Prosecution Insights
Last updated: October 01, 2026
Application No. 17/661,325

Method of Bonding Active Dies and Dummy Dies and Structures Thereof

Non-Final OA §112
Filed
Apr 29, 2022
Priority
Feb 25, 2022 — provisional 63/268,521
Examiner
LANDAU, MATTHEW C
Art Unit
2891
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
3 (Non-Final)
28%
Grant Probability
At Risk
3-4
OA Rounds
0m
Est. Remaining
40%
With Interview

Examiner Intelligence

Grants only 28% of cases
28%
Career Allowance Rate
22 granted / 80 resolved
-40.5% vs TC avg
Moderate +12% lift
Without
With
+12.5%
Interview Lift
resolved cases with interview
Typical timeline
3y 3m
Avg Prosecution
2 currently pending
Career history
91
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
53.5%
+13.5% vs TC avg
§102
29.1%
-10.9% vs TC avg
§112
15.0%
-25.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 80 resolved cases

Office Action

§112
Notice of Pre-AIA or AIA Status The present application is being examined under the pre-AIA first to invent provisions. Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 11/17/2025 has been entered. Response to Arguments Applicant’s arguments, filed 11/17/2025, with respect to claim 13 have been fully considered and are persuasive. The rejection of claim 13 has been withdrawn. Claim Rejections - 35 USC § 112 The following is a quotation of the first paragraph of 35 U.S.C. 112(a): (a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention. The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112: The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention. Claims 18-20 rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention. Regarding claim 18, the limitation “determining positions of the first plurality of dummy dies in the wafer based on positions of the second plurality of active dies in the wafer” (emphasis added). The specification discloses the first plurality of dummy dies are placed on the wafer prior to placing the second plurality of active dies. Figures 1-4 disclose the dummy dies 4D formed on the wafer 2 prior to forming the second active dies 56A. Paragraph [0041] discloses the position of the dummy dies 4D is determined based on the positions of the first active dies 4A. Therefore, there is no support for determining the position of the first dummy dies based on the yet to be placed second active dies. Allowable Subject Matter Claims 1, 4-17, 21, and 22 are allowed. The following is an examiner’s statement of reasons for allowance: Regarding claim 1, the prior art of record, either singularly or in combination, does not disclose or suggestion the combination of limitations including “bonding one of the plurality of dummy dies to the dummy die and to a position offset from the second reference point”. Regarding claim 13, the prior art of record, either singularly or in combination, does not disclose or suggestion the combination of limitations including “bonding a second plurality of dummy dies to the first plurality of dummy dies, wherein the plurality of dummy dies comprises: offsetting from the second reference point to determine a first position; and bonding a first one of the second plurality of dummy dies to the first position”. Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.” Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MATTHEW C LANDAU whose telephone number is (571)272-1731. The examiner can normally be reached M-F, 9:30-5:30. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Matthew Landau can be reached at 571-272-1731. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. MATTHEW C. LANDAU Supervisory Patent Examiner Art Unit 2891 /MATTHEW C LANDAU/Supervisory Patent Examiner, Art Unit 2891
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Prosecution Timeline

Apr 29, 2022
Application Filed
Dec 02, 2024
Non-Final Rejection mailed — §112
Mar 10, 2025
Response Filed
Sep 16, 2025
Final Rejection mailed — §112
Nov 17, 2025
Response after Non-Final Action
Dec 10, 2025
Request for Continued Examination
Dec 22, 2025
Response after Non-Final Action
Sep 16, 2026
Non-Final Rejection mailed — §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12740081
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
4y 10m to grant Granted Sep 15, 2026
Patent 12690217
GROUP III NITRIDE SEMICONDUCTOR DEVICE WITH FIRST AND SECOND CONDUCTIVE LAYERS
4y 6m to grant Granted Jul 21, 2026
Patent 12690313
LIGHT-EMITTING DIODE
4y 1m to grant Granted Jul 21, 2026
Patent 12666767
uLED DISPLAY DESIGN METHOD BASED ON NANOWIRE
4y 2m to grant Granted Jun 23, 2026
Patent 12641936
DISPLAY UNIT, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE DISPLAY UNIT
4y 0m to grant Granted May 26, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
28%
Grant Probability
40%
With Interview (+12.5%)
3y 3m (~0m remaining)
Median Time to Grant
High
PTA Risk
Based on 80 resolved cases by this examiner. Grant probability derived from career allowance rate.

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