Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
The amendment filed August 18, 2025 has been entered and considered. With the entry of the amendment, claims 2 and 4 are canceled, and claims 1, 3 and 5 are pending for examination.
Claim Interpretation
The following is a quotation of 35 U.S.C. 112(f):
(f) Element in Claim for a Combination. – An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The following is a quotation of pre-AIA 35 U.S.C. 112, sixth paragraph:
An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The claims in this application are given their broadest reasonable interpretation using the plain meaning of the claim language in light of the specification as it would be understood by one of ordinary skill in the art. The broadest reasonable interpretation of a claim element (also commonly referred to as a claim limitation) is limited by the description in the specification when 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is invoked.
As explained in MPEP § 2181, subsection I, claim limitations that meet the following three-prong test will be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph:
(A) the claim limitation uses the term “means” or “step” or a term used as a substitute for “means” that is a generic placeholder (also called a nonce term or a non-structural term having no specific structural meaning) for performing the claimed function;
(B) the term “means” or “step” or the generic placeholder is modified by functional language, typically, but not always linked by the transition word “for” (e.g., “means for”) or another linking word or phrase, such as “configured to” or “so that”; and
(C) the term “means” or “step” or the generic placeholder is not modified by sufficient structure, material, or acts for performing the claimed function.
Use of the word “means” (or “step”) in a claim with functional language creates a rebuttable presumption that the claim limitation is to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites sufficient structure, material, or acts to entirely perform the recited function.
Absence of the word “means” (or “step”) in a claim creates a rebuttable presumption that the claim limitation is not to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is not interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites function without reciting sufficient structure, material or acts to entirely perform the recited function.
Claim limitations in this application that use the word “means” (or “step”) are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. Conversely, claim limitations in this application that do not use the word “means” (or “step”) are not being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action.
This application includes one or more claim limitations that do not use the word “means,” but are nonetheless being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, because the claim limitation(s) uses a generic placeholder that is coupled with functional language without reciting sufficient structure to perform the recited function and the generic placeholder is not preceded by a structural modifier. Such claim limitation(s) is/are: “activation unit”, “heating unit” in claim 5.
Because this/these claim limitation(s) is/are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, it/they is/are being interpreted to cover the corresponding structure described in the specification as performing the claimed function, and equivalents thereof.
If applicant does not intend to have this/these limitation(s) interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, applicant may: (1) amend the claim limitation(s) to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph (e.g., by reciting sufficient structure to perform the claimed function); or (2) present a sufficient showing that the claim limitation(s) recite(s) sufficient structure to perform the claimed function so as to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph.
Claim Rejections - 35 USC § 112
The rejection of claims 1 and 5 under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement is withdrawn due to the amendment filed August 18, 2025.
The rejection of claims 1, 3 and 5 under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention is withdrawn due to the amendment filed August 18, 2025 clarifying the claim language.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim 1, 3 and 5 are rejected under 35 U.S.C. 103 as being unpatentable over Jomen et al (US 2006/0081461) in view of Tanaka et al (US 2010/0015791) and EP 1188097 B1 (hereinafter ‘097).
Claim 1: Jomen provides a substrate plating processing method that would successively process multiple substrates (note 0001, 0063, 0054—note how processing of a present/current wafer/substrate would occur followed by a following/next wafer/substrate), the method comprising activating a plating liquid by heating and maintaining (heating/maintaining before later accumulation) the plating liquid at a preset temperature (note figures 1, 2, note 0036, 0037, 0042, 0009, 0013, 0049, the heating control while at standby provides heating/maintaining the desired temperature), holding a current substrate being processed currently by a holder configured to hold and rotate the first substrate (note figure 1, 0031, 0048), further as to performing a pre-processing with liquid on the current substrate before being subjected to the accumulating of the plating liquid, this would be indicated by Jomen (note figures 4A, 4B, 0045-0048), then accumulating the activated plating liquid on the current substrate (note 0048, figure 5A), forming a plating film on the current substrate by electroless plating while heating the substrate on which the plating liquid is accumulated (note 0048-0049), performing a post-processing with a liquid on the current substrate on which the plating film is formed (note 0052-0053, figures 5B, 6A), and drying the current substrate after being subjected to the post-processing (note 0053, figure 6B). Furthermore, the activating the plating liquid (heating/maintaining) for the substrate to be processed next (next substrate) is performed simultaneously with the forming of the plating film, the performing of the post-processing, and the drying of the current substrate upon the substrate being processed currently (note as plating liquid being discharged in accumulating, new processing liquid supplied to line 41 which would be heated, and this would remain until the next electroless plating application, so during plating, post-processing, and drying of the current substrate, note 0050, 0054, 0058-0061, 0063). Thus, Jomen provides a method for plating processing and treating multiple substrates to be successively processed (note 0063).
(A) As to providing a controller (which receives a required time to activate the plating liquid) and where the current substrate being held stands by for a time period/standing time before accumulating the activated plating liquid, and where the controller is configured to calculate the standing time for the next substrate (and would have also calculated a standing time for the current substrate) to stand by based on the received required time and based on a recipe information storing a first time taken for the forming of the plating film, the performing of the post-processing and the drying of the current substrate, and configured to set the calculated standing time in the recipe information,
Jomen indicates that the time to time to heat up (activate) the plating liquid can affect the time that start of plating for a next substrate would occur (giving a waiting time/delaying time) (note 0061). Jomen also notes that the plating liquid to be applied to a substrate (such as the current, or next substrate) can be heated (so with the activating) starting during the accumulating time of the previous substrate to be plated (note 0053, 0050, figure 5A, where plating solution kept between valves 51/63 and 43 in supply line 41 is refilled into that area simultaneously as plating liquid is discharged from that area to the wafer substrate, where this area would be heated, note 0049, 0036, and note also the discussion of heating the mixed plating solution in the supply area is provided between the time when plating processing has been started on a substrate and when the plating processing is to start on a following substrate, note 0054). Jomen also indicates providing a controller (control unit) which includes a sequence program for controlling operations of the pumps and valves in the system and can be a computer (note 0043, claim 1).
Additionally, Tanaka describes an electroless plating process (note 0026) where a plating liquid is activated by heating/maintaining the plating liquid at a preset temperature (note figures 2, 5, 0059-0061), holding the current substrate being processed currently by a holder configured to hold and rotate the current substrate (note figure 2, 0043, note chuck 130), providing preprocessing/precleaning (note 0067-0068), then accumulating the activating plating liquid on a current substrate (note 0075), forming a plating film on the current substrate by electroless plating while heating the current substrate on which the plating liquid is accumulated (note 0076-0077, 0048), performing post processing with a liquid on the current substrate on which the plating film is formed, and drying the current substrate after being subjected to the post processing (note 0080-0082, 0088-0089). Tanaka further describes how there can be a heating time for the activating of the plating fluid that occurs simultaneously with other steps in the process, such as post processing, drying, precleaning (note figure 12, 0101-0105), where if the required time for activating is longer than the other processing steps, then a controlled amount of waiting time (stand by time, standing time, standing of the substrate) needs to be provided, delaying the start of the next accumulation of plating, where such a control can be implemented by an instruction from a process controller for the system, and determined waiting times (delay times/standing times) provided for different conditions, where as shown for figure 12, times for the other process steps would be taken into account, and leading to additional processing of further substrates, such as second/next substrates (note figure 12, 0105), where the process controller can be a microprocessor/computer (note 0036).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Jomen to provide receiving a designation of a required time of activating the plating liquid by a controller, and delaying a start of the preprocessing/accumulating on the substrate to be processed next (that is, providing a standing time (stand by time) for the current substrate that has been provided as being held on the holder before the preprocessing/accumulating, and also for the next substrate to be treated), where the controller is configured to calculate a standing time to stand the next substrate/current substrate, based on the required time in the receiving of the designation of the required time and recipe information and a time taken for the forming of the plating film, the performing of the post-processing and the drying of the first substrate, and configured to set the calculated standing time in the recipe information (that is, use to provide the sequence of steps and timing provided) as suggested by Tanaka with an expectation of providing a desirably controlled process, since Jomen indicates that the time to time to heat up (activate) the plating liquid can affect the time that start of plating for a next substrate would occur (giving a waiting time/delaying time), where the time for heating/activating occurs over the accumulating and forming plating and continues until the start of the next plating step, and describes that a controller can be used, and Tanaka indicates that in a similar such system with heating/maintaining plating liquid at a preset temperature before accumulation and where this would occur simultaneously to other process steps, it would be known to provide designations of amount of heating time needed and adjust the start of the accumulation with a delaying of the start based on the required time for heating as compared to other process steps, which here would include the time for plating (since Jomen heats during the plating), the post processing and the drying of the substrate, and indicates using the process controller to control the processing of steps including the delay/standing time, and thus the controller would be suggested to be configured to calculate the standing time for stand by as claimed (using information from a current substrate to give conditions for the next substrate as the most recent supply of information and time of processing, etc. occurs for processing the current substrate) and set the calculated standing time in the recipe information (to provide the steps as claimed) and also receiving a time for activating by the controller, as this would be needed to determine the standing time and the controller is to control operations, which would include standing, and can be a computer as noted by Jomen and Tanaka, and there would also be a stand by for the current substrate that has been calculated as for the next substrate (as there would be a series of substrates, note Tanaka, figure 12) and the current substrate can be one of the series that would need the stand by time, followed by a next substrate, and so forth.
(B) Further as to determining whether a current substrate being processed is a first one amount the multiple substrates to be successively processed by the controller, wherein no preceding substrate has been processed immediately before the current substrate, and when the current substrate is determined to be the first one among the multiple substrates to be successively processed, the controller delays the start of a holding by the first one by the holder by a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing, and the drying of the current substrate, such that the plating liquid is sufficiently activated prior to processing the first substrate, and when the current substrate is determined not to be the first one among the multiple substrates to be successively processed, the controller starts the holding of the current substrate by the holder without the delay, Jomen, as discussed above, would provide for the processing successively of multiple substrates, and therefore when processing multiple substrates, one would have to be the first/initially processed substrate, and the others of such substrates would have to be the latter/second+ substrates to be processed. Similarly, Tanaka would indicate successively processing multiple substrates, (note figure 12, 0101, 0105), and therefore one would have to be the first/ initially processed substrate, and the others of such substrates would have to be the latter/second+ substrates to be processed. Further, as discussed for Jomen above, there is a time needed for the activating with heating of the plating solution (note 0061). Tanaka would indicate how the heating/maintaining time can be equivalent to or longer than other process steps, or even shorter, and can be determined and set according to different conditions used (figures 11, 12, 0104-0105). Jomen indicates that the process can be used in the treating of semiconductor substrates for forming wiring (circuits) (note 0001, 0002). Tanaka notes that the process can be used in semiconductor manufacturing for forming wiring (circuits) (note 0001-0004), and notes using a semiconductor manufacturing apparatus with loading/unloading, processing, conveyance and control units (note figure 1, and 0009-0036).
‘097 describes how in semiconductor manufacturing, such as making integrated circuits, there are numbers fabrication steps performed serially on the substrate and require transport between modules, where delivery and removal must be performed in a timely manner to maintain the flow of the substrate in a periodic and synchronized manner (note 0002). It is noted that the manufacturing system can include a cluster tool with process chambers and transporting tools to process the substrate sequentially through a series of modules (note 0019), where substrates/wafers can be emptied out of a cluster tool (exiting lot) and the a new lot of substrates can be provided (entering lot) to populate the tool (note 0051), where it is described how the timing of launching of the wafers of the entering lot needs proper timing, where for timing of launching the first wafer of the lot can be delayed for a time needed to change the process module over to a new setting required by the entering lot, so that when the first wafer of the entering lot arrives, the process module is ready to accept the wafer (note 0057). The system uses a scheduler which can be considered a controller (note 0023-0024, 0006), and the system would need to be controlled to provide the actions. It is also noted that it is known for the control system to verify the status of substrates in different modules (note 0006), and to provide computer control and monitoring in systems (note 0008).
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Jomen in view of Tanaka to specifically provide that the system determines whether a current substrate is a first substrate from multiple substrates to be successively processed, wherein no preceding substate has been processed immediately before the current substrate, and when the current substrate is determined to be the first one among the multiple substrates to be successively processed, the controller delays the start of a holding by the first one by the holder by a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing, and the drying of the current substrate, such that the plating liquid is sufficiently activated prior to processing the first substrate, and when the current substrate is determined not to be the first one among the multiple substrates to be successively processed, the controller starts the holding of the current substrate by the holder without the delay with an expectation of providing a desirable controlled system as further suggested by ‘097 since both Jomen and Tanaka indicate treating a successive series of substrates in a semiconductor system, which would require there to be a first of these successive substrates (multiple substrates) to be treated, where each describe using a controller, and where ‘097 indicates how when treating substates in a semiconductor system, there can be sets/lots of substrates to enter modules of the system where the first of such substrates can be provided with a delay before entering to provide the module with the new set up for processing, and how with such systems it is known to use controllers, including those that verify the status of substrates in different modules (and would therefore know which substrate is which and where) and noting the use of real time data gathering, monitoring, and thus one would be suggested to determine which substrate is which, including which is the first substrate and which is not, for providing special treatment such as delay when providing the first substrate, where when using processing as in Jomen and Tanaka, Jomen indicates that there is a time needed for the activating with heating of the plating solution and Tanaka would indicate how the heating/maintaining time can be equivalent to or longer than other process steps, or even shorter, and can be determined and set according to different conditions used, and therefore, it would be suggested to optimize the preheating/maintaining (activation) time before the first plating accumulating on a first substrate, and to delay the start processing including placement on the holder until the desired heating/activating provided so that the substrate is not exposed to unactivated liquid (that is giving a setting to new conditions as indicated by ‘097), and this, from optimization, would be predictably and acceptably be a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing, and the drying of the current substrate, where Tanaka provides how a plating system to provide the substrate on the holder can be provided with a transfer system that transfers the substrate into position (note 0039), and since this transfer system would be controlled by the controller (note 0036), it would be understood that the controller can control the placement onto the holder to be provided at the desired time, and further when the substrate is not the first substrate, the delay would not be needed.
Claim 3: As to the standing time calculated by subtracting the time taken for the forming of the plating film, the performing of the post processing, and the drying of the current substrate and also the time for pre-processing from the required time in the receiving of the designation of the required time (such that the standing time occurs before the pre-processing), this would further be indicated by Tanaka, which also takes into account the pre-preprocessing time, and notes that the time before further addition can be equivalent or longer to other process steps (note figures 11, 12, 0104-0105).
Claim 5: Jomen further describes a substrate processing apparatus for the substrate processing of multiple substrates (note figures 1, 2) with an activation unit configured to activate a plating liquid by heating and maintaining the plating liquid at a preset temperature (note figure 2, with 41, 44, 0036,0037, where 41, 44 can be considered as to providing an activation unit as described by applicant as per 35 USC 112(f) or at least a substantial equivalent thereof), a holder configured to hold and rotate a current substrate being processed currently (note figure 1, with chuck 11, 0031), a first liquid supply configured to supply the plating liquid activated by the activation unit to the current substrate held by the holder (note figures 1, 2, with opening 42, for example, 0036, 0048), a heating unit configured to heat the current substrate held by the holder (note figures 1, 2, upper temperature controller 3, 0036, 0049, where 3 can be considered as providing a heating unit as described by applicant as per 35 USC 112(f) or at least a substantial equivalent thereof), a second liquid supply configured to supply a processing liquid other than the plating liquid to the current substrate held by the holder (note figures 1, 2, figures 4A, 6A, note nozzles 17, 18, for example, 0046, 0052). Additionally, Jomen provides a controller (control unit 100) that can be a computer and can control operations of pumps and valves in the system (0043), controlling supplying of electroless plating solution.
As to providing a controller configured to provide all the claimed steps, Jomen in view of Tanaka and ‘097 would provide performing the claimed steps as discussed for claim 1 above. Furthermore, as to providing a controller for all these steps,
Tanaka describes an electroless plating process (note 0026) where a plating liquid is activated by heating/maintaining the plating liquid at a preset temperature (note figures 2, 5, 0059-0061), accumulating the activating plating liquid on a substrate (note 0075), forming a plating film on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated (note 0076-0077, 0048), performing post processing with a liquid on the substrate on which the plating film is formed, and drying the substrate after being subjected to the post processing (note 0080-0082, 0088-0089). Tanaka further describes providing a control unit with a process controller 51 that can be a computer that controls the processing (note 0036), where the activating/heating can be controlled by the controller, and also parallel/simultaneous processing (note 0105), the first liquid supply for accumulation can be controlled by the controller, as can be the plating process, the post-processing with second liquid supply, and drying process, and also heating of the substrate using a heating unit (note 0060, 0090, 0077, for example). ‘097 as discussed for claim 1 above, also indicates using a controller.
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify Jomen in view of Tanaka and ‘097 to provide a controller for the system that is configured to provide all the process steps described in claim 5 as suggested by Tanaka with an expectation of providing a desirable control of the system, since Jomen in view of Tanaka and ‘097 provides the claimed apparatus system, and would provide the claimed steps of the system as described for claim 1 above, and Tanka would further describe how it would have been conventional with similar such systems to provide a controller that would control all of the apparatus parts and thus control providing the claimed process steps as desired, and furthermore, the controller would be suggested to provide the steps claimed as discussed for claim 1 above, and thus the controller would be configured as claimed. Furthermore, as to the processing a first one among the multiple substrates to be successively processed, wherein no preceding substrate has been processed immediately before the current substrate where the controller is configure to delay as start of the holding of a first one by the holder by a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing, and the drying of the current substrate, and not delaying when using a substrate that is not a first substrate, it would be suggested by the combination of Jomen, Tanaka and ‘097 as discussed above, as one of the actions provided as discussed for claim 1 above, and the same would be suggested for having the controller configured to determine whether the current substate is the first substrate or not, and to have the current substrate stand by for a standing time, held by the holder after holding the current substrate and before accumulating the activated plating liquid, when a first substrate and not delaying when not a first substrate.
Hara et al (US 2007/0128373) also describes electroless plating with temperature control (note abstract).
Response to Arguments
Applicant's arguments filed August 18, 2025 have been fully considered.
As to the 35 USC 103 rejections, it is argued that in ‘097 the delay is for accommodating process module changeover to meet different processing requirements between lots, while in the present application, the delay is to make sure each substrate receives properly activated plating liquid.
The Examiner has reviewed these arguments, however, the rejection above is maintained. Applicant has argued what ‘097 does not teach, but the rejection is a combination of references. In response to applicant's arguments against the references individually, one cannot show nonobviousness by attacking references individually where the rejections are based on combinations of references. See In re Keller, 642 F.2d 413, 208 USPQ 871 (CCPA 1981); In re Merck & Co., 800 F.2d 1091, 231 USPQ 375 (Fed. Cir. 1986). Here, while ‘097 does not specifically base delay time for properly activating coating liquid, it shows that when processing, there would be initial/first substrates to be processed where no preceding substrate has been processed immediately before the current substrate, and notes the use of controllers and use of a delay before the first substrate processed. This is combined with the teaching from Jomen and Tanaka, where Jomen indicates that there is a time needed for activating with heating of the plating solution – which would apply to the first substate to be treated as well, and thus initial activation time would need to be taken into account for the first substrate. Tanaka would indicate how the heating/maintaining time can be equivalent to or longer than other process steps, or even shorter, and can be determined and set according to different conditions used. Therefore, from the combination of references, it would be suggested to optimize the preheating/maintaining (activation) time before the first plating accumulating on a first substrate, and to delay the start processing including placement on the holder until the desired heating/activating provided so that the substrate is not exposed to unactivated liquid (that is giving a setting to new conditions as indicated by ‘097), and this, from optimization, would be predictably and acceptably be a time equivalent to the time taken for the forming of the plating film, the performing of the post-processing, and the drying of the current substrate. When the substrate is not a first substrate, the initial delay would not be needed.
Conclusion
THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
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/KATHERINE A BAREFORD/Primary Examiner, Art Unit 1718