | Pending | Oct 25, 2024 |
| 18923719 | WIRING SUBSTRATE | BURNS, TREMESHA WILLIS | — | §102 | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18913104 | COOLANT CONDUIT AND WAFER-COOLING APPARATUS INCLUDING THE SAME | RUBY, TRAVIS C | 3763 | §102§103 | Non-Final OA | — | Pending | Oct 11, 2024 |
| 18910043 | DUTY CYCLE CORRECTION CIRCUIT AND METHOD FOR OPERATING THE SAME | NGUYEN, LONG T | 2836 | §102§112 | Non-Final OA | — | Pending | Oct 09, 2024 |
| 18889962 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | ERDEM, FAZLI | — | §102 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18808284 | APPARATUS AND METHOD FOR OPTICAL INSPECTION OF EUV PELLICLES | KIM, PETER B | 2882 | §103 | Final Rejection | — | Pending | Aug 19, 2024 |
| 18807429 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | RAYAN, MIHIR K | — | §102 | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18802241 | SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION | JORDAN, ANDREW | — | §102§103 | Non-Final OA | — | Pending | Aug 13, 2024 |
| 18796870 | IMAGE SENSOR | TRUONG, NGUYEN T | 2486 | §102§103 | Non-Final OA | — | Pending | Aug 07, 2024 |
| 18795067 | INSPECTION APPARATUS AND METHODS OF USING THE SAME | WONG, ALLEN C | 2488 | §103 | Non-Final OA | 9d | Pending | Aug 05, 2024 |
| 18794560 | MEMORY DEVICES WITH REDUCED TIMING VARIATION AND METHODS FOR OPERATING THE SAME | HILTUNEN, THOMAS J | 2849 | §102§112 | Non-Final OA | 8d | Pending | Aug 05, 2024 |
| 18790547 | MEMORY CIRCUITS WITH REGISTER CIRCUTIS AND METHODS FOR OPERATING THE SAME | REECE, CHRISTOPHER LANE | 2824 | §103 | Non-Final OA | 27d | Pending | Jul 31, 2024 |
| 18791308 | MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE | RAMALLO, GUSTAVO G | — | §112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790492 | SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA SURROUNDINGS | SHAH, NEEL D | — | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791384 | METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | — | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789686 | METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL | BOOKER, KELVIN | — | §101§102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790025 | Integrated Reference Electrode And Fluid Dispenser | FISHER, BRITTANY I | 1796 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790831 | Fin-Based Field Effect Transistors | FAN, SU JYA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789988 | METHOD OF MAKING SEMICONDUCTOR DEVICE | HAN, JONATHAN | — | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791421 | IN-CHIP THERMOELECTRIC DEVICE | MOWLA, GOLAM | 1721 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18788409 | SEMICONDUCTOR DEVICES WITH THRESHOLD VOLTAGE MODULATION LAYER | HUNTER III, CARNELL | — | §103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788450 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME | MILLER, JAMI VALENTINE | — | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788823 | SEMICONDUCTOR DEVICE HAVING WIDE TUNING RANGE VARACTOR AND METHOD OF MANUFACTURING THE SAME | SLUTSKER, JULIA | — | §102§103Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788414 | SEMICONDUCTOR STRUCTURE HAVING EPITAXIAL STRUCTURE | SANDVIK, BENJAMIN P | — | §102 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788413 | TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | PRIDEMORE, NATHAN ANDREW | — | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788783 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | SANDVIK, BENJAMIN P | — | §102Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789554 | Isolation Structures Of Semiconductor Devices | LEE, WOO KYUNG | — | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789668 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789197 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | TRICE III, WILLIAM CLARENCE | 2827 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788172 | MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN, AND METHOD FOR FORMING MULTIPLEXER CELL | ASSOUMAN, HERVE-LOUIS Y | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788322 | CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES | YUSHINA, GALINA G | 2811 | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788380 | CONTROL OF DYNAMIC GAS LOCK FLOW INLETS OF AN INTERMEDIATE FOCUS CAP | CHANG, HANWAY | — | §102§103Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789164 | METAL FUSE STRUCTURE BY VIA LANDING | HATFIELD, MARSHALL MU-NUO | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789206 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KHALIFA, MOATAZ | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788145 | MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND METHOD FOR CLEANING AIR USING THE SAME | LAWRENCE JR, FRANK M | — | §102§103§112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789054 | SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK | SANDVIK, BENJAMIN P | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788979 | LOW-RESISTANCE COPPER INTERCONNECTS | LUKE, DANIEL M | 2896 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789530 | CONTACT METALLIZATION PROCESS | MALEK, MALIHEH | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789104 | SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE | LEE, WOO KYUNG | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789172 | SEMICONDUCTOR DEVICE STRUCTURE WITH HYBRID FINS | YEMELYANOV, DMITRIY | 2891 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788253 | THIN FILM TRANSISTOR BASED LIGHT SENSOR | RODRIGUEZ VILLANU, SANDRA MILENA | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788153 | FINFET DEVICES AND METHODS OF FORMING THE SAME | KEBEDE, BROOK | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788538 | PHASE CHANGE RANDOM ACCESS MEMORY (PCRAM) DEVICE WITH INCREASED PACKING DENSITY AND METHOD OF MAKING SAME | OH, JIYOUNG | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788448 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | NGUYEN, HUNG | 2882 | §103 | Non-Final OA | 10d overdue | Pending | Jul 30, 2024 |
| 18788787 | METHOD OF MEASURING ELECTRO-OPTIC CHARACTERISTIC OF A TRAVELING WAVE MACH-ZEHNDER MODULATOR AND DEVICE FOR SAME | ENDRESEN, KIRSTEN DANIELA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18787960 | INTERCONNECTION FOR A MEMORY ARRAY AND METHODS FOR FORMING THE SAME | WATTS, JEREMY DANIEL | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786595 | INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE DEVICE | SHEN, MATTHEW LIANFENG | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787608 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LEE, WOO KYUNG | — | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788108 | METHOD AND SYSTEM FOR REDUCING WORK-IN-PROCESS | WORKU, KIDEST | — | §112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787928 | RETICLE ENCLOSURE FOR LITHOGRAPHY SYSTEMS | WHITESELL, STEVEN H | 2682 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786599 | SEMICONDUCTOR DEVICE INCLUDING A FINFET STRUCTURE AND METHOD FOR FABRICATING THE SAME | ZHU, SHENG-BAI | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786587 | SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF | VALENZUELA, PATRICIA D | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787573 | PASSIVATION LAYERS WITH ROUNDED CORNERS | LINDSEY, COLE LEON | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788116 | CIRCUIT AND METHOD TO ENHANCE EFFICIENCY OF SEMICONDUCTOR DEVICE | CHOE, HENRY | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787572 | FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | YI, CHANGHYUN | — | §102§103§112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786952 | SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE | MYERS, GLENN F | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786591 | TRANSISTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF HBNC LAYER | LOHAKARE, PRATIKSHA JAYANT | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787801 | SYSTEM AND METHOD FOR A LOW VOLTAGE SUPPLY BANDGAP | PERENY, TYLER J | 2843 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786700 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | ANDREWS, FELIX BRYAN | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788031 | MULTI-GATE SEMICONDUCTOR DEVICE WITH INNER SPACER AND FABRICATION METHOD THEREOF | GEYER, SCOTT B | — | §102 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787321 | METHODS AND SYSTEMS FOR IMPROVING PLASMA IGNITION STABILITY | BRAYTON, JOHN JOSEPH | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786836 | DUAL AMPOULE SEPARATOR PLATE AND METHOD | MELLOTT, JAMES M | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786573 | SEMICONDUCTOR PACKAGES | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786619 | MEMORY DEVICES | SENGDARA, VONGSAVANH | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786614 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | BELOUSOV, ALEXANDER | — | §102Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786797 | FIELD-EFFECT TRANSISTOR DEVICE WITH GATE SPACER STRUCTURE | SPALLA, DAVID C | — | §103DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787569 | CAPACITOR IN NANOSHEET | DYKES, LAURA M | — | §102§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786568 | MRAM STACKS, MRAM DEVICES AND METHODS OF FORMING THE SAME | MILLER, JAMI VALENTINE | — | §112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786563 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK | GOODLING, DEVIN KIRK | — | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786561 | METHOD OF FORMING SEMICONDUCTOR DEVICES | HO, TU TU V | — | §102 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786475 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | NELSON, JACOB THEODORE | — | §102§103§112 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786268 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | TRICE III, WILLIAM CLARENCE | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785414 | SYSTEMS AND METHODS FOR PRODUCING ULTRAPURE WATER FOR SEMICONDUCTOR FABRICATION PROCESSES | DRODGE, JOSEPH W | — | §102§112DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785612 | APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES | WOLDEGEORGIS, ERMIAS T | — | §103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785032 | VENT PORT DIFFUSER | ROST, ANDREW J | 3753 | §103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786057 | SYSTEM AND METHOD FOR AUTOMATED MATERIAL HANDLING MANAGEMENT | LOGAN, KYLE O | — | §112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785151 | DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION | CHAN, WEI | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785878 | CANTILEVER WITH ETCH CHAMBER FLOW DESIGN | CROWELL, ANNA M | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786260 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | TRICE III, WILLIAM CLARENCE | — | §102§103§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785966 | METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING | RAHMAN, KHATIB A | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18783997 | STOPPER BUMP STRUCTURES FOR MEMS DEVICE | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783486 | IMPLANTATION MASK FORMATION | VU, DAVID | — | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784544 | CHANNEL LAST PROCESS FOR DUMMY GATE VOID DEFECT REDUCTION | LE, THAO P | — | §102Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783518 | Epitaxial Source/Drain Structures for Multigate Devices and Methods of Fabricating Thereof | DINKE, BITEW A | — | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784838 | METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING | SHUM, KENT N | 3723 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784851 | NOISE DETECTING CIRCUIT AND ASSOCIATED SYSTEM AND METHOD | CHOE, HENRY | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783610 | DATA BACKUP UNIT FOR STATIC RANDOM-ACCESS MEMORY DEVICE | BEGUM, SULTANA | 2824 | §103§112Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | BELOUSOV, ALEXANDER | — | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784089 | Ferroelectric Memory Device and Method of Manufacturing the Same | IMTIAZ, S M SOHEL | — | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784525 | APPARATUS AND METHOD FOR GENERATING EXTREME ULTRAVIOLET RADIATION | NGUYEN, KIET TUAN | 2881 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784297 | ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE | NIELSEN, DEREK LANG | — | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784667 | GUARD RING STRUCTURE | KHALIFA, MOATAZ | — | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784139 | SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER | DINKE, BITEW A | — | §102§103Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784860 | METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | NIELSEN, DEREK LANG | — | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784553 | SEMICONDUCTOR MEMORY DEVICES WITH DIELECTRIC FIN STRUCTURES | NGUYEN, SOPHIA T | — | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784888 | METHOD FOR CLEANING OHT VEHICLE | JENNINGS, MICHAEL DEANGILO | — | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783824 | BOND PAD WITH ENHANCED RELIABILITY | DIALLO, MAMADOU L | — | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783529 | BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES | JUNG, MICHAEL YOO LIM | — | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784645 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GEYER, SCOTT B | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783474 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEMICAL, AND METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | LEE, WOO KYUNG | — | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782660 | METHOD FOR FORMING SEMICONDUCTOR MEMORY DEVICE | MALSAWMA, LALRINFAMKIM HMAR | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782565 | RESIN, PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | §103 | Final Rejection | 12d | Pending | Jul 24, 2024 |
| 18783071 | SEMICONDUCTOR DEVICES USING CARBON NANOTUBES | NGUYEN, SOPHIA T | — | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782061 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | WALL, VINCENT | — | Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782962 | HYBRID SEMICONDUCTOR DEVICE | YI, CHANGHYUN | — | §112Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782676 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | KIM, JEANNE MYON | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782993 | PACKAGE STRUCTURE WITH PROTECTIVE LID | VALENZUELA, PATRICIA D | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782439 | HIGH ASPECT RATIO BOSCH DEEP ETCH | CHAMBLISS, ALONZO | — | §102DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782783 | SEMICONDUCTOR SUBSTRATE STAGE FOR CARRING SUBSTRATE | NGUYEN, HUNG | 2882 | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782515 | TUNING GATE LENGTHS IN MULTI-GATE FIELD EFFECT TRANSISTORS | HATFIELD, MARSHALL MU-NUO | — | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782351 | SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782345 | TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE | HOSSAIN, MOAZZAM | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782651 | METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE | BENNETT, CHARLEE | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782050 | STORAGE ENVIRONMENT MONITORING SYSTEM AND METHODS OF OPERATION | PAN, YUHUI R | 2116 | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783192 | HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE | CHEN, YU | — | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18781435 | EUV LITHOGRAPHY APPARATUS | CHANG, HANWAY | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | KLEIN, JORDAN M | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780969 | Protective Liner for Source/Drain Contact to Prevent Electrical Bridging While Minimizing Resistance | YI, CHANGHYUN | — | §102§103§112Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781959 | SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF | KOLAHDOUZAN, HAJAR | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781293 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | VU, VU A | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781335 | SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781599 | Ion Beam Etching Apparatus And Method | MCCORMACK, JASON L | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780501 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | NGUYEN, NIKI HOANG | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781105 | OVERHANGING SOURCE/DRAIN CONTACT | JONES, ERIC W | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18782005 | SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE | VANYO, MICHAEL MOHABIR | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781008 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | TAYLOR, EARL N | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781323 | SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | HUNTER III, CARNELL | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779425 | METHOD FOR ELIMINATING DIVOT FORMATION AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME | AHMED, SHAHED | 2813 | §103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779109 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, DAO H | — | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780436 | METHOD OF FORMING PACKAGE STRUCTURE | NIX, NORA TAYLOR | — | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779710 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | CHIU, TSZ K | — | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779844 | DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS | SARKER-NAG, AKHEE | — | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780029 | REDUCING RC DELAY IN SEMICONDUCTOR DEVICES | VALENZUELA, PATRICIA D | — | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779390 | METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION | WIEGAND, TYLER J | 2812 | §102 | Final Rejection | — | Pending | Jul 22, 2024 |
| 18779643 | Magnetic Layer for Magnetic Random Access Memory (MRAM) by Moment Enhancement | DIAZ, JOSE R | — | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779305 | DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE | WARD, ERIC A | — | §102§103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779252 | STILTED PAD STRUCTURE | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779097 | SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | SMITH, BRADLEY | — | §103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779221 | METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780440 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | DEO, DUY VU NGUYEN | — | §102DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779063 | SYSTEM AND METHOD FOR TESTING A FILTER | SCHMITT, BENJAMIN R | — | DP | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | BELOUSOV, ALEXANDER | — | §103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778990 | SPACER SCHEME AND METHOD FOR MRAM | HO, TU TU V | — | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778989 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778946 | DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DIALLO, MAMADOU L | — | DP | Non-Final OA | — | Pending | Jul 20, 2024 |
| 18778106 | OVERHEAD HOIST TRANSPORT DEVICE AND METHOD OF USING THE SAME | MYERS, GLENN F | 3652 | §103 | Final Rejection | — | Pending | Jul 19, 2024 |
| 18777573 | OPTICAL MODULATOR AND PACKAGE | STAHL, MICHAEL J | — | §103Other | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18778563 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776816 | SEMICONDUCTOR STRUCTURE WITH COMPOSITE OXIDE LAYER | HOANG, TUAN A | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776346 | SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFERENT THICKNESSES | CRAWFORD EASON, LATANYA N | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776288 | METHOD OF MANUFACTURING AN OPTICAL SENSOR | LIU, MIKKA H | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | GEBREMARIAM, SAMUEL A | — | §112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776833 | METHOD AND APPARATUS FOR MITIGATING CONTAMINATION | CHANG, HANWAY | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776282 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | HOANG, TUAN A | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18775598 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§112Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | REYES, JOSHUA NATHANIEL PI | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775457 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DANG, PHUC T | — | §103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775591 | Fin Field-Effect Transistor With Void and Method of Forming The Same | STEPHENSON, KENNETH STEPHEN | — | §101DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | CROSS, XIA L | — | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775130 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | CLINTON, EVAN GARRETT | — | §102 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775482 | METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMAL INTERFACE MATERIAL | VALENZUELA, PATRICIA D | — | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774843 | PACKAGE STRUCTURE | CHANG, JAY C | — | §112 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773592 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | LE, THAO P | — | §102§103§112 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773631 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | TRICE III, WILLIAM CLARENCE | — | §102§103 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774903 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | NGUYEN, NIKI HOANG | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774408 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | HO, TU TU V | — | §102§103 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18772364 | CAPPING LAYER OVER FET FERAM TO INCREASE CHARGE MOBILITY | DIAZ, JOSE R | — | §102DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772307 | SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF | WRIGHT, TUCKER J | 2891 | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772650 | TUNGSTEN VIA FOR A MAGNETIC TUNNEL JUNCTION INTERCONNECT | MILLER, JAMI VALENTINE | — | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773342 | MEMORY DEVICE | RADKE, JAY W | — | §103§112Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772382 | CELL PLACEMENT OPTIMIZATION | BOWEN, ADAM S | — | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773250 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | FOX, BRANDON C | — | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772304 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | CUNNINGHAM, KIERAN MURRAY | — | §103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773229 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | — | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772677 | INTEGRATED CIRCUIT DEVICE AND METHOD | YEAMAN, JAMES G | 2842 | §102§103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773202 | PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT | LEBENTRITT, MICHAEL | — | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773284 | BALANCED NEGATIVE BITLINE VOLTAGE FOR A WRITE ASSIST CIRCUIT | YOHA, CONNIE C | 2825 | DPOther | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772634 | STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE | ASSOUMAN, HERVE-LOUIS Y | — | §102§103Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773243 | AMPLIFIER WITH VCO-BASED ADC | NGUYEN, HIEU P | — | Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773539 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | DIAZ, JOSE R | — | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772713 | Epitaxial Structures For Semiconductor Devices | KIM, TONG-HO | — | §102Other | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772224 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | LEE, EUGENE | 2815 | §102 | Non-Final OA | — | Pending | Jul 14, 2024 |
| 18772123 | SEMICONDUCTOR DEVICES INCLUDING METAL GATE PROTECTION AND METHODS OF FABRICATION THEREOF | KIM, TONG-HO | — | §102§112Other | Non-Final OA | — | Pending | Jul 13, 2024 |
| 18772124 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 13, 2024 |
| 18771450 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | VALENZUELA, PATRICIA D | — | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771757 | IMAGING DEVICE | WILLIAMS, DON J | 2878 | DP | Final Rejection | — | Pending | Jul 12, 2024 |
| 18771255 | METHODS OF MANUFACTURING SPIN-ORBIT-TORQUE MAGNETIC DEVICE | SANDVIK, BENJAMIN P | — | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770758 | INTEGRATED CIRCUIT WITH EMBEDDED HIGH-DENSITY AND HIGH-CURRENT SRAM MACROS | KIM, TONG-HO | — | §102Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | BELOUSOV, ALEXANDER | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771945 | MAGNETIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | — | §102§103DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771815 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | HO, TU TU V | 2818 | §102 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771652 | SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF FORMING THE SAME | GOODLING, DEVIN KIRK | — | §102§103§112 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771578 | CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES | TAYLOR, EARL N | — | §102 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18769957 | ACTIVE REGION CUT PROCESS | HOANG, TUAN A | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769407 | MEMORY DEVICE INCLUDING DUAL CONTROL CIRCUITS | CHO, SUNG IL | 2825 | §102 | Final Rejection | 5d | Pending | Jul 11, 2024 |
| 18769417 | SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES | MAZUMDER, DIDARUL A | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770299 | DUAL CRYSTAL ORIENTATION FOR SEMICONDUCTOR DEVICES | SANDVIK, BENJAMIN P | — | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770177 | SEMICONDUCTOR DEVICE WITH BACKSIDE CONTACT AND METHODS OF FORMING SUCH | NGUYEN, DAO H | — | §103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770372 | Gate Isolation for Multigate Device | NGUYEN, NIKI HOANG | — | §102Other | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770367 | SOURCE/DRAIN EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770166 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE | SEHAR, FAKEHA | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768284 | INTEGRATED CIRCUITS AND METHODS FOR POWER DELIVERY | SLUTSKER, JULIA | — | §102Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768421 | VERTICAL INTERCONNECT STRUCTURES WITH INTEGRATED CIRCUITS | LE, THAO P | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768993 | FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME | MOONEY, MICHAEL P | — | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769246 | AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL | GOODLING, DEVIN KIRK | — | §102§103§112DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768948 | INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT LAYOUT | HO, TU TU V | 2818 | §103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769334 | MEMORY DEVICE | BRECHT, CHARLES MATTHEW | — | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769278 | SHALLOW TRENCH ISOLATION STRUCTURES HAVING UNIFORM STEP HEIGHTS | NGUYEN, THU VAN | — | §101§102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768995 | STRUCTURE AND METHOD FOR MRAM DEVICES | NGUYEN, NIKI HOANG | — | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769261 | THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE | SLUTSKER, JULIA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768125 | SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING THE SAME | PRIDEMORE, NATHAN ANDREW | 2898 | §102§103DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769182 | SEMICONDUCTOR DEVICE | SLUTSKER, JULIA | — | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767722 | ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZATION | PETERSON, ERIK T | 2898 | §102§103§112DP | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767205 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | PHAM, HOAI V | 2892 | §102§112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767970 | METHOD OF FABRICATING PACKAGE STRUCTURE | MAZUMDER, DIDARUL A | — | §102§103 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767168 | SEMICONDUCTOR DEVICE WITH FIN STRUCTURES | KIM, TONG-HO | — | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767939 | SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN | PHAM, HOAI V | 2892 | §102§103§112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766674 | PACKAGE STRUCTURE | ULLAH, ELIAS | — | §102 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18767571 | Work Function Layers For Transistor Gate Electrodes | SLUTSKER, JULIA | — | §103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766856 | IN-LINE ELECTRICAL DETECTION OF DEFECTS AT WAFER LEVEL | ZAKARIA, AKM | 2858 | §102§103 | Final Rejection | — | Pending | Jul 09, 2024 |
| 18767396 | LITHOGRAPHY APPARATUS AND METHOD FOR OPERATING THE SAME | RIDDLE, CHRISTINA A | 2882 | §102§103 | Final Rejection | — | Pending | Jul 09, 2024 |
| 18766582 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766003 | STRUCTURE AND METHOD FOR FINFET DEVICE WITH SOURCE/DRAIN MODULATION | BOWEN, ADAM S | — | Other | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765356 | PACKAGE | PRASAD, NEIL R | — | §102§103Other | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765661 | ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM | LOPEZ ALVAREZ, OLVIN | — | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18765271 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | DINKE, BITEW A | — | §102§103 | Non-Final OA | — | Pending | Jul 07, 2024 |
| 18764951 | GATE-ALL-AROUND DEVICES | PHAM, LONG | — | §102§112 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764945 | SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME | GREEN, TELLY D | — | DP | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764936 | SEMICONDUCTOR DEVICE WITH DIELECTRIC STRUCTURE IN CHANNEL REGION AND MANUFACTURING METHODS THEREOF | PHAM, LONG | — | §102 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18762685 | PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER AND METHOD OF FABRICATING THE SAME | CROSS, XIA L | 2892 | §102 | Final Rejection | 9d overdue | Pending | Jul 03, 2024 |
| 18761335 | SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF | NGUYEN, SOPHIA T | — | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18761592 | AIR CURTAIN FOR DEFECT REDUCTION | MCCLAIN, GERALD | 3652 | §102§103Other | Final Rejection | 33d | Pending | Jul 02, 2024 |
| 18761077 | SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME | CRAWFORD EASON, LATANYA N | — | §112 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18760276 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | LINDSEY, COLE LEON | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18761238 | SEMICONDUCTOR PACKAGE | TRAN, THANH Y | — | §102§103DP | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18760292 | CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION | LE, THAO P | 2818 | DP | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18757882 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | VU, HUNG K | — | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757531 | PACKAGE STRUCTURE | SEVEN, EVREN | — | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758948 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | KIM, TONG-HO | — | §102§103Other | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18759006 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | LEE, CHEUNG | — | §103DP | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | HO, TU TU V | — | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758214 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAC, JONATHAN KHANH | 3653 | §102§103 | Final Rejection | 39d | Pending | Jun 28, 2024 |
| 18757630 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS | QUINTO, KEVIN V | — | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758212 | ETCHING APPARATUS AND METHODS OF CLEANING THEREOF | BRAYTON, JOHN JOSEPH | 1713 | §101§102§103Other | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18756544 | NON-PLANAR TRANSISTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | OJEH, NDUKA E | 2892 | §112DP | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18755752 | LEVEL SHIFTER WITH INDEPENDENT DRIVER | KIM, JUNG H | 2842 | §102 | Final Rejection | 19d | Pending | Jun 27, 2024 |
| 18757043 | MEMORY CIRCUITS WITH MULTI-ROW STORAGE CELLS AND METHODS FOR OPERATING THE SAME | KROFCHECK, MICHAEL C | 2138 | §103 | Final Rejection | — | Pending | Jun 27, 2024 |
| 18755895 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | SABUR, ALIA | — | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18755014 | SYSTEM AND METHOD FOR LIQUID LEAK DETECTION | FLETCHER III, WILLIAM P | 1717 | §103§112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18754948 | SEMICONDUCTOR INTEGRATED CIRCUIT | ERDEM, FAZLI | 2812 | §103 | Non-Final OA | 12d | Pending | Jun 26, 2024 |
| 18753091 | CHIP PACKAGE HAVING MULTIPLE CHIPS | JUNG, MICHAEL YOO LIM | — | §102§103DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753738 | CIRCUIT AND METHOD FOR RECEIVER WITH TRACK PATH | PUENTES, DANIEL CALRISSIAN | 2849 | §103§112 | Non-Final OA | 35d | Pending | Jun 25, 2024 |
| 18753024 | SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING THE SAME | LEE, CHEUNG | — | DP | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18753293 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HARRISON, MONICA D | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18751382 | SEMICONDUCTOR STRUCTURE | MALEK, MALIHEH | 2813 | §112DP | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18752388 | THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGULATOR POWER DELIVERY | TRAN, THANH Y | — | Other | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18750097 | ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME | MUSE, ISMAIL A | — | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18749921 | IMAGE SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF | SEDOROOK, DAVID PAUL | — | §102§103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18749516 | PACKAGE STRUCTURE | SYLVIA, CHRISTINA A | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18748250 | CONTACT AND VIA STRUCTURES | LEBENTRITT, MICHAEL | — | §102§103§112 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18749029 | SEMICONDUCTOR DEVICE HAVING CUT METAL GATE | KOO, LAMONT B | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18748206 | GATE ELECTRODE EXTENDING INTO A SHALLOW TRENCH ISOLATION STRUCTURE IN HIGH VOLTAGE DEVICES | CHOI, CALVIN Y | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18747457 | SEMICONDUCTOR STRUCTURE FOR REDUCING STRAY CAPACITANCE AND METHOD OF FORMING THE SAME | NADAV, ORI | — | §103§112 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18746930 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18746081 | FIN-TYPE FIELD EFFECT TRANSISTOR | WARD, DAVID WILLIAM | — | §103§112Other | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18744306 | STATIC RANDOM ACCESS MEMORY DEVICE | NELSON, JACOB THEODORE | — | §102§103 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18743957 | MULTIZONE THERMAL DEVICE FOR SEMICONDUCTOR STRUCTURES | LEBENTRITT, MICHAEL | — | §103§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18741963 | Contact Structures In Semiconductor Devices | BOWEN, ADAM S | — | §102 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18741837 | SEMICONDUCTOR PHOTONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | PENG, CHARLIE YU | 2874 | §103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18740881 | SEMICONDUCTOR PACKAGE STRUCTURE | PRASAD, NEIL R | — | §102§103Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741714 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | GREEN, TELLY D | — | §103Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741248 | SEMICONDUCTOR DEVICE | BRASWELL, DONALD H.B. | 2825 | §103 | Final Rejection | — | Pending | Jun 12, 2024 |
| 18740625 | MEMORY DEVICE WITH MULTIPLE MEMORY CELL ARCHITECTURES | HARBOTTLE, CHARLOTTE ELIZABETH | — | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18739603 | OPTICAL MODULATORS FOR PHOTONICS DEVICES AND METHODS THEREFOR | BLEVINS, JERRY M | — | §102§103§112 | Non-Final OA | — | Pending | Jun 11, 2024 |
| 18736947 | ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING | BARZYKIN, VICTOR V | — | §103Other | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18736659 | METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE SAME | FAYETTE, NATHALIE RENEE | — | §102§103§112 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18737615 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | CHEN, DAVID Z | 2815 | §102§103 | Final Rejection | 30d overdue | Pending | Jun 05, 2024 |
| 18734190 | SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING | SALERNO, SARAH KATE | 2814 | §102§103 | Non-Final OA | 9d | Pending | Jun 05, 2024 |
| 18734575 | IMAGE SENSOR DEVICES AND METHODS OF FORMATION | HOSSAIN, MOAZZAM | — | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18733536 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | JONES, ERIC W | — | §102§103 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18733512 | SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE | AU, BAC H | 2898 | §103 | Final Rejection | 26d | Pending | Jun 04, 2024 |
| 18731821 | BONDED STRUCTURE WITH HALF-OVAL BONDING PAD PAIR DESIGN AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | — | §102 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | WINTERS, SEAN AYERS | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731593 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18731031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | LIU, BENJAMIN T | — | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18679331 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | ERDEM, FAZLI | — | §103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18677746 | METHOD OF FABRICATING SEMICONDUCTOR SUBSTRATE | MULERO FLORES, ERIC MANUEL | — | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676841 | PIXEL ISOLATION STRUCTURE FOR IMAGE SENSOR | KLEIN, JORDAN M | — | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676595 | SYSTEMS AND METHODS FOR FABRICATING FINFETS WITH DIFFERENT THRESHOLD VOLTAGES | HSIEH, HSIN YI | — | §102 | Non-Final OA | — | Pending | May 29, 2024 |
| 18677191 | INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME | ARMAND, MARC ANTHONY | — | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18676649 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | SMITH, SAMUEL JONATHAN | — | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18675090 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ZHU, SHENG-BAI | 2897 | §102§103 | Non-Final OA | — | Pending | May 27, 2024 |
| 18674894 | APPARATUS INCLUDING COOLING STRUCTURE | SEVEN, EVREN | — | §102§103 | Non-Final OA | — | Pending | May 26, 2024 |
| 18673432 | SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673328 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | GUMEDZOE, PENIEL M | — | §103§112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18673792 | SEMICONDUCTOR ISOLATION STRUCTURE FOR INJECTION SUPPRESSION AND METHOD OF MAKING THEREOF | RAMIREZ, ALEXANDRE XAVIER | — | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18672076 | SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE | NGUYEN, DUY T V | — | DP | Non-Final OA | — | Pending | May 23, 2024 |
| 18672733 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BRADFORD, PETER | — | §102§103§112 | Non-Final OA | — | Pending | May 23, 2024 |
| 18673204 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | MUNOZ, ANDRES F | — | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18671605 | ESD CLAMP CIRCUIT WITH LATCH | MEHARI, YEMANE | — | §103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18671330 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | GUMEDZOE, PENIEL M | — | §102§103 | Non-Final OA | — | Pending | May 22, 2024 |
| 18669948 | SEMICONDUCTOR STRUCTURE WITH REDUCED BODY LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME | CRITE, ANTONIO B | — | §102 | Non-Final OA | — | Pending | May 21, 2024 |
| 18669560 | SEMICONDUCTOR DEVICE AND FORMING METHO OF THE SAME | HOLLWEG, THOMAS A | 2874 | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18668809 | CHIP PACKAGE STRUCTURE WITH ADHESIVE WALL STRUCTURE AND METHOD FOR FORMING THE SAME | MARIN, JACOB RAUL | — | §103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18668631 | CO-PACKAGED OPTICAL FIBER MOUNTING UNIT AND METHOD OF FABRICATION | PAK, SUNG H | 2874 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18666982 | SEMICONDUCTOR STRUCTURE HAVING VERTICAL CHANNELS AND METHOD FOR MANUFACTURING THE SAME | BOEGEL, CHEVY JACOB | — | §102§103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18666761 | METHOD FOR FORMING THERMAL CONDUCTOR MATERIAL FILM AND STACKING STRUCTURE FORMD THEREWITH | JOHNSON, CHRISTOPHER A | — | §103§112 | Non-Final OA | — | Pending | May 16, 2024 |
| 18664837 | MEMORY DEVICE | STUESSY, NOLAN GABRIEL | — | §102§103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18664301 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | REAMES, MATTHEW L | — | §102§112Other | Non-Final OA | — | Pending | May 15, 2024 |
| 18664291 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME | BERNSTEIN, ALLISON | — | §102§103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18663771 | PHOTONIC INTEGRATED CIRCUIT AND CONTROLLING METHOD THEREOF FOR VERTICAL OPTICAL COMPUTING | NGUYEN, DUNG T | 2871 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18663776 | POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL | OH, JAEHWAN | 2899 | §102 | Final Rejection | 28d | Pending | May 14, 2024 |
| 18663606 | HEAT CLEANING SYSTEM AND METHOD FOR CMP PAD BY-PRODUCT CONTROL | MACARTHUR, SYLVIA | 1713 | §103 | Non-Final OA | — | Pending | May 14, 2024 |
| 18662168 | HIGHLY PHYSICAL ION RESISTIVE SPACER TO DEFINE CHEMICAL DAMAGE FREE SUB 60NM MRAM DEVICES | CRITE, ANTONIO B | — | §103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662286 | SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN UNIT WITH TUNNEL LAYER AND METHOD FOR MANUFACTURING THE SAME | LOHAKARE, PRATIKSHA JAYANT | — | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18661000 | MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE | BERNSTEIN, ALLISON | 2824 | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18660641 | SEMICONDUCTOR PROCESSING APPARATUS | ISLAM, MOHAMMAD K | — | §102§103 | Non-Final OA | — | Pending | May 10, 2024 |
| 18659212 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | DAS, PINAKI | — | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | BODNAR, JOHN A | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18659745 | SEMICONDUCTOR PACKAGE WITH HEAT SPREADING LID | VU, VU A | — | §102§103§112 | Non-Final OA | — | Pending | May 09, 2024 |
| 18658962 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | SMITH, CHAD | — | §103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18658786 | DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME | MINNEY, GABRIEL SEBASTIAN | — | §102§103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18656884 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CRAWFORD EASON, LATANYA N | — | §102§103Other | Non-Final OA | — | Pending | May 07, 2024 |
| 18656666 | EPITAXIAL STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FORMING THEREOF | KHALIFA, MOATAZ | — | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18656782 | GATE-ALL-AROUND TRANSISTOR HAVING MULTIPLE GATE LENGTHS | SEDOROOK, DAVID PAUL | — | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18655466 | SEMICONDUCTOR DEVICES HAVING CONTACT FIELD PLATES AND METHODS FOR FORMING THE SAME | GEBREMARIAM, SAMUEL A | — | §102§112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18655769 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | ANYA, IGWE U | — | §102§103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18656348 | LOW-RESISTANCE SOURCE/DRAIN FEATURES | LEE, ALVIN LYNGHI | — | §103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18654020 | SEMICONDUCTOR APPARATUS FOR GAS MIXING AND METHOD OF FILM DEPOSITION | HARRISON, MONICA D | — | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18654400 | CONDITIONING PAD WITH DEPOSITED DIAMOND COATING | DEO, DUY VU NGUYEN | 1713 | §102§103Other | Non-Final OA | — | Pending | May 03, 2024 |
| 18654441 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION | ANYA, IGWE U | — | §102 | Non-Final OA | — | Pending | May 03, 2024 |
| 18652963 | VOLTAGE CONTROL CIRCUITS AND METHODS FOR OPERATING THE SAME | RADKE, JAY W | 2827 | §112 | Non-Final OA | — | Pending | May 02, 2024 |
| 18652772 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | RODELA, EDUARDO A | — | §103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18651776 | WAFER TRANSPORT CONTAINER | ACKUN, JACOB K | 3652 | DP | Non-Final OA | — | Pending | May 01, 2024 |
| 18650905 | Gate Structures For Semiconductor Devices | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18651321 | INTEGRATED CIRCUIT PACKAGES | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18649262 | Dielectric Frame Structures to Mitigate Lay-Out-Dependent Effect in Semiconductor Devices | WALL, VINCENT | — | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18648510 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURE | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18649541 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP | PARKER, JOHN M | 2899 | §102§103Other | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | PARKER, JOHN M | — | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18647151 | SYSTEMS AND METHODS FOR TESTING SEMICONDUCTOR DEVICE | NGUYEN, TRUNG Q | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18647384 | CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHOD | LEE, AIDEN Y | — | §102§103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646677 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | LEE, EUGENE | 2898 | §102§103§112 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646723 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | ROBERTSON, NOAH CHRISTOPHER | — | §103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645564 | LOW DROPOUT REGULATOR WITH ALTERNATIVE LOOP CONTROL | LEE, JYE-JUNE | — | §103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645747 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | AHMED, SHAHED | — | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645481 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | BOWEN, ADAM S | 2897 | §102 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646170 | DIELECTRIC MATERIALS FOR STACKED TRANSISTOR STRUCTURES AND RELATED METHODS | QUINTO, KEVIN V | — | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646444 | Epitaxial Structures in Image Sensors | BRECHT, CHARLES MATTHEW | — | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646458 | ADHESION OF A PACKAGE COMPONENT TO A HEAT SINK | GONZALES, VICENTE ROLANDO | — | §102§103 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644231 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KIELIN, ERIK J | 2893 | §103 | Final Rejection | — | Pending | Apr 24, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | GEYER, SCOTT B | — | §102 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18642992 | Content Addressable Memory Cells | ABDELAZIEZ, YASSER A | — | §103§112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18642872 | SEMICONDUCTOR DEVICE HAVING NANOSTRUCTURE TRANSISTOR AND METHODS OF FABRICATION THEREOF | SOWARD, IDA M | — | §102§112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643788 | Integrated Circuit Package Structure with Thermelectric Self-Cooling Device | TRAN, DZUNG | — | §103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643789 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | REAMES, MATTHEW L | — | §112 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18642273 | COMPLEMENTARY FET STRUCTURES WITH REDUCED AREA | SEDOROOK, DAVID PAUL | — | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18642658 | MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE | BELOUSOV, ALEXANDER | 2818 | DP | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18641017 | SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF | AHMADI, MOHSEN | — | §103§112 | Non-Final OA | — | Pending | Apr 19, 2024 |
| 18640921 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SPRENGER, JAIME LYNN | — | §102§103 | Non-Final OA | — | Pending | Apr 19, 2024 |
| 18638982 | RADIATION SOURCE APPARATUS AND METHOD FOR OPERATING THE SAME | WHITESELL, STEVEN H | 1759 | §102§103§112 | Final Rejection | — | Pending | Apr 18, 2024 |
| 18639105 | SEMICONDUCTOR STRUCTURE WITH REDUCED CURRENT LEAKAGE AND METHOD FOR MANUFACTURING THE SAME | MARIN, JACOB RAUL | — | §103§112 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18639739 | GATE SPACERS AND METHODS OF FORMING THE SAME IN SEMICONDUCTOR DEVICES | KOO, LAMONT B | 2813 | §102§103§112 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18638088 | SEMICONDUCTOR ELECTRODE STRUCTURES AND METHODS OF FORMING SAME | ANDREWS, FELIX BRYAN | 2881 | §103 | Non-Final OA | — | Pending | Apr 17, 2024 |
| 18636372 | INTEGRATED CIRCUIT INTER-DIE COMMUNICATION USING OPTICAL TRANSMISSION STRUCTURES | PENG, CHARLIE YU | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | SMITH, CHAD | 2874 | §102 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635310 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | — | §103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635103 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | WEILAND, ADAM DAVID | — | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18634774 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | VU, DAVID | — | §102 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18631274 | SEMICONDUCTOR STRUCTURE | DINKE, BITEW A | — | §102§103§112 | Final Rejection | — | Pending | Apr 10, 2024 |
| 18631525 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SCHOENHOLTZ, JOSEPH | — | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18630307 | SEMICONDUCTOR WAVEGUIDE HEATER WITH HEATER CONTACTS | BLEVINS, JERRY M | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18629474 | FRONTSIDE AND BACKSIDE BIT LINES IN A MEMORY ARRAY | MINNEY, GABRIEL SEBASTIAN | — | §103§112 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18629044 | SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME | NGUYEN, KHIEM D | — | §103 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18629679 | POLISHING PAD WITH HEAT DISSIPATION PATTERN | NEIBAUR, ROBERT F | 3723 | §102§103 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18627686 | Structure and Method of an Integrated Circuit Having Silicon Photonic Integration | MANHEIM, MARC ETIENNE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627570 | METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE SAME | CHOU, SHIH TSUN A | — | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627507 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | WOODARD, AUSTIN TAYLOR | — | §103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627885 | CONDUCTIVE PATH WITH REDUCED RESISTANCE | PUNCHBEDDELL, SEYON ALI-SIMAH | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18626960 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | ANDERSON, WILLIAM H | — | §102§103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626638 | METHOD FOR TREATING TWO SUBSTRATES AND SEMICONDUCTOR APPARATUS FOR PERFORMING THE TREATMENT | CHOUDHRY, MOHAMMAD M | — | §103 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626948 | SEMICONDUCTOR PHOTONICS DEVICES AND METHODS OF FORMATION | PENG, CHARLIE YU | 2874 | §102 | Non-Final OA | — | Pending | Apr 04, 2024 |
| 18626116 | Input-Aware Data Inversion Scheme for Low Power Memory Circuit Design | SIMONETTI, NICHOLAS J | 2137 | §103 | Final Rejection | 26d | Pending | Apr 03, 2024 |
| 18625485 | MRAM DEVICE HAVING TWO-TERMINAL SELECTORS | BLACKWELL, ASHLEY NICOLE | — | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18625788 | SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL | SNOW, COLLEEN ERIN | 2899 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18624145 | PACKAGE STRUCTURE HAVING RING RESONANT STRUCTURE AND METHOD OF FORMING THE SAME | PENG, CHARLIE YU | 2874 | §102§103§112 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18621250 | SPACER FRAME FOR GRAPHITE THERMAL INTERFACE MATERIALS | WHALEN, DANIEL B | — | §102§103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18617963 | METHOD FOR FORMING CAULKING LAYER, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE THEREOF | NGUYEN, KHIEM D | — | §103 | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | DINKE, BITEW A | — | §103 | Final Rejection | — | Pending | Mar 27, 2024 |
| 18618312 | HYBRID BULK SEMICONDUCTOR AND SEMICONDUCTOR ON INSULATOR (SOI) SUBSTRATE AND METHODS OF FORMATION | PETERSON, ERIK T | — | §102§112 | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18616674 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | RAHMAN, MOHAMMAD A | — | §102§112 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18617303 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING COMPLEMENTARY FIELD-EFFECT TRANSISTOR STRUCTURE | FOX, BRANDON C | — | §102§103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18614756 | METHOD OF FORMING PACKAGE STRUCTURE | SALERNO, SARAH KATE | 2814 | §102 | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18615579 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | DEO, DUY VU NGUYEN | 1713 | §102§103 | Final Rejection | — | Pending | Mar 25, 2024 |
| 18615459 | MAGNETIC TUNNEL JUNCTION DEVICES | MILLER, JAMI VALENTINE | 2818 | §103 | Final Rejection | 16d | Pending | Mar 25, 2024 |
| 18615866 | MEMORY DEVICE AND METHOD | CHEN, XIAOCHUN L | 2824 | §112Other | Non-Final OA | — | Pending | Mar 25, 2024 |
| 18614445 | EUV LITHOGRAPHY MASK BLANKS, EUV MASKS AND METHODS | FRASER, STEWART A | — | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18614098 | CHANNEL STRUCTURES IN SEMICONDUCTOR DEVICES | SENGDARA, VONGSAVANH | — | §102 | Final Rejection | — | Pending | Mar 22, 2024 |
| 18611797 | INTEGRATED CIRCUIT CHIP HAVING VIA TOWERS FOR POWER CONNECTION AND METHOD OF FORMING THE SAME | MANDALA, MICHELLE | — | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18612386 | INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE | WARD, DAVID WILLIAM | — | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18609456 | INTERCONNECT STRUCTURE AND METHODS THEREOF | RAHMAN, MOHAMMAD A | — | §102§112 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18607714 | Semiconductor Device Including a Voltage Regulator and an Integrated Circuit Module | HILTUNEN, THOMAS J | 2849 | §102§103 | Non-Final OA | 8d overdue | Pending | Mar 18, 2024 |
| 18606335 | INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF | STEVENSON, ANDRE C | 2899 | DP | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18605515 | SYSTEMS AND METHODS FOR RECOVERY OF AN IMPAIRED VEHICLE ON A SUSPENDED TRACK | LIN, CHENG XI | — | §102§103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18605724 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18603779 | INTEGRATED CIRCUIT PACKAGES | CRITE, ANTONIO B | — | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603469 | Analog Cell Structure | ELLIOTT, DANIEL KURT | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18602163 | THERMAL CONDUCTIVE BONDING STRUCTURE | DULKA, JOHN P | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18602854 | STACKED TRANSISTORS AND METHOD OF FORMING THE SAME | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18601191 | SLOW WAVE INDUCTIVE STRUCTURE | HINSON, RONALD | 2837 | §103 | Final Rejection | 36d overdue | Pending | Mar 11, 2024 |
| 18599702 | CHANNEL EXTENSION STRUCTURES FOR SEMICONDUCTOR DEVICES | BELL, LAUREN R | 2896 | §102§103§112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597966 | SEMICONDUCTOR DEVICES HAVING A PATTERNED CONTACT | RAMALLO, GUSTAVO G | 2812 | §112 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597846 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596416 | METHOD OF FORMING NANOSTRUCTURE DEVICE AND RELATED STRUCTURE | YI, CHANGHYUN | 2812 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18595429 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | 2898 | §103 | Final Rejection | 22d | Pending | Mar 05, 2024 |
| 18596600 | PACKAGE STRUCTURE | PETKOVSEK, DANIEL | 2874 | §103 | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18596404 | 3D IC POWER GRID | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | 119d overdue | Pending | Mar 05, 2024 |
| 18593444 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | TRAN, TRANG Q | 2811 | §102§103§112 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18591282 | IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR DEVICES | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18592029 | Source/Drains for Stacked Device Structures and Methods of Fabrication Thereof | STEPHENSON, KENNETH STEPHEN | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591992 | SEMICONDUCTOR DEVICE | JOHNSON, CHRISTOPHER A | 2899 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591873 | TRANSISTOR AND SEMICONDUCTOR DEVICE USING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §102§103§112 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18590957 | SEMICONDUCTOR DEVICE AND METHOD OF ARRANGING AN INTERFACE OF A SEMICONDUCTOR DEVICE | RAMPERSAUD, PRIYA M | 2897 | §102 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591047 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | BOOTH, RICHARD A | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591700 | BONDING TOOL FOR BONDING DIES ONTO SUBSTRATES AND METHODS OF USE | HENRY, CALEB E | 2818 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18589669 | SELECTIVE DEPOSITION METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME | ROBERTSON, NOAH CHRISTOPHER | 2812 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18590175 | Diffusion Barrier Layers in Semiconductor Devices | LIU, XIAOMING | 2812 | §103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18590911 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BRECHT, CHARLES MATTHEW | 2817 | §103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18588069 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREADER LAYERS | KIELIN, ERIK J | 2814 | §102§103§112 | Non-Final OA | — | Pending | Feb 27, 2024 |
| 18586942 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | TRAN, TIEN | 2812 | §103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18586596 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18584047 | WAVEGUIDE WITH TRANSITIONAL PORTION AND METHOD OF FABRICATING SAME | CHIEM, DINH D | 2874 | §103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18584092 | SEMICONDUCTOR DEVICE | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §102§103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582953 | MEMORY CELL STRUCTURES WITH GATE-CUT FEATURES ON CELL BOUNDARIES | MORA, ONASIS | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18583044 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | MULERO FLORES, ERIC MANUEL | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18583194 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | LUKE, DANIEL M | 2896 | §103§112 | Final Rejection | 11d overdue | Pending | Feb 21, 2024 |
| 18582702 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18583209 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18581750 | AUTOMATED SEMICONDUCTOR WAFER TRANSFER MONITORING | WORKU, KIDEST | 2119 | §101§102§103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18581058 | SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES | DYKES, LAURA M | 2892 | §103§112 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18443616 | DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | — | Pending | Feb 16, 2024 |
| 18443323 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | ALAM, MOHAMMED R | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18444092 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | HOQUE, MOHAMMAD M | 2817 | §102§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18443329 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING AND TESTING THE SAME | PARTHASARATHY, ROHIT | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18442381 | HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18443158 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHODS | ALBRECHT, PETER M | 2811 | §112 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18440483 | SACRIFICIAL TEST PAD | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18440671 | DELAMINATION DETECTION STRUCTURE | KAO, SOPHIA WEI-CHUN | 2817 | §103 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18438875 | Threshold Voltage Tuning Using Aluminum Layer as Dipole Material | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18438538 | DUAL DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | WEGNER, AARON MICHAEL | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18435093 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | CHIN, EDWARD | 2893 | §103 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18435128 | SEMICONDUCTOR DEVICES HAVING FERROELECTRIC MEMORY CELLS AND METHODS OF FORMING THE SAME | CHEEK, EDWARD RHETT | 2813 | §102§103 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18435685 | SEMICONDUCTOR STRUCTURE WITH BLOCKING FEATURES FORMED WITHIN BASE EPITAXY LAYERS AND METHOD FOR MANUFACTURING THE SAME | YEMELYANOV, DMITRIY | 3616 | §102§103§112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18435378 | SEMICONDUCTOR STRUCTURE INCLUDING INTERMEDIATE CONDUCTIVE LAYERS AND METHOD FOR MANUFACTURING THE SAME | WINTERS, SEAN AYERS | 2892 | §112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18433412 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | GOODLING, DEVIN KIRK | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434559 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | NGUYEN, CUONG B | 2818 | §112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433641 | BIT LINE WITH NON-UNIFORM WIDTH IN A MEMORY ARRAY | HOANG, HUAN | 2893 | §102§103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433934 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WARREN, MATTHEW E | 2815 | — | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18432333 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | REAMES, MATTHEW L | 2896 | §102§103§112 | Final Rejection | — | Pending | Feb 05, 2024 |
| 18433033 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MANDALA, VICTOR A | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432386 | CHIP PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME | YUSHINA, GALINA G | 2811 | §103§112 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432199 | Single Phase Clock Controlled Master Latch in Flip Flops | NGUYEN, LONG T | 2842 | §102 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432058 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | FAN, SU JYA | 2818 | §103§112 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432197 | INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18432027 | SEMICONDUCTOR STRUCTURE INCLUDING HIGH THERMAL CONDUCTIVITY MATERIAL AND METHOD OF FORMING THE SAME | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Feb 04, 2024 |
| 18432031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | SENGDARA, VONGSAVANH | 2893 | §102 | Non-Final OA | — | Pending | Feb 04, 2024 |
| 18431950 | SEMICONDUCTOR DEVICES WITH LOWERED EPITAXIAL SOURCE/DRAIN REGIONS AND METHODS OF FABRICATION THEREOF | DYKES, LAURA M | 2892 | §102§103§112Other | Non-Final OA | — | Pending | Feb 03, 2024 |
| 18431140 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §102 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430868 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | GARCES, NELSON Y | 2814 | §102§112 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18430507 | SEMICONDUCTOR DEVICE | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | — | Pending | Feb 01, 2024 |
| 18428603 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | JAHAN, BILKIS | 2817 | DP | Non-Final OA | — | Pending | Jan 31, 2024 |
| 18428967 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | LUONG, DUY HAN | 2825 | §103 | Final Rejection | 2d overdue | Pending | Jan 31, 2024 |
| 18428230 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | DINKE, BITEW A | 2812 | §103 | Final Rejection | 76d | Pending | Jan 31, 2024 |
| 18426796 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | SUN, YU-HSI DAVID | 2817 | §103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18426664 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | TORNOW, MARK W | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18426140 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CHOI, CALVIN Y | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425306 | TRENCH CAPACITOR STRUCTURE AND METHOD OF FORMING THE SAME | SEVEN, EVREN | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425333 | OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE | AHMED, SHAHED | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425264 | THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE | NGUYEN, CUONG B | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18425352 | SEMICONDUCTOR STRUCTURE | PETERSON, ERIK T | 2898 | §102§112 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18423888 | OPTICAL SIGNAL REDIRECTION STRUCTURE FOR PHOTONICS DEVICE | ALANKO, ANITA KAREN | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | SANDVIK, BENJAMIN P | 2812 | §103 | Final Rejection | — | Pending | Jan 26, 2024 |
| 18423745 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIM, SU C | 2899 | — | Final Rejection | — | Pending | Jan 26, 2024 |
| 18421267 | ANTI-SLIP COMPOSITIONS AND COMPONENTS FOR SEMICONDUCTOR WAFER HANDLING SYSTEMS | ROBINSON, CHANCEITY N | — | §103§112 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421026 | SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND METHODS OF FORMING SAME | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18421312 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18420674 | PHOTONIC DEVICE AND FABRICATING METHOD THEREOF | LEE, CHEUNG | 2874 | §102 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18420232 | MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18417314 | SEMICONDUCTOR DEVICES WITH DOUBLE SILICON LENS | RADKOWSKI, PETER | 2874 | §103 | Final Rejection | — | Pending | Jan 19, 2024 |
| 18417128 | PELLICLE FOR EUV APPLICATIONS | FRASER, STEWART A | — | §103§112 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18418142 | POLISHING APPARATUS AND POLISHING METHOD USING THE SAME | RIRIE, EVERETT TRAJAN | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 19, 2024 |
| 18416715 | FERROELECTRIC NON-VOLATILE MEMORY AND METHODS OF FORMATION | ALAM, MOHAMMED R | 2897 | §112 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415668 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18416800 | THIN FILM RESISTOR AND METHODS OF FORMING THE SAME | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415986 | Extreme Ultraviolet (EUV) Mask and Method of Fabrication Thereof | TRAYWICK, ANDREW PRESTON | — | §103§112 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18414622 | APPARATUSES AND METHODS FOR ASSESSING DEEP ULTRAVIOLET REFLECTIVITY OF A PELLICLE FOR AN EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY MASK | AKANBI, ISIAKA O | — | §102 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415267 | Semiconductor Device Including A Pulse Amplitude Modulation Driver | LAM, TUAN THIEU | 2843 | §102 | Final Rejection | — | Pending | Jan 17, 2024 |
| 18415487 | SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD THEREOF | REIDA, MOLLY KAY | 2899 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415616 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | MILLER, MICHAEL G | 2817 | §103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18414480 | METHOD AND SYSTEM FOR OBTAINING OPTICAL CRITICAL DIMENSION | SOUNDRANAYAGAM, RAYAPPU NMN | 2858 | §102 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415330 | SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Jan 17, 2024 |
| 18415529 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME | WARD, ERIC A | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18415192 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | GREEN, TELLY D | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18413079 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | BOEGEL, CHEVY JACOB | 2812 | §103 | Final Rejection | — | Pending | Jan 16, 2024 |
| 18413062 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18414245 | SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WARD, ERIC A | 2891 | §103 | Non-Final OA | — | Pending | Jan 16, 2024 |
| 18412581 | SEMICONDUCTOR DEVICE | PRICE, LYTESHIA M | 2818 | §103§112 | Non-Final OA | — | Pending | Jan 14, 2024 |
| 18411595 | Contact Structures in Semiconductor Devices | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411620 | Static Random-Access Memory Device with Enhanced Isolation Structure and Increased Packing Density | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18411422 | MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM | MOHAMED-ALY, KAREEM M | 2898 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18412209 | DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS | ONUTA, TIBERIU DAN | 2814 | §103 | Final Rejection | — | Pending | Jan 12, 2024 |
| 18412071 | DEPOSITION TOOL WITH DIELECTRIC COATED CHAMBER SIDEWALLS TO IMPROVE ELECTROMANGNETIC FIELD UNIFORMITY | TADAYYON ESLAMI, TABASSOM | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18412129 | MEMORY DEVICES WITH DIFFERENTLY SIZED ACTIVE REGIONS IN PERIPHERY CIRCUITS | DYKES, LAURA M | 2892 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18410734 | ONE-TIME-PROGRAMMABLE MEMORY ARRAY HAVING DIFFERENT DEVICE CHARACTERISTICS AND METHODS OF MANUFACTURING THEREOF | WOLDEGEORGIS, ERMIAS T | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409827 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | NGUYEN, CUONG B | 2818 | §102§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410302 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | MENZ, LAURA MARY | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409839 | SEMICONDUCTOR STRUCTURE INCLUDING MEMORY UNIT AND MANUFACTURING METHOD THEREOF | SHAMSUZZAMAN, MOHAMMED | 2897 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410303 | SEMICONDUCTOR STRUCTURE HAVING NON-SILICIDE SOURCE/DRAIN CONTACT AND METHOD FOR MANUFACTURING THE SAME | TYNES JR., LAWRENCE C | 2899 | §103§112 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18409950 | WAFER HOLDER APPARATUS, SYSTEM AND METHOD OF FORMING SAME | DODDS, SCOTT | — | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18409915 | METHODS FOR SELECTIVE METAL CAP FORMATION | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18410852 | DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETWEEN MG AND SD | SENGDARA, VONGSAVANH | 2893 | §102§112 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18410813 | MULTI-LAYER ALIGNMENT MARK STRUCTURE | CHOWDHARY, NIMARTA KAUR | 2898 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18408782 | DEVICE HAVING ALTERNATING ROWS OF CORRESPONDING FIRST AND SECOND ROW-ARCHITECTURES AND METHOD OF MANUFACTURING SAME | AISAKA, BRYCE M | — | §112 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18409126 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) STRUCTURES AND METHODS OF FORMING SAME | CHANG, JAY C | 2817 | §102§103§112 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18408944 | TRANSISTOR STRUCTURE WITH HIGHER JUNCTION BREAKDOWN VOLTAGE | TRAN, TIEN | 2812 | §103 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18408487 | SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | HUNTER III, CARNELL | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407436 | SEMICONDUCTOR DEVICE AND SYSTEM FOR OPTICAL SIGNAL PROCESSING | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407524 | SEMICONDUCTOR DEVICE WITH HYBRID SUBSTRATE AND MANUFACTURING METHODS THEREOF | CHAMBLISS, ALONZO | 2897 | §112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18407342 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ARORA, AJAY | 2892 | §102 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18406246 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | REAMES, MATTHEW L | 2896 | §103§112 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18407368 | PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR DEVICE USING THE SAME | KENDALL, BENJAMIN R | 2896 | §102 | Final Rejection | — | Pending | Jan 08, 2024 |
| 18405951 | ONE-TIME-PROGRAMMABLE MEMORY DEVICES WITH HIGH SECURITY AND METHODS OF MANUFACTURING THEREOF | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404932 | TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME | THROCKMORTON, ROBERT EMIL | 2818 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405450 | THIN FILM RESISTORS AND METHODS OF FORMING THE SAME | DAS, PINAKI | 2898 | §102§103 | Final Rejection | — | Pending | Jan 05, 2024 |
| 18405919 | IMAGE SENSOR | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405146 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405318 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BELL, LAUREN R | 2896 | §103§112 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404187 | SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL GATE VIA AND METHOD FOR MANUFACTURING THE SAME | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | ADHIKARI DAWADI, BIPANA | 2898 | §102§103§112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403735 | PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME | CAPUTO, LISA M | 2874 | §103§112 | Final Rejection | 21d | Pending | Jan 04, 2024 |
| 18404345 | BACKSIDE CONTACT RESISTANCE REDUCTION | LOPEZ, JORGE ANDRES | 2897 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404831 | Gate Patterning for Stacked Device Structure | HRNJIC, ADIN | 2817 | §112 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404515 | SOURCE/DRAIN STRUCTURE DOPANT CLUSTER DESIGN | GREAVING, JASON JAMES | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404233 | EPITAXIAL STRUCTURES IN SEMICONDUCTOR DEVICES | CIESLEWICZ, ANETA B | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403779 | PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING PHOTOELECTRIC DEVICE | CAPUTO, LISA M | 2874 | §102§103 | Final Rejection | 5d overdue | Pending | Jan 04, 2024 |
| 18404737 | METHOD OF INCREASING CROSSLINKING DENSITY OF PHOTORESIST | CHACKO DAVIS, DABORAH | — | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403747 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404290 | SEMICONDUCTOR STRUCTURE INCLUDING MICRO WELLS WITH DIFFERENT HEIGHTS | MIHALIOV, DMITRI | 2812 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403723 | SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404467 | REDUCTION OF SIZE OF EDGE CELL REGION IN MEMORY DEVICES | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103 | Final Rejection | — | Pending | Jan 04, 2024 |
| 18403587 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | 2898 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402935 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LEBENTRITT, MICHAEL | 2893 | §102 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403643 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403148 | INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUBSTRATE | GOODLING, DEVIN KIRK | 2898 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18402976 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | FARMER, EMILY NICOLE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403455 | INSPECTION SYSTEM AND METHOD FOR OPERATING THEREOF | YAZBACK, MAHER | — | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403616 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | CUTLER, ETHAN EDWARD | 2892 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401853 | PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE STRUCTURE | YEMELYANOV, DMITRIY | 2891 | §103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402404 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18402035 | CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME | ANYA, IGWE U | 2891 | §102 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18401948 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | MAI, ANH D | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 02, 2024 |
| 18400440 | SEMICONDUCTOR DIE AND METHODS OF FORMATION | PHAM, THOMAS T | 1713 | §103§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18398437 | CIRCUIT CELLS HAVING CONDUCTION PATH BETWEEN FRONTSIDE POWER RAIL AND BACKSIDE POWER RAIL | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398925 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | CHOU, SHIH TSUN A | 2811 | §103 | Final Rejection | — | Pending | Dec 28, 2023 |
| 18398951 | METHODS AND DEVICES THAT INCLUDE A GATE CONTACT THAT ABUTS A DIELECTRIC REGION THAT HAS A LOW-K DIELECTRIC | WRIGHT, TUCKER J | 2891 | §102 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398937 | PHOTONICS DEVICE WITH BACKSIDE TRANSMISSIVE REGION | HAN, JONATHAN | 2818 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18398856 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL | JEAN BAPTISTE, WILNER | 2899 | §103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18397398 | REDUCTION OF METAL LOSS DURING GATE PATTERNING | TRAN, TONY | 2893 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18396662 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | SENGDARA, VONGSAVANH | 2893 | §102 | Final Rejection | 9d overdue | Pending | Dec 26, 2023 |
| 18396186 | MEMORY REFRESH | KING, DOUGLAS | 2824 | §112Other | Non-Final OA | 6d | Pending | Dec 26, 2023 |
| 18395728 | SEMICONDUCTOR DEVICE FOR HIGH-VOLTAGE APPLICATION | SARKER-NAG, AKHEE | 2893 | §102§103§112 | Non-Final OA | — | Pending | Dec 25, 2023 |
| 18393711 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | SHEKER, RHYS PONIENTE | 2813 | §103 | Non-Final OA | — | Pending | Dec 22, 2023 |
| 18393890 | SEMICONDUCTOR DEVICES AND METHODS THEREOF WITH SELECTIVELY FORMED ISOLATION LAYERS | GOODLING, DEVIN KIRK | 2898 | §103§112 | Non-Final OA | — | Pending | Dec 22, 2023 |
| 18391546 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | STARK, JARRETT J | 2898 | §103 | Non-Final OA | — | Pending | Dec 20, 2023 |
| 18543110 | CHIP STRUCTURE | PIZARRO CRESPO, MARCOS D | 2814 | §103§112 | Non-Final OA | — | Pending | Dec 18, 2023 |
| 18535477 | METHOD AND APPARATUS FOR MONITORING AN EXTREME ULTRAVIOLET RADIATION SOURCE | NGUYEN, KIET TUAN | 2881 | §102§112 | Non-Final OA | 24d overdue | Pending | Dec 11, 2023 |
| 18535546 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME | DOAN, NGHIA M | — | §103Other | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18533054 | OPTICAL WAVEGUIDE, SEMICONDUCTOR DEVICE WITH OPTICAL WAVEGUIDE, AND METHODS OF MANUFACTURING THE SAME | CONNELLY, MICHELLE R | 2874 | §102§103 | Non-Final OA | — | Pending | Dec 07, 2023 |
| 18530248 | LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND METHOD FOR FORMING THE SAME | YAP, DOUGLAS ANTHONY | 2899 | §102§103 | Final Rejection | — | Pending | Dec 06, 2023 |
| 18529008 | METHODS FOR FORMING THIN FILM RESISTOR | HARRISON, MONICA D | 2815 | §103 | Final Rejection | 10d overdue | Pending | Dec 05, 2023 |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Final Rejection | 14d | Pending | Dec 04, 2023 |
| 18527532 | IMAGE SENSOR WITH METAL-INSULATOR-METAL STORAGE ELEMENTS | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18527714 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | CHANG, JAY C | 2817 | §112 | Non-Final OA | — | Pending | Dec 04, 2023 |
| 18526121 | METHOD OF SMOOTHENING PROFILE OF PHOTORESIST | EOFF, ANCA | — | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526529 | METHODS FOR IMPROVING DEPTH LOADING IN TRANSISTORS | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526473 | CONTACT GATE ISOLATION | ADHIKARI DAWADI, BIPANA | 2898 | §103§112 | Final Rejection | 22d | Pending | Dec 01, 2023 |
| 18526083 | CHIP TESTING STRUCTURE | PATEL, PARESH H | 2858 | §103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18524445 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | CUNNINGHAM, KIERAN MURRAY | 2893 | §102§103 | Final Rejection | 41d | Pending | Nov 30, 2023 |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 21d | Pending | Nov 30, 2023 |
| 18522662 | SYSTEM AND STRUCTURE INCLUDING A PELLICLE | ANGEBRANNDT, MARTIN J | 1737 | §102§103DP | Final Rejection | — | Pending | Nov 29, 2023 |
| 18523286 | INTERCONNECTION STRUCTURE HAVING AIR GAP | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18522224 | CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE | PENG, CHARLIE YU | 2874 | §102§103 | Final Rejection | 16d overdue | Pending | Nov 29, 2023 |
| 18523531 | CHARGE PUMP CIRCUITS WITH BACKSIDE FLY CAPACITORS AND METHODS OF MANUFACTURING THEREOF | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | LIU, BENJAMIN T | 2893 | §102§103 | Final Rejection | 40d | Pending | Nov 28, 2023 |
| 18519805 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | TURNER, BRIAN | 2894 | §102§103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18519452 | POWER PERFORMANCE AREA ATTRACTIVE MULTIPLE TRANSISTOR ANTI-FUSE BIT CELL LAYOUT STRUCTURE | VU, HUNG K | 2897 | §103 | Final Rejection | — | Pending | Nov 27, 2023 |
| 18519633 | SRAM HAVING CFET STACKS AND METHOD OF MANUFACTURING SAME | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Nov 27, 2023 |
| 18517892 | SEMICONDUCTOR PACKAGE | NELSON, JACOB THEODORE | 2815 | §103§112 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18517078 | Defect Monitor | ANDREWS, BRENT J | 2858 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18515503 | METHOD OF DESIGNING SEMICONDUCTOR DEVICE | DINH, PAUL | — | §102 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18514410 | VIAS WITH SELECTED GRAIN DISTRIBUTION | GONDARENKO, NATALIA A | 2891 | §103 | Final Rejection | — | Pending | Nov 20, 2023 |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | SEVEN, EVREN | 2812 | §102§103 | Final Rejection | 2d overdue | Pending | Nov 20, 2023 |
| 18513562 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | TURNER, BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Nov 19, 2023 |
| 18512339 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SANDVIK, BENJAMIN P | 2812 | §103§112 | Final Rejection | — | Pending | Nov 17, 2023 |
| 18512452 | POWER GATING USING NANOELECTROMECHANICAL SYSTEMS (NEMS) IN BACK END OF LINE (BEOL) | GREWAL, HEIM KIRIN | 2812 | §103§112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18512411 | CONDUCTOR SCHEME SELECTION AND TRACK PLANNING FOR MIXED-DIAGONAL-MANHATTAN ROUTING | AISAKA, BRYCE M | — | §112 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | FARMER, EMILY NICOLE | 2812 | §103 | Final Rejection | 9d | Pending | Nov 17, 2023 |
| 18511666 | PROTECTION AGAINST PLASMA INDUCED DAMAGES | HOQUE, MOHAMMAD M | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18510011 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | OH, JIYOUNG | 2818 | §103§112 | Non-Final OA | — | Pending | Nov 15, 2023 |
| 18509343 | METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD FOR CLASSIFYING SEMICONDUCTOR STRUCTURE | LI, LARRY | 2881 | §103§112 | Final Rejection | — | Pending | Nov 15, 2023 |
| 18509235 | SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18508423 | PHOTORESIST COMPOSITION | ANGEBRANNDT, MARTIN J | — | §102§103§112 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18507100 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18507402 | FIBER ARRAY UNIT INTEGRATED WITH LIGHT GUIDING ELEMENTS AND METHOD FOR FORMING THE SAME | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 34d | Pending | Nov 13, 2023 |
| 18506142 | NON-VOLATILE MEMERY CELL AND METHOD OF FORMING THE SAME | NGUYEN, VAN THU T | 2824 | §102 | Final Rejection | — | Pending | Nov 10, 2023 |
| 18506154 | PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME | TRAN, HOANG Q | 2874 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18505632 | GATE ISOLATION FEATURES | KOO, LAMONT B | 2813 | §103 | Final Rejection | 10d overdue | Pending | Nov 09, 2023 |
| 18503189 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | JORDAN, ANDREW | 2874 | §102§103 | Final Rejection | 29d | Pending | Nov 07, 2023 |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | GREEN, TELLY D | 2898 | §103Other | Final Rejection | — | Pending | Nov 07, 2023 |
| 18502297 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE | KOO, LAMONT B | 2813 | §103 | Final Rejection | 50d overdue | Pending | Nov 06, 2023 |
| 18502792 | INTERCONNECTION STRUCTURE | WARD, ERIC A | 2891 | §103 | Final Rejection | — | Pending | Nov 06, 2023 |
| 18502377 | INTEGRATED CIRCUIT DESIGN FLOW WITH LAYOUT ADJUSTMENT | TAT, BINH C | — | §102 | Non-Final OA | — | Pending | Nov 06, 2023 |
| 18500878 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18499235 | CHIP STACKING STRUCTURE | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | — | Pending | Nov 01, 2023 |
| 18385563 | ADDITIVES FOR METALLIC PHOTORESIST | EOFF, ANCA | — | §102§103§112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18498369 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | WELLS, JAMES STEVEN | 2825 | §103§112 | Final Rejection | 77d overdue | Pending | Oct 31, 2023 |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | 30d | Pending | Oct 31, 2023 |
| 18498293 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SYLVIA, CHRISTINA A | 2817 | §112 | Non-Final OA | — | Pending | Oct 31, 2023 |
| 18497643 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | KAO, SOPHIA WEI-CHUN | 2817 | §102§103 | Non-Final OA | — | Pending | Oct 30, 2023 |
| 18498031 | DUMMY DIES AND METHOD OF FORMING THE SAME | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 21d | Pending | Oct 30, 2023 |
| 18496509 | INTEGRATED CIRCUIT LAYOUT SHAPES | DOAN, NGHIA M | — | §102§103§112 | Non-Final OA | — | Pending | Oct 27, 2023 |
| 18495189 | SEMICONDUCTOR DEVICE INCLUDING GATE DIELECTRICS OF DIFFERENT THICKNESSES AND METHOD FOR MANUFACTURING THE SAME | JOHNSON, CHRISTOPHER A | 2899 | §102§103 | Final Rejection | 34d | Pending | Oct 26, 2023 |
| 18495411 | Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The Same | HALL, VICTORIA KATHLEEN | 2897 | §103§112 | Final Rejection | — | Pending | Oct 26, 2023 |
| 18384253 | SEMICONDUCTOR PROCESS APPARATUS AND METHOD | GASSEN, CHRISTOPHER J | 2881 | §103§112 | Final Rejection | — | Pending | Oct 26, 2023 |
| 18493768 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | LEBENTRITT, MICHAEL | 2893 | §102§103 | Final Rejection | 14d | Pending | Oct 24, 2023 |
| 18492777 | DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMING THE SAME | GOFF II, JOHN L | 1746 | §102§103 | Final Rejection | — | Pending | Oct 24, 2023 |
| 18491889 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SYLVIA, CHRISTINA A | 2817 | §102 | Non-Final OA | — | Pending | Oct 23, 2023 |
| 18492033 | IMAGE SENSING SYSTEM AND METHOD THEREOF | TRIDICO, JOHN CESARE | 3645 | §102§103 | Non-Final OA | — | Pending | Oct 23, 2023 |
| 18492382 | Contact Formation Method and Related Structure | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103§112 | Final Rejection | 45d overdue | Pending | Oct 23, 2023 |
| 18491486 | VARACTORS HAVING INCREASED TUNING RATIO | BEARDSLEY, JONAS TYLER | 2811 | §103 | Final Rejection | — | Pending | Oct 20, 2023 |
| 18490919 | SEMICONDUCTOR DEVICES WITH GATE EXTENSIONS AND METHODS OF FABRICATING THE SAME | HO, ANTHONY | 2817 | §102 | Final Rejection | 12d | Pending | Oct 20, 2023 |
| 18490081 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | §112 | Final Rejection | 6d | Pending | Oct 19, 2023 |
| 18489365 | MULTI-PORT SRAM CELL WITH DUAL SIDE POWER RAILS | MARIN, JACOB RAUL | 2818 | §103 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18487451 | SEMICONDUCTOR DEVICE WITH NON-CONFORMAL WORK FUNCTION LAYERS AND METHODS OF FABRICATION THEREOF | RIRIE, EVERETT TRAJAN | 2897 | §103 | Final Rejection | — | Pending | Oct 16, 2023 |
| 18488028 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MINNEY, GABRIEL SEBASTIAN | 2897 | §103 | Final Rejection | 14d | Pending | Oct 16, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18379870 | PHOTORESIST MATERIAL AND METHOD FOR LITHOGRAPHY | WALKE, AMANDA C | — | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18486203 | METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Final Rejection | — | Pending | Oct 13, 2023 |
| 18486876 | ETCH TOOL WITH SPINEL-BASED COMPOSITE MATERIAL COMPONENTS | JANSSEN, REBECCA | 1733 | §103§112 | Final Rejection | — | Pending | Oct 13, 2023 |
| 18486561 | STRUCTURE AND METHOD FOR HIGH-VOLTAGE DEVICE | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18484051 | PHOTORESIST COMPOSITION | WALKE, AMANDA C | 1722 | §103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18484405 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | AHMED, MEHEK | 2812 | §102§103 | Non-Final OA | — | Pending | Oct 10, 2023 |
| 18480482 | ELECTROSTATIC FIELD STRENGTH MEASURING APPARATUS, DETECTING APPARATUS, METHOD OF MEASURING ELECTROSTATIC FIELD STRENGTH OF TARGET OBJECT | FREDERIKSEN, DAVID B | 2858 | §112 | Non-Final OA | — | Pending | Oct 03, 2023 |
| 18480372 | METHOD FOR MODELING CROSS DIE COUPLING CAP IMPACT | LIN, ARIC | — | §102§103 | Non-Final OA | — | Pending | Oct 03, 2023 |
| 18478086 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | BARZYKIN, VICTOR V | 2893 | §102§103§112 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18476922 | STANDARD CELL SPACING QUALITY CHECKING | SOUNDRANAYAGAM, RAYAPPU NMN | — | — | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18476394 | METHODOLOGY FOR PREDICTION OF PPA DESIGN | MEMULA, SURESH | — | §103 | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18475965 | STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND BOTTOM SOURCE/DRAIN FEATURES | DINKE, BITEW A | 2812 | §103 | Final Rejection | 28d overdue | Pending | Sep 27, 2023 |
| 18474606 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | NGUYEN, DAO H | 2818 | §103 | Final Rejection | 46d | Pending | Sep 26, 2023 |
| 18473706 | PHOTOSENSOR HAVING GATE-ALL-AROUND STRUCTURE AND METHOD FOR FORMING THE PHOTOSENSOR | NARAGHI, ALI | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 25, 2023 |
| 18472725 | SYSTEMS AND METHODS FOR IMPLEMENTING INTEGRATED CIRCUIT DESIGN | MEMULA, SURESH | — | §101 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18371577 | RADIO FREQUENCY INDUCTOR | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Non-Final OA | 20d | Pending | Sep 22, 2023 |
| 18472862 | MEMORY DEVICE WITH TWISTED BIT LINES AND METHODS OF MANUFACTURING THE SAME | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 22, 2023 |
| 18472267 | SEMICONDUCTOR PROCESSING APPARATUS FOR GENERATING PLASMA | ALEJANDRO MULERO, LUZ L | 1716 | §102§103§112 | Non-Final OA | — | Pending | Sep 22, 2023 |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | TAN, DAVE | 2897 | §103 | Final Rejection | 11d overdue | Pending | Sep 22, 2023 |
| 18471316 | SEMICONDUCTOR CHIP | CHUNG, ANDREW | 2898 | §103 | Final Rejection | 50d overdue | Pending | Sep 21, 2023 |
| 18469014 | THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES | SEHAR, FAKEHA | 2893 | §103§112 | Final Rejection | — | Pending | Sep 18, 2023 |
| 18467979 | INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103 | Final Rejection | — | Pending | Sep 15, 2023 |
| 18369099 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | NADAV, ORI | 2811 | §103§112 | Non-Final OA | 30d | Pending | Sep 15, 2023 |
| 18368387 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | GOODLING, DEVIN KIRK | 2898 | §103§112 | Final Rejection | — | Pending | Sep 14, 2023 |
| 18467389 | METHOD FOR FORMING SEMICONDUCTOR DIE | CHEEK, EDWARD RHETT | 2813 | §102§103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18466004 | MAGNETIC TUNNEL JUNCTION (MTJ) STRUCTURE AND MEMORY CELL | SPRENGER, JAIME LYNN | 2893 | §103 | Final Rejection | 13d | Pending | Sep 13, 2023 |
| 18367605 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | ADROVEL, WILLIAM | 2898 | §103 | Non-Final OA | — | Pending | Sep 13, 2023 |
| 18465748 | SEMICONDUCTOR DEVICE WITH BOTTOM DIELECTRIC ISOLATOR AND MANUFACTURING METHOD THEREOF | SRINIVASAN, SESHA SAIRAMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 12, 2023 |
| 18464815 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | TRAN, THANH Y | 2817 | §102 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18464508 | INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME | CHA, GRACE YEH-EUN SAET | 2897 | §103 | Non-Final OA | — | Pending | Sep 11, 2023 |
| 18244040 | METHODS FOR FORMING GATE OXIDE LAYER FOR HIGH-VOLTAGE TRANSISTOR | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | — | Pending | Sep 08, 2023 |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | NGUYEN, DAO H | 2818 | §102§103§112 | Non-Final OA | — | Pending | Sep 07, 2023 |
| 18462151 | INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTACT RESISTIVITY | ARORA, AJAY | 2892 | §102§103 | Non-Final OA | — | Pending | Sep 06, 2023 |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §102§103§112 | Final Rejection | 27d | Pending | Sep 06, 2023 |
| 18461328 | INTERCONNECTION STRUCTURE | KUSUMAKAR, KAREN M | 2897 | §102§103 | Non-Final OA | — | Pending | Sep 05, 2023 |
| 18460594 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | §103§112 | Final Rejection | 28d | Pending | Sep 04, 2023 |
| 18459077 | PHOTO ACID GENERATOR | EOFF, ANCA | 1722 | §102§103 | Final Rejection | — | Pending | Aug 31, 2023 |
| 18240033 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | MILLER, ALEXANDER MICHAEL | 2898 | §102§103 | Final Rejection | 27d | Pending | Aug 30, 2023 |
| 18239999 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | RAMIREZ, ALEXANDRE XAVIER | 2812 | §103§112 | Non-Final OA | 83d | Pending | Aug 30, 2023 |
| 18455654 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §103 | Final Rejection | — | Pending | Aug 25, 2023 |
| 18456093 | CONNECTOR HEIGHT UNIFORMITY OVER UNDER BUMP METAL (UBM) | PHAM, THANHHA S | 2812 | §102§103 | Final Rejection | — | Pending | Aug 25, 2023 |
| 18455211 | REDUCED RESIDUE AT ETCHED STRUCTURE SIDEWALLS | MCDONALD, JASON ANDREW | 2898 | §103 | Non-Final OA | — | Pending | Aug 24, 2023 |
| 18454084 | INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE | PARVEZ, AZM A | 2892 | §102§103§112 | Non-Final OA | — | Pending | Aug 23, 2023 |
| 18454128 | SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME | PHAM, THANHHA S | 2812 | §102§103§112 | Final Rejection | — | Pending | Aug 23, 2023 |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | CHANG, JAY C | 2817 | §102 | Non-Final OA | 22d | Pending | Aug 22, 2023 |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §102§103§112 | Final Rejection | 23d | Pending | Aug 21, 2023 |
| 18451866 | SEMICONDUCTOR DEVICE | WHITESELL, STEVEN H | 2813 | §102§103 | Non-Final OA | — | Pending | Aug 18, 2023 |
| 18451263 | SEMICONDUCTOR STRUCTURE | ZARNEKE, DAVID A | 2891 | §102§103 | Final Rejection | 22d | Pending | Aug 17, 2023 |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | CHAN, CANDICE | 2813 | §102§103§112 | Non-Final OA | 42d overdue | Pending | Aug 15, 2023 |
| 18450140 | IN-TRENCH CAPACITOR MERGED STRUCTURE | WHALEN, DANIEL B | 2893 | §102§103 | Final Rejection | 28d | Pending | Aug 15, 2023 |
| 18450358 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STACK | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 28d | Pending | Aug 15, 2023 |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | VU, HUNG K | 2897 | §102 | Final Rejection | 37d overdue | Pending | Aug 14, 2023 |
| 18447580 | MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME | PARIHAR, SUCHIN | — | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18232717 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 70d overdue | Pending | Aug 10, 2023 |
| 18447568 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | §103§112 | Non-Final OA | 69d | Pending | Aug 10, 2023 |
| 18448093 | METHOD OF MANUFACTURING SEMICONDUCTOR IMAGE SENSOR | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447964 | METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Aug 10, 2023 |
| 18447321 | SEMICONDUCTOR DEVICE | PARTHASARATHY, ROHIT | 2899 | §102§103§112 | Final Rejection | 30d overdue | Pending | Aug 10, 2023 |
| 18232306 | SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT | DINKE, BITEW A | 2812 | §103 | Non-Final OA | 75d | Pending | Aug 09, 2023 |
| 18366776 | REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | TURNER, BRIAN | 2818 | §102§103§112 | Final Rejection | 15d | Pending | Aug 08, 2023 |
| 18446424 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18231540 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | STEPHENSON, KENNETH STEPHEN | 2898 | §102 | Final Rejection | 8d | Pending | Aug 08, 2023 |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | ISAAC, STANETTA D | 2898 | §102§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366175 | PIXEL SENSOR INCLUDING REFRACTION STRUCTURES | NARAGHI, ALI | 2817 | §103 | Final Rejection | 12d | Pending | Aug 07, 2023 |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | — | Pending | Aug 04, 2023 |
| 18365241 | ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME | WILCZEWSKI, MARY A | 2898 | §103§112 | Non-Final OA | — | Pending | Aug 04, 2023 |
| 18364291 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | SNOW, COLLEEN ERIN | 2899 | §102§103 | Final Rejection | 14d | Pending | Aug 02, 2023 |
| 18363756 | MEMORY STRUCTURE AND METHOD OF FORMING THE SAME | WARREN, MATTHEW E | 2815 | §102 | Non-Final OA | — | Pending | Aug 02, 2023 |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | CHEN, DAVID Z | 2815 | §102§103 | Non-Final OA | 28d | Pending | Aug 01, 2023 |
| 18228250 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362842 | PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362213 | MASK-FREE PROCESS FOR IMPROVING DRAIN TO GATE BREAKDOWN VOLTAGE IN SEMICONDUCTOR DEVICES | GUPTA, RAJ R | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18361816 | METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE | TRAN, PABLO N | 2643 | §112Other | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | §103§112 | Final Rejection | 34d | Pending | Jul 28, 2023 |
| 18360853 | EXTREME ULTRAVIOLET LITHOGRAPHY METHOD AND EUV PHOTOMASK | FRASER, STEWART A | 1724 | §102§103 | Final Rejection | — | Pending | Jul 28, 2023 |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | ENAD, CHRISTINE A | 2811 | DP | Final Rejection | — | Pending | Jul 28, 2023 |
| 18360666 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Non-Final OA | 26d | Pending | Jul 27, 2023 |
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | WALL, VINCENT | 2898 | §103 | Non-Final OA | 35d overdue | Pending | Jul 27, 2023 |
| 18360178 | SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 5d | Pending | Jul 27, 2023 |
| 18226508 | COATER PHOTORESIST ARM SMART CENTERING JIG | KURPLE, KARL | 1717 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | LUKE, DANIEL M | 2896 | §103 | Non-Final OA | 5d | Pending | Jul 25, 2023 |
| 18358662 | SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 46d overdue | Pending | Jul 25, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18357517 | OPTOELECTRONIC DEVICE INCLUDING A VERTICAL-CAVITY SURFACE EMITTING LASER DIODE | CAMACHO ALANIS, FERNANDA ADRIANA | 2828 | §103§112 | Non-Final OA | — | Pending | Jul 24, 2023 |
| 18356911 | Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 21, 2023 |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | SIPLING, KENNETH MARK | 2818 | §103 | Final Rejection | 2d overdue | Pending | Jul 20, 2023 |
| 18354603 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | MOVVA, AMAR | 2800 | §103 | Final Rejection | — | Pending | Jul 18, 2023 |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | 37d overdue | Pending | Jul 14, 2023 |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | WILCZEWSKI, MARY A | 2898 | §102§112 | Final Rejection | 8d | Pending | Jul 14, 2023 |
| 18352071 | GATE HARD MASK DESIGN FOR IMPROVED SOURCE/DRAIN FORMATION | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Jul 13, 2023 |
| 18350512 | DESIGN-FOR-TEST CIRCUITS AND METHODS OF OPERATING THE SAME | GARBOWSKI, LEIGH M | 2851 | §102 | Non-Final OA | — | Pending | Jul 11, 2023 |
| 18349325 | THROUGH VIA STRUCTURE AND METHOD OF FABRICATION THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 42d overdue | Pending | Jul 10, 2023 |
| 18218927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIM, JAY C | 2815 | §102§112 | Final Rejection | 26d | Pending | Jul 06, 2023 |
| 18348343 | NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY | BRADFORD, PETER | 2897 | §102§103 | Final Rejection | 38d overdue | Pending | Jul 06, 2023 |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Jul 06, 2023 |
| 18346959 | CONDUCTIVE CONTACT OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | — | Pending | Jul 05, 2023 |
| 18346506 | HIGH EFFICIENCY OPTICAL COUPLER | PETKOVSEK, DANIEL | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2023 |
| 18346772 | SEMICONDUCTOR DEVICE HAVING LOW-RESISTANCE GATE CONNECTOR | NARAGHI, ALI | 2817 | §103 | Final Rejection | 3d overdue | Pending | Jul 03, 2023 |
| 18346267 | METHOD AND SYSTEM OF ARRANGING PATTERNS OF SEMICONDUCTOR DEVICE | REAMES, MATTHEW L | 1737 | §102§112Other | Non-Final OA | — | Pending | Jul 02, 2023 |
| 18346219 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | RAHMAN, MOIN M | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 01, 2023 |
| 18216829 | METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCANNING | JANG, BO BIN | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | GOODWIN, DAVID J | 2817 | §102Other | Final Rejection | 1d overdue | Pending | Jun 30, 2023 |
| 18345988 | SEMICONDUCTOR DEVICE HAVING DIELECTRIC GATE ISOLATION SECTION | HOSSAIN, MOAZZAM | 2800 | §102§103 | Final Rejection | 45d overdue | Pending | Jun 30, 2023 |
| 18345552 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | 71d | Pending | Jun 30, 2023 |
| 18344860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | CHUNG, ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18340843 | ACTIVE REGION TRIMMING AFTER FORMATION OF SOURCE/DRAIN COMPONENTS | KEAGY, ROSE ALYSSA | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 24, 2023 |
| 18338381 | DIELECTRIC WAVEGUIDE FOR TRANSMITTING ELECTRICAL SIGNAL AND METHOD OF FORMING THE SAME | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18338984 | MEMORY DEVICE | AHMAD, KHAJA | 2813 | §103 | Non-Final OA | 11d overdue | Pending | Jun 21, 2023 |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | 4d overdue | Pending | Jun 21, 2023 |
| 18337267 | STACKED TRANSISTORS IN MEMORY CIRCUIT AND METHOD OF OPERATING SAME | BERMUDEZ LOZADA, ALFREDO | 2825 | §103 | Final Rejection | 46d overdue | Pending | Jun 19, 2023 |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | 15d | Pending | Jun 15, 2023 |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | §103 | Non-Final OA | 32d overdue | Pending | Jun 14, 2023 |
| 18332837 | HIGH VOLTAGE RESISTOR WITH HIGH VOLTAGE JUNCTION TERMINATION | LIN, JOHN | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2023 |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | FERNANDES, ERROL V | 2893 | §102 | Final Rejection | 26d | Pending | Jun 12, 2023 |
| 18332054 | THRESHOLD VOLTAGE TUNING USING A MULTIPLE DIPOLE LOOP PROCESS FOR CFET DEVICES | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Jun 09, 2023 |
| 18331897 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | KUSUMAKAR, KAREN M | 2897 | §102§103 | Non-Final OA | 26d | Pending | Jun 08, 2023 |
| 18329063 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | CHEEK, EDWARD RHETT | 2813 | §103 | Non-Final OA | 61d | Pending | Jun 05, 2023 |
| 18329271 | PROTECTIVE PACKAGE ASSEMBLY | SPICER, JENINE MARIE | 3736 | §103 | Final Rejection | — | Pending | Jun 05, 2023 |
| 18327082 | SEMICONDUCTOR DEVICES | SIPLING, KENNETH MARK | 2818 | §103 | Non-Final OA | — | Pending | Jun 01, 2023 |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | MCDONALD, RODNEY GLENN | 1794 | §102§103 | Non-Final OA | — | Pending | Jun 01, 2023 |
| 18326494 | SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION | LU, JIONG-PING | 1713 | §103 | Final Rejection | 20d | Pending | May 31, 2023 |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §103 | Final Rejection | 15d overdue | Pending | May 29, 2023 |
| 18324729 | WRAP-AROUND SILICIDE LAYER | FAYETTE, NATHALIE RENEE | 2812 | §102§103 | Non-Final OA | — | Pending | May 26, 2023 |
| 18323483 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18323732 | STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18322882 | SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF MAKING | MUNOZ, ANDRES F | 2818 | §102§112DP | Non-Final OA | — | Pending | May 24, 2023 |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §102§103 | Non-Final OA | 53d overdue | Pending | May 24, 2023 |
| 18200939 | SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD | WITTENBERG, STEFANIE S | 1795 | §103 | Final Rejection | — | Pending | May 23, 2023 |
| 18321844 | METHOD FOR PERFORMING TRENCH ISOLATION PROCESS | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | May 23, 2023 |
| 18321268 | PIEZOELECTRIC DEVICE HAVING PIEZOELECTRIC STRUCTURE DISPOSED BETWEEN PATTERNED CONDUCTIVE STRUCTURES | NGUYEN, DONGHAI D | 2837 | §102§103 | Non-Final OA | — | Pending | May 22, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18320398 | PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | May 19, 2023 |
| 18318865 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | May 17, 2023 |
| 18197968 | FINFET DEVICE STRUCTURE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 82d | Pending | May 16, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | CHEN, JACK S J | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 12, 2023 |
| 18315868 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION | LU, JIONG-PING | 1713 | §102§103 | Non-Final OA | — | Pending | May 11, 2023 |
| 18314968 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | §102§103 | Final Rejection | 3d overdue | Pending | May 10, 2023 |
| 18312766 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | LI, MEIYA | 2811 | §112 | Non-Final OA | — | Pending | May 05, 2023 |
| 18312012 | WAFER BONDING APPARATUS AND METHOD | GHYKA, ALEXANDER G | 2812 | §103 | Final Rejection | — | Pending | May 04, 2023 |
| 18312199 | COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | §102§103 | Non-Final OA | 49d overdue | Pending | May 04, 2023 |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | PIZARRO CRESPO, MARCOS D | 2814 | §102§103 | Non-Final OA | — | Pending | May 03, 2023 |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | LE, THAO P | 2818 | §103 | Non-Final OA | 34d | Pending | Apr 28, 2023 |
| 18308026 | DIELECTRIC GAS SPACER FORMATION FOR REDUCING PARASITIC CAPACITANCE IN A TRANSISTOR INCLUDING NANOSHEET STRUCTURES | LEE, DA WEI | 2817 | §102 | Non-Final OA | 8d overdue | Pending | Apr 27, 2023 |
| 18139266 | PELLICLE FOR EUV LITHOGRAPHY MASKS AND METHODS OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §102§103DP | Non-Final OA | — | Pending | Apr 25, 2023 |
| 18307002 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | ANDERSON, WILLIAM H | 2817 | §103 | Final Rejection | — | Pending | Apr 25, 2023 |
| 18305514 | SEMICONDUCTOR DEVICE STRUCTURE WITH EXPANSION FILM AND METHOD FOR FORMING THE SAME | HOANG, TUAN A | 2898 | §102§103 | Non-Final OA | — | Pending | Apr 24, 2023 |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Apr 21, 2023 |
| 18137288 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | CHACKO DAVIS, DABORAH | 1737 | §103 | Final Rejection | 4d overdue | Pending | Apr 20, 2023 |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | MUNOZ, ANDRES F | 2818 | §102§103§112 | Final Rejection | — | Pending | Apr 20, 2023 |
| 18302972 | OPTICAL DIGITAL-TO-ANALOG CONVERTER | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18303551 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | ZABEL, ANDREW JOHN | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18302010 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Apr 18, 2023 |
| 18302154 | Energy-Efficient Recurrent Neural Network Accelerator | KHAN, SHAHID K | 2146 | §101§103 | Final Rejection | 15d | Pending | Apr 18, 2023 |
| 18301524 | GUARD RING STRUCTURE AND METHOD FORMING SAME | HOANG, TUAN A | 2898 | §102 | Non-Final OA | — | Pending | Apr 17, 2023 |
| 18300513 | METAL ISOLATION TESTING IN THE CONTEXT OF MEMORY CELLS | PARIHAR, SUCHIN | 2851 | §112 | Non-Final OA | — | Pending | Apr 14, 2023 |
| 18299691 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | WALL, VINCENT | 2898 | §103 | Non-Final OA | 34d | Pending | Apr 12, 2023 |
| 18298277 | Isolation Structures in Semiconductor Devices | KOO, LAMONT B | 2813 | §103 | Final Rejection | — | Pending | Apr 10, 2023 |
| 18131562 | CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING | COMLEY, ALEXANDER BRYANT | 3746 | §102§103 | Final Rejection | — | Pending | Apr 06, 2023 |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | GREEN, TELLY D | 2898 | §102Other | Non-Final OA | 29d | Pending | Mar 20, 2023 |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | 2812 | §103 | Non-Final OA | 20d | Pending | Mar 17, 2023 |
| 18185232 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURE | SON, ERIKA HEERA | 2893 | §103 | Final Rejection | 34d | Pending | Mar 16, 2023 |
| 18185059 | CHARGE PUMP CIRCUIT AND METHOD | TRA, ANH QUAN | 2843 | §103Other | Non-Final OA | 70d overdue | Pending | Mar 16, 2023 |
| 18118498 | PELLICLE AND METHOD OF MANUFACTURING THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103§112 | Non-Final OA | — | Pending | Mar 07, 2023 |
| 18178522 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 05, 2023 |
| 18177909 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC SPACER AND METHOD FOR MANUFACTURING THE SAME | MARIN, JACOB RAUL | 2818 | §103 | Non-Final OA | 29d | Pending | Mar 03, 2023 |
| 18177144 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KIELIN, ERIK J | 2814 | §102§103§112 | Non-Final OA | 70d | Pending | Mar 02, 2023 |
| 18173086 | PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME | JEAN BAPTISTE, WILNER | 2899 | §103 | Non-Final OA | 5d | Pending | Feb 23, 2023 |
| 18171384 | SIMULATION MODEL AUTHENTICATION | GAN, CHUEN-MEEI | 4100 | §101§103 | Non-Final OA | — | Pending | Feb 20, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103§112 | Final Rejection | 8d | Pending | Feb 16, 2023 |
| 18110838 | METHOD OF MANUFACTURING PHOTO MASKS | COSGROVE, JAYSON D | 1737 | §103 | Non-Final OA | — | Pending | Feb 16, 2023 |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | PATEL, REEMA | 2812 | §112 | Final Rejection | 21d | Pending | Feb 15, 2023 |
| 18169594 | VOLTAGE SUPPLY SELECTION CIRCUIT AND METHODS FOR OPERATING THE SAME | ALMO, KHAREEM E | 2849 | §103 | Final Rejection | — | Pending | Feb 15, 2023 |
| 18169579 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Non-Final OA | — | Pending | Feb 15, 2023 |
| 18109116 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Feb 13, 2023 |
| 18107658 | MULTICHANNEL TRANSISTORS WITH SOURCE/DRAIN REGIONS HAVING WAVY INNER PROFILES AND METHODS FOR MANUFACTURING THEREOF | DUREN, TIMOTHY EDWARD | 2817 | §103 | Non-Final OA | — | Pending | Feb 09, 2023 |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | DAS, PINAKI | 2898 | §103 | Non-Final OA | — | Pending | Feb 08, 2023 |
| 18165669 | ETCHING PROCESS WITH PROTECTED REGION | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§103 | Non-Final OA | — | Pending | Feb 07, 2023 |
| 18165292 | METHOD OF EXECUTING DESIGN FLOW WITH MACHINE LEARNING TECHNIQUES | NGUYEN, NHA T | 2851 | §103 | Non-Final OA | 2d overdue | Pending | Feb 06, 2023 |
| 18163878 | COMPUTING CIRCUIT, COMPUTING METHOD, AND DECODER | DE LA GARZA, CARLOS HEBERTO | — | §103§112 | Non-Final OA | — | Pending | Feb 03, 2023 |
| 18103676 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | NGUYEN, THANH T | 2893 | §102§103 | Final Rejection | — | Pending | Jan 31, 2023 |
| 18160697 | MULTI-BIT FLIP-FLOP REGION WITH SERPENTINE DATA FLOW PATH, SEMICONDUCTOR DEVICE INCLUDING SAME, METHOD OF OPERATING SAME AND METHOD OF MANUFACTURING SAME | TAT, BINH C | 2851 | §102 | Non-Final OA | — | Pending | Jan 27, 2023 |
| 18100714 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | SIPLING, KENNETH MARK | 2818 | §102§103 | Final Rejection | 26d overdue | Pending | Jan 24, 2023 |
| 18099951 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103§112 | Final Rejection | 34d | Pending | Jan 22, 2023 |
| 18157252 | DATA COMPUTATION CIRCUIT AND METHOD | GUDAS, JAKOB OSCAR | — | §101§102§103 | Non-Final OA | — | Pending | Jan 20, 2023 |
| 18099482 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING OXIDE FILM AND METHOD FOR SUPPRESSING GENERATION OF LEAKAGE CURRENT | RAHMAN, MOIN M | 2898 | §103 | Non-Final OA | 46d | Pending | Jan 20, 2023 |
| 18099405 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | HOANG, TUAN A | 2898 | §103 | Non-Final OA | 69d | Pending | Jan 20, 2023 |
| 18099348 | SEMICONDUCTOR DEVICE | LASASSO, VICTOR JOSEPH | 2898 | §103§112 | Final Rejection | 21d | Pending | Jan 20, 2023 |
| 18099555 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Non-Final OA | 3d overdue | Pending | Jan 20, 2023 |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 31d overdue | Pending | Jan 20, 2023 |
| 18153700 | GATE PROFILE TUNING FOR MULTIGATE DEVICE | NGUYEN, DUY T V | 2818 | §103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18154017 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18096389 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Jan 12, 2023 |
| 18152938 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | RONO, VINCENT KIPKEMOI | 2891 | §102§103 | Final Rejection | — | Pending | Jan 11, 2023 |
| 18152157 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jan 10, 2023 |
| 18150810 | COMPUTATION METHOD AND COMPUTATION APPARATUS WITH INPUT SWAPPING | WAJE, CARLO C | — | §101§112 | Non-Final OA | — | Pending | Jan 06, 2023 |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | TAN, DAVE | 2897 | §103 | Final Rejection | — | Pending | Jan 06, 2023 |
| 18151141 | SEMICONDUCTOR DEVICE INCLUDING A BLOCKING LAYER | WALL, VINCENT | 2898 | §103 | Final Rejection | 60d | Pending | Jan 06, 2023 |
| 18150362 | PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Final Rejection | 76d | Pending | Jan 05, 2023 |
| 18150617 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELECTRICAL BREAKDOWN PERFORMANCE, AND METHOD FOR MANUFACTURING THE SAME | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18150027 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | 7d | Pending | Jan 04, 2023 |
| 18149215 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | 45d overdue | Pending | Jan 03, 2023 |
| 17982587 | MRAM DEVICE HAVING SELF-ALIGNED SHUNTING LAYER | CRAWFORD EASON, LATANYA N | 2813 | §102§103§112 | Non-Final OA | — | Pending | Nov 08, 2022 |
| 17899865 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THEREOF | BERRY, PAUL ANTHONY | 2898 | §103§112 | Non-Final OA | — | Pending | Aug 31, 2022 |
| 17823508 | EMBEDDED SOI STRUCTURE FOR LOW LEAKAGE MOS CAPACITOR | MAI, ANH D | 2893 | §102§103 | Final Rejection | 7d | Pending | Aug 30, 2022 |
| 17898163 | POLISHING METROLOGY | ZAWORSKI, JONATHAN R | 3723 | §102§103§112 | Non-Final OA | — | Pending | Aug 29, 2022 |
| 17897196 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | — | Pending | Aug 28, 2022 |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | 23d overdue | Pending | Aug 27, 2022 |
| 17896081 | MEMORY DEVICE AND METHOD OF MAKING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | 42d overdue | Pending | Aug 26, 2022 |
| 17894169 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Aug 24, 2022 |
| 17890883 | Defect Reduction Through Scheme Of Conductive Pad Layer And Capping Layer | AUTORE JR, MARIO ANDRES | 2897 | §103 | Non-Final OA | — | Pending | Aug 18, 2022 |
| 17890571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | BOULGHASSOUL, YOUNES | 2814 | §112 | Non-Final OA | — | Pending | Aug 18, 2022 |
| 17887490 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Aug 14, 2022 |
| 17886466 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17819482 | POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK | OH, JIYOUNG | 2818 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17887122 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | KIELIN, ERIK J | 2814 | §103 | Non-Final OA | — | Pending | Aug 12, 2022 |
| 17886053 | INSPECTION METHOD FOR PELLICLE MEMBRANE OF LITHOGRAPHY SYSTEM | FABIAN JR, ROBERTO | 2877 | §103 | Non-Final OA | 63d | Pending | Aug 11, 2022 |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | 22d | Pending | Aug 11, 2022 |
| 17818369 | PHOTOMASK AND METHOD OF MANUFACTURING THE SAME | CLEVELAND, MICHAEL B | 1737 | §103 | Non-Final OA | — | Pending | Aug 09, 2022 |
| 17882047 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | NELSON, HUNTER JARED | 2828 | §103 | Non-Final OA | 11d overdue | Pending | Aug 05, 2022 |
| 17880676 | TARGET MATERIAL IDENTIFICATION METHOD | FRITCHMAN, REBECCA M | 1758 | §103 | Final Rejection | 4d overdue | Pending | Aug 04, 2022 |
| 17880019 | EXTREME ULTRAVIOLET MASK WITH DIFFUSION BARRIER LAYER | CLEVELAND, MICHAEL B | 1700 | §102§103 | Final Rejection | — | Pending | Aug 03, 2022 |
| 17817023 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | NARAGHI, ALI | 2817 | §103 | Final Rejection | 15d overdue | Pending | Aug 03, 2022 |
| 17817025 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ADHIKARI DAWADI, BIPANA | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 03, 2022 |
| 17816208 | LIGHT-EMITTING PACKAGE AND FORMING METHOD THEREOF | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | 10d overdue | Pending | Jul 29, 2022 |
| 17875975 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME | TRICE III, WILLIAM CLARENCE | 2893 | §102 | Non-Final OA | — | Pending | Jul 28, 2022 |
| 17815318 | PLASMA ETCHER EDGE RING WITH A CHAMFER GEOMETRY AND IMPEDANCE DESIGN | CHEN, KEATH T | 1716 | §103§112 | Non-Final OA | 30d overdue | Pending | Jul 27, 2022 |
| 17873146 | FLUIDIC CARTRIDGE MODULE, BIOSENSOR DEVICE, METHOD OF DETECTING ANALYTE IN SAMPLE | HERBERT, MADISON TAYLOR | 1758 | §102§103§112 | Non-Final OA | 9d overdue | Pending | Jul 26, 2022 |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | KOLB, THADDEUS J | 2817 | §103 | Final Rejection | — | Pending | Jul 26, 2022 |
| 17873060 | 3D SEMICONDUCTOR PACKAGE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2022 |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | ISAAC, STANETTA D | 2898 | §103 | Final Rejection | 27d | Pending | Jul 24, 2022 |
| 17814382 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | HENRY, CALEB E | 2818 | §102 | Non-Final OA | — | Pending | Jul 22, 2022 |
| 17814317 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | LEE, ALVIN LYNGHI | 2813 | §103 | Final Rejection | — | Pending | Jul 22, 2022 |
| 17870341 | CO-OPTIMIZATION OF MEMORY AND LOGIC DEVICES BY SOURCE/DRAIN MODULATION AND STRUCTURES THEREOF | GREWAL, HEIM KIRIN | 2812 | §103 | Final Rejection | — | Pending | Jul 21, 2022 |
| 17869205 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WEGNER, AARON MICHAEL | 2897 | §103 | Final Rejection | 34d | Pending | Jul 20, 2022 |
| 17813212 | MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE | KOLB, THADDEUS J | 2817 | §103§112 | Final Rejection | — | Pending | Jul 18, 2022 |
| 17812700 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | Jul 14, 2022 |
| 17862422 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | §103§112 | Final Rejection | 2d overdue | Pending | Jul 12, 2022 |
| 17863175 | TIE OFF DEVICE | ADROVEL, WILLIAM | 2800 | §103 | Final Rejection | — | Pending | Jul 12, 2022 |
| 17861234 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | CRAWFORD EASON, LATANYA N | 2813 | §103§112 | Final Rejection | 17d overdue | Pending | Jul 10, 2022 |
| 17859982 | Strained Channel Field Effect Transistor | PIZARRO CRESPO, MARCOS D | 2814 | §112 | Final Rejection | 268d overdue | Pending | Jul 07, 2022 |
| 17858971 | SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS | OH, JIYOUNG | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17810626 | PACKAGE STRUCTURE WITH FAN-OUT STRUCTURE | BELL, LAUREN R | 2896 | §103 | Final Rejection | 6d | Pending | Jul 04, 2022 |
| 17857049 | SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CAPACITOR OR MEMEORY CELL | ALAM, MOHAMMED R | 2800 | §102 | Final Rejection | — | Pending | Jul 04, 2022 |
| 17853543 | SEMICONDUCTOR STRUCTURE HAVING CONTACT PLUG | ZHU, SHENG-BAI | 2897 | §103§112 | Final Rejection | 22d overdue | Pending | Jun 29, 2022 |
| 17851569 | SEMICONDUCTOR DEVICE INCLUDING ANTI-FUSE CELL STRUCTURE | SENGDARA, VONGSAVANH | 2893 | §103 | Final Rejection | 53d overdue | Pending | Jun 28, 2022 |
| 17850734 | STACKED IMAGE SENSORS AND METHODS OF MANUFACTURING THEREOF | FLECK, LINDA JOAN | 2812 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17849720 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING 2D MATERIAL LAYER | MCCUTCHEON, COLIN RUSSELL | 2892 | §103§112 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17809099 | HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | XU, ZHIJUN | 2818 | §103 | Final Rejection | 27d | Pending | Jun 27, 2022 |
| 17808175 | ANISOTROPIC WET ETCHING IN PATTERNING | MELLINGER, CORBYN DAVID | 2899 | §103 | Non-Final OA | — | Pending | Jun 22, 2022 |
| 17847075 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | KOLAHDOUZAN, HAJAR | 2898 | §103§112 | Final Rejection | — | Pending | Jun 22, 2022 |
| 17837664 | GRAPHENE-CLAD METAL INTERCONNECT | CHEN, DAVID Z | 2815 | §103§112 | Final Rejection | 34d | Pending | Jun 10, 2022 |
| 17836781 | SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | SALAZ, SAMMANTHA KATELYN | 2892 | §102§103 | Non-Final OA | 31d overdue | Pending | Jun 09, 2022 |
| 17835769 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | CULBERT, CHRISTOPHER A | 2815 | §112 | Non-Final OA | — | Pending | Jun 08, 2022 |
| 17833440 | BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS | MARIN, JACOB RAUL | 2818 | §103 | Final Rejection | — | Pending | Jun 06, 2022 |
| 17833830 | EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF | ANGEBRANNDT, MARTIN J | 1737 | §103 | Final Rejection | 9d overdue | Pending | Jun 06, 2022 |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | REIDA, MOLLY KAY | 2899 | §103 | Non-Final OA | 8d overdue | Pending | Jun 06, 2022 |
| 17805109 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | KHALIFA, MOATAZ | 2815 | §102§103 | Non-Final OA | — | Pending | Jun 02, 2022 |
| 17825698 | SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING | XU, ZHIJUN | 2818 | §103 | Final Rejection | — | Pending | May 26, 2022 |
| 17824915 | EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION | MANNO, JESSICA S | 2898 | §103 | Non-Final OA | 2d overdue | Pending | May 26, 2022 |
| 17825411 | SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §103 | Final Rejection | 27d | Pending | May 26, 2022 |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 5d | Pending | May 23, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | SON, ERIKA HEERA | 2893 | §103§112 | Non-Final OA | 18d overdue | Pending | May 23, 2022 |
| 17747058 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTORS AND BACK-SIDE INTERCONNECT STRUCTURE COMPRISING POWER LINE | MICHAUD, NICHOLAS BRIAN | 2818 | §103 | Non-Final OA | — | Pending | May 18, 2022 |
| 17744585 | INSULATED-GATE BIPOLAR TRANSISTOR (IGBT) DEVICE WITH 3D ISOLATION | NADAV, ORI | 2811 | §103 | Non-Final OA | — | Pending | May 13, 2022 |
| 17663108 | PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | SEHAR, FAKEHA | 2893 | §103 | Non-Final OA | 78d overdue | Pending | May 12, 2022 |
| 17742714 | FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH OXIDE SEMICONDUCTOR CHANNEL | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | 56d overdue | Pending | May 12, 2022 |
| 17740367 | MULTI-CHIPLET ENERGY-EFFICIENT DNN ACCELERATOR ARCHITECTURE | HALES, BRIAN J | 2125 | §101§103§112 | Final Rejection | — | Pending | May 10, 2022 |
| 17736772 | MANUFACTURING METHOD OF EUV PHOTO MASKS | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | May 04, 2022 |
| 17730217 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | BOYLE, ABBIGALE A | 2899 | §103 | Non-Final OA | 40d | Pending | Apr 27, 2022 |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | GOODWIN, DAVID J | 2817 | §102 | Non-Final OA | 24d overdue | Pending | Apr 26, 2022 |
| 17726705 | Metal Interconnects And Method Of Forming The Same | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | 8d overdue | Pending | Apr 22, 2022 |
| 17726036 | PHOTORESIST COMPOSITION WITH NOVEL SOLVENT | CHU, JOHN S Y | 1737 | §103§112 | Final Rejection | — | Pending | Apr 21, 2022 |
| 17726494 | FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Apr 21, 2022 |
| 17725439 | METHOD FOR FORMING CONDUCTIVE FEATURE | NETTLES, CORALIE ANN | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 20, 2022 |
| 17722386 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | NGUYEN, SOPHIA T | 2893 | §103§112 | Non-Final OA | — | Pending | Apr 18, 2022 |
| 17723372 | MULTI-CHAMBER SEMICONDUCTOR PROCESSING SYSTEM WITH TRANSFER ROBOT TEMPERATURE ADJUSTMENT | FORD, NATHAN K | 1716 | §103 | Final Rejection | 10d overdue | Pending | Apr 18, 2022 |
| 17722302 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §102§103 | Final Rejection | 8d | Pending | Apr 16, 2022 |
| 17721723 | Semiconductor Structure And Method For Forming The Same | FOX, BRANDON C | 2818 | §103 | Final Rejection | 28d | Pending | Apr 15, 2022 |
| 17721814 | NEUROMORPHIC FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICE WITH ANTI-FERROELECTRIC BUFFER LAYER | SMITH, BRADLEY | 2817 | §112 | Final Rejection | — | Pending | Apr 15, 2022 |
| 17710218 | METHOD FOR LITHOGRAPHY USING MIDDLE LAYER WITH POROUS TOP SURFACE | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Mar 31, 2022 |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | 39d | Pending | Mar 23, 2022 |
| 17697822 | EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE | CHU, CHRIS H | 2874 | §103 | Final Rejection | 23d | Pending | Mar 17, 2022 |
| 17695839 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Mar 16, 2022 |
| 17691359 | SEMICONDUCTOR DEVICE STRUCTURE WITH GLUE LAYER AND METHOD FOR FORMING THE SAME | RONO, VINCENT KIPKEMOI | 2891 | §103 | Final Rejection | — | Pending | Mar 10, 2022 |
| 17688647 | FORMATION METHOD OF CHIP PACKAGE | CHEN, YU | 2896 | §103§112 | Final Rejection | 26d | Pending | Mar 07, 2022 |
| 17685584 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | 28d | Pending | Mar 03, 2022 |
| 17679463 | SURFACE TREATMENT TO PHOTOSENSITIVE LAYER | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Feb 24, 2022 |
| 17671813 | LOW RANDOM TELEGRAPH NOISE DEVICE | LOKE, STEVEN HO YIN | 2818 | §103 | Non-Final OA | — | Pending | Feb 15, 2022 |
| 17586664 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | KHALIFA, MOATAZ | 2817 | §103 | Non-Final OA | — | Pending | Jan 27, 2022 |
| 17584716 | MEMORY DEVICE WITH DUAL CHANNEL TRANSISTOR | BAUMAN, SCOTT E | 2815 | §103 | Non-Final OA | 3d overdue | Pending | Jan 26, 2022 |
| 17585252 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | CRAMER, HALEE PAIGE | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 26, 2022 |
| 17575578 | DEVICE LEVEL THERMAL DISSIPATION | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | 162d overdue | Pending | Jan 13, 2022 |
| 17558105 | COMPUTE IN MEMORY ACCUMULATOR | WAJE, CARLO C | 2151 | §102§103 | Final Rejection | — | Pending | Dec 21, 2021 |
| 17486223 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | LEE, ALEXANDER N | 1737 | §103 | Final Rejection | 11d overdue | Pending | Sep 27, 2021 |
| 17464460 | SEMICONDUCTOR MEMORY STRUCTURES HAVING A GREATER SOURCE AREA | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | — | Pending | Sep 01, 2021 |
| 17460909 | SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | 12d | Pending | Aug 30, 2021 |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | 79d overdue | Pending | Aug 30, 2021 |
| 17461398 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | WEILAND, ADAM DAVID | 2813 | §103§112 | Non-Final OA | — | Pending | Aug 30, 2021 |
| 17396523 | METHOD OF GENERATING LAYOUT DIAGRAM INCLUDING DUMMY PATTERN CONVERSION AND SYSTEM OF GENERATING SAME | LIN, ARIC | 2851 | §103 | Final Rejection | — | Pending | Aug 06, 2021 |
| 17367631 | APPARATUS AND METHOD FOR SUBSTRATE HANDLING | GATES, ERIC ANDREW | 3722 | §103§112 | Final Rejection | 3d overdue | Pending | Jul 06, 2021 |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | LEE, ALEXANDER N | 1737 | §103 | Non-Final OA | 9d | Pending | Jun 07, 2021 |
| 17340069 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Final Rejection | 5d | Pending | Jun 06, 2021 |
| 17303524 | METHOD FOR FORMING DEEP TRENCH ISOLATION IN AN IMAGING SENSOR BY SEPARATELY FORMING FIRST SET OF DEEP TRENCHES IN FIRST DIRECTION THEN FORMING SECOND SET OF DEEP TRENCHES IN SECOND DIRECTION | MAI, ANH D | 2893 | §103§112 | Non-Final OA | 28d overdue | Pending | Jun 01, 2021 |
| 17302880 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | LEE, ALEXANDER N | 1737 | §112 | Final Rejection | — | Pending | May 14, 2021 |
| 17321158 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | CHEN, YU | 2896 | §103§112 | Non-Final OA | — | Pending | May 14, 2021 |
| 17302054 | DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | HRNJIC, ADIN | 2817 | §103 | Non-Final OA | — | Pending | Apr 22, 2021 |
| 17232563 | VALVE BOX MODULE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KLUNK, MARGARET D | 1716 | §103§112 | Non-Final OA | 17d overdue | Pending | Apr 16, 2021 |
| 17220269 | INTEGRATED CIRCUIT STRUCTURE | LIN, ARIC | 2851 | §103§112 | Non-Final OA | 58d overdue | Pending | Apr 01, 2021 |
| 17120702 | SRAM MEMORY HAVING SUBARRAYS WITH COMMON IO BLOCK | CHO, SUNG IL | 2825 | §102 | Final Rejection | — | Pending | Dec 14, 2020 |
| 17111014 | INTEGRATED CIRCUIT LAYOUT DIAGRAM SYSTEM | LIN, ARIC | 2851 | §103 | Non-Final OA | 58d overdue | Pending | Dec 03, 2020 |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 10d overdue | Pending | Nov 25, 2020 |
| 16600888 | DYNAMIC RANGE AND LINEARITY OF RESISTIVE ELEMENTS FOR ANALOG COMPUTING | RUTTEN, JAMES D | 2121 | §103§112 | Non-Final OA | — | Pending | Oct 14, 2019 |
| 16549153 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103§112 | Non-Final OA | — | Pending | Aug 23, 2019 |
| 19283688 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §103§112DP | Non-Final OA | — | Pending | Jul 29, 2025 |
| 19259701 | SEMICONDUCTOR PACKAGE AND METHOD | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2025 |
| 19228490 | METHOD FOR DEPOSITING TARGET MATERIAL IN DEPOSITION CHAMBER WITH TILTABLE WORKPIECE HOLDER | CHEN, BRET P | — | §112DP | Non-Final OA | — | Pending | Jun 04, 2025 |
| 19189538 | WAFER POSITIONING METHOD AND APPARATUS | AHMED, JAMIL | — | DP | Non-Final OA | — | Pending | Apr 25, 2025 |
| 19186135 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | KO, TONY | — | §102§112 | Non-Final OA | — | Pending | Apr 22, 2025 |
| 19170096 | ARTIFICIAL INTELLIGENCE ACCELERATOR DEVICE | SUN, MICHAEL | — | §103Other | Non-Final OA | — | Pending | Apr 04, 2025 |
| 19022593 | MEMORY DEVICE INCLUDING A WORD LINE WITH PORTIONS WITH DIFFERENT SIZES IN DIFFERENT METAL LAYERS | ALROBAIE, KHAMDAN N | 2824 | DP | Non-Final OA | — | Pending | Jan 15, 2025 |
| 18983284 | METHOD AND APPARATUS FOR DEFECT-TOLERANT MEMORY-BASED ARTIFICIAL NEURAL NETWORK | PHAM, LY D | — | DP | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18981155 | VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES | SAENZ, ALBERTO | — | §103Other | Non-Final OA | — | Pending | Dec 13, 2024 |
| 18979108 | AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL | MYERS, GLENN F | — | DP | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18973300 | Photoresist and Method | TRAN, BINH X | — | §102§103Other | Non-Final OA | — | Pending | Dec 09, 2024 |
| 18952808 | HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM | JOERGER, KAITLIN S | — | §103§112Other | Non-Final OA | — | Pending | Nov 19, 2024 |
| 18946633 | STORAGE FOR EXTREME ULTRAVIOLET LIGHT LITHOGRAPHY | WHITESELL, STEVEN H | 1759 | §101DP | Non-Final OA | — | Pending | Nov 13, 2024 |
| 18885851 | FETS and Methods of Forming FETS | SANDVIK, BENJAMIN P | — | DP | Non-Final OA | — | Pending | Sep 16, 2024 |
| 18826347 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH INNER SPACER | HOANG, DZUNG T | — | §102§103 | Non-Final OA | — | Pending | Sep 06, 2024 |
| 18790296 | METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS | KORZUCH, WILLIAM R | 2400 | §102§112Other | Non-Final OA | 7d | Pending | Jul 31, 2024 |
| 18789808 | Via for Component Electrode Connection | JONES, ERIC W | — | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790674 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | LUKE, DANIEL M | 2896 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790227 | SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY | PARK, SAMUEL | — | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790122 | SEMICONDUCTOR DEVICE AND METHOD | PRIDEMORE, NATHAN ANDREW | — | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790426 | STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE | BUI, THA-O H | 2825 | §103 | Final Rejection | 2d overdue | Pending | Jul 31, 2024 |
| 18790277 | Ferroelectric Device and Methods of Fabrication Thereof | TAN, DAVE | — | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791313 | OPTICAL WAVEGUIDE TERMINATION | WONG, ERIC K | — | §102§103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790273 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | KIELIN, ERIK J | — | §102§103§112 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18791017 | 3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS | TRINH, MINH N | 3729 | §112DP | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18790354 | DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMANCE OF AN ANTENNA SWITCH | ARMAND, MARC ANTHONY | — | DP | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789042 | FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING | GONDARENKO, NATALIA A | 2891 | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789443 | Method of Manufacturing Semiconductor Devices Including The Steps of Removing One or More of the Nanotubes from the Stack of Nanotubes, and/or Removing Spacers that Surrounds Each of the Plurality of Nanotubes, and Forming Gate Dielectric and/or Gate Electrode to the Nanotubes | WOLDEGEORGIS, ERMIAS T | — | §112Other | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789467 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | YAP, DOUGLAS ANTHONY | — | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789598 | SYSTEMS AND METHODS FOR WAFER BOND MONITORING | GHYKA, ALEXANDER G | — | §103DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788591 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE | SEHAR, FAKEHA | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788697 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME | TRAN, TRANG Q | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ISAAC, STANETTA D | — | §102§103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18788363 | DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES | YUSHINA, GALINA G | 2811 | §102§103§112 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18789176 | SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS | YI, CHANGHYUN | — | DP | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18787838 | BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME | YI, CHANGHYUN | — | §112Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786693 | Interconnect Structure of Semiconductor Device and Method of Forming Same | BOEGEL, CHEVY JACOB | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787736 | LITHOGRAPHY THERMAL CONTROL | CHANG, HANWAY | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787755 | AUTOMATED MATERIAL HANDLING SYSTEMS | YANCHUS III, PAUL B | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787212 | PACKAGE STRUCTURE AND METHOD | BRASFIELD, QUINTON A | — | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787996 | FIELD EFFECT TRANSISTOR AND METHOD | BEARDSLEY, JONAS TYLER | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786788 | INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME | MANDALA, MICHELLE | 2893 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787531 | Semiconductor Devices and Methods | YI, CHANGHYUN | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786711 | PACKAGE AND METHOD OF FORMING SAME | CONNELLY, MICHELLE R | — | §102§103Other | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787978 | SEMICONDUCTOR DEVICE, METHOD AND TOOL OF MANUFACTURE | TRINH, MINH N | 3729 | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | SPALLA, DAVID C | — | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786787 | PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | PENG, CHARLIE YU | 2874 | DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787915 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | KLUNK, MARGARET D | — | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786886 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | — | §103DP | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786724 | Conductive Features with Air Spacer and Method of Forming Same | CRAWFORD EASON, LATANYA N | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787765 | SURFACE CLEAN SYSTEM AND METHOD | PARIHAR, PRADHUMAN | 1731 | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786524 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | SON, ERIKA HEERA | — | §102§103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786531 | GATE STRUCTURES IN TRANSISTORS AND METHOD OF FORMING SAME | SEHAR, FAKEHA | — | §103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786529 | SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND METHODS OF MANUFACTURE | LOHAKARE, PRATIKSHA JAYANT | — | §103DP | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786525 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, SOPHIA T | — | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786532 | Nanostructure Field-Effect Transistor Device and Method of Forming | JUNG, MICHAEL YOO LIM | — | §102§103 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786482 | PACKAGE AND METHOD OF FABRICATING THE SAME | TRAN, TRANG Q | — | §102§112 | Non-Final OA | — | Pending | Jul 27, 2024 |
| 18786321 | MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION SYSTEMS | NEIBAUR, ROBERT F | — | §112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786276 | EMBEDDED BACKSIDE PCRAM DEVICE STRUCTURE | KING, DOUGLAS | 2824 | §103§112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785596 | SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES | RAHMAN, MOHAMMAD A | — | §102§112 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785842 | INTEGRATED CIRCUIT DEVICE | HO, TU TU V | — | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785172 | RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME | HOQUE, MOHAMMAD M | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786265 | Wafer Bonding Apparatus and Method | LINDSEY, COLE LEON | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785934 | Spacers for Semiconductor Devices Including Backside Power Rails | PARKER, JOHN M | — | DP | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785381 | SEMICONDUCTOR DEVICES WITH IMPROVED CAPACITORS | MIYOSHI, JESSE Y | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785053 | Semiconductor Devices and Methods of Manufacture | VU, VU A | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18786023 | PACKAGE STRUCTURE | HAWKINS, IHSAN TAIWO | — | §102§103 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785442 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | — | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18783614 | FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783688 | IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING | CHAMBLISS, ALONZO | — | §102§112DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783597 | MULTIPLE THRESHOLD VOLTAGE IMPLEMENTATION THROUGH LANTHANUM INCORPORATION | ISAAC, STANETTA D | — | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784233 | HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS | FAN, SU JYA | — | §102§103Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783807 | 3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME | GEYER, SCOTT B | — | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783848 | NFET with Aluminum-Free Work-Function Layer and Method Forming Same | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783765 | EUV METALLIC RESIST PERFORMANCE ENHANCEMENT VIA ADDITIVES | CHU, JOHN S Y | 1737 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783905 | SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF | GUMEDZOE, PENIEL M | — | §102§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784531 | SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMING THE SAME | LEE, CHEUNG | — | §102§103DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784675 | APPARATUS AND METHODS FOR THREE DIMENSIONAL RETICLE DEFECT SMART REPAIR | SHARIFF, MICHAEL ADAM | — | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783501 | SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD | GREEN, TELLY D | — | §102§103§112Other | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784624 | INTEGRATED CIRCUIT WITH NANOSHEET TRANSISTORS WITH METAL GATE PASSIVATION | WINTERS, SEAN AYERS | — | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784164 | BONDING STRUCTURE AND METHOD OF FORMING SAME | DIALLO, MAMADOU L | — | DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783789 | PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME | ENDRESEN, KIRSTEN DANIELA | — | §102§103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784638 | NOVEL MIM STRUCTURE | PAGE, STEVEN MITCHELL CHR | — | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782255 | Dual Dopant Source/Drain Regions and Methods of Forming Same | WILCZEWSKI, MARY A | — | §103§112DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783157 | Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells | ASSOUMAN, HERVE-LOUIS Y | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782988 | IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING | CHEN, CHIA WEI A | 2637 | §102§103 | Final Rejection | 8d overdue | Pending | Jul 24, 2024 |
| 18782460 | INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME | SEDOROOK, DAVID PAUL | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782846 | GATE STRUCTURE FOR SEMICONDUCTOR DEVICE | KIM, TONG-HO | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783347 | INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING | MUNOZ, ANDRES F | — | §103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782214 | EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS | WILCZEWSKI, MARY A | — | §102§103§112DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782253 | MULTI-LEVEL STACKING OF WAFERS AND CHIPS | GOODWIN, DAVID J | — | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782124 | Semiconductor Device and Method of Manufacture | KIM, TONG-HO | — | §102Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782354 | HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED CIRCUITS | JEAN BAPTISTE, WILNER | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783352 | SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE | WILCZEWSKI, MARY A | — | §102§103DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782667 | SYSTEM AND METHOD FOR DYNAMICALLY ADJUSTING THIN-FILM DEPOSITION PARAMETERS | KHUU, HIEN DIEU THI | 2116 | §102§103§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783178 | SYSTEM AND METHOD FOR CLEANING AN EUV MASK | RIDDLE, CHRISTINA A | 2882 | §103§112 | Final Rejection | 8d overdue | Pending | Jul 24, 2024 |
| 18783031 | PACKAGED DEVICE WITH OPTICAL PATHWAY | NGUYEN, KHIEM D | — | §102§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782335 | AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME | PARKER, JOHN M | — | §102§103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783146 | CAPACITOR, MEMORY DEVICE, AND METHOD | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782219 | TRANSISTOR GATE STRUCTURES | KIM, TONG-HO | — | §102§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782959 | Transducer Device and Method of Manufacture | ARMSTRONG, JONATHAN D | 3645 | §103 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18783277 | SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION | MARKMAN, MAKENA | — | §102§112 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780679 | Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor Device | BEARDSLEY, JONAS TYLER | 2811 | §101§102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781604 | SEMICONDUCTOR DEVICE AND METHOD | NGUYEN, KHIEM D | — | §102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781476 | SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS | MAI, ANH D | 2893 | §103§112 | Final Rejection | — | Pending | Jul 23, 2024 |
| 18780927 | GATE-ALL-AROUND DEVICES HAVING SELF-ALIGNED CAPPING BETWEEN CHANNEL AND BACKSIDE POWER RAIL | YI, CHANGHYUN | — | §112DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780842 | TRANSISTOR SOURCE/DRAIN REGIONS | WIEGAND, TYLER J | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780824 | Semiconductor Device and Manufacturing Method of Semiconductor Device | CRAWFORD EASON, LATANYA N | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780748 | CUT METAL GATE IN MEMORY MACRO EDGE AND MIDDLE STRAP | MEHTA, RATISHA | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781059 | SEMICONDUCTOR DEVICE AND METHOD | TRAN, TAN N | — | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780838 | Fully Self-Aligned Interconnect Structure | MATTABONI, TIMOTHY JAMES | — | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781455 | Method for Reducing Line-End Space in Integrated Circuit Patterning | JEFFERSON, QUOVAUNDA | — | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781018 | Metal Contacts on Metal Gates and Methods Thereof | CULBERT, CHRISTOPHER A | 2815 | §102§103 | Non-Final OA | 36d overdue | Pending | Jul 23, 2024 |
| 18780081 | MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS | NGUYEN, CUONG B | 2872 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779954 | FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS | BRASFIELD, QUINTON A | — | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | ISAAC, STANETTA D | 2898 | §102 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779329 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME | TYNES JR., LAWRENCE C | — | Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779804 | EPITAXIAL SOURCE/DRAIN STRUCTURE AND METHOD | HAIDER, WASIUL | 2812 | Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779444 | Source/Drain Contact with Low-K Contact Etch Stop Layer and Method of Fabricating Thereof | SPALLA, DAVID C | — | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18780150 | INNER SPACER FEATURES FOR MULTI-GATE TRANSISTORS | SPALLA, DAVID C | — | §102§103DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778763 | Integrated Circuit Package and Method | DANG, PHUC T | — | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776617 | SEMICONDUCTOR DEVICES | KIM, TONG-HO | — | §102§103Other | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777240 | NANOSTRUCTURE DEVICE WITH REDUCED HIGH-K DIELECTRIC AREA AND RELATED METHOD | JONES, ERIC W | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777250 | METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR DEVICES | FAN, SU JYA | — | §102§103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18777198 | SEMICONDUCTOR DEVICES | GHYKA, ALEXANDER G | — | §102DP | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18776388 | Semiconductor Device Structure and Method for Forming the Same | DINKE, BITEW A | 2812 | §103Other | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18775943 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING | BOWEN, ADAM S | — | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775879 | HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM | GUMEDZOE, PENIEL M | — | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775995 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | OH, JIYOUNG | — | §102§103§112 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775646 | NANOSHEET FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775706 | VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES | STEVENSON, ANDRE C | — | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18774512 | DUMMY FIN PROFILE CONTROL TO ENLARGE GATE PROCESS WINDOW | STEVENSON, ANDRE C | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774323 | BURIED METAL TRACK AND METHODS FORMING SAME | QUINTO, KEVIN V | — | §102 | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774643 | Semiconductor Device with Cut Metal Gate and Method of Manufacture | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18774289 | BOTTOM-UP FORMATION OF CONTACT PLUGS | GHYKA, ALEXANDER G | — | DP | Non-Final OA | — | Pending | Jul 16, 2024 |
| 18773070 | ETCHING BACK AND SELECTIVE DEPOSITION OF METAL GATE | ASHBAHIAN, ERIC K | — | §102§103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18773367 | UNDERLAYER OF MULTILAYER STRUCTURE AND METHODS OF USE THEREOF | LEBENTRITT, MICHAEL | — | DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18772445 | MAGNETIC TUNNEL JUNCTION DEVICE AND METHOD OF FORMING THE SAME | MILLER, JAMI VALENTINE | — | §103 | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18771181 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | ASSOUMAN, HERVE-LOUIS Y | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770750 | Semiconductor Device and Method of Manufacture | CHANG, JAY C | — | §102§112 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771714 | GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | NIX, NORA TAYLOR | 2891 | §103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770919 | METHODS OF FORMING EPITAXIAL STRUCTURES IN FIN-LIKE FIELD EFFECT TRANSISTORS | TRAN, THANH Y | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771043 | SELECTIVE EPITAXY PROCESS FOR THE FORMATION OF CFET LOCAL INTERCONNECTION | KIM, TONG-HO | — | Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771503 | EPITAXIAL BACKSIDE CONTACT | KIM, TONG-HO | — | Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771191 | Photonic Semiconductor Device And Method | RAHLL, JERRY T | — | §102§103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18769875 | FINFETS WITH EPITAXY REGIONS HAVING MIXED WAVY AND NON-WAVY PORTIONS | LEE, CHEUNG | — | §102 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770349 | SEMICONDUCTOR DEVICE WITH FUNNEL SHAPE SPACER AND METHODS OF FORMING THE SAME | LEE, CHEUNG | — | §102DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770185 | SEMICONDUCTOR DEVICE GATE STRUCTURES | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18770052 | NMOS and PMOS Transistor Gates with Hafnium Oxide Layers and Lanthanum Oxide Layers | KOO, LAMONT B | — | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769781 | PARASITIC CAPACITANCE REDUCTION | LI, MEIYA | — | §112 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768357 | LATCH-UP PREVENTION | KIM, TONG-HO | — | §103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768952 | Semiconductor Device Structure With Uniform Threshold Voltage Distribution and Method of Forming the Same | NGUYEN, DAO H | — | §102 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768942 | SEMICONDUCTOR DEVICE INCLUDING COMBINATION ROWS | HAWKINS, IHSAN TAIWO | — | §102§103§112 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18769227 | STRUCTURES AND METHODS FOR TRENCH ISOLATION | SALERNO, SARAH KATE | — | DP | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18766881 | FIN FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING THE SAME | SLUTSKER, JULIA | — | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766767 | Self-Aligned Contact Hard Mask Structure of Semiconductor Device and Method of Forming Same | KEAGY, ROSE ALYSSA | — | §102§103Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766853 | FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | BOWEN, ADAM S | — | Other | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766402 | MINIMIZATION OF SILICON GERMANIUM FACETS IN PLANAR METAL OXIDE SEMICONDUCTOR STRUCTURES | KOO, LAMONT B | — | §102§103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766246 | COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS | KIELIN, ERIK J | — | DP | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766300 | SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES | JONES, ERIC W | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18766336 | BSI CHIP WITH BACKSIDE ALIGNMENT MARK | TAYLOR, EARL N | — | §102§112 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18762706 | DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR | DIALLO, MAMADOU L | 2897 | DP | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18761653 | SHALLOW TRENCH ISOLATION (STI) CONTACT STRUCTURES AND METHODS OF FORMING SAME | KOO, LAMONT B | — | §102§103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18760800 | EPITAXY REGIONS WITH LARGE LANDING AREAS FOR CONTACT PLUGS | LIU, BENJAMIN T | — | §103 | Non-Final OA | — | Pending | Jul 01, 2024 |
| 18756609 | PLANAR AND NON-PLANAR FET-BASED ELECTROSTATIC DISCHARGE PROTECTION DEVICES | JEFFERSON, QUOVAUNDA | 2899 | DP | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18750737 | Source/Drain Feature to Contact Interfaces | MUNOZ, ANDRES F | — | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18749013 | LAYOUT STRUCTURE INCLUDING ANTI-FUSE CELL | SMET, UYEN TRAN | 2824 | §102 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18747623 | NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME | KOO, LAMONT B | — | §102 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18748008 | NOVEL THIN FILM RESISTOR | JONES, ERIC W | 2892 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18746181 | Contact for Semiconductor Device and Method of Forming Thereof | TAYLOR, EARL N | — | §102§103§112 | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18745760 | Etch Profile Control Of Polysilicon Structures Of Semiconductor Devices | DULKA, JOHN P | — | §102§112 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18743529 | HIGH-DENSITY MEMORY CELLS AND LAYOUTS THEREOF | SMET, UYEN TRAN | 2824 | §102§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18744471 | METHOD AND DEVICE TO INCREASE NANOSHEET DEVICE WIDTH | TYNES JR., LAWRENCE C | — | §102§103§112 | Non-Final OA | — | Pending | Jun 14, 2024 |
| 18741756 | ANTENNA DEVICE | MUSE, ISMAIL A | — | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741654 | DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKING THE SAME | VU, VU A | — | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18738443 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE | BRASFIELD, QUINTON A | — | §103DP | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18731752 | OPTICAL FIBER COUPLING STRUCTURE FOR PHOTONIC PACKAGE | LE, UYEN CHAU N | — | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18680053 | SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES | MARIN, JACOB RAUL | — | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18679788 | SEMICONDUCTOR PACKAGE AND METHOD | IQBAL, HAMNA FATHIMA | — | §102§103 | Non-Final OA | — | Pending | May 31, 2024 |
| 18677641 | CMP METHOD AND SYSTEM WITH NANOBUBBLE CLEANING | HAWKINS, JASON KHALIL | — | §103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18674634 | LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF | RODELA, EDUARDO A | — | §103DP | Non-Final OA | — | Pending | May 24, 2024 |
| 18673546 | ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING | CHI, SUBERR L | — | §112 | Non-Final OA | — | Pending | May 24, 2024 |
| 18672485 | LOW-STRESS PASSIVATION LAYER | OH, JAEHWAN | — | §102 | Non-Final OA | — | Pending | May 23, 2024 |
| 18671497 | GATE PATTERNING PROCESS FOR MULTI-GATE DEVICES | KIM, TONG-HO | 2811 | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18671732 | Contact Structures With Deposited Silicide Layers | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 22, 2024 |
| 18669102 | CHEMICAL MECHANICAL POLISHING METHOD | GUMP, MICHAEL ANTHONY | 3723 | §103DP | Non-Final OA | — | Pending | May 20, 2024 |
| 18668911 | GATE ISOLATION FOR MULTIGATE DEVICE | JUNG, MICHAEL YOO LIM | 2898 | §102 | Non-Final OA | — | Pending | May 20, 2024 |
| 18667509 | STRUCTURE FOR FRINGING CAPACITANCE CONTROL | KIM, TONG-HO | 2891 | §103Other | Non-Final OA | — | Pending | May 17, 2024 |
| 18667981 | METHODS OF FORMING PHOTONIC DEVICES | HO, ANTHONY | 2817 | DP | Non-Final OA | — | Pending | May 17, 2024 |
| 18666517 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | — | Pending | May 16, 2024 |
| 18664767 | High-K Gate Dielectric and Method Forming Same | JUNGE, BRYAN R. | — | §103 | Non-Final OA | — | Pending | May 15, 2024 |
| 18663038 | DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF | GUMEDZOE, PENIEL M | — | §102 | Non-Final OA | — | Pending | May 13, 2024 |
| 18661969 | AIR SPACER FOR A GATE STRUCTURE OF A TRANSISTOR | RAHMAN, MOHAMMAD A | — | §102§103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18662374 | DUAL SILICIDE STRUCTURE AND METHODS THEREOF | BOWEN, ADAM S | — | DP | Non-Final OA | — | Pending | May 13, 2024 |
| 18658480 | DETACHABLE FIBER ARRAY UNIT FITTING WITH GUIDE PINS | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | May 08, 2024 |
| 18657170 | DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME | OZDEN, ILKER NMN | — | §102§103§112DP | Non-Final OA | — | Pending | May 07, 2024 |
| 18655833 | CONNECTION BETWEEN SOURCE/DRAIN AND GATE | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | May 06, 2024 |
| 18654298 | NANOSHEET FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18648917 | Die Stacking Structure and Method Forming Same | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18646870 | Interconnect Structure of Semiconductor Device | QUINTO, KEVIN V | 2893 | §103DP | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646326 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | WONG, ERIC K | 2874 | §102§112 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646459 | PLANARIZATION PROCESS AND METHOD | PHAM, THOMAS T | 1713 | §103Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18646469 | CMOS IMAGE SENSOR STRUCTURE | CHAN, CANDICE | 2813 | §103§112 | Non-Final OA | 25d overdue | Pending | Apr 25, 2024 |
| 18644770 | Semiconductor Device and Method of Manufacture | AHMAD, KHAJA | 2813 | §102§103Other | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18643324 | ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING | NGUYEN, KHIEM D | — | §102§103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18643212 | Depositing and Oxidizing Silicon Liner for Forming Isolation Regions | BOULGHASSOUL, YOUNES | 2814 | §102§112DP | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18641764 | SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT | PARKER, JOHN M | 2899 | §102§103§112 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18642330 | Forming Source And Drain Features In Semiconductor Devices | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18641904 | Gate-All-Around Field-Effect Transistors In Integrated Circuits | KIM, TONG-HO | 2811 | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18635641 | ASYMMETRIC EPITAXY REGIONS FOR LANDING CONTACT PLUG | BOWEN, ADAM S | 2897 | DP | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18627789 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18628173 | SEMICONDUCTOR PACKAGE AND METHOD | JUNG, MICHAEL YOO LIM | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18627334 | PROCESSING AND MEMORY DEVICE AND SYSTEM | WESTBROOK, MICHAEL L | 2139 | §103 | Final Rejection | — | Pending | Apr 04, 2024 |
| 18623490 | THRESHOLD VOLTAGE TUNING FOR CFETS HAVING COMMON GATES | LEE, ALVIN LYNGHI | — | §102§103§112 | Non-Final OA | — | Pending | Apr 01, 2024 |
| 18619758 | SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES | FAYETTE, NATHALIE RENEE | 2812 | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619459 | PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING THE SAME | AHMAD, KHAJA | — | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619983 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MOONEY, MICHAEL P | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18616604 | CONNECTOR FOR OPTICAL FIBER ALIGNMENT | PEACE, RHONDA S | 2874 | §103 | Final Rejection | 6d | Pending | Mar 26, 2024 |
| 18610375 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD | MCFARLAND, TYLER JAMES | 3723 | §103Other | Final Rejection | — | Pending | Mar 20, 2024 |
| 18609870 | SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FORMING THE SAME | ZABEL, ANDREW JOHN | — | §102§103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18606495 | PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE SAME | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18606497 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18603046 | Semiconductor Structure with Gate Isolation Layer and Manufacturing Method Thereof | NICELY, JOSEPH C | 2813 | §102§103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18600931 | THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE | TRAPANESE, WILLIAM C | 2812 | §103 | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18600172 | INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS OF FORMING THE SAME | HARBOTTLE, CHARLOTTE ELIZABETH | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18599797 | ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES | JOHNSON, CHRISTOPHER A | 2899 | §112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18597219 | SEMICONDUCTOR DEVICE AND METHOD | WALL, VINCENT | 2898 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18596123 | MECHANISMS FOR GROWING EPITAXY STRUCTURE OF FINFET DEVICE | CRITE, ANTONIO B | 2817 | §103 | Final Rejection | — | Pending | Mar 05, 2024 |
| 18593661 | SEMICONDUCTOR DEVICE | KIM, SU C | 2899 | §103 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18591758 | SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF MANUFACTURING THE SAME | RIRIE, EVERETT TRAJAN | 2897 | §102§103§112 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18590271 | SEMICONDUCTOR PACKAGE AND METHOD | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18587104 | SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMING THE SAME | TRAN, TAN N | 2812 | §103 | Non-Final OA | — | Pending | Feb 26, 2024 |
| 18584080 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18581604 | Methods, Structures and Devices for Intra-Connection Structures | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18582070 | CARRIER WAFER DEBONDING PROCESS AND METHOD | CUDA, BRENNEN STUART | 2818 | §103 | Non-Final OA | — | Pending | Feb 20, 2024 |
| 18442758 | SEMICONDUCTOR PACKAGE AND METHODS | MICHAUD, NICHOLAS BRIAN | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18442747 | SELECTIVE FORMATION OF ETCH STOP LAYERS AND THE STRUCTURES THEREOF | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18437960 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | CAPUTO, LISA M | 2874 | §102 | Final Rejection | 40d | Pending | Feb 09, 2024 |
| 18437139 | SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Feb 08, 2024 |
| 18434222 | EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME | ADROVEL, WILLIAM | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18433908 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18434553 | DEVICE OF DIELECTRIC LAYER | DINKE, BITEW A | 2812 | §103 | Final Rejection | — | Pending | Feb 06, 2024 |
| 18431187 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §102§103 | Final Rejection | 26d | Pending | Feb 02, 2024 |
| 18431117 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | MOONEY, MICHAEL P | 2874 | §103 | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18428315 | SEMICONDUCTOR DEVICE AND METHOD | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2024 |
| 18420550 | TREATMENT FOR TUNING THRESHOLD VOLTAGES OF TRANSISTORS | AHMED, SHAHED | 2813 | §102§103 | Final Rejection | — | Pending | Jan 23, 2024 |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | WIECZOREK, MICHAEL P | 1712 | §102§103§112 | Final Rejection | 21d | Pending | Jan 18, 2024 |
| 18415784 | PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | RADKOWSKI, PETER | 2874 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18416410 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | MOHAMED-ALY, KAREEM M | 2898 | §102§103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18415092 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Final Rejection | 45d overdue | Pending | Jan 17, 2024 |
| 18415426 | PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME | RAHIM, NILUFA | 2893 | §102§103 | Non-Final OA | — | Pending | Jan 17, 2024 |
| 18412779 | SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME | LI, MEIYA | 2811 | §103§112 | Non-Final OA | — | Pending | Jan 15, 2024 |
| 18411675 | SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND TRENCH ISOLATION ETCHBACK | WARD, DAVID WILLIAM | 2891 | §103§112 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | TRAN, TAN N | 2812 | §102§112 | Final Rejection | 22d | Pending | Jan 11, 2024 |
| 18410301 | Semiconductor Packages and Methods of Forming | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Jan 11, 2024 |
| 18408932 | SEMICONDUCTOR DEVICE AND METHOD | MEHTA, RATISHA | 2817 | §102 | Non-Final OA | — | Pending | Jan 10, 2024 |
| 18405973 | INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS | AHMED, SHAHED | 2813 | §102§103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18405526 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHOD | ZABEL, ANDREW JOHN | 2818 | §103 | Non-Final OA | — | Pending | Jan 05, 2024 |
| 18404266 | INTEGRATED CIRCUIT PACKAGE AND METHOD | KEAGY, ROSE ALYSSA | 2818 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404639 | DIFFRACTION-BASED OVERLAY MARK DESIGN | BEARDSLEY, JONAS TYLER | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404762 | INSPECTION SYSTEM WITH MULTIWAVELENGTH LIGHT SOURCE AND METHOD | NGUYEN, KEMAYA DEANN HUU | 2877 | §103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18404776 | MULTILAYER PROTECTION COATING WITH LAYERS OF DIFFERENT FUNCTIONS ON CARBON NANOTUBE | ANGEBRANNDT, MARTIN J | — | §102§103Other | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18403326 | SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403418 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME | ADROVEL, WILLIAM | 2898 | §103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18403298 | PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME | MCCOY, THOMAS WILSON | 2814 | §103§112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18401846 | PACKAGES WITH DTCS ON OTHER DEVICE DIES AND METHODS OF FORMING THE SAME | SPRENGER, JAIME LYNN | 2893 | §103 | Final Rejection | — | Pending | Jan 02, 2024 |
| 18529948 | CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18526496 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | ABEL, GARY ROBERT | 2897 | §103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526920 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | CHIEM, DINH D | 2874 | §102§103 | Final Rejection | — | Pending | Dec 01, 2023 |
| 18526445 | SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME | TURNER, BRIAN | — | §102§103 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18526786 | OPTICAL DEVICE AND METHODS OF MANUFACTURE | PEACE, RHONDA S | 2874 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18524386 | MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF | CIESLEWICZ, ANETA B | 2893 | §102§103 | Final Rejection | 5d | Pending | Nov 30, 2023 |
| 18521701 | SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATING THE SAME | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | — | Pending | Nov 28, 2023 |
| 18521726 | ADJUSTABLE NOZZLE DEVICE | TADESSE, YEWEBDAR T | 1717 | §102§103 | Final Rejection | 1d overdue | Pending | Nov 28, 2023 |
| 18521931 | METAL SOURCE/DRAIN FEATURES | TURNER, BRIAN | — | §102§103§112 | Non-Final OA | — | Pending | Nov 28, 2023 |
| 18517577 | Gradually Changed Dummy Pattern Distribution Around TSVs | BLACKWELL, ASHLEY NICOLE | 2897 | §102§103 | Non-Final OA | — | Pending | Nov 22, 2023 |
| 18516431 | CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES | HUNTER III, CARNELL | 2893 | §103Other | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18514859 | SPACE FILLING DEVICE FOR WET BENCH | ZHANG, RICHARD Z | 1711 | §103§112Other | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | 71d | Pending | Nov 20, 2023 |
| 18510523 | SEAL RING STRUCTURE AND METHOD OF FORMING SAME | PARTHASARATHY, ROHIT | 2899 | §102§103§112 | Non-Final OA | — | Pending | Nov 15, 2023 |
| 18508015 | SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUCTURES HAVING REDUCED PARASITIC CIRCUIT | JAHAN, BILKIS | 2817 | §103 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18506864 | LOW VOLUME SHRINKAGE, HIGH ETCH RESISTANCE AND HIGH RESOLUTION PHOTORESISTS | ANGEBRANNDT, MARTIN J | — | §103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506366 | IMMERSION COOLING SYSTEM AND METHODS | ANDERSON, WILLIAM H | 2817 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506747 | DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FORMING SAME | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18506641 | DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES | OH, JIYOUNG | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18502485 | ANTI-PLASMA COATING | GRUSBY, REBECCA LYNN | 1785 | §102§103§112 | Final Rejection | 5d | Pending | Nov 06, 2023 |
| 18493187 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME | RAHMAN, MOHAMMAD A | 2898 | §112 | Non-Final OA | — | Pending | Oct 24, 2023 |
| 18491237 | MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Final Rejection | — | Pending | Oct 20, 2023 |
| 18490014 | PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING | ZHU, SHENG-BAI | 2897 | §102§103§112 | Non-Final OA | 27d | Pending | Oct 19, 2023 |
| 18488592 | IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME | NARAGHI, ALI | 2817 | §102§103§112 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18482632 | INTEGRATED CIRCUIT PACKAGES AND METHODS | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18482122 | DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY ENHANCEMENT | CHEN, YU | 2896 | §102§103§112 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18467020 | OPTICAL DEVICE AND METHOD OF MANUFACTURE | MANHEIM, MARC ETIENNE | 2874 | §102§103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | CUTLER, ETHAN EDWARD | 2892 | §103 | Final Rejection | 10d overdue | Pending | Sep 12, 2023 |
| 18462499 | FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | — | Pending | Sep 07, 2023 |
| 18240065 | SEMICONDUCTOR PACKAGE AND METHOD | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | 31d overdue | Pending | Aug 30, 2023 |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Final Rejection | 1d overdue | Pending | Aug 29, 2023 |
| 18232986 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18448337 | OPTICAL DEVICES AND METHODS OF MANUFACTURE | ROLAND, CHRISTOPHER M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18232719 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103§112 | Non-Final OA | 146d overdue | Pending | Aug 10, 2023 |
| 18232718 | Contact Structure For Semiconductor Device | AU, BAC H | 2898 | §103 | Final Rejection | 12d | Pending | Aug 10, 2023 |
| 18446858 | WAFER DRYING SYSTEM | YUEN, JESSICA JIPING | 3762 | §103§112 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18232181 | Profile Control Of Gate Structures In Semiconductor Devices | HOANG, TUAN A | 2898 | §103 | Final Rejection | — | Pending | Aug 09, 2023 |
| 18446753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | LI, MEIYA | 2811 | §112DP | Final Rejection | 17d overdue | Pending | Aug 09, 2023 |
| 18447149 | SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18366297 | Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same | RAHMAN, MOIN M | 2898 | §102§103§112 | Final Rejection | — | Pending | Aug 07, 2023 |
| 18366370 | STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18366073 | Gate Structure of Semiconductor Device and Method of Forming Same | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | 66d overdue | Pending | Aug 07, 2023 |
| 18364614 | METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION | BAUMAN, SCOTT E | 2815 | §103 | Final Rejection | — | Pending | Aug 03, 2023 |
| 18364332 | PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | THOMASON, DARBY MARGARET | 2874 | §102§103 | Non-Final OA | — | Pending | Aug 02, 2023 |
| 18363554 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | — | Pending | Aug 01, 2023 |
| 18363350 | Different Source/Drain Profiles for N-type FinFETs and P-type FinFETs | TURNER, BRIAN | 2818 | DP | Final Rejection | — | Pending | Aug 01, 2023 |
| 18363444 | SEMICONDUCTOR DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Aug 01, 2023 |
| 18228288 | Biological Device And Biosensing Method Thereof | EOM, ROBERT J | 1797 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18361569 | BENT FIN DEVICES | KOO, LAMONT B | 2813 | §103 | Final Rejection | 10d overdue | Pending | Jul 28, 2023 |
| 18361609 | EUV RETICLE WITH EMBEDDED PROCESS ASSISTANCE LAYER AND METHOD OF MANUFACTURING THE EUV RETICLE | CHACKO DAVIS, DABORAH | 1737 | §103 | Final Rejection | — | Pending | Jul 28, 2023 |
| 18361298 | DOSE REDUCTION BOTTOM ANTI-REFLECTIVE COATING FOR METALLIC PHOTORESIST | CHACKO DAVIS, DABORAH | 1737 | §102§103 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18361704 | SEMICONDUCTOR DEVICES WITH DIELECTRIC FINS AND METHOD FOR FORMING THE SAME | KOO, LAMONT B | 2813 | §103 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18359180 | Novel CMP Pad Design and Method of Using the Same | CHANG, SUKWOO JAMES | 3723 | §103 | Non-Final OA | — | Pending | Jul 26, 2023 |
| 18358383 | Tuning Work Functions of Complementary Transistors | MALEK, MALIHEH | 2813 | §103 | Final Rejection | — | Pending | Jul 25, 2023 |
| 18352055 | DEVICE HAVING MULTIPHASE DIELECTRIC LAYER AND METHOD | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 40d | Pending | Jul 13, 2023 |
| 18351099 | Volume-Less Dipole Incorporation into CFET Having Common Gate | SALAZ, SAMMANTHA KATELYN | 2892 | §103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18350429 | SEMICONDUCTOR DEVICES WITH IMPROVED GATE CONTROL | HOANG, TUAN A | 2898 | §102§103 | Final Rejection | 61d | Pending | Jul 11, 2023 |
| 18348967 | Cut Metal Gate Refill With Buffer Layer | HOSSAIN, MOAZZAM | 2800 | §103§112 | Final Rejection | 42d overdue | Pending | Jul 07, 2023 |
| 18219259 | Surface Profile Control Of Passivation Layers In Integrated Circuit Chips | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 56d overdue | Pending | Jul 07, 2023 |
| 18346113 | METHOD OF PRODUCING MASK DATA FOR SEMICONDUCTOR DEVICE MANUFACTURING | AISAKA, BRYCE M | 2851 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18336382 | GALLIUM NITRIDE DEVICE WITH ARTIFICIAL FIELD PLATES | NEWTON, VALERIE N | 2897 | §103 | Non-Final OA | — | Pending | Jun 16, 2023 |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §102§103 | Final Rejection | 14d | Pending | Jun 14, 2023 |
| 18334650 | Redistribution Lines and The Method Forming the Same Through Stitching | ABRAHAM, JOSE K | 3729 | §112 | Non-Final OA | — | Pending | Jun 14, 2023 |
| 18330492 | VOLTAGE SUPPLY SELECTION CIRCUIT | CHEN, SIBIN | 2896 | Other | Final Rejection | 31d overdue | Pending | Jun 07, 2023 |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 13d | Pending | Jun 05, 2023 |
| 18328982 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §103 | Non-Final OA | 15d overdue | Pending | Jun 05, 2023 |
| 18328207 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | OZDEN, ILKER NMN | 2812 | §103 | Non-Final OA | 34d | Pending | Jun 02, 2023 |
| 18328502 | CRYSTALLIZATION TEMPERATURE REDUCTION OF HIGH-K DIELECTRIC LAYER | SARKER-NAG, AKHEE | 2893 | §103 | Non-Final OA | 38d overdue | Pending | Jun 02, 2023 |
| 18324036 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | GREEN, TELLY D | 2898 | §103 | Final Rejection | 61d | Pending | May 25, 2023 |
| 18319854 | Optical Devices and Methods of Manufacture | CHU, CHRIS H | 2874 | §103 | Non-Final OA | — | Pending | May 18, 2023 |
| 18314446 | Complementary Field Effect Transistors and Methods of Forming the Same | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 28d | Pending | May 09, 2023 |
| 18313705 | METHOD OF MODELING A MASK BY TAKING INTO ACCOUNT OF MASK PATTERN EDGE INTERACTION | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Non-Final OA | 30d | Pending | May 08, 2023 |
| 18193405 | Multi-Blade Trimming and Dressing Tool | MARKMAN, MAKENA | 3723 | §102§103§112 | Non-Final OA | — | Pending | Mar 30, 2023 |
| 18188929 | PRE-TREATMENT APPARATUS | TUROCY, DAVID P | 1718 | §102§103 | Final Rejection | 46d | Pending | Mar 23, 2023 |
| 18186413 | Optical Device and Method of Manufacture | ST CYR, DANIEL | 2876 | §103 | Non-Final OA | — | Pending | Mar 20, 2023 |
| 18167755 | WORKPIECE PLATING AND RINSE APPARATUS AND METHOD | RUFO, LOUIS J | 1795 | §102§103§112 | Non-Final OA | — | Pending | Feb 10, 2023 |
| 18153978 | CHILLER SYSTEM WITH INTELLIGENT CONTROL | AHMED, ISTIAQUE | 2116 | §102§103 | Final Rejection | 46d overdue | Pending | Jan 12, 2023 |
| 18152390 | METHOD OF SACRIFICIAL NANOSTRUCTURE REPLACEMENT IN SEMICONDUCTOR DEVICES | XU, ZHIJUN | 2818 | §103 | Final Rejection | — | Pending | Jan 10, 2023 |
| 18152314 | Water Cooling System for Semiconductor Package | HIBBERT, DANIEL JOHNATHAN | 2899 | §102§103§112 | Non-Final OA | 34d | Pending | Jan 10, 2023 |
| 18151856 | Die Structures and Methods of Forming the Same | TRAN, TRANG Q | 2811 | §102§103§112 | Final Rejection | 13d | Pending | Jan 09, 2023 |
| 18151413 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | CLEVELAND, MICHAEL B | 1700 | §103§112 | Final Rejection | — | Pending | Jan 06, 2023 |
| 18150912 | SEMICONDUCTOR DEVICE WITH INDUCTIVE COMPONENT AND METHOD OF FORMING | PATERSON, BRIGITTE A | 2896 | §102 | Non-Final OA | 22d | Pending | Jan 06, 2023 |
| 18150256 | INTEGRATED CIRCUIT PACKAGES AND METHODS | PETERSON, ERIK T | 2898 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18149265 | Via Structures | BOULGHASSOUL, YOUNES | 2814 | §102§103 | Non-Final OA | 34d | Pending | Jan 03, 2023 |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | 35d | Pending | Aug 26, 2022 |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 28d | Pending | Aug 19, 2022 |
| 17884636 | PMOSFET SOURCE DRAIN | NARAGHI, ALI | 2817 | §103 | Final Rejection | 28d | Pending | Aug 10, 2022 |
| 17818785 | Semiconductor Device and Method | KOO, LAMONT B | 2813 | §103 | Final Rejection | 46d overdue | Pending | Aug 10, 2022 |
| 17881128 | SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF | BELL, LAUREN R | 2896 | §103§112 | Non-Final OA | — | Pending | Aug 04, 2022 |
| 17879529 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | SHAMSUZZAMAN, MOHAMMED | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 02, 2022 |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | OH, JIYOUNG | 2818 | §103 | Non-Final OA | 8d overdue | Pending | Aug 02, 2022 |
| 17815968 | FinFET Having Non-Merging Epitaxially Grown Source/Drains | HSIEH, HSIN YI | 2899 | §102§103 | Non-Final OA | 72d | Pending | Jul 29, 2022 |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | LEE, ALEXANDER N | 1737 | §112 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | CRITE, ANTONIO B | 2817 | §103§112 | Non-Final OA | 100d overdue | Pending | Jul 27, 2022 |
| 17815088 | Semiconductor Package and Method | OH, JIYOUNG | 2818 | §103 | Final Rejection | 5d overdue | Pending | Jul 26, 2022 |
| 17814725 | Semiconductor Device and Method | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Non-Final OA | 26d | Pending | Jul 25, 2022 |
| 17872160 | Source/Drain Via Having Reduced Resistance | NARAGHI, ALI | 2817 | §103 | Non-Final OA | — | Pending | Jul 25, 2022 |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 13d | Pending | Jul 25, 2022 |
| 17870251 | SLURRY RECYCLING FOR CHEMICAL MECHANICAL POLISHING SYSTEM | KEYWORTH, PETER | 1777 | §103§112 | Final Rejection | 29d | Pending | Jul 21, 2022 |
| 17813700 | MITIGATION OF TIME DEPENDENT DIELECTRIC BREAKDOWN | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | — | Pending | Jul 20, 2022 |
| 17868635 | Methods Of Forming Metal Gate Spacer | CULBERT, CHRISTOPHER A | 2815 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2022 |
| 17858985 | Inner Spacers for Gate-All-Around Semiconductor Devices | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17809039 | SEMICONDUCTOR PACKAGE AND METHOD | KOLB, THADDEUS J | 2817 | §103 | Non-Final OA | — | Pending | Jun 27, 2022 |
| 17840362 | Molding Structures for Integrated Circuit Packages and Methods of Forming the Same | WARD, DAVID WILLIAM | 2891 | §103 | Final Rejection | 10d overdue | Pending | Jun 14, 2022 |
| 17837312 | HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2022 |
| 17833208 | Semiconductor Device and Method Forming Same | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | — | Pending | Jun 06, 2022 |
| 17752558 | TRANSDUCER DEVICE AND METHOD OF MANUFACTURE | CULBERT, CHRISTOPHER A | 2815 | §103 | Non-Final OA | — | Pending | May 24, 2022 |
| 17752730 | ON-LINE ANALYSIS SYSTEM AND METHOD FOR SPECIALTY GASSES | GZYBOWSKI, MICHAEL STANLEY | 1798 | §103 | Non-Final OA | 30d | Pending | May 24, 2022 |
| 17750145 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | TUROCY, DAVID P | 1718 | §103 | Non-Final OA | — | Pending | May 20, 2022 |
| 17750148 | SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT | TALBOT, BRIAN K | 1712 | §103 | Non-Final OA | — | Pending | May 20, 2022 |
| 17663683 | Semiconductor Package and Method | SCHODDE, CHRISTOPHER A | 2898 | §103 | Final Rejection | — | Pending | May 17, 2022 |
| 17745562 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | DEGRASSE, IAN ISAAC | 2818 | §103 | Non-Final OA | — | Pending | May 16, 2022 |
| 17663278 | SEMICONDUCTOR DEVICE AND METHOD | WARD, DAVID WILLIAM | 2891 | §103 | Non-Final OA | — | Pending | May 13, 2022 |
| 17739259 | Semiconductor Device Including Air Spacer and Method of Manufacture | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Non-Final OA | — | Pending | May 09, 2022 |
| 17737810 | PHOTORESIST COMPOSITION AND METHODS OF USE | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | — | Pending | May 05, 2022 |
| 17661325 | Method of Bonding Active Dies and Dummy Dies and Structures Thereof | LANDAU, MATTHEW C | 2891 | §112 | Non-Final OA | — | Pending | Apr 29, 2022 |
| 17652398 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | NGUYEN, SOPHIA T | 2893 | §103§112 | Final Rejection | — | Pending | Feb 24, 2022 |
| 17675558 | Methods of Manufacturing Semiconductor Devices | NGUYEN, DUY T V | 2818 | §103§112 | Non-Final OA | 29d | Pending | Feb 18, 2022 |
| 17669953 | High Voltage ESD Protection Apparatus | BELL, LAUREN R | 2896 | §112DP | Non-Final OA | — | Pending | Feb 11, 2022 |
| 17582563 | SEMICONDUCTOR DEVICE AND METHOD | RAMOS-DIAZ, FERNANDO JOSE | 2814 | §103§112 | Non-Final OA | — | Pending | Jan 24, 2022 |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | STEVENSON, ANDRE C | 2899 | §103 | Non-Final OA | — | Pending | Jan 20, 2022 |
| 17562794 | SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER | SCHODDE, CHRISTOPHER A | 2898 | §103§112 | Non-Final OA | — | Pending | Dec 27, 2021 |
| 17461656 | Semiconductor Device and Methods of Manufacture | CLEVELAND, MICHAEL B | 1700 | §103 | Final Rejection | — | Pending | Aug 30, 2021 |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | WILCZEWSKI, MARY A | 2898 | §102§103 | Non-Final OA | 31d overdue | Pending | Jul 22, 2021 |
| 17352133 | DEPOSITION SYSTEM AND METHOD | KURPLE, KARL | 1717 | §103§112 | Non-Final OA | 26d | Pending | Jun 18, 2021 |
| 17232319 | SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD | SWEELY, KURT D | 1718 | §103§112 | Non-Final OA | 50d | Pending | Apr 16, 2021 |
| 17215555 | Chip on Package Structure and Method | MIYOSHI, JESSE Y | 2898 | §103§112 | Non-Final OA | 42d overdue | Pending | Mar 29, 2021 |
| 17150044 | FINFET DEVICE AND METHOD | WILCZEWSKI, MARY A | 2898 | §103 | Final Rejection | 79d | Pending | Jan 15, 2021 |
| 17107420 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | BAUMAN, SCOTT E | 2815 | §103§112 | Non-Final OA | 30d | Pending | Nov 30, 2020 |
| 17068375 | System and Method of Chemical Mechanical Polishing | POON, DANA LEE | 3723 | §103 | Non-Final OA | — | Pending | Oct 12, 2020 |
| 16927638 | Pre-Clean for Contacts | ALEJANDRO MULERO, LUZ L | 1716 | §103 | Final Rejection | — | Pending | Jul 13, 2020 |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | CHAMPION, RICHARD DAVID | 1737 | §103 | Non-Final OA | 35d | Pending | May 08, 2020 |
| 16655156 | CONDUCTIVE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | — | Pending | Oct 16, 2019 |
| 16585859 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MAI, ANH D | 2893 | §103 | Final Rejection | 17d overdue | Pending | Sep 27, 2019 |
| 16525978 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | LIN, JOHN | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 30, 2019 |
| 16283838 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME | CULBERT, CHRISTOPHER A | 2815 | §103 | Final Rejection | 31d overdue | Pending | Feb 25, 2019 |
| 19184149 | CANTILEVER NANOELECTROMECHANICAL DECODER CIRCUIT AND METHODS FOR FORMING THE SAME | LUU, PHO M | — | DP | Non-Final OA | — | Pending | Apr 21, 2025 |
| 19176369 | Pre-Charging Bit Lines Through Charge-Sharing | CHO, SUNG IL | — | §102§103§112Other | Non-Final OA | — | Pending | Apr 11, 2025 |
| 19004372 | ADHESIVE TAPE APPLICATION SYSTEM TO MODIFY THE ADHESIVE STRENGTH OF THE ADHESIVE TAPE AND METHOD OF APPLYING THE ADHESIVE TAPE | RAIMUND, CHRISTOPHER W | 1746 | §102§103 | Non-Final OA | — | Pending | Dec 29, 2024 |
| 18991656 | METHOD FOR ERROR CORRECTION CODING WITH MULTIPLE HASH GROUPINGS AND DEVICE FOR PERFORMING THE SAME | BRITT, CYNTHIA H | 2111 | §112DP | Non-Final OA | — | Pending | Dec 22, 2024 |
| 18984182 | Multi-Fuse Memory Cell Circuit and Method | NGUYEN, VIET Q | — | §102 | Non-Final OA | — | Pending | Dec 17, 2024 |
| 18959802 | Turbo Mode SRAM for High Performance | SMET, UYEN TRAN | — | §103DP | Non-Final OA | — | Pending | Nov 26, 2024 |
| 18947402 | THERMOELECTRIC TEMPERATURE CONTROLLER FOR A TESTER AND METHODS OF OPERATING THE SAME | RIOS RUSSO, RAUL J | 2858 | §112 | Non-Final OA | — | Pending | Nov 14, 2024 |
| 18889666 | PACKAGE SUBSTRATE INCLUDING FIBER-REINFORCED DIELECTRIC LAYER, PACKAGE STRUCTURE INCLUDING THE PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME | FARMER, EMILY NICOLE | — | §102§103 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18808430 | POLISHING MATERIAL SUPPLY SYSTEM AND RELATED METHODS | HUANG, STEVEN | 3723 | §102§103 | Non-Final OA | — | Pending | Aug 19, 2024 |
| 18792873 | SURFACE INSPECTION TOOL FOR TRANSFER TOOLS AND METHODS OF USING THE SAME | TON, TRI T | 2877 | §103 | Final Rejection | — | Pending | Aug 02, 2024 |
| 18789786 | SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF | MANDALA, MICHELLE | 2893 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789812 | WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER | MELLOTT, JAMES M | 1718 | §103 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18789289 | DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT | CAMPBELL, SHAUN M | — | §103 | Non-Final OA | — | Pending | Jul 30, 2024 |
| 18787593 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | WINTERS, SEAN AYERS | — | §102§103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788082 | ORGANIC GATE TFT-TYPE STRESS SENSORS AND METHOD OF MAKING AND USING THE SAME | FOX, BRANDON C | — | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786948 | CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METHODS FOR FORMING THE SAME | VU, DAVID | — | §102 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18788036 | PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAGE AND METHODS FOR FORMING THE SAME | MOONEY, MICHAEL P | — | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18787153 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING | VALENZUELA, PATRICIA D | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18786520 | METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME | SCHODDE, CHRISTOPHER A | — | §103§112 | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18786510 | SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS BETWEEN SEMICONDUCTOR DIES AND METHODS OF FORMING THE SAME | TRAN, THANH Y | — | DP | Non-Final OA | — | Pending | Jul 28, 2024 |
| 18785009 | METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE LAYERS AND METHODS OF FORMING THE SAME | DULKA, JOHN P | — | §112Other | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18785091 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | ISAAC, STANETTA D | — | §102 | Non-Final OA | — | Pending | Jul 26, 2024 |
| 18783478 | RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME | KIM, JAY C | — | §112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784583 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA LANDING | PARKER, JOHN M | — | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783713 | PHYSICAL VAPOR DEPOSITION (PVD) SYSTEM AND METHOD OF PROCESSING TARGET | MURATA, AUSTIN | 1718 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782095 | ION IMPLANTATION SYSTEM | NGUYEN, KIET TUAN | 2881 | §101§103Other | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18780592 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | YI, CHANGHYUN | — | §102§103Other | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779047 | MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS | LEE, EUGENE | — | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18779020 | ACCESS TRANSISTORS IN A DUAL GATE LINE CONFIGURATION AND METHODS FOR FORMING THE SAME | WALL, VINCENT | — | §112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18779006 | THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-MODULATED ACTIVE REGION AND METHODS FOR FORMING THE SAME | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18777672 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | GOODLING, DEVIN KIRK | — | §103§112DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18771856 | Semiconductor Structure | KIM, SU C | 2899 | §112DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18771613 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS OF MAKING THE SAME | LE, THAO P | — | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18770392 | PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME | NGUYEN, NIKI HOANG | — | §112DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18769998 | SEMICONDUCTING METAL OXIDE TRANSISTORS HAVING A PATTERNED GATE AND METHODS FOR FORMING THE SAME | KIM, TONG-HO | — | DP | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768080 | Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same | NGUYEN, NIKI HOANG | — | §102Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18767239 | Zero Mask High Density Capacitor | TYNES JR., LAWRENCE C | — | DP | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18757668 | THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME | PARKER, JOHN M | — | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18756313 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | GARCES, NELSON Y | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18747849 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | GOODWIN, DAVID J | — | §102§103 | Non-Final OA | — | Pending | Jun 19, 2024 |
| 18745271 | LIQUID DETECTION APPARATUS AND METHOD OF DETECTING LIQUID IN WAFER PROCESSING DEVICE | MAINI, RAHUL | 2858 | §103Other | Final Rejection | — | Pending | Jun 17, 2024 |
| 18734669 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION CIRCUIT | MUSE, ISMAIL A | — | §102§103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18667673 | POLISHING APPARATUS | MACARTHUR, SYLVIA | 1716 | §102§103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18661935 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE INCLUDING A PRECISION PROOF MASS ELEMENT AND METHODS FOR FORMING THE SAME | ABDELAZIEZ, YASSER A | 2898 | §102 | Non-Final OA | — | Pending | May 13, 2024 |
| 18647104 | HYBRID-BONDING STACK INCLUDING A PROCESSOR DIE AND MULTI-CACHE-LEVEL MEMORY DIES AND METHODS OF FORMING THE SAME | KIM, JAY C | — | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18641473 | BONDING SCHEME TO PROVIDE IMPROVED COPLANARITY AND HIGH JOINT YIELDS WITH REDUCED COSTS AND METHODS FOR FORMING THE SAME | LEE, EUGENE | — | §103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18629037 | MEMORY DEVICE INCLUDING MULTIPLICATE SOURCE LINES AND METHODS OF FORMING THE SAME | LEE, CHEUNG | — | §102 | Non-Final OA | — | Pending | Apr 08, 2024 |
| 18625292 | RESISTIVE MEMORY CELL TOP ELECTRODE CONTACT WITH REDUCED CORNER EROSION AND METHOD OF FORMING THE SAME | SUN, MICHAEL BRENNAN | 2892 | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18613172 | SEMICONDUCTOR DIES HAVING ELECTRICAL ISOLATION LAYERS AND METHODS OF MAKING THE SAME | GUMEDZOE, PENIEL M | — | §102§103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18601062 | CARRIER MODIFICATION DEVICES FOR AVOIDING CHANNEL LENGTH REDUCTION AND METHODS FOR FABRICATING THE SAME | CHOI, CALVIN Y | 2812 | §102§103Other | Non-Final OA | — | Pending | Mar 11, 2024 |
| 18596501 | VERTICAL HETEROSTRUCTURE SEMICONDUCTOR MEMORY CELL AND METHODS FOR MAKING THE SAME | LEE, CHEUNG | 2812 | §102§103DP | Non-Final OA | — | Pending | Mar 05, 2024 |
| 18591150 | PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC PACKAGES AND METHODS OF FORMING THE SAME | KIANNI, KAVEH C | 2874 | §103Other | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18440331 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ARROYO, TERESA M | 2893 | §102§103§112 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18434886 | ELECTROPLATING PROCESS USING A PROXIMITY MASK WITH AN OVERHANG AND AN APPARATUS FOR PERFORMING THE SAME | VAN, LUAN V | — | §112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18424960 | SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE WITH VARIABLE RESISTIVITY EPITAXIAL SEMICONDUCTOR LAYERS AND METHODS OF MAKING THE SAME | RAHMAN, MOIN M | 2898 | §103 | Non-Final OA | — | Pending | Jan 29, 2024 |
| 18421102 | TUNABLE PHOTONIC COUPLERS FOR ELECTRONIC/PHOTONIC SYSTEMS AND METHODS OF FORMING THE SAME | LEPISTO, RYAN A | 2874 | §102§103 | Non-Final OA | — | Pending | Jan 24, 2024 |
| 18415751 | WAFER RETAINING DEVICE | NEJAD, MAHDI H | 3723 | §102§103§112 | Final Rejection | 23d | Pending | Jan 18, 2024 |
| 18416783 | FERROELECTRIC TUNNEL JUNCTION DEVICES WITH METAL-FE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | MARUF, SHEIKH | 2897 | §103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18412736 | EXHAUST DEVICE | ANDERSON II, STEVEN S | 3762 | §102 | Final Rejection | — | Pending | Jan 15, 2024 |
| 18402778 | SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME | GHYKA, ALEXANDER G | 2812 | §112 | Non-Final OA | — | Pending | Jan 03, 2024 |
| 18526331 | SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUMPS AND METHOD OF MAKING THE SAME | HSIEH, HSIN YI | 2899 | §112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18511976 | MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRUCTURE | TUGBANG, ANTHONY D | — | §103 | Non-Final OA | — | Pending | Nov 16, 2023 |
| 18501062 | PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE WITH A RECESSED PORTION AND METHODS OF FORMING THE SAME | RODELA, EDUARDO A | 2893 | §103§112 | Final Rejection | — | Pending | Nov 03, 2023 |
| 18484541 | SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS FOR FORMING THE SAME | TAN, DAVE | 2897 | §103 | Non-Final OA | — | Pending | Oct 11, 2023 |
| 18470557 | FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHODS OF FORMING THE SAME | PATERSON, BRIGITTE A | 2896 | §102§103 | Final Rejection | 29d | Pending | Sep 20, 2023 |
| 18464399 | SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS FOR FORMING THE SAME | TOBERGTE, NICHOLAS J | 2817 | §103 | Final Rejection | 26d | Pending | Sep 11, 2023 |
| 18455698 | PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME | JAHAN, BILKIS | 2817 | §102§103 | Final Rejection | 8d overdue | Pending | Aug 25, 2023 |
| 18366725 | RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME | KIM, JAY C | 2815 | §112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18230719 | DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME | GAMINO, CARLOS J | 2899 | §102§103§112 | Non-Final OA | — | Pending | Aug 07, 2023 |
| 18230756 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | BOATMAN, CASEY PAUL | 2893 | §102§103 | Non-Final OA | 71d | Pending | Aug 07, 2023 |
| 18362192 | MEMORY CHIPLET HAVING MULTIPLE ARRAYS OF MEMORY DEVICES AND METHODS OF FORMING THE SAME | MIYOSHI, JESSE Y | 2898 | §103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18362251 | SYSTEMS FOR IMPROVED EFFICIENCY OF BALL MOUNT CLEANING AND METHODS FOR USING THE SAME | ORTA, LAUREN GRACE | 1711 | §103§112 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18349412 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME | FAN, SU JYA | 2818 | §102§103 | Non-Final OA | 22d overdue | Pending | Jul 10, 2023 |
| 18206876 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | ZHONG, XIN Y | 2855 | §102§103 | Final Rejection | 26d overdue | Pending | Jun 07, 2023 |
| 18321129 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 29d overdue | Pending | May 22, 2023 |
| 18317121 | INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHODS OF MAKING AND USING THE SAME | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | — | Pending | May 15, 2023 |
| 18309874 | PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FORMING THE PACKAGE MODULE | MOJADDEDI, OMAR F | 2898 | §102§103§112 | Non-Final OA | — | Pending | May 01, 2023 |
| 18304638 | PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME | ONUTA, TIBERIU DAN | 2814 | §103 | Non-Final OA | — | Pending | Apr 21, 2023 |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | CHAN, CANDICE | 2813 | §102§103§112 | Non-Final OA | 40d | Pending | Mar 27, 2023 |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | CHANG, JAY C | 2817 | §102§103 | Non-Final OA | 10d overdue | Pending | Mar 01, 2023 |
| 18110134 | BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFORMING THE SAME | PATEL, DEVANG R | 1735 | §103 | Non-Final OA | — | Pending | Feb 15, 2023 |
| 18110009 | THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 40d | Pending | Feb 15, 2023 |
| 17874366 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | LIN, JOHN | 2815 | §103 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17851072 | RADIO FREQUENCY SWITCH FOR MULTI-BAND FILTER APPLICATIONS AND METHODS FOR FORMING THE SAME | KOLAHDOUZAN, HAJAR | 2898 | §103 | Final Rejection | — | Pending | Jun 28, 2022 |
| 17842672 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | NGUYEN, SOPHIA T | 2893 | §103 | Non-Final OA | 28d | Pending | Jun 16, 2022 |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | DAS, PINAKI | 2898 | §103 | Non-Final OA | 3d overdue | Pending | Jun 02, 2022 |
| 17828064 | PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME | RAHMAN, MOIN M | 2898 | §103§112 | Non-Final OA | — | Pending | May 31, 2022 |
| 17738169 | TRANSISTOR STRUCTURE HAVING REDUCED CONTACT RESISTANCE AND METHODS OF FORMING THE SAME | WINTERS, SEAN AYERS | 2892 | §103 | Non-Final OA | 78d overdue | Pending | May 06, 2022 |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | NGUYEN, CUONG B | 2818 | §112 | Final Rejection | 4d overdue | Pending | May 03, 2022 |
| 17716010 | PROCESSING APPARATUS AND METHOD OF MANUFACTURE | LOGIE, MICHAEL J | 2800 | §102§103DP | Non-Final OA | — | Pending | Apr 08, 2022 |
| 17708348 | SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS OF FORMING THE SAME | DINKE, BITEW A | 2812 | §103 | Non-Final OA | 14d | Pending | Mar 30, 2022 |
| 17654927 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF | BELL, LAUREN R | 2896 | §102§103 | Non-Final OA | 1d overdue | Pending | Mar 15, 2022 |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | NETTLES, CORALIE ANN | 2893 | §103 | Final Rejection | — | Pending | Mar 10, 2022 |
| 17653780 | SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORMATION AND REMOVAL | NETTLES, CORALIE ANN | 2893 | §103 | Non-Final OA | 54d | Pending | Mar 07, 2022 |
| 17650312 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | SEHAR, FAKEHA | 2893 | §103§112 | Non-Final OA | — | Pending | Feb 08, 2022 |
| 17565220 | WORK FUNCTION MATERIAL AND MANUFACTURING PROCESS THEREOF | ASHBAHIAN, ERIC K | 2891 | §103 | Non-Final OA | — | Pending | Dec 29, 2021 |
| 17367698 | SEMICONDUCTOR ARRANGEMENT INCLUDING A SPACER ADJACENT A CONDUCTIVE LAYER AND METHOD OF MAKING | WINTERS, SEAN AYERS | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 06, 2021 |
| 19006992 | SHARED DECODER CIRCUIT AND METHOD | TRAN, MICHAEL THANH | — | §102§112 | Non-Final OA | — | Pending | Dec 31, 2024 |
| 18790469 | COUPLING MONITORING SYSTEM | SMITH, MAURICE C | 2877 | §102§103§112 | Final Rejection | — | Pending | Jul 31, 2024 |
| 18748954 | OSCILLATOR CIRCUIT, LAYOUT, AND METHOD | SHIN, JEFFREY M | — | §102 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18630807 | SEMICONDUCTOR DEVICE | ANDERSON, WILLIAM H | — | §102§112 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18598580 | METHOD OF FABRICATING TRANSISTOR HAVING EXPANDED GATE STRUCTURE, AND TRANSISTOR FABRICATED THEREBY | DINKE, BITEW A | 2812 | §102§103Other | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18526337 | METHOD FOR OPTIMIZING FLOOR PLAN FOR AN INTEGRATED CIRCUIT | GARBOWSKI, LEIGH M | — | §103DP | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18195058 | SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY | RIRIE, EVERETT TRAJAN | 2897 | §103 | Non-Final OA | 66d overdue | Pending | May 09, 2023 |
| 18103698 | SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IMPROVED RELIABILITY | PURVIS, SUE A | 2800 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2023 |
| 18093537 | ADDITIVES FOR METALLIC PHOTORESIST | CHU, JOHN S Y | 1737 | §103§112 | Non-Final OA | — | Pending | Jan 05, 2023 |
| 18093472 | LOW RESISTANCE BOTTOM ELECTRODE VIA | TRAN, TONY | 2893 | §103 | Non-Final OA | — | Pending | Jan 05, 2023 |
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