Prosecution Insights
Last updated: October 26, 2026
Application No. 17/667,432

METHODS AND SYSTEMS FOR FABRICATION OF VERTICAL FIN-BASED JFETS

Non-Final OA §102§103
Filed
Feb 08, 2022
Priority
Feb 10, 2021 — provisional 63/148,024
Examiner
SARKER-NAG, AKHEE
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Semiconductor Components Industries LLC
OA Round
2 (Non-Final)
82%
Grant Probability
Favorable
2-3
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
59 granted / 72 resolved
+13.9% vs TC avg
Moderate +12% lift
Without
With
+12.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 5m
Avg Prosecution
27 currently pending
Career history
110
Total Applications
across all art units

Statute-Specific Performance

§103
62.4%
+22.4% vs TC avg
§102
21.8%
-18.2% vs TC avg
§112
15.5%
-24.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 72 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of invention 2, drawn to claims 9-20, in the reply filed on 05/28/2024 is acknowledged. Claims 1-8 withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected group I, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 05/28/2024. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 16 and 18-20 are rejected under 35 U.S.C. 102(a)(1) as being taught by Kub et al (US-20180315820-A1, pub date 11/01/2018, hereinafter “Kub”). Regarding claim 16, figs. 1-3A of Kub teach: providing a semiconductor structure including a substrate (308, para. [0063]), a first semiconductor layer (306, para. [0063]), and a second semiconductor layer (302, para. [0063]); forming a plurality of fins (the combination of channels 306A and 302) having sidewall surfaces (the sidewalls of the fins are made up of 306 material and 302 material) in a portion of the first semiconductor layer (306) and the second semiconductor layer (302), wherein the plurality of fins (combination of channels 306A and 302) are separated by trenches (filled with material 1304A); providing a third semiconductor layer (304A, para. [0063] and [0064]) coupled to the sidewall surfaces of the plurality of fins (304A is on the sidewalls of the fins, which are the combination of 306A and 302), wherein the third semiconductor layer includes a dopant (304A is p-type and therefore doped) and comprises a recessed gate region (304A forms a gate region that is recessed in form); and forming a source metal (see fig. 11, step 1116, where additional sources and metal contacts are patterned on top of the channels), a gate metal (304A), and a drain contact (310). Regarding claim 18, figs. 1-3A of Kub teach the third semiconductor layer (304A, para. [0063] and [0064]) extends along a portion of the sidewall surfaces of the plurality of fins (304A is on the sidewalls of the fins, which are the combination of 306A and 302). Regarding claim 19, figs. 1-3A of Kub teach forming an edge termination for the recessed gate region (304A forms a gate region that is recessed in form) (1006) overlaying a top surface of the first semiconductor layer (the 304B elements form a termination towards the edge of the fin component of the device). Regarding claim 20, fig. 1-3A of Kub teaches the third semiconductor layer (304A, para. [0063] and [0064]) comprises a conformal layer (304A is conformal to the fins). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim 17 is rejected under 35 U.S.C. 103 as being unpatentable over Kub in view of Adekore et al. (US-20130043468-A1, pub 08/18/2015, hereinafter “Adekore”). Regarding claim 17, Kub teaches the limitations of claim 16 as provided above. Kub does not teach performing a thermal treatment to activate the dopant in the recessed gate region. However, in a similar field of endeavor, Adekore teaches performing a thermal treatment to activate the dopant in the recessed gate region (para. [0095], "the implanted layers can be further subjected to rapid thermal annealing processes in activated ambient of, for example, nitrogen or argon at temperatures of about 200° C. to 1050° C."). It would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains to employ the teachings of Adekore into the vertical FET device of Kub to form a vertical FET device formed using a method step of thermally treating particular regions of the device. One would have been motivated to do so as Adekore teaches that thermally treating a layer can be “used to prepare a metal substrate” (para. [0096]) as needed for different embodiments. This preparation could allow the substrate to bond better to subsequent layers, or on the reverse allow only certain layers to bond well to the substrate in particular regions, for example. Allowable Subject Matter Claims 9-15 are allowed. The following is an examiner’s statement of reasons for allowance: The closest prior art of record, Kub, does not teach “forming a patterned hard mask coupled to the second semiconductor layer; … applying a sacrificial planarization layer on the diffusion dopant layer; selectively etching the sacrificial planarization layer to expose the diffusion dopant layer; … removing the diffusion dopant layer and the patterned hard mask;” of independent claim 9. Similarly, Adekore does not teach these features. Claim 9 is therefore allowable over the prior art of record. Claims 10-16, since they depend from claim 9, are therefore also allowable. Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.” Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TESSA E MCNAMEE whose telephone number is (703)756-1079. The examiner can normally be reached Mon-Fri 8:00-5:00 PST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Yara Green can be reached on (571) 270-3035. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TESSA ELIZABETH MCNAMEE/Examiner, Art Unit 2893 /YARA B GREEN/Supervisor Patent Examiner, Art Unit 2893
Read full office action

Prosecution Timeline

Feb 08, 2022
Application Filed
Mar 14, 2025
Non-Final Rejection mailed — §102, §103
Jun 16, 2025
Response Filed
Oct 20, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

2-3
Expected OA Rounds
82%
Grant Probability
94%
With Interview (+12.0%)
3y 5m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 72 resolved cases by this examiner. Grant probability derived from career allowance rate.

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